US20150098788A1 - Substrate transfer chamber and container connecting mechanism - Google Patents

Substrate transfer chamber and container connecting mechanism Download PDF

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Publication number
US20150098788A1
US20150098788A1 US14/507,724 US201414507724A US2015098788A1 US 20150098788 A1 US20150098788 A1 US 20150098788A1 US 201414507724 A US201414507724 A US 201414507724A US 2015098788 A1 US2015098788 A1 US 2015098788A1
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US
United States
Prior art keywords
lid
container
main body
container connecting
foup
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/507,724
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English (en)
Inventor
Shinji Wakabayashi
Keisuke Kondoh
Sensho Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KOBAYASHI, SENSHO, KONDOH, KEISUKE, WAKABAYASHI, SHINJI
Publication of US20150098788A1 publication Critical patent/US20150098788A1/en
Priority to US15/428,896 priority Critical patent/US10229847B2/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G65/00—Loading or unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0297—Wafer cassette

Definitions

  • the present invention relates to a substrate transfer chamber and a container connecting mechanism.
  • a plasma processing system for performing plasma processing on a substrate e.g., a semiconductor wafer (hereinafter, simply referred to as “wafer”) includes a process module serving as a vacuum plasma processing chamber, and a loader module serving as an atmospheric transfer chamber for loading and unloading the wafer into and from a container, e.g., a front opening unified pod (FOUP), accommodating a plurality of wafers.
  • a process module serving as a vacuum plasma processing chamber
  • a loader module serving as an atmospheric transfer chamber for loading and unloading the wafer into and from a container, e.g., a front opening unified pod (FOUP), accommodating a plurality of wafers.
  • FOUP front opening unified pod
  • the wafer is unloaded from the FOUP connected to a container connecting mechanism (load port) of the loader module and then loaded into the process module through the loader module, a load-lock module serving as an atmosphere/vacuum switchable chamber and a transfer module serving as a vacuum transfer chamber.
  • the plasma processing system generally includes a plurality of process modules. Therefore, the loader module has a plurality of, e.g., three, load ports to simultaneously load wafers into the respective process modules.
  • the load ports are arranged linearly on one side surface of a housing-shaped loader module (see, e.g., Japanese Patent Application Publication No. 2006-261456).
  • the number of process modules of the plasma processing system increases in view of throughput improvement.
  • a plasma processing system including six process modules.
  • different processes may be performed in the respective process modules depending on the modes of the respective process modules.
  • the process modules and wafer lots are made to correspond to one another, and each of the process modules may process only wafers in a lot corresponding thereto.
  • wafers are transferred between a load port and a single process module without being sequentially transferred between the process modules.
  • load ports are preferably provided such that the number of the load ports is equal to or greater than the number of process modules.
  • the loader module has at least seven load ports.
  • the present invention provides a substrate transfer chamber and a container connecting mechanism, capable of reducing increase in a foot print.
  • a substrate transfer chamber to which a plurality of containers accommodating substrates is connected, for unloading the substrates from the containers, including: a housing-shaped main body; and a plurality of container connecting mechanisms to which the containers are connected.
  • some of the container connecting mechanisms are arranged on top of one another in a height direction of the main body.
  • FIG. 1 is a top view schematically showing a configuration of a substrate processing system including a substrate transfer chamber (loader module) in accordance with an embodiment of the present invention
  • FIG. 2 is a front view schematically showing a configuration of the loader module shown in FIG. 1 ;
  • FIG. 3 is a side view schematically showing the configuration of the loader module shown in FIG. 1 , as seen from a direction of an arrow in FIG. 2 ;
  • FIGS. 4A and 4B show a configuration of a pair of an upper and a lower load port shown in FIGS. 2 and 3 , wherein FIG. 4A is a side view and FIG. 4B is a front view;
  • FIGS. 5A and 5B schematically show a configuration of a modification of the upper load port, wherein FIG. 5A is a rear view and FIG. 5B is a side view;
  • FIG. 6 is a front view schematically showing a configuration of the modification of the loader module.
  • FIG. 7 is a side view schematically showing the modification of the loader module, as seen from a direction of an arrow in FIG. 6 .
  • FIG. 1 is a top view schematically showing a configuration of a substrate processing system including a substrate transfer chamber (loader module) in accordance with an embodiment of the present invention.
  • a substrate transfer chamber loader module
  • FIG. 1 components in the system are illustrated to be seen through for convenience of explanation.
  • a substrate processing system 10 includes: a transfer module 11 serving as a vacuum transfer chamber formed in a substantially heptagonal shape when seen from the top; six process modules 13 a to 13 f , serving as vacuum plasma processing chambers, which are arranged radially around the transfer module 11 and connected to the transfer module 11 through gate valves 12 ; two load-lock modules 14 , serving as atmosphere/vacuum switchable chambers, which are connected to one side surface of the transfer module 11 where the process modules 13 a to 13 f are not connected; and a loader module 15 , serving as an atmospheric transfer chamber, which is connected to the load-lock modules 14 at the opposite side to the transfer module 11 .
