US20150065019A1 - Dressing device, chemical mechanical polishing apparatus including the same, and dresser disc used in the same - Google Patents

Dressing device, chemical mechanical polishing apparatus including the same, and dresser disc used in the same Download PDF

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Publication number
US20150065019A1
US20150065019A1 US14/471,481 US201414471481A US2015065019A1 US 20150065019 A1 US20150065019 A1 US 20150065019A1 US 201414471481 A US201414471481 A US 201414471481A US 2015065019 A1 US2015065019 A1 US 2015065019A1
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United States
Prior art keywords
disc
dresser
holder
dressing
dressing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/471,481
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English (en)
Inventor
Hiroyuki Shinozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
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Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Assigned to EBARA CORPORATION reassignment EBARA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHINOZAKI, HIROYUKI
Publication of US20150065019A1 publication Critical patent/US20150065019A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor

Definitions

  • a chemical mechanical polishing apparatus (hereinafter referred to as a CMP (Chemical Mechanical Polishing) apparatus) is used for planarization of a surface of a semiconductor wafer or the like.
  • the CMP apparatus includes, for example, a polishing table 11 having a polishing pad 10 at an upper surface and a top ring 12 which holds a substrate, such as a semiconductor wafer, as shown in FIG. 16 .
  • a surface of a substrate held in the top ring 12 can be polished by rotating the polishing pad 10 and the top ring 12 in respective directions of arrows and pressing the substrate against the polishing pad 10 with predetermined pressure while supplying a polishing liquid onto the polishing pad 10 .
  • an alkaline solution with fine particles of, e.g., silica suspended therein as abrasive grains can be used as the polishing liquid.
  • the surface of the substrate is planarized not only through polishing using the polishing pad but also by chemical polishing action of an alkali in the polishing liquid and mechanical polishing action of abrasive grains.
  • the polishing pad 10 becomes smooth, and the polishing performance decreases due to adherence of abrasive grains, polishing waste, and the like to the polishing pad 10 .
  • dressing teething
  • the CMP apparatus may be provided with a dressing device 13 .
  • the dressing device 13 includes, for example, a rotatable holder 14 and a dresser disc which is mounted to the holder.
  • a bottom surface of the dresser disc is a dressing surface, and diamond particles or the like are electrodeposited on the dressing surface.
  • the dressing device 13 can dress the polishing pad 10 and remove abrasive grains, polishing waste, and the like adhering to the polishing pad 10 by rubbing the dressing surface against the polishing pad while rotating the dressing surface.
  • Japanese Patent Laid-Open No. 2001-121417 discloses a conditioning disc (corresponding to a dresser disc) which has diamond particles electrodeposited in a ring-like pattern on a surface of a base metal and can sufficiently scrape out polishing waste.
  • Japanese Patent Laid-Open No. 2010-172996 discloses a dressing device including a spherical bearing which allows a dressing member (corresponding to a dresser disc) to tilt with respect to a dresser driving shaft and a spring mechanism which generates force against tilting motion of the dressing member and free of partial wear of a polishing pad.
  • Japanese Patent Laid-Open No. 2012-250309 discloses a method for monitoring a polishing surface of a polishing pad by producing a height distribution within the polishing surface through repetition of measurement of the height of the polishing surface and calculation of the position of a measurement point during conditioning of the polishing surface.
  • planarization of a polishing pad is achieved through various methods in order to implement miniaturization and complication of semiconductor devices.
  • a conventional dressing device has, for example, a configuration in which the holder 14 and a dresser disc 15 are coupled with a fixture 16 , such as a fixing screw or a pin in the shape of a round bar to transmit running torque of the holder 14 to the dresser disc 15 , as shown in FIG. 17 (FIG. 4 of Japanese Patent Laid-Open No. 2010-172996).
  • the transmission of running torque to the dresser disc 15 through the fixture 16 may cause stress to concentrate locally on the fixture 16 and its vicinity.
  • rotation of the dresser disc 15 may become subtly wobbly and may fail to maintain horizontal rotation.
  • the status of contact with the polishing pad 10 may change microscopically to affect dressing of the polishing pad 10 .
  • the embodiment relates to a dressing device for dressing a polishing pad used to polish an object to be polished, such as a semiconductor wafer, a chemical mechanical polishing apparatus including the dressing device, and a dresser disc used in the dressing device, and the embodiment proposes a dressing device capable of remedying wobbly rotation of a dresser disc, a CMP apparatus including the dressing device, and a dresser disc used in the dressing device.
