US20180254432A1 - Display substrate, display panel, and display apparatus - Google Patents

Display substrate, display panel, and display apparatus Download PDF

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Publication number
US20180254432A1
US20180254432A1 US15/560,898 US201715560898A US2018254432A1 US 20180254432 A1 US20180254432 A1 US 20180254432A1 US 201715560898 A US201715560898 A US 201715560898A US 2018254432 A1 US2018254432 A1 US 2018254432A1
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micro
substrate
structure layer
display panel
layer
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Hsiaowen HUNG
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BOE Technology Group Co Ltd
Beijing BOE Display Technology Co Ltd
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BOE Technology Group Co Ltd
Beijing BOE Display Technology Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H10K50/115—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers comprising active inorganic nanostructures, e.g. luminescent quantum dots
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • H01L51/5246—
    • H01L27/32—
    • H01L51/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/331—Nanoparticles used in non-emissive layers, e.g. in packaging layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Definitions

  • the present invention relates to display technology, more particularly, to a display substrate, a display panel, and a display apparatus.
  • Display apparatuses such as liquid crystal display (LCD) apparatuses and organic light-emitting diode (OLED) display apparatuses have been widely used.
  • a liquid crystal display apparatus includes a counter substrate and an array substrate facing each other. Thin film transistors, gate lines, data lines, pixel electrodes, common electrodes, and common electrode lines are disposed on the array substrate and the counter substrate. Between the two substrates, a liquid crystal material is injected to form a liquid crystal layer.
  • an organic light-emitting display apparatus includes a counter substrate and an array substrate facing each other.
  • the array substrate in the organic light-emitting display apparatus includes an anode, a light emitting layer and a cathode.
  • the array substrate and the counter substrate are typically sealed together using a frame sealant such as an optical clear resin.
  • the present invention provides a display panel comprising a first substrate; and a second substrate facing the first substrate; wherein the first substrate comprises a first base substrate; and a first micro-structure layer on the first base substrate, the first micro-structure layer having a first corrugated surface on a side distal to the first base substrate, the first micro-structure layer in a peripheral area of the first substrate and enclosing a display area of the first substrate.
  • the display panel further comprises a sealant layer on a side of the first micro-structure layer distal to the first base substrate for sealing the first substrate and the second substrate together to form a cell.
  • the display panel further comprises a desiccant material layer on a side of the first micro-structure layer distal to the first base substrate; wherein the desiccant material layer is in the peripheral area of the first substrate and in an area enclosed by the sealant layer.
  • the display panel is an organic light emitting diode display panel; and the first substrate further comprises an organic light emitting layer on the first base substrate; and an encapsulating layer on a side of the organic light emitting layer distal to the first base substrate.
  • the first substrate further comprises a quantum dots layer on a side of the encapsulating layer distal to the organic light emitting layer.
  • the second substrate comprises a second base substrate; and a second micro-structure layer on the second base substrate, the second micro-structure layer having a second corrugated surface on a side distal to the second base substrate, the second micro-structure layer in a peripheral area of the second substrate and enclosing a display area of the second substrate.
  • the display panel further comprises a sealant layer between the first micro-structure layer and the second micro-structure layer for sealing the first substrate and the second substrate together to form a cell.
  • the first micro-structure layer comprises an array of a plurality of micro-structures.
  • distances between the plurality of micro-structures are substantially the same.
  • distances between the plurality of micro-structures are in a range of approximately 0.1 mm to approximately 1 mm.
  • the distances between the plurality of micro-structures are approximately 0.5 mm.
  • each of the plurality of micro-structures has a curved cross-section.
  • each of the plurality of micro-structures has a cross-section of a substantially semi-circular shape.
  • the plurality of micro-structures have a substantially the same radius.
  • the plurality of micro-structures are a plurality of convex portions.
  • the plurality of micro-structures are a plurality of concaved portions.
  • the present invention provides a display apparatus comprising a display panel described herein.
  • the present invention provides a display substrate, comprising a base substrate; and a micro-structure layer on the base substrate in a peripheral area of the display substrate, the micro-structure layer having a corrugated surface on a side distal to the base substrate, the micro-structure layer enclosing a display area of the display substrate.
  • the micro-structure layer comprises a plurality of convex portions.
  • the micro-structure layer comprises a plurality of concaved portions.