  • the transfer module 11 has therein a transfer mechanism 16 for transferring a wafer W between the process modules 13 a to 13 f or between the process modules 13 a to 13 f and the load-lock modules 14 .
  • a pressure in the transfer module 11 is depressurized to a predetermined vacuum level.
  • Each of the process modules 13 a to 13 f has a single stage 17 for mounting thereon the wafer W.
  • a pressure in the respective process modules 13 a to 13 f is depressurized to a predetermined vacuum level.
  • a predetermined plasma process e.g., dry etching, is performed on the wafer W mounted on the stage 17 .
  • the loader module 15 has a transfer robot 19 for transferring the wafer W between the load-lock modules 14 and FOUPs 18 , each accommodating a plurality of wafers W.
  • a pressure in the loader module 15 is maintained at an atmospheric pressure.
  • Each of the load-lock modules 14 has a stage 20 for mounting thereon the wafer W.
  • the inner space of each load-lock module 14 can be switched between an atmospheric environment and a depressurized environment. For example, when the wafer W is transferred by using the transfer robot 19 in the loader module 15 , the inner space of the load-lock module 14 is switched to the atmospheric environment to communicate with the inner space of the loader module 15 . Further, when the wafer W is transferred by using the transfer mechanism 16 in the transfer module 11 , the inner space of the load-lock module 14 is switched to the depressurized environment to communicate with the inner space of the transfer module 11 . In other words, the inner spaces of the load-lock modules 14 are switched between the atmospheric environment and the depressurized environment, and the wafer W is transferred between the transfer module 11 and the loader module 15 via the load-lock modules 14 .
  • FIG. 2 is a front view schematically showing a configuration of the loader module shown in FIG. 1 .
  • FIG. 3 is a side view schematically showing the configuration of the loader module, as seen from a direction of an arrow in FIG. 2 .
  • the loader module 15 further includes a main body 21 having a hexagonal housing shape when seen from the top, and a plurality of load ports 22 each serving as a container connecting mechanism for connecting the FOUP 18 to the main body 21 .
  • the load ports 22 are disposed at a side surface 21 a of the loader module 15 opposite to a side surface of the loader module 15 where the load-lock modules 14 are connected and at two side surfaces 21 b and 21 c adjacent to the side surface 21 a . Further, the load ports 22 are arranged on top of one another in a height direction of the main body 21 (hereinafter, simply referred to as “height direction”). In the present embodiment, the load ports 22 are classified into lower load ports 22 a and upper load ports 22 b , for convenience. Two pairs of lower and upper load ports 22 a and 22 b are disposed at the side surface 21 a , and one pair of lower and upper load port 22 a and 22 b is disposed at each of the side surfaces 21 b and 21 c.
  • Each of the load ports 22 includes a plate-shaped stage 23 extending in a horizontal direction from the main body 21 , and a FOUP connecting port 24 (container connecting port) that opens at a portion of the main body 21 so as to face the FOUP 18 mounted on the stage 23 .
  • the FOUP connecting port 24 is generally blocked by a shutter (not shown) or the like. However, when the FOUP 18 is mounted on the stage 23 and connected to the FOUP connecting port 24 , the FOUP connecting port 24 opens and a lid 18 a of the FOUP 18 which will be described later faces the FOUP connecting port 24 .
  • a port 25 a or a buffer 25 b extending in a horizontal direction from the main body 21 is provided above each pair of lower and upper load ports 22 a and 22 b .
  • Each buffer 25 b is configured to temporarily place thereon the FOUP 18 transferred by a FOUP transfer unit 26 to be described later.
  • the loader module 15 includes two FOUP transfer units (container transfer units) that are disposed at a corner 21 d (see FIG. 1 ) formed by the side surfaces 21 a and 21 b of the main body 21 and a corner 21 e (see FIG. 1 ) formed by the side surfaces 21 a and 21 c of the main body 21 .
  • Each of the FOUP transfer unit 26 includes: a column 27 standing upright in the height direction; a base 28 attached at the column 27 and movable in the height direction; a rotation base 29 disposed at the base 28 and rotatable on a horizontal plane; a SCARA type arm 30 installed at a position offset from the center of the rotation base 29 ; a coupling portion 31 provided at the leading end of the arm 30 and to be coupled to an upper portion of the FOUP 18 .
  • the FOUP transfer unit 26 transfers the FOUP 18 between the load ports 22 , the ports 25 a and the buffers 25 b by the vertical movement of the base 28 , the rotation of the rotation base 29 , and the extension/contraction of the arm 30 .
  • FIGS. 4A and 4B show the configuration of the pair of the lower and the upper load port in FIGS. 2 and 3 .
  • FIG. 4A is a side view and FIG. 4B is a front view.
  • the main body is omitted.
  • a lid-open-state is indicated by a dashed line.
  • FIG. 4B a lower lid-opening mechanism and an upper lid-opening mechanism which will be described later are indicated by dashed lines.
  • the lower load port 22 a has a lower lid-opening mechanism 32 a that is disposed inside the main body 21 to detach the lid 18 a of the FOUP 18 facing the FOUP connecting port 24 and move the detached lid 18 a in a downward direction in FIGS. 4A and 4B .
