US20140184958A1 - Cliche for offset-printing and method for manufacturing same - Google Patents

Cliche for offset-printing and method for manufacturing same Download PDF

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Publication number
US20140184958A1
US20140184958A1 US14/240,722 US201214240722A US2014184958A1 US 20140184958 A1 US20140184958 A1 US 20140184958A1 US 201214240722 A US201214240722 A US 201214240722A US 2014184958 A1 US2014184958 A1 US 2014184958A1
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US
United States
Prior art keywords
cliché
offset printing
mask pattern
pattern
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/240,722
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English (en)
Inventor
Ji Young Hwang
Beom Mo KOO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Chem Ltd
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LG Chem Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Chem Ltd filed Critical LG Chem Ltd
Assigned to LG CHEM, LTD. reassignment LG CHEM, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HWANG, JI YOUNG, KOO, BEOM MO
Publication of US20140184958A1 publication Critical patent/US20140184958A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F13/00—Common details of rotary presses or machines
    • B41F13/08—Cylinders
    • B41F13/18—Impression cylinders
    • B41F13/187—Impression cylinders for rotogravure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/02—Engraving; Heads therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F1/00—Platen presses, i.e. presses in which printing is effected by at least one essentially-flat pressure-applying member co-operating with a flat type-bed
    • B41F1/16—Platen presses, i.e. presses in which printing is effected by at least one essentially-flat pressure-applying member co-operating with a flat type-bed for offset printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N3/00—Preparing for use and conserving printing surfaces
    • B41N3/03—Chemical or electrical pretreatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M2205/00—Printing methods or features related to printing methods; Location or type of the layers
    • B41M2205/14—Production or use of a mask
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/006—Printing plates or foils; Materials therefor made entirely of inorganic materials other than natural stone or metals, e.g. ceramics, carbide materials, ferroelectric materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Definitions