  • a dressing device for dressing a polishing pad including a holder which can be coupled to a dresser driving shaft capable of rotating and moving upward and downward, a dresser disc which can be mounted to the holder and has a dressing surface to be rubbed against a polishing pad, a set of concave and convex torque transmitting sections extending in a disc radial direction which are formed at the holder and the dresser disc and fit together when the dresser disc is mounted to the holder, and a set of contact surfaces in the shapes of flat surfaces which are formed as one surfaces around the set of torque transmitting sections and come into surface-to-surface contact at the time of transmitting torque of the dresser driving shaft.
  • one on the dresser disc side can be formed in a groove-like shape, and one on the holder side can be formed in a ridge-like shape. Additionally, at least one pair of the sets of torque transmitting sections can be formed symmetrically with respect to a rotation center of the dresser disc in a disc plan view.
  • the set of contact surfaces can be formed on a straight line passing through the rotation center of the dresser disc in a disc plan view.
  • the set of contact surfaces can be formed at an angle not more than 13° with respect to a straight line passing through the rotation center of the dresser disc in a disc plan view.
  • the holder can have a peripheral wall section provided at an outer periphery which protrudes downward and can have a disc storage section formed inside the peripheral wall section which can store the dresser disc.
  • the set of torque transmitting sections can be formed such that a width on the disc outer edge side is not more than 1 ⁇ 2 of a distance from an inner end point of the set of contact surfaces to the rotation center in a disc plan view.
  • the set of contact surfaces can be formed such that a length of an edge portion appearing at an upper surface of the dressing disc is not less than 0.4 of a disc radius in a disc plan view.
  • a chemical mechanical polishing apparatus including the above-described dressing device.
  • a dressing disc which is used in a dressing device for dressing a polishing pad and is mountable to a holder that can be coupled to a dresser driving shaft capable of rotating and moving upward and downward, including a concave or convex torque transmitting section extending in a disc radial direction which fits when the dresser disc is mounted to the holder and a contact surface in the shape of a flat surface which is formed as one surface around the torque transmitting section.
  • the convex or concave torque transmitting sections extending in the disc radial direction are formed at the holder and the dresser disc, and the contact surfaces in the shapes of flat surfaces are formed at the torque transmitting sections.
  • the dressing device is configured to be capable of transmitting torque of the dresser driving shaft through surface-to-surface contact at the surfaces. This configuration allows alleviation of stress concentration through distribution of stress and allows easier horizontal rotation of the dresser disc.
  • the dressing device can dress a polishing pad without partial wear.
  • FIG. 1 is a schematic perspective view showing a dressing device according to one embodiment of the embodiment
  • FIG. 2 is a cross-sectional view of a holder, a dresser disc, and their vicinity of the dressing device shown in FIG. 1 ;
  • FIG. 3 is a perspective view showing the holder and the dresser disc
  • FIG. 4 is a bottom view showing a state in which the dresser disc is mounted to the holder
  • FIGS. 5 to 8 are plan views showing respective modifications of the dresser disc
  • FIG. 9 is an enlarged perspective view showing a portion to be fitted and its vicinity of the dresser disc
  • FIG. 10 is an enlarged perspective view showing a torque transmitting section and its vicinity
  • FIGS. 11 to 13 are views for explaining an angle of the torque transmitting section
  • FIG. 14 is a view for explaining the relationship between the width and the position of the torque transmitting section
  • FIG. 15 is a view for explaining the length of a contact surface of the torque transmitting section and a disc radius
  • FIG. 16 is a schematic perspective view showing an example of a conventional CMP apparatus.
  • FIG. 17 is a cross-sectional view showing an example of a conventional dressing device.
  • a dressing device 1 can be used to dress a polishing pad 8 b for polishing a semiconductor substrate or the like, as shown in FIG. 1 .
  • the dressing device 1 includes a dresser driving shaft 2 , a holder 3 , and a dresser disc 4 , as shown in FIG. 2 and the like.
  • the holder 3 is coupled to a lower end portion of the dresser driving shaft 2 , as shown in FIG. 1 .
  • the holder 3 has the dresser disc 4 mounted thereto.
  • the polishing pad 8 b can be dressed by rubbing the dresser disc 4 against the polishing pad 8 b provided on a polishing table 8 a which rotates while horizontally rotating the dresser disc 4 .
  • the dresser driving shaft 2 is supported by a support arm 1 a so as to be capable of moving to an appropriate position.
  • the dressing device 1 is included in a CMP apparatus 8 .
  • the CMP apparatus 8 also includes a top ring 9 which holds a substrate, such as a semiconductor wafer, and the like.
  • the CMP apparatus 8 can polish a surface of the substrate held in the top ring 9 by rotating the top ring 9 and the polishing pad 8 b in respective directions of arrows and pressing the substrate against the polishing pad 8 b with predetermined pressure while supplying a polishing liquid onto the polishing pad 8 b .
  • an alkaline solution with fine particles of, e.g., silica suspended therein as abrasive grains can be used as the polishing liquid.
  • the surface of the substrate is planarized not only through polishing using the polishing pad 8 b but also by chemical polishing action of an alkali in the polishing liquid and mechanical polishing action of abrasive grains.