  • the upper load port 22 b has an upper lid-opening mechanism 33 a that is disposed inside the main body 21 to detach the lid 18 a of the FOUP 18 facing the FOUP connecting port 24 and move the detached lid 18 a in an upward direction in FIGS. 4A and 4B .
  • the lower lid-opening mechanism 32 a includes: a coupling portion 32 b to be coupled to the lid 18 a ; a rod 32 c , which is connected to the coupling portion 32 b to extend and contract in the height direction; a driving unit 32 d for driving the rod 32 c .
  • the upper lid-opening mechanism 33 a includes a coupling portion 33 b to be coupled to the lid 18 a ; a rod 33 c , which is connected to the coupling portion 33 b to extend and contract in the height direction; and a driving unit 33 d for driving the rod 33 c.
  • the lower lid-opening mechanism 32 a of the upper one of the two lower load ports 22 a needs to be provided above the lower one of the two lower load ports 22 a . Since the FOUP connecting port 24 of the lower load port 22 a is disposed above the lower lid-opening mechanism 32 a , the FOUP connecting port 24 of the upper one of the two lower load ports 22 a needs to open at the upper portion of the main body 21 . However, a space is required near the upper portion of the main body 21 to ensure a moving path of a container transfer unit (not shown) moving in a ceiling container transfer system (not shown).
  • the upper load port 22 b having the upper lid-opening mechanism 33 a is arranged above the lower load ports 22 a . Since the FOUP connecting port 24 of the upper load port 22 b is disposed below the upper lid-opening mechanism 33 a , it is possible to arrange the upper load port 22 b above the lower load port 22 a while ensuring a space near the upper portion of the main body 21 .
  • FIGS. 5A and 5B schematically show a configuration of a modification of the upper load port.
  • FIG. 5A is a rear view and FIG. 5B is a side view.
  • the main body is omitted, and the lid-open-state is indicated by dashed lines.
  • the upper load port 34 has a lid-opening mechanism 35 , in addition to the FOUP connecting port 24 , the stage 23 and the like, which is disposed inside the main body 21 to detach the lid 18 a of the FOUP 18 facing the FOUP connecting port 24 and move the detached lid 18 a in an inclined downward direction in FIG. 5A .
  • the lid-opening mechanism 35 includes: a coupling portion 35 a to be coupled to the lid 18 a ; two swing arms 35 b connected to the coupling portion 35 a and arranged in parallel to each other in the height direction; and a driving unit 35 c for driving the two swing arms 35 b .
  • Each of the two swing arms 35 b swings about one end thereof on a plane in the height direction (vertical plane), thereby moving the coupling portion 35 a together with the lid 18 a in the inclined downward direction in FIG. 5A .
  • the rod 32 c needs to be extended in a height direction by a distance greater than or equal to the height of the lid 18 a in order to remove the lid 18 a from the FOUP connecting port 24 and open the FOUP connecting port 24 .
  • the rod 32 c and the driving unit 32 d need to be arranged linearly along the height direction in order to drive the rod 32 c in the height direction.
  • the lower lid-opening mechanism 32 a requires a predetermined length in the height direction.
  • the lid 18 a is removed by swing operation of the two swing arms 35 b .
  • the driving unit 35 c and the two swing arms 35 b linearly along the height direction. Accordingly, the length of the lid-opening mechanism 35 in the height direction does not need to be as large as that of the lower lid-opening mechanism 32 a.
  • the upper load port 34 instead of the upper load port 22 b , can be arranged above the lower load ports 22 a while ensuring a space near the upper portion of the main body 21 .
  • the lid-opening mechanisms 33 a and 35 of the respective upper load ports 22 b and 34 remove the lid 18 a of the FOUP 18 from the FOUP connecting port 24 in an upward or an inclined downward direction. Therefore, the upper load port 22 b or can be arranged above the lower load port 22 a in the height direction. In other words, in the loader module 15 , the upper load port 22 b or 34 can be arranged above the lower load port 22 a in the height direction, and thus it is unnecessary to expand the main body 21 in the width direction to install a plurality of load ports 22 . Accordingly, the increase in the foot print of the loader module 15 can be reduced.
  • a plurality of load ports 22 is separately arranged at the side surfaces 21 a to 21 c of the main body 21 . Hence, it is unnecessary to expand only one side surface of the main body 21 in the width direction to install the plurality of load ports 22 .
  • two FOUP transfer units 26 are disposed at the corner 21 d formed by the side surfaces 21 a and 21 b and the corner 21 e formed by the side surfaces 21 a and 21 c .
  • the FOUP 18 can be smoothly transferred to each of the load ports 22 even in case where the load ports 22 are separately arranged at the side surfaces 21 a to 21 c.
  • the load module 15 does not necessarily have eight load ports 22 .
  • the number of load ports 22 may be at least greater than or equal to the number of process modules 13 .
  • the loader module 15 may have seven load ports 22 . In this case, two lower load ports 22 a and one upper load port 22 b are arranged at the side surface 21 a.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Robotics (AREA)
  • Drying Of Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Mechanical Engineering (AREA)
US14/507,724 2013-10-07 2014-10-06 Substrate transfer chamber and container connecting mechanism Abandoned US20150098788A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/428,896 US10229847B2 (en) 2013-10-07 2017-02-09 Substrate transfer chamber and container connecting mechanism with lid opening mechanisms

