KR20150026887A - 드레싱 장치 및 그것을 구비한 화학적 기계적 연마 장치, 그것에 사용하는 드레서 디스크 - Google Patents

드레싱 장치 및 그것을 구비한 화학적 기계적 연마 장치, 그것에 사용하는 드레서 디스크 Download PDF

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Publication number
KR20150026887A
KR20150026887A KR20140111554A KR20140111554A KR20150026887A KR 20150026887 A KR20150026887 A KR 20150026887A KR 20140111554 A KR20140111554 A KR 20140111554A KR 20140111554 A KR20140111554 A KR 20140111554A KR 20150026887 A KR20150026887 A KR 20150026887A
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KR
South Korea
Prior art keywords
disk
dresser
dressing
holder portion
dresser disk
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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KR20140111554A
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English (en)
Korean (ko)
Inventor
히로유키 시노자키
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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Application filed by 가부시키가이샤 에바라 세이사꾸쇼 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20150026887A publication Critical patent/KR20150026887A/ko
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR20140111554A 2013-08-29 2014-08-26 드레싱 장치 및 그것을 구비한 화학적 기계적 연마 장치, 그것에 사용하는 드레서 디스크 Ceased KR20150026887A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-177741 2013-08-29
JP2013177741A JP6254383B2 (ja) 2013-08-29 2013-08-29 ドレッシング装置及びそれを備えた化学的機械的研磨装置、それに用いるドレッサーディスク

Publications (1)

Publication Number Publication Date
KR20150026887A true KR20150026887A (ko) 2015-03-11

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ID=52583891

Family Applications (1)

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KR20140111554A Ceased KR20150026887A (ko) 2013-08-29 2014-08-26 드레싱 장치 및 그것을 구비한 화학적 기계적 연마 장치, 그것에 사용하는 드레서 디스크

Country Status (5)

Country Link
US (1) US20150065019A1 (enExample)
JP (1) JP6254383B2 (enExample)
KR (1) KR20150026887A (enExample)
CN (1) CN104416463A (enExample)
TW (1) TWI638705B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180036545A (ko) * 2016-09-30 2018-04-09 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
KR102108155B1 (ko) 2020-02-04 2020-05-08 주식회사 이노프 경사면에 의한 잠금 여부가 결정되는 높이 조절형 책걸상

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6842859B2 (ja) * 2016-08-12 2021-03-17 株式会社荏原製作所 ドレッシング装置、研磨装置、ホルダー、ハウジング及びドレッシング方法
CN107553330B (zh) * 2017-10-20 2019-07-12 德淮半导体有限公司 修整盘系统、化学机械研磨装置及修整盘脱落侦测方法
JP7308074B2 (ja) * 2019-05-14 2023-07-13 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2020192627A (ja) * 2019-05-27 2020-12-03 株式会社ディスコ 加工装置
JP7430450B2 (ja) * 2020-02-25 2024-02-13 株式会社ディスコ ドレッサーボード
CN111438631A (zh) * 2020-04-30 2020-07-24 苏州珂玛材料科技股份有限公司 一种用于研磨抛光设备的修整环及研磨抛光设备

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US5667433A (en) * 1995-06-07 1997-09-16 Lsi Logic Corporation Keyed end effector for CMP pad conditioner
US6200199B1 (en) * 1998-03-31 2001-03-13 Applied Materials, Inc. Chemical mechanical polishing conditioner
JP3295888B2 (ja) * 1998-04-22 2002-06-24 株式会社藤森技術研究所 ケミカルマシンポリッシャの研磨盤用研磨ドレッサ
US6217429B1 (en) * 1999-07-09 2001-04-17 Applied Materials, Inc. Polishing pad conditioner
JP2001121417A (ja) * 1999-10-29 2001-05-08 Applied Materials Inc コンディショニングディスク
US6386963B1 (en) * 1999-10-29 2002-05-14 Applied Materials, Inc. Conditioning disk for conditioning a polishing pad
US7201645B2 (en) * 1999-11-22 2007-04-10 Chien-Min Sung Contoured CMP pad dresser and associated methods
US6523215B2 (en) * 2001-04-04 2003-02-25 Saint-Gobain Abrasives Technology Company Polishing pad and system
US6887138B2 (en) * 2003-06-20 2005-05-03 Freescale Semiconductor, Inc. Chemical mechanical polish (CMP) conditioning-disk holder
JP4775881B2 (ja) * 2004-12-10 2011-09-21 東洋ゴム工業株式会社 研磨パッド
JP4999337B2 (ja) * 2006-03-14 2012-08-15 株式会社ノリタケカンパニーリミテド Ｃｍｐパッドコンディショナー
JP5778580B2 (ja) * 2008-11-26 2015-09-16 エスゲーエフ ジュートドイチェ ゲレンクシャイベンファブリク ゲゼルシャフト ミット ベシュレンクテルハフツング ウント コンパニー コマンディトゲゼルシャフト トルク伝達装置
JP5236515B2 (ja) * 2009-01-28 2013-07-17 株式会社荏原製作所 ドレッシング装置、化学的機械的研磨装置及び方法
JP5896625B2 (ja) * 2011-06-02 2016-03-30 株式会社荏原製作所 研磨装置に使用される研磨パッドの研磨面を監視する方法および装置
TW201350267A (zh) * 2012-05-04 2013-12-16 聖高拜磨料有限公司 用於同雙側化學機械平坦化墊修整器一起使用之工具
USD743456S1 (en) * 2012-09-26 2015-11-17 Ebara Corporation Dresser disk
JP5919157B2 (ja) * 2012-10-01 2016-05-18 株式会社荏原製作所 ドレッサー
JP2016519852A (ja) * 2013-04-19 2016-07-07 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 多重ディスク化学機械研磨パッドコンディショナー及び方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180036545A (ko) * 2016-09-30 2018-04-09 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
KR102108155B1 (ko) 2020-02-04 2020-05-08 주식회사 이노프 경사면에 의한 잠금 여부가 결정되는 높이 조절형 책걸상

Also Published As

Publication number Publication date
US20150065019A1 (en) 2015-03-05
CN104416463A (zh) 2015-03-18
TW201509600A (zh) 2015-03-16
JP6254383B2 (ja) 2017-12-27
JP2015044273A (ja) 2015-03-12
TWI638705B (zh) 2018-10-21

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