  • the dresser driving shaft 2 is formed so as to be rotatable and movable upward and downward.
  • the holder 3 can be fixed to a lower end of the dresser driving shaft 2 . Upward/downward movement of the dresser driving shaft 2 lifts/lowers the dresser disc 4 mounted to the holder 3 , which allows adjustment of a load on the polishing pad. Rotation of the dresser driving shaft 2 rotates the dresser disc 4 mounted to the holder 3 , which allows dressing of the polishing pad.
  • the holder 3 is formed in a disc-like shape.
  • the holder 3 is formed such that the upper surface side thereof can be coupled to the lower end portion of the dresser driving shaft 2 and such that the dresser disc 4 can be mounted to the bottom surface side thereof.
  • the material for the holder 3 is not particularly limited and can be selected from among synthetic resins and the like.
  • a circular opening 3 a is formed at the center of the holder 3 , and the holder 3 can be coupled to the dresser driving shaft 2 by fitting the dresser driving shaft 2 into the opening 3 a .
  • a method for coupling to the dresser driving shaft 2 is not limited to this, and a coupling method well known in the art can be used.
  • the holder 3 can be coupled so as to be tiltable with respect to the dresser driving shaft 2 by being fixed through, e.g., a spherical bearing.
  • a bottom surface 3 b of the holder 3 is formed in the shape of a horizontal surface, and a peripheral wall section 3 c which protrudes downward all around the bottom surface 3 b is provided at an outer periphery.
  • a portion inside the peripheral wall section 3 c serves as a disc storage section 3 d to which the dresser disc 4 can be mounted.
  • the peripheral wall section 3 c is formed in a rectangular shape in cross-section, and an inner side surface thereof is formed so as to follow an outer edge of the mounted dresser disc 4 .
  • the provision of the peripheral wall section 3 c positions the dresser disc 4 and allows the dresser disc 4 to be prevented from deviating due to centrifugal force while rotating.
  • a convex fitting portion 5 a which extends in a radial direction is formed at the bottom surface 3 b of the holder 3 and can form a torque transmitting section 6 when fitted into a portion 5 b to be fitted which is formed at the dresser disc 4 .
  • the fitting portion 5 a can also be formed to be concave, which will be described in detail later.
  • the dresser disc 4 is formed in the shape of a discal plate having a circular opening at the center.
  • the dresser disc 4 has a dressing surface 4 a to be rubbed against the polishing pad formed at a bottom surface and is formed such that the upper surface side can be mounted to the holder 3 .
  • the circular opening may not be provided.
  • the dressing surface 4 a is formed in the shape of a circular ring having a fixed width and is formed through electrodeposition or the like to have hard particles of, e.g., diamond.
  • the shape of the dressing surface 4 a is not limited to this, and a shape well known in the art can be adopted.
  • a convex portion of fixed width which protrudes downward at an outer periphery may be formed, and the dressing surface 4 a may be formed at a distal end surface of the convex portion.
  • a method well known in the art can be used to mount the dresser disc 4 to the holder 3 . It is preferable to bury a magnet or the like in the holder 3 to allow the dresser disc 4 to be mounted by magnetic force.
  • the dresser disc 4 is preferably formed of a metal having magnetism, such as stainless steel.
  • the dresser disc 4 can be mounted using, for example, a pin, a screw, a bolt, or the like.
  • a through hole may be formed in an upper surface of the holder 3 to allow the dresser disc 4 to be mounted by suction.
  • the concave portion 5 b to be fitted extending in the disc radial direction is formed at an upper surface of the dresser disc 4 , as shown in FIG. 2 , 3 , or the like.
  • the portion 5 b to be fitted is shaped so as to fit on the fitting portion 5 a and forms the torque transmitting section 6 together with the fitting portion 5 a.
  • the torque transmitting section 6 is composed of the fitting portion 5 a and the portion 5 b to be fitted that fit in with each other and can efficiently transmit torque of the dresser driving shaft 2 from the holder 3 to the dresser disc 4 .
  • the portion 5 b to be fitted can also be formed to be convex and can be formed in a corresponding concave/convex shape so as to fit in with the fitting portion 5 a .
  • the fitting portion 5 a and the portion 5 b to be fitted preferably fit substantially without any space when the fitting portion 5 a and the portion 5 b to be fitted are fitted together. Surfaces around the fitting portion 5 a and the portion 5 b to be fitted are preferably substantially vertical surfaces.
  • the groove-like portion 5 b to be fitted is provided at the dresser disc 4 , and the ridge-like fitting portion 5 a is provided at the holder 3 .
  • the ridge-like portion 5 b to be fitted may be provided at the dresser disc 4 while the groove-like fitting portion 5 a may be provided at the holder 3 .
  • the dresser disc 4 may succeed in being mounted as long as, for example, the upper surface of the dresser disc 4 is planar.
  • the portion 5 b to be fitted (or the fitting portion 5 a ) is formed in a shape extending in the disc radial direction in a disc plan view.
  • modifications of the portion 5 b to be fitted in the dresser disc 4 are shown in FIGS. 5 to 8 .
