JP6439958B2 - 研磨パッド - Google Patents
研磨パッド Download PDFInfo
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- JP6439958B2 JP6439958B2 JP2014072367A JP2014072367A JP6439958B2 JP 6439958 B2 JP6439958 B2 JP 6439958B2 JP 2014072367 A JP2014072367 A JP 2014072367A JP 2014072367 A JP2014072367 A JP 2014072367A JP 6439958 B2 JP6439958 B2 JP 6439958B2
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- polishing
- polishing pad
- pad
- wall thickness
- hollow spheres
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
*2 B・・・ユニロイヤルケミカル社製 アジプレンL−325
*3 AkzoNobel社製 エクスパンセル 551DE40d42
*4 1.350mm×1.012mm領域あたりの数値
・使用研磨機:荏原製作所社製、F−REX300
・回転数:(定盤)70rpm、(トップリング)71rpm
・研磨剤:キャボット社製、品番:SS25(SS25原液:純水=1:1の混合液を使用)
・研磨剤温度:30℃
・研磨剤吐出量:200ml/min
・使用ワーク(被研磨物):12インチφシリコンウェハ上にテトラエトキシシランをCVDで絶縁膜1μmの厚さになるように形成した基板
・研磨時間:60秒間/各回
3 被研磨物
7 研磨パッド
21 微小中空球状体
Claims (3)
- 微小中空球状体を含有するポリウレタン製の研磨パッドであって、
ショアD硬度が10°以上40°以下であり、前記微小中空球状体は直径が15〜35μmであり、研磨面に露出している前記微小中空球状体のエッジの長さの合計が1.350mm×1.012mmの領域あたり40000〜60000μm以上である、研磨パッド。 - また、本発明において、好ましくは、前記微小中空球状体の間の壁厚は、少なくとも15μm以上である、請求項1に記載の研磨パッド。
- 前記エッジ部の長さの合計と前記微小中空球状体の間の壁厚の比は、1800〜3100:1である、請求項1又は2に記載の研磨パッド。
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JP2014072367A JP6439958B2 (ja) | 2014-03-31 | 2014-03-31 | 研磨パッド |
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JP2014072367A JP6439958B2 (ja) | 2014-03-31 | 2014-03-31 | 研磨パッド |
Publications (2)
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JP2015193058A JP2015193058A (ja) | 2015-11-05 |
JP6439958B2 true JP6439958B2 (ja) | 2018-12-19 |
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ID=54432609
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JP2014072367A Active JP6439958B2 (ja) | 2014-03-31 | 2014-03-31 | 研磨パッド |
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JP (1) | JP6439958B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170087958A1 (en) | 2015-09-30 | 2017-03-30 | Fuji Jukogyo Kabushiki Kaisha | Vehicle air conditioner |
TWI738323B (zh) * | 2019-05-07 | 2021-09-01 | 美商Cmc材料股份有限公司 | 化學機械拋光墊及化學機械拋光晶圓之方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3455208B2 (ja) * | 2001-11-13 | 2003-10-14 | 東洋紡績株式会社 | 半導体ウエハ研磨パッド、半導体ウエハの研磨方法、研磨パッド用研磨シート、及び研磨シート用発泡体ブロック |
JP5687119B2 (ja) * | 2011-04-15 | 2015-03-18 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
WO2013089240A1 (ja) * | 2011-12-16 | 2013-06-20 | 東洋ゴム工業株式会社 | 研磨パッド |
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- 2014-03-31 JP JP2014072367A patent/JP6439958B2/ja active Active
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