  • FIG. 1 is a schematic diagram illustrating the structure of a display panel in some embodiments according to the present disclosure.
  • FIG. 2 is a schematic diagram illustrating the structure of a display panel in some embodiments according to the present disclosure.
  • FIG. 3 is a schematic diagram illustrating the structure of a display panel in some embodiments according to the present disclosure.
  • FIG. 4 is a schematic diagram illustrating the structure a micro-structure layer in some embodiments according to the present disclosure.
  • FIG. 5 is a schematic diagram illustrating the structure a micro-structure layer in some embodiments according to the present disclosure.
  • FIG. 6 is a flow chart illustrating a method of fabricating a display panel in some embodiments according to the present disclosure.
  • Conventional display panel sealing methods include coating methods and film encapsulating methods.
  • a coating method one or more organic or inorganic material layers are deposited on display components inside the display panels (e.g., organic light emitting diodes) to insulate them from external oxygen and moist.
  • a film encapsulating method one or more oxygen-resistant and moist-resistant films are encapsulated over the display components.
  • oxygen and moist are mainly insulated from the top side of the display components. Oxygen and moist can still permeate into the display components from the lateral sides of the display components, resulting deteriorated properties.
  • the present disclosure provides, inter alia, a display substrate, a display panel, and a display apparatus that substantially obviate one or more of the problems due to limitations and disadvantages of the related art.
  • the present disclosure provides a display panel.
  • the display panel includes a first substrate; and a second substrate facing the first substrate.
  • the first substrate includes a first base substrate; and a first micro-structure layer having a first corrugated surface on a side distal to the first base substrate, the first micro-structure layer in a peripheral area of the first substrate and enclosing a display area of the first substrate.
  • peripheral area refers to an area of a display panel or a display substrate (e.g., an array substrate or a counter substrate) in the display panel where various circuits and wires are provided to transmit signals to the display panel or display substrate.
  • non-transparent or opaque components of the display apparatus e.g., battery, printed circuit board, metal frame
  • display area refers to an area of a display panel or a display substrate (e.g., an array substrate or a counter substrate) in a display panel where image is actually displayed.
  • corrugated surface refers to a non-level surface having a plurality of protrusions and a plurality of concaved portions relative to the plurality of protrusions.
  • a corrugated surface may include a wide variety of periodic or non-periodic structuration, deformation, induced roughness, undulation, texturing or the combination thereof.
  • the plurality of corrugated protrusions are spaced apart by the plurality of concaved portions.
  • the corrugated surface in the context of the present disclosure has a typical distance between two adjacent apexes of the corrugated protrusions in the range of approximately 0.1 mm to approximately 1 mm.
  • the corrugated surface in the context of the present disclosure has a typical distance between two adjacent nadirs of the corrugated concaved portions in the range of approximately 0.1 mm to approximately 1 mm.
  • the corrugated surface in the context of the present disclosure has a typical height difference between an apex of a corrugated protrusion and a nadir of an adjacent corrugated concaved portion in the range of approximately 0.1 mm to approximately 1 mm.
  • FIG. 1 is a schematic diagram illustrating the structure of a display panel in some embodiments according to the present disclosure.
  • the display panel in some embodiments includes a first substrate 101 , and a second substrate 201 facing the first substrate 101 .
  • the first substrate 101 includes a first base substrate 100 and a first micro-structure layer 102 on the first base substrate 100 .
  • the first micro-structure layer 102 has a first corrugated surface on a side distal to the first base substrate 100 .
  • the first micro-structure layer 102 is in a peripheral area PA of the first substrate 101 .
  • the first micro-structure layer 102 encloses a display area DA of the first substrate 101 .
  • the first substrate 101 is an array substrate and the second substrate 201 is a counter substrate facing the array substrate.
  • the first substrate 101 is a counter substrate and the second substrate 201 is an array substrate facing the counter substrate.
  • FIG. 2 is a schematic diagram illustrating the structure of a display panel in some embodiments according to the present disclosure.
  • the first substrate 101 is a counter substrate of the display panel.
  • the first substrate 101 includes a first micro-structure layer 102 in a peripheral area PA of the first substrate 101 .
  • the first micro-structure layer 102 encloses a display area DA of the first substrate 101 .