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013210090A JP6235294B2 (ja) 2013-10-07 2013-10-07 基板搬送室及び容器接続機構
JP2013-210090 2013-10-07

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US15/428,896 Continuation US10229847B2 (en) 2013-10-07 2017-02-09 Substrate transfer chamber and container connecting mechanism with lid opening mechanisms

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US14/507,724 Abandoned US20150098788A1 (en) 2013-10-07 2014-10-06 Substrate transfer chamber and container connecting mechanism
US15/428,896 Active US10229847B2 (en) 2013-10-07 2017-02-09 Substrate transfer chamber and container connecting mechanism with lid opening mechanisms

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US (2) US20150098788A1 (zh)
JP (1) JP6235294B2 (zh)
KR (1) KR101817391B1 (zh)
TW (1) TWI630161B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9728431B2 (en) * 2015-09-29 2017-08-08 Hitachi Kokusai Electric Inc. Method of manufacturing semiconductor device
US10354903B2 (en) * 2014-09-05 2019-07-16 Rorze Corporation Load port and load port atmosphere replacing method
CN111312576A (zh) * 2018-12-12 2020-06-19 东京毅力科创株式会社 基片处理系统、输送方法、输送程序和保持器具

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Publication number Priority date Publication date Assignee Title
JP7018779B2 (ja) 2018-02-13 2022-02-14 東京エレクトロン株式会社 基板搬送装置および基板処理システム
JP2020131308A (ja) * 2019-02-14 2020-08-31 オークマ株式会社 工作機械における自動パレット交換装置

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US9728431B2 (en) * 2015-09-29 2017-08-08 Hitachi Kokusai Electric Inc. Method of manufacturing semiconductor device
CN111312576A (zh) * 2018-12-12 2020-06-19 东京毅力科创株式会社 基片处理系统、输送方法、输送程序和保持器具

Also Published As

Publication number Publication date
US10229847B2 (en) 2019-03-12
TW201527196A (zh) 2015-07-16
TWI630161B (zh) 2018-07-21
JP6235294B2 (ja) 2017-11-22
KR20150040762A (ko) 2015-04-15
US20170154799A1 (en) 2017-06-01
JP2015076432A (ja) 2015-04-20
KR101817391B1 (ko) 2018-01-10

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