US20110108997A1 - Mounting method and mounting structure for semiconductor package component - Google Patents

Mounting method and mounting structure for semiconductor package component Download PDF

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Publication number
US20110108997A1
US20110108997A1 US13/003,996 US201013003996A US2011108997A1 US 20110108997 A1 US20110108997 A1 US 20110108997A1 US 201013003996 A US201013003996 A US 201013003996A US 2011108997 A1 US2011108997 A1 US 2011108997A1
Authority
US
United States
Prior art keywords
semiconductor package
package component
substrate
reinforcing adhesive
reinforcing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/003,996
Other languages
English (en)
Inventor
Naomichi OHASHI
Atsushi Yamaguchi
Arata Kishi
Masato Udaka
Seiji TOKII
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2009105758A external-priority patent/JP5464897B2/ja
Priority claimed from JP2009105757A external-priority patent/JP5707569B2/ja
Application filed by Panasonic Corp filed Critical Panasonic Corp
Assigned to PANASONIC CORPORATION reassignment PANASONIC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TOKII, SEIJI, UDAKA, MASATO, YAMAGUCHI, ATSUSHI, KISHI, ARATA, OHASHI, NAOMICHI
Publication of US20110108997A1 publication Critical patent/US20110108997A1/en
Priority to US14/092,407 priority Critical patent/US9331047B2/en
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. reassignment PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: PANASONIC CORPORATION
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. reassignment PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. CORRECTIVE ASSIGNMENT TO CORRECT THE ERRONEOUSLY FILED APPLICATION NUMBERS 13/384239, 13/498734, 14/116681 AND 14/301144 PREVIOUSLY RECORDED ON REEL 034194 FRAME 0143. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Assignors: PANASONIC CORPORATION
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
US13/003,996 2009-04-24 2010-04-19 Mounting method and mounting structure for semiconductor package component Abandoned US20110108997A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/092,407 US9331047B2 (en) 2009-04-24 2013-11-27 Mounting method and mounting structure for semiconductor package component

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2009-105758 2009-04-24
JP2009105758A JP5464897B2 (ja) 2009-04-24 2009-04-24 半導体パッケージ部品の実装方法と実装構造体
JP2009-105757 2009-04-24
JP2009105757A JP5707569B2 (ja) 2009-04-24 2009-04-24 半導体パッケージ部品の実装方法と実装構造体
PCT/JP2010/002800 WO2010122757A1 (ja) 2009-04-24 2010-04-19 半導体パッケージ部品の実装方法と実装構造体

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/002800 A-371-Of-International WO2010122757A1 (ja) 2009-04-24 2010-04-19 半導体パッケージ部品の実装方法と実装構造体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/092,407 Division US9331047B2 (en) 2009-04-24 2013-11-27 Mounting method and mounting structure for semiconductor package component

Publications (1)

Publication Number Publication Date
US20110108997A1 true US20110108997A1 (en) 2011-05-12

Family

ID=43010884

Family Applications (2)

Application Number Title Priority Date Filing Date
US13/003,996 Abandoned US20110108997A1 (en) 2009-04-24 2010-04-19 Mounting method and mounting structure for semiconductor package component
US14/092,407 Active US9331047B2 (en) 2009-04-24 2013-11-27 Mounting method and mounting structure for semiconductor package component

Family Applications After (1)

Application Number Title Priority Date Filing Date
US14/092,407 Active US9331047B2 (en) 2009-04-24 2013-11-27 Mounting method and mounting structure for semiconductor package component

Country Status (4)

Country Link
US (2) US20110108997A1 (zh)
EP (1) EP2423955B8 (zh)
CN (1) CN102105971B (zh)
WO (1) WO2010122757A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102800634A (zh) * 2011-05-23 2012-11-28 松下电器产业株式会社 半导体封装器件的安装结构体及制造方法
US20150181740A1 (en) * 2012-09-06 2015-06-25 Panasonic Intellectual Property Management Co., Ltd. Mounting structure and method for supplying reinforcing resin material
US20170211769A1 (en) * 2016-01-27 2017-07-27 Lite-On Electronics (Guangzhou) Limited Vehicle lamp device and light-emitting module thereof
US20200011498A1 (en) * 2016-01-27 2020-01-09 Lite-On Electronics (Guangzhou) Limited Light-emitting module for vehicle lamp

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012160817A1 (ja) * 2011-05-26 2012-11-29 パナソニック株式会社 電子部品実装方法、電子部品搭載装置および電子部品実装システム
KR20180014903A (ko) * 2016-08-01 2018-02-12 삼성디스플레이 주식회사 전자 소자, 이의 실장 방법 및 이를 포함하는 표시 장치의 제조 방법
WO2019087700A1 (ja) * 2017-11-01 2019-05-09 ソニーセミコンダクタソリューションズ株式会社 撮像素子、撮像装置、及び、電子機器、並びに、撮像素子の製造方法
US10211072B2 (en) * 2017-06-23 2019-02-19 Applied Materials, Inc. Method of reconstituted substrate formation for advanced packaging applications
US11094668B2 (en) * 2019-12-12 2021-08-17 Micron Technology, Inc. Solderless interconnect for semiconductor device assembly
JP7283407B2 (ja) * 2020-02-04 2023-05-30 株式会社デンソー 電子装置

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102800634A (zh) * 2011-05-23 2012-11-28 松下电器产业株式会社 半导体封装器件的安装结构体及制造方法
US20120299202A1 (en) * 2011-05-23 2012-11-29 Panasonic Corporation Mounting structure of semiconductor package component and manufacturing method therefor
US8664773B2 (en) * 2011-05-23 2014-03-04 Panasonic Corporation Mounting structure of semiconductor package component and manufacturing method therefor
US20150181740A1 (en) * 2012-09-06 2015-06-25 Panasonic Intellectual Property Management Co., Ltd. Mounting structure and method for supplying reinforcing resin material
US9955604B2 (en) * 2012-09-06 2018-04-24 Panasonic Intellectual Property Management Co., Ltd. Mounting structure and method for supplying reinforcing resin material
US20170211769A1 (en) * 2016-01-27 2017-07-27 Lite-On Electronics (Guangzhou) Limited Vehicle lamp device and light-emitting module thereof
US20200011498A1 (en) * 2016-01-27 2020-01-09 Lite-On Electronics (Guangzhou) Limited Light-emitting module for vehicle lamp
US10823355B2 (en) * 2016-01-27 2020-11-03 Lite-On Electronics (Guangzhou) Limited Light-emitting module for vehicle lamp
US11506352B2 (en) * 2016-01-27 2022-11-22 Lite-On Electronics (Guangzhou) Limited Light-emitting module for vehicle lamp

Also Published As

Publication number Publication date
US9331047B2 (en) 2016-05-03
CN102105971A (zh) 2011-06-22
US20140120663A1 (en) 2014-05-01
EP2423955A4 (en) 2013-04-10
WO2010122757A1 (ja) 2010-10-28
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CN102105971B (zh) 2013-05-22
EP2423955B8 (en) 2019-10-09

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