  • the display panel includes a first micro-structure layer in the first substrate and a second micro-structure layer in the second substrate.
  • FIG. 3 is a schematic diagram illustrating the structure of a display panel in some embodiments according to the present disclosure.
  • the first micro-structure layer 102 on the first base substrate 100 has a first corrugated surface on a side distal to the first base substrate 100
  • the second micro-structure layer 102 ′ on a second base substrate 200 has a second corrugated surface on a side distal to the second base substrate 200 in the second substrate 201 .
  • the first micro-structure layer 102 is in a peripheral area PA of the first substrate 101 and enclosing a display region DA of the first substrate 101
  • the second micro-structure layer 102 ′ is in a peripheral area PA of the second substrate 201 and enclosing a display region DA of the second substrate 201 .
  • the display panel in some embodiments further includes a sealant layer 103 on a side of the first micro-structure layer 102 distal to the first base substrate 100 for sealing the first substrate 101 and the second substrate 201 together to form a cell.
  • the sealant layer 103 is between the first substrate 101 and the second substrate 201 , e.g., between the first micro-structure layer 102 and the second micro-structure layer 102 ′, as depicted in FIG. 3 .
  • the sealant layer 103 and the first micro-structure layer 102 cooperatively seal the first substrate 101 and the second substrate 201 together.
  • a sealant material of the sealant layer 103 is in contact with (e.g., bonded with) the first micro-structure layer 102 .
  • the interface is substantially impermeable to external oxygen or moist.
  • the interface in the present display panel has a corrugated interface, which makes it significantly more difficult for external oxygen and moist to permeate through into the inside of the display panel.
  • the present display panel is highly oxygen-resistant and moist-resistant.
  • the sealant layer 103 forms a first interface with the first micro-structure layer 102 and a second interface with the second micro-structure layer 102 ′.
  • the sealant material of the sealant layer 103 is in contact with (e.g., bonded with) the first micro-structure layer 102 at the first interface and with the second micro-structure layer 102 ′ at the second interface. Because both the first interface and the second interface are corrugated interfaces that are difficult for external oxygen and moist to permeate through, the display panel is sealed tight on both sides of the sealant layer 103 .
  • the oxygen-resistant and moist-resistant properties of the display panel can be further enhanced.
  • the display panel in some embodiments further includes a desiccant material layer 104 in the peripheral area PA of the first substrate 101 and in an area enclosed by the sealant layer 103 .
  • the desiccant material layer 104 is on a side of the sealant layer 103 proximal to the display area DA.
  • the desiccant material layer 104 in some embodiments is on a side of the first micro-structure layer 102 distal to the first base substrate 100 .
  • the desiccant material layer 104 is between the first substrate 101 and the second substrate 201 , e.g., between the first micro-structure layer 102 and the second micro-structure layer 102 ′, as depicted in FIG. 3 .
  • the desiccant material layer 104 is made of a desiccant material. Examples of appropriate desiccant materials include, but are not limited to, copper sulfate and magnesium sulfate.
  • the display panel is an organic light emitting diode display panel
  • the first substrate 101 is an array substrate of the organic light emitting diode display panel.
  • the first substrate 101 further includes a first base substrate 100 , an organic light emitting layer 105 on the first base substrate 100 , and an encapsulating layer 106 on a side of the organic light emitting layer 105 distal to the first base substrate 100 .
  • the first substrate 101 further includes a quantum dots layer 107 on a side of the encapsulating layer 106 distal to the organic light emitting layer 105 . By having a quantum dots layer 107 , the light emission intensity of the present display panel may be enhanced.
  • the first micro-structure layer 102 and the second micro-structure layer 102 ′ are layers having a plurality of micro-structures.
  • the plurality of micro-structures in a micro-structure layer may be arranged in an orderly fashion on the substrate.
  • the plurality of micro-structures in a micro-structure layer may be arranged in an irregular fashion on the substrate.
  • the plurality of micro-structures in a micro-structure layer may be randomly arranged on the substrate.
  • the micro-structure layer (e.g., the first micro-structure layer 102 and the second micro-structure layer 102 ′) includes an array of a plurality of micro-structures.
  • FIG. 4 is a schematic diagram illustrating the structure a micro-structure layer in some embodiments according to the present disclosure.
  • the micro-structure layer in some embodiments includes a plurality of convex portions 301 .