  • the portion 5 b to be fitted can be formed in a wedge shape as shown in FIG. 5 , a semicircular shape or a hogbacked shape, for example, a shape which an opposing surface of a contact face in a rectangular is an arc-like shape, as shown in FIG. 6 , a rectangular shape as shown in FIG. 7 , an elliptical shape as shown in FIG. 8 , or the like.
  • Forming the portion 5 b to be fitted in a shape extending in the disc radial direction makes force less likely to act in the disc radial direction and stabilizes rotation of the dresser disc 4 . If the portion 5 b to be fitted is formed in a semicircular shape or a hogbacked shape as shown in FIG. 6 , a positional shift is particularly unlikely to occur when the dresser disc rotates. Note that the portions 5 b to be fitted shown in FIGS. 5 to 8 are formed in groove-like shapes.
  • the depth (or the protruding width) of the portion 5 b to be fitted (or the fitting portion 5 a ) is not particularly limited.
  • the portion 5 b to be fitted (or the fitting portion 5 a ) can be formed to have a depth (or a protruding width) which causes the portions to fit in with each other at the time of torque transmission.
  • the depth (or the protruding width) is preferably 20% to 80% of the thickness of the outer edge of the dresser disc 4 , particularly preferably 40% to 60%.
  • At least one torque transmitting section 6 It suffices to form at least one torque transmitting section 6 .
  • At least one pair of torque transmitting sections 6 is preferably formed symmetrically with respect to a rotation center of the dresser disc 4 , particularly preferably one pair to four pairs. With this configuration, stress concentration can be more alleviated.
  • Four pairs of torque transmitting sections 6 may be formed symmetrically with respect to the rotation center of the dresser disc 4 , as shown in FIG. 8 .
  • the torque transmitting section 6 has a contact surface 7 in the shape of a flat surface formed such that the fitting portion 5 a and the portion 5 b to be fitted come into surface-to-surface contact with each other when the dresser driving shaft 2 rotates.
  • the presence of the contact surface 7 causes stress to be appropriately distributed and allows transmission to the dresser disc 4 with lower loss.
  • left surfaces of the fitting portion 5 a and the portion 5 b to be fitted in FIG. 10 are the contact surfaces 7 .
  • the contact surface 7 is preferably a substantially vertical surface. Since the contact surface 7 is formed as a flat surface, an edge portion of the contact surface 7 appears as a straight line at the upper surface of the dresser disc 4 .
  • the torque transmitting section 6 is formed in a wedge shape, an elliptical shape, a rectangular shape, or the like in a plan view, surfaces facing the contact surfaces 7 can be made contact surfaces 7 ′.
  • the dresser disc 4 can support rotation in either direction.
  • the contact surface 7 is preferably formed such that an angle ⁇ with respect to a straight line passing through the rotation center of the dresser disc 4 and an inner end point I of the contact surface 7 is not more than 13° in a disc plan view, particularly preferably not more than 5°. If the angle exceeds 13°, torque is likely to escape in the disc radial direction, and rotation of the dresser disc 4 is unlikely to be stabilized.
  • the contact surface 7 may be diagonal to the disc radial direction, as shown in FIG. 11 or 12 . If the contact surface 7 extends in the disc radial direction, as shown in FIG. 13 , torque loss decreases, and torque can be reliably transmitted to the dresser disc 4 .
  • the torque transmitting section 6 is preferably formed such that a width W on the disc outer edge side is not more than 1 ⁇ 2 of a distance R from the inner end point I of the contact surface 7 to the rotation center in a disc plan view, particularly preferably not more than 1 ⁇ 4. This configuration makes stress more unlikely to escape in the disc radial direction and reduces torque loss.
  • FIG. 14 shows a case where the portion 5 b to be fitted is formed in a rectangular groove-like shape in a disc plan view, the embodiment is not limited to this.
  • the contact surface 7 is preferably formed such that a length L of the end portion appearing at the upper surface of the dresser disc 4 is not less than 0.4 of a disc radius r in a disc plan view, particularly preferably not less than 0.7. Since this configuration causes stress to be appropriately distributed at the contact surface 7 , the dresser disc 4 can be prevented from wobbling at the time of rotation.
  • the convex or concave torque transmitting sections 6 extending in the disc radial direction are formed at the holder 3 and the dresser disc 4 , and the contact surfaces 7 in the shapes of flat surfaces are formed at the torque transmitting sections 6 .
  • the dressing device 1 is configured to be capable of transmitting torque of the dresser driving shaft 2 through surface-to-surface contact at the surfaces. This configuration alleviates stress concentration and reduces wobbles when the dresser disc 4 rotates.
  • the dressing device 1 can dress the polishing pad 8 b without partial wear.
  • the dressing device 1 can be included in the CMP apparatus 8 and can dress a polishing pad used for polishing of an object to be polished, such as a semiconductor wafer.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
US14/471,481 2013-08-29 2014-08-28 Dressing device, chemical mechanical polishing apparatus including the same, and dresser disc used in the same Abandoned US20150065019A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013177741A JP6254383B2 (ja) 2013-08-29 2013-08-29 ドレッシング装置及びそれを備えた化学的機械的研磨装置、それに用いるドレッサーディスク
JP2013-177741 2013-08-29

