JP6254383B2 - ドレッシング装置及びそれを備えた化学的機械的研磨装置、それに用いるドレッサーディスク - Google Patents

ドレッシング装置及びそれを備えた化学的機械的研磨装置、それに用いるドレッサーディスク Download PDF

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Publication number
JP6254383B2
JP6254383B2 JP2013177741A JP2013177741A JP6254383B2 JP 6254383 B2 JP6254383 B2 JP 6254383B2 JP 2013177741 A JP2013177741 A JP 2013177741A JP 2013177741 A JP2013177741 A JP 2013177741A JP 6254383 B2 JP6254383 B2 JP 6254383B2
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Japan
Prior art keywords
dresser
disk
dresser disk
dressing
end point
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JP2013177741A
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Japanese (ja)
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JP2015044273A (ja
JP2015044273A5 (enExample
Inventor
篠崎　弘行
弘行 篠崎
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Ebara Corp
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Ebara Corp
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Priority to JP2013177741A priority Critical patent/JP6254383B2/ja
Priority to TW103128579A priority patent/TWI638705B/zh
Priority to CN201410418002.2A priority patent/CN104416463A/zh
Priority to KR20140111554A priority patent/KR20150026887A/ko
Priority to US14/471,481 priority patent/US20150065019A1/en
Publication of JP2015044273A publication Critical patent/JP2015044273A/ja
Publication of JP2015044273A5 publication Critical patent/JP2015044273A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2013177741A 2013-08-29 2013-08-29 ドレッシング装置及びそれを備えた化学的機械的研磨装置、それに用いるドレッサーディスク Active JP6254383B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013177741A JP6254383B2 (ja) 2013-08-29 2013-08-29 ドレッシング装置及びそれを備えた化学的機械的研磨装置、それに用いるドレッサーディスク
TW103128579A TWI638705B (zh) 2013-08-29 2014-08-20 Dressing device, chemical mechanical polishing device with dressing device, and dresser plate for dressing device
CN201410418002.2A CN104416463A (zh) 2013-08-29 2014-08-22 修整装置及具有它的化学机械研磨装置、用于它的修整器盘
KR20140111554A KR20150026887A (ko) 2013-08-29 2014-08-26 드레싱 장치 및 그것을 구비한 화학적 기계적 연마 장치, 그것에 사용하는 드레서 디스크
US14/471,481 US20150065019A1 (en) 2013-08-29 2014-08-28 Dressing device, chemical mechanical polishing apparatus including the same, and dresser disc used in the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013177741A JP6254383B2 (ja) 2013-08-29 2013-08-29 ドレッシング装置及びそれを備えた化学的機械的研磨装置、それに用いるドレッサーディスク

Publications (3)

Publication Number Publication Date
JP2015044273A JP2015044273A (ja) 2015-03-12
JP2015044273A5 JP2015044273A5 (enExample) 2016-06-16
JP6254383B2 true JP6254383B2 (ja) 2017-12-27

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JP2013177741A Active JP6254383B2 (ja) 2013-08-29 2013-08-29 ドレッシング装置及びそれを備えた化学的機械的研磨装置、それに用いるドレッサーディスク

Country Status (5)

Country Link
US (1) US20150065019A1 (enExample)
JP (1) JP6254383B2 (enExample)
KR (1) KR20150026887A (enExample)
CN (1) CN104416463A (enExample)
TW (1) TWI638705B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6842859B2 (ja) * 2016-08-12 2021-03-17 株式会社荏原製作所 ドレッシング装置、研磨装置、ホルダー、ハウジング及びドレッシング方法
JP6357260B2 (ja) * 2016-09-30 2018-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
CN107553330B (zh) * 2017-10-20 2019-07-12 德淮半导体有限公司 修整盘系统、化学机械研磨装置及修整盘脱落侦测方法
JP7308074B2 (ja) * 2019-05-14 2023-07-13 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2020192627A (ja) * 2019-05-27 2020-12-03 株式会社ディスコ 加工装置
KR102108155B1 (ko) 2020-02-04 2020-05-08 주식회사 이노프 경사면에 의한 잠금 여부가 결정되는 높이 조절형 책걸상
JP7430450B2 (ja) * 2020-02-25 2024-02-13 株式会社ディスコ ドレッサーボード
CN111438631A (zh) * 2020-04-30 2020-07-24 苏州珂玛材料科技股份有限公司 一种用于研磨抛光设备的修整环及研磨抛光设备

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5667433A (en) * 1995-06-07 1997-09-16 Lsi Logic Corporation Keyed end effector for CMP pad conditioner
US6200199B1 (en) * 1998-03-31 2001-03-13 Applied Materials, Inc. Chemical mechanical polishing conditioner
JP3295888B2 (ja) * 1998-04-22 2002-06-24 株式会社藤森技術研究所 ケミカルマシンポリッシャの研磨盤用研磨ドレッサ
US6217429B1 (en) * 1999-07-09 2001-04-17 Applied Materials, Inc. Polishing pad conditioner
JP2001121417A (ja) * 1999-10-29 2001-05-08 Applied Materials Inc コンディショニングディスク
US6386963B1 (en) * 1999-10-29 2002-05-14 Applied Materials, Inc. Conditioning disk for conditioning a polishing pad
US7201645B2 (en) * 1999-11-22 2007-04-10 Chien-Min Sung Contoured CMP pad dresser and associated methods
US6523215B2 (en) * 2001-04-04 2003-02-25 Saint-Gobain Abrasives Technology Company Polishing pad and system
US6887138B2 (en) * 2003-06-20 2005-05-03 Freescale Semiconductor, Inc. Chemical mechanical polish (CMP) conditioning-disk holder
JP4775881B2 (ja) * 2004-12-10 2011-09-21 東洋ゴム工業株式会社 研磨パッド
JP4999337B2 (ja) * 2006-03-14 2012-08-15 株式会社ノリタケカンパニーリミテド Ｃｍｐパッドコンディショナー
JP5778580B2 (ja) * 2008-11-26 2015-09-16 エスゲーエフ ジュートドイチェ ゲレンクシャイベンファブリク ゲゼルシャフト ミット ベシュレンクテルハフツング ウント コンパニー コマンディトゲゼルシャフト トルク伝達装置
JP5236515B2 (ja) * 2009-01-28 2013-07-17 株式会社荏原製作所 ドレッシング装置、化学的機械的研磨装置及び方法
JP5896625B2 (ja) * 2011-06-02 2016-03-30 株式会社荏原製作所 研磨装置に使用される研磨パッドの研磨面を監視する方法および装置
TW201350267A (zh) * 2012-05-04 2013-12-16 Saint Gobain Abrasives Inc 用於同雙側化學機械平坦化墊修整器一起使用之工具
USD743456S1 (en) * 2012-09-26 2015-11-17 Ebara Corporation Dresser disk
JP5919157B2 (ja) * 2012-10-01 2016-05-18 株式会社荏原製作所 ドレッサー
WO2014172662A1 (en) * 2013-04-19 2014-10-23 Applied Materials, Inc Multi-disk chemical mechanical polishing pad conditioners and methods

Also Published As

Publication number Publication date
TWI638705B (zh) 2018-10-21
US20150065019A1 (en) 2015-03-05
TW201509600A (zh) 2015-03-16
JP2015044273A (ja) 2015-03-12
CN104416463A (zh) 2015-03-18
KR20150026887A (ko) 2015-03-11

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