  • FIG. 5 is a schematic diagram illustrating the structure a micro-structure layer in some embodiments according to the present disclosure. Referring to FIG. 5 , the micro-structure layer in some embodiments includes a plurality of concaved portions 401 .
  • the first micro-structure layer in the first substrate includes a plurality of convex portions 301 .
  • the first micro-structure layer in the first substrate includes a plurality of concaved portions 401 .
  • the second micro-structure layer in the second substrate includes a plurality of convex portions 301 .
  • the second micro-structure layer in the second substrate includes a plurality of concaved portions 401 .
  • the first micro-structure layer in the first substrate includes a plurality of convex portions 301
  • the second micro-structure layer in the second substrate includes a plurality of convex portions 301
  • the first micro-structure layer in the first substrate includes a plurality of concaved portions 401
  • the second micro-structure layer in the second substrate includes a plurality of concaved portions 401
  • the first micro-structure layer in the first substrate includes a plurality of convex portions 301
  • the second micro-structure layer in the second substrate includes a plurality of concaved portions 401
  • the first micro-structure layer in the first substrate includes a plurality of concaved portions 401
  • the second micro-structure layer in the display substrate includes a plurality of convex portions 301 .
  • the plurality of micro-structures in a micro-structure layer may be arranged in an orderly fashion on the substrate.
  • distances between the plurality of micro-structures are substantially the same.
  • distances between the plurality of micro-structures are in a range of approximately 0.1 mm to approximately 1 mm, e.g., approximately 0.5 mm.
  • each of the plurality of micro-structures has a curved cross-section (as shown in FIGS. 4 and 5 ).
  • each of the plurality of micro-structures has a cross-section of a substantially semi-circular shape.
  • each of the plurality of micro-structures has a cross-section having a shape of a portion of a circle (as shown in FIGS. 4 and 5 ).
  • the plurality of micro-structures have a substantially the same radius.
  • the pattern and dimensions of the micro-structures may be designed based on the frame width of the display panel. For example, in a display panel having a small frame width, the micro-structures may be designed to have a relatively smaller size, e.g., each of the plurality of micro-structures having a relatively small radius.
  • At least one micro-structure layer is formed on at least one of the substrates.
  • the sealant layer and the micro-structure layer cooperatively seal the substrates together.
  • a sealant material of the sealant layer is in contact with (e.g., bonded with) the micro-structure layer.
  • the interface is substantially impermeable to external oxygen or moist.
  • the interface in the present display panel has a corrugated interface, which makes it significantly more difficult for external oxygen and moist to permeate through into the inside of the display panel.
  • the present display panel is highly oxygen-resistant and moist-resistant.
  • the sealant layer forms a first interface with the first micro-structure layer and a second interface with the second micro-structure layer.
  • the sealant material of the sealant layer is in contact with (e.g., bonded with) the first micro-structure layer at the first interface and with the second micro-structure layer at the second interface. Because both the first interface and the second interface are corrugated interfaces that are difficult for external oxygen and moist to permeate through, the display panel is sealed tight on both sides of the sealant layer. The oxygen-resistant and moist-resistant properties of the display panel can be further enhanced.
  • the moist trapped inside the space can be further reduced or eliminated, leading to the longer life time of the display panel.
  • the light emission intensity of the present display panel can be further enhanced.
  • the pattern and dimensions of the micro-structures may be designed based on a desired frame width of the display panel. For example, in a display panel having a small frame width, the micro-structures may be designed to have a relatively smaller size, e.g., each of the plurality of micro-structures having a relatively small radius.
  • the display panel is an organic light emitting diode display panel.
  • the display panel is a liquid crystal display panel.
  • FIG. 6 is a flow chart illustrating a method of fabricating a display panel in some embodiments according to the present disclosure.
  • the method in some embodiments includes forming a first substrate and forming a second substrate facing the first substrate.
  • the step of forming the first substrate includes forming a first micro-structure layer on a first base substrate, the first micro-structure layer formed to have a first corrugated surface on a side distal to the first base substrate, the first micro-structure layer formed in a peripheral area of the first substrate and enclosing a display area of the first substrate.
  • a micro-structure layer having a plurality of micro-structures may be fabricated by a lithography method.
  • the plurality of micro-structures may be formed in a molding process using a molding plate.