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US (1) US20150065019A1 (enExample)
JP (1) JP6254383B2 (enExample)
KR (1) KR20150026887A (enExample)
CN (1) CN104416463A (enExample)
TW (1) TWI638705B (enExample)

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US20180047572A1 (en) * 2016-08-12 2018-02-15 Ebara Corporation Dressing device, polishing apparatus, holder, housing and dressing method
US20180093360A1 (en) * 2016-09-30 2018-04-05 Ebara Corporation Polishing apparatus and polishing method

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CN107553330B (zh) * 2017-10-20 2019-07-12 德淮半导体有限公司 修整盘系统、化学机械研磨装置及修整盘脱落侦测方法
JP7308074B2 (ja) * 2019-05-14 2023-07-13 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2020192627A (ja) * 2019-05-27 2020-12-03 株式会社ディスコ 加工装置
KR102108155B1 (ko) 2020-02-04 2020-05-08 주식회사 이노프 경사면에 의한 잠금 여부가 결정되는 높이 조절형 책걸상
JP7430450B2 (ja) * 2020-02-25 2024-02-13 株式会社ディスコ ドレッサーボード
CN111438631A (zh) * 2020-04-30 2020-07-24 苏州珂玛材料科技股份有限公司 一种用于研磨抛光设备的修整环及研磨抛光设备

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Cited By (7)

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Publication number Priority date Publication date Assignee Title
US20180047572A1 (en) * 2016-08-12 2018-02-15 Ebara Corporation Dressing device, polishing apparatus, holder, housing and dressing method
US10636665B2 (en) * 2016-08-12 2020-04-28 Ebara Corporation Dressing device, polishing apparatus, holder, housing and dressing method
US10777417B2 (en) 2016-08-12 2020-09-15 Ebara Corporation Dressing device, polishing apparatus, holder, housing and dressing method
US20180093360A1 (en) * 2016-09-30 2018-04-05 Ebara Corporation Polishing apparatus and polishing method
US10688620B2 (en) * 2016-09-30 2020-06-23 Ebara Corporation Polishing apparatus
US20200269381A1 (en) * 2016-09-30 2020-08-27 Ebara Corporation Polishing apparatus
US11583973B2 (en) * 2016-09-30 2023-02-21 Ebara Corporation Polishing apparatus

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TWI638705B (zh) 2018-10-21
TW201509600A (zh) 2015-03-16
JP2015044273A (ja) 2015-03-12
CN104416463A (zh) 2015-03-18
KR20150026887A (ko) 2015-03-11
JP6254383B2 (ja) 2017-12-27

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