  • the present invention relates to a cliché for offset printing and a method of manufacturing the same, and more particularly, to a cliché for offset printing having various line widths and etching depths in order to control a bottom touch phenomenon occurring due to an increase in line width to be implemented when the cliché is manufactured by single etching, and a method of manufacturing the same.
  • FPD flat panel display
  • LCD liquid crystal display
  • PDP plasma display panel
  • the photomask process has a problem in that a material such as photosensitive resist or developing solution is often used, an expensive photomask needs to be used, and many processing steps need to be performed or the process time is prolonged.
  • the offset printing method using a cliché is advantageous in that the material consumption is less and the process is simpler than a method in the related art using a photosensitive resist and the process speed is faster than inkjet printing or laser transfer.
  • the offset printing method is disadvantageous in that clichés are needed respectively for substrates with different patterns and manufacturing clichés usually made of glass is a complicated and expensive process.
  • the present invention has been made in an effort to provide a cliché for offset printing, which can solve a bottom touch phenomenon occurring according to an increase in line width to be implemented when the cliché is manufactured by single etching and has various line widths and etching depths, and a method of manufacturing the same.
  • An exemplary embodiment of the present invention provides a cliché for offset printing comprising: a groove pattern, wherein a depth of at least a partial region of the groove pattern is different from a depth of a residual region.
  • Another exemplary embodiment of the present invention provides a method of manufacturing a cliché for offset printing, comprising: 1) forming a first mask pattern on a substrate, 2) forming a second mask pattern on the substrate and the first mask pattern, 3) etching the substrate by using the second mask pattern, 4) removing the second mask pattern, and 5) etching the substrate by using the first mask pattern in an etching depth that is different from an etching depth of step 3).
  • Yet another exemplary embodiment of the present invention provides a method of manufacturing a cliché for offset printing, comprising: 1) forming a first mask pattern on a substrate, 2) forming a front surface layer for a second mask pattern on the substrate and the first mask pattern, 3) forming a third mask pattern on the front surface layer for the second mask pattern, 4) forming the second mask pattern by using the third mask pattern, 5) etching the substrate by using the second mask pattern, 6) removing the second mask pattern, and 7) etching the substrate by using the first mask pattern in an etching depth that is different from an etching depth of step 5).
  • Still another exemplary embodiment of the present invention provides a printed matter printed by using the cliché.
  • Still yet another exemplary embodiment of the present invention provides a touch panel comprising: the printed matter.
  • FIG. 1 is a view showing the Relationship Equation of an etching depth and a final etching line width according to an initial patterning line width during a single etching process.
  • FIG. 2 is a view showing a result of bottom touch of a linear pattern in a printing direction of a cliché for offset printing with regard to various etching depths during the single etching process.
  • FIG. 3 is a view showing a result of bottom touch of a square pattern of the cliché for offset printing with regard to various etching depths during the single etching process.
  • FIG. 4 is a view schematically showing a process of manufacturing a cliché for offset printing according to an exemplary embodiment of the present invention.
  • FIG. 6 is a view showing an electronic microscope picture of a cross-section of the cliché for offset printing according to the exemplary embodiment of the present invention.
  • FIG. 7 is a view showing a relative difference in transmission by HF in the case where only Cr is present and in the case where CrOx is present.
  • the present invention provides a cliché for offset printing, which can control a bottom touch phenomenon that is a problem exhibited when a known wide line width is implemented and has various line widths and etching depths, and the cliché for offset printing according to the present invention comprises a groove pattern, wherein a depth of at least a partial region of the groove pattern is different from a depth of a residual region.
  • the regions having different depths of the groove pattern may comprise regions having different line widths of the groove pattern.
  • the region having the relatively larger line width of the groove pattern comprise the region having the larger depth as compared to the region having the relatively smaller line width.
  • a minimum line width W may be determined by the Relationship Equation of a patterning line width WO and an etching depth D before etching, and it is possible to perform printing without bottom touch only in the case where the line width W corresponds to a printing-enable region of the graph. Therefore, in the case of the single etching, printing-enable line width and pitch are limited according to the etching depth.
  • the cliché having various etching depths and line widths may be manufactured by introducing a double etching process, and a printed matter having various line widths and pitches using the same may be formed.
  • the groove pattern may comprise at least two patterns having different line widths simultaneously, and a difference between the line widths of at least two patterns may be 15 ⁇ m or more. At least two patterns where the difference between the line widths is 15 ⁇ m or more may be connected to each other. That is, the groove pattern may comprise a pattern where the region of the minimum line width and the region of the new line width formed through a double etching process are connected.
  • the groove pattern may comprise two or more patterns where the difference between the line widths is 15 ⁇ m or more, and the groove pattern may further comprise a pattern having the line width that is different from the minimum line width by 500 ⁇ m or more.
  • an align key may be further comprised in the region where the groove pattern of the cliché for offset printing is not provided.
  • the exemplary embodiment of a method of manufacturing a cliché for offset printing comprises 1) forming a first mask pattern on a substrate, 2) forming a second mask pattern on the substrate and the first mask pattern, 3) etching the substrate by using the second mask pattern, 4) removing the second mask pattern, and 5) etching the substrate by using the first mask pattern in an etching depth that is different from an etching depth of step 3).
  • another exemplary embodiment of a method of manufacturing a cliché for offset printing comprises 1) forming a first mask pattern on a substrate, 2) forming a front surface layer for a second mask pattern on the substrate and the first mask pattern, 3) forming a third mask pattern on the front surface layer for the second mask pattern, 4) forming the second mask pattern by using the third mask pattern, 5) etching the substrate by using the second mask pattern, 6) removing the second mask pattern, and 7) etching the substrate by using the first mask pattern in an etching depth that is different from an etching depth of step 5).
  • a transparent glass substrate, a plastic film substrate and the like may be used as the substrate, but the substrate is not limited thereto.
  • the first mask pattern and the second mask pattern comprise a material that has excellent adhesion strength to the substrate and does not etch the first mask pattern when the second mask pattern is formed.
  • the first mask pattern may comprise one or more selected from the group consisting of chrome, nickel, oxides thereof, and nitrides thereof
  • the second mask pattern may comprise one or more selected from the group consisting of molybdenum and molybdenum oxide.
  • the etching process of the substrate may adopt a method known in the art, and more specifically, a wet etching process using a HF solution and the like may be used, but the process is not limited thereto.
  • the present invention is characterized in that the cliché is manufactured by a double etching process applying a known method of manufacturing a single etching cliché.
  • a double patterning process comprising an align process is introduced and a deep region and a shallow region are continuously etched while wet etching is performed.
  • patterning of the entire figure region (comprising the align key for second exposure) is firstly performed on glass on which CrOx/Cr is deposited to pattern CrOx/Cr (CrOx/Cr etching and PR stripping are performed), and, thereafter, Mo is deposited on the entire surface thereof.
  • the reason why the double layer of CrOx/Cr is used is because since a stack coverage of the subsequently deposited material (Mo) is nonuniformly formed due to a high taper angle of Cr to allow a hydrofluoric acid solution to be transmitted through cracks when first HF etching is performed, in order to prevent this, it is preferable to introduce CrOx having a relatively lower taper angle and lower etching rate as compared to Cr to form a tail.
  • FIG. 7 is a view showing a relative difference in transmission by HF in the case where only Cr is present and in the case where CrOx is present.
  • opening (method such as shadow masking) of the first patterned align key region is performed.
  • patterning of Mo is performed with regard to the regions having different etching depths, and a first master cliché manufactured by using this method is provided to a glass etching process.
  • the first etching process is performed through optimization of a HF concentration and a temperature in order to basically perform etching in a large etching depth.
  • the etching process may be performed in order to implement a second small glass etching depth.
  • a bottom touch region is confirmed through the following method in order to ensure a more precise etching depth when single etching and double etching of the cliché are performed.
  • the relationship of the aperture ratio (the groove is defined by the line width) obtained by the line width and the pitch and the etching depth with regard to various etching depths is confirmed for each printing pressure.
  • the relationship does not largely depend on printing pressure but the bottom touch region is largely changed according to the aperture ratio.
  • the printing-enable region may be represented by the following Relationship Equation 1.
  • D is the etching depth
  • P is the pitch
  • W is the line width of the pattern, and all of units thereof are micrometers.
  • the same experiment is performed with regard to the closed figures such as mesh and square patterns instead of the aforementioned two-dimensional linear pattern.
  • the graph like FIG. 3 can be obtained, and in this case, in the change graph, in the case where the aperture ratio is defined through the line width and the pitch, the printing-enable region may be represented by the following Relationship Equation 2.
  • the present invention provides a printed matter printed by using the cliché for offset printing.
  • the printed matter may comprise at least two patterns having different line widths, and a difference between the line widths of at least two patterns may be 15 ⁇ m or more.
  • the present invention provides a touch panel comprising the printed matter.
  • the touch panel may adopt materials and manufacturing methods known in the art, except that the printed matter printed by using the cliché for offset printing according to the present invention is comprised.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Printing Methods (AREA)
  • Printing Plates And Materials Therefor (AREA)
US14/240,722 2011-09-27 2012-09-27 Cliche for offset-printing and method for manufacturing same Abandoned US20140184958A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2011-0097755 2011-09-27
KR20110097755 2011-09-27
PCT/KR2012/007799 WO2013048133A2 (ko) 2011-09-27 2012-09-27 오프셋 인쇄용 클리쉐 및 이의 제조방법