  • the micro-structure layer may be formed by a deposition method, e.g., using a plasma-enhanced chemical vapor deposition (PECVD) process.
  • PECVD plasma-enhanced chemical vapor deposition
  • Examples of appropriate materials for making the micro-structure layer include, but are not limited to, inorganic insulating materials and organic insulating materials.
  • inorganic insulating materials include, but are not limited to, silicon oxide, silicon nitride (e.g., Si 3 N 4 ), silicon oxynitride (SiO x N y ).
  • organic insulating materials include, but are not limited to, resins, polyimide, etc.
  • the step of forming the first substrate includes forming a first micro-structure layer on a first base substrate
  • the step of forming the second substrate includes forming a second micro-structure layer on a second base substrate.
  • the first micro-structure layer is formed to have a first corrugated surface on a side distal to the first base substrate
  • the second micro-structure layer is formed to have a second corrugated surface on a side distal to the second base substrate.
  • the first micro-structure layer is formed in a peripheral area of the first substrate and enclosing a display region of the first substrate.
  • the second micro-structure layer is formed in a peripheral area of the second substrate and enclosing a display region of the second substrate.
  • the method further includes forming a sealant layer on a side of the first micro-structure layer distal to the first base substrate for sealing the first substrate and the second substrate together to form a cell.
  • the sealant layer is formed between the first substrate and the second substrate, e.g., between the first micro-structure layer and the second micro-structure layer.
  • sealants include a UV curable sealant (e.g., an epoxy resin), a low-temperature heat curable sealant, and a laser curable sealant.
  • the method further includes forming a desiccant material layer in the peripheral area of the first substrate and in an area enclosed by the sealant layer.
  • the desiccant material layer is formed on a side of the sealant layer proximal to the display area.
  • the desiccant material layer is formed on a side of the first micro-structure layer distal to the first base substrate.
  • the desiccant material layer is formed between the first substrate and the second substrate, e.g., between the first micro-structure layer and the second micro-structure layer.
  • the display panel is an organic light emitting diode display panel
  • the first substrate is an array substrate of the organic light emitting diode display panel.
  • the step of forming the first substrate includes forming an organic light emitting layer on a base substrate, and forming an encapsulating layer on a side of the organic light emitting layer distal to the first base substrate.
  • the step of forming the first substrate further includes forming a quantum dots layer on a side of the encapsulating layer distal to the organic light emitting layer.
  • quantum dots materials may be incorporated into a polymer matrix, and the mixture of the quantum dots materials and the polymer matrix is deposited on the substrate, e.g., on a side of the encapsulating layer distal to the organic light emitting layer.
  • appropriate quantum dots materials include, but are not limited to, selanylidenecadmium (CdSe) quantum dots.
  • the step of forming the first micro-structure layer includes forming an array of a plurality of micro-structures.
  • the plurality of micro-structures are a plurality of convex portions.
  • the plurality of micro-structures are a plurality of concaved portions.
  • the first micro-structure layer (or the second micro-structure layer) is formed so that distances between the plurality of micro-structures are substantially the same.
  • distances between the plurality of micro-structures are in a range of approximately 0.1 mm to approximately 1 mm, e.g., approximately 0.5 mm.
  • each of the plurality of micro-structures is formed to have a curved cross-section.
  • each of the plurality of micro-structures is formed to have a cross-section of a substantially semi-circular shape.
  • each of the plurality of micro-structures is formed to have a cross-section having a shape of a portion of a circle.
  • the plurality of micro-structures are formed to have a substantially the same radius.
  • the pattern and dimensions of the micro-structures may be formed based on the frame width of the display panel. For example, in a display panel having a small frame width, the micro-structures may be formed to have a relatively smaller size, e.g., each of the plurality of micro-structures formed to have a relatively small radius.
  • the present disclosure provides a display apparatus having a display panel described herein or fabricated by a method described herein.
  • appropriate display apparatuses include, but are not limited to, an electronic paper, a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital album, a GPS, etc.
  • the display apparatus is an organic light emitting diode display apparatus.
  • the display apparatus is a liquid crystal display apparatus.
  • At least one micro-structure layer is formed on at least one of the substrates.
  • the sealant layer and the micro-structure layer cooperatively seal the two substrates of the display apparatus together.
  • a sealant material of the sealant layer is in contact with (e.g., bonded with) the micro-structure layer.
  • the interface is substantially impermeable to external oxygen or moist.
  • the interface in the present display panel has a corrugated interface, which makes it significantly more difficult for external oxygen and moist to permeate through into the inside of the display apparatus.
  • the present display apparatus is highly oxygen-resistant and moist-resistant.
  • the sealant layer forms a first interface with the first micro-structure layer and a second interface with the second micro-structure layer.
  • the sealant material of the sealant layer is in contact with (e.g., bonded with) the first micro-structure layer at the first interface and with the second micro-structure layer at the second interface. Because both the first interface and the second interface are corrugated interfaces that are extremely difficult for external oxygen and moist to permeate through, the display apparatus is sealed tight on both sides of the sealant layer.
  • the oxygen-resistant and moist-resistant properties of the display apparatus can be further enhanced.
  • the moist trapped inside the space can be further reduced or eliminated, leading to the longer life time of the display apparatus.
  • the light emission intensity of the present display apparatus can be further enhanced.
  • the pattern and dimensions of the micro-structures may be designed based on a desired frame width of the display apparatus. For example, in a display apparatus having a small frame width, the micro-structures may be designed to have a relatively smaller size, e.g., each of the plurality of micro-structures having a relatively small radius.
  • the present disclosure provides a display substrate.
  • the display substrate includes a base substrate and a micro-structure layer on the base substrate in a peripheral area of the display substrate, the micro-structure layer having a corrugated surface on a side distal to the base substrate, and the micro-structure layer enclosing a display region of the display substrate.
  • the micro-structure layer includes a plurality of convex portions.
  • the micro-structure layer includes a plurality of concaved portions.
  • the display substrate is an array substrate.
  • the display substrate is a counter substrate.
  • the display substrate is an array substrate in an organic light emitting diode display panel.
  • the display substrate further includes a base substrate; an organic light emitting layer on the base substrate; an encapsulating layer on a side of the light emitting layer distal to the base substrate; and a quantum dots layer on a side of the encapsulating layer distal to the light emitting layer.
  • the micro-structure layer includes a plurality of micro-structures.
  • the plurality of micro-structures in a micro-structure layer may be arranged in an orderly fashion on the display substrate.
  • the plurality of micro-structures in a micro-structure layer may be arranged in an irregular fashion on the display substrate.
  • the plurality of micro-structures in a micro-structure layer may be randomly arranged on the display substrate.
  • the micro-structure layer includes an array of a plurality of micro-structures.
  • distances between the plurality of micro-structures are substantially the same.
  • distances between the plurality of micro-structures are in a range of approximately 0.1 mm to approximately 1 mm, e.g., approximately 0.5 mm.
  • each of the plurality of micro-structures has a curved cross-section.
  • each of the plurality of micro-structures has a cross-section of a substantially semi-circular shape.
  • each of the plurality of micro-structures has a cross-section having a shape of a portion of a circle.
  • the plurality of micro-structures have a substantially the same radius.
  • the term “the invention”, “the present invention” or the like does not necessarily limit the claim scope to a specific embodiment, and the reference to exemplary embodiments of the invention does not imply a limitation on the invention, and no such limitation is to be inferred.
  • the invention is limited only by the spirit and scope of the appended claims. Moreover, these claims may refer to use “first”, “second”, etc. following with noun or element. Such terms should be understood as a nomenclature and should not be construed as giving the limitation on the number of the elements modified by such nomenclature unless specific number has been given. Any advantages and benefits described may not apply to all embodiments of the invention.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Geometry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
US15/560,898 2016-07-19 2017-03-31 Display substrate, display panel, and display apparatus Abandoned US20180254432A1 (en)

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CN201610571225.1 2016-07-19
PCT/CN2017/078908 WO2018014587A1 (en) 2016-07-19 2017-03-31 Display substrate, display panel, and display apparatus

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CN108292712B (zh) 2020-10-30
CN106025092B (zh) 2018-05-25
KR20180029956A (ko) 2018-03-21
US10658612B2 (en) 2020-05-19
EP3488478A4 (en) 2020-05-27
EP3488478B1 (en) 2023-04-19
EP3488477A1 (en) 2019-05-29
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JP2019527843A (ja) 2019-10-03
KR101989417B1 (ko) 2019-06-17

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