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Publication Number Publication Date
US20140184958A1 true US20140184958A1 (en) 2014-07-03

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US14/240,722 Abandoned US20140184958A1 (en) 2011-09-27 2012-09-27 Cliche for offset-printing and method for manufacturing same
US13/973,063 Abandoned US20130344300A1 (en) 2011-09-27 2013-08-22 Cliche for offset-printing and method for manufacturing same

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US (2) US20140184958A1 (de)
EP (1) EP2762313B1 (de)
JP (1) JP5904448B2 (de)
KR (1) KR101385843B1 (de)
CN (1) CN103998243B (de)
TW (1) TWI522024B (de)
WO (1) WO2013048133A2 (de)

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KR101924056B1 (ko) * 2014-09-29 2018-11-30 주식회사 엘지화학 오프셋 인쇄용 클리쉐 및 이의 제조방법
JP2017024295A (ja) * 2015-07-23 2017-02-02 富士通コンポーネント株式会社 印刷版、印刷物及び印刷方法
WO2017034372A1 (ko) * 2015-08-26 2017-03-02 주식회사 엘지화학 오프셋 인쇄용 클리쉐의 제조방법 및 오프셋 인쇄용 클리쉐
CN106042702A (zh) * 2016-08-04 2016-10-26 云南侨通包装印刷有限公司 一种高载墨量的胶印涂布树脂版
CN111889888A (zh) * 2020-07-24 2020-11-06 厦门合兴包装印刷股份有限公司 一种多头的无墨印刷方法

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Also Published As

Publication number Publication date
EP2762313B1 (de) 2019-07-24
WO2013048133A2 (ko) 2013-04-04
KR20130033991A (ko) 2013-04-04
TW201334657A (zh) 2013-08-16
WO2013048133A3 (ko) 2013-05-23
EP2762313A2 (de) 2014-08-06
EP2762313A4 (de) 2015-07-15
CN103998243A (zh) 2014-08-20
KR101385843B1 (ko) 2014-04-17
JP2014529535A (ja) 2014-11-13
US20130344300A1 (en) 2013-12-26
TWI522024B (zh) 2016-02-11
CN103998243B (zh) 2016-08-17
JP5904448B2 (ja) 2016-04-13

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