US20070215673A1 - Bonding apparatus and bonding method - Google Patents

Bonding apparatus and bonding method Download PDF

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Publication number
US20070215673A1
US20070215673A1 US11/503,907 US50390706A US2007215673A1 US 20070215673 A1 US20070215673 A1 US 20070215673A1 US 50390706 A US50390706 A US 50390706A US 2007215673 A1 US2007215673 A1 US 2007215673A1
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Prior art keywords
bonding
electronic component
substrate
load detection
detection mechanisms
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US11/503,907
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Inventor
Kazuhiro Yoshimoto
Yuzo Shimobeppu
Kazuo Teshirogi
Yoshiaki Shinjo
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Fujitsu Semiconductor Ltd
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Fujitsu Ltd
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Publication of US20070215673A1 publication Critical patent/US20070215673A1/en
Assigned to FUJITSU MICROELECTRONICS LIMITED reassignment FUJITSU MICROELECTRONICS LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FUJITSU LIMITED
Assigned to FUJITSU SEMICONDUCTOR LIMITED reassignment FUJITSU SEMICONDUCTOR LIMITED CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: FUJITSU MICROELECTRONICS LIMITED
Priority to US12/888,972 priority Critical patent/US20110011919A1/en
Priority to US14/249,852 priority patent/US9010615B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process
    • H01L2224/7592—Load or pressure adjusting means, e.g. sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Definitions

  • the present invention relates to a bonding apparatus capable of increasing product quality by realizing high-precision control of a pressing force applied upon mounting of an electronic component on a substrate by bonding, and to a bonding method capable of providing high-quality products stably.
  • bump connection terminal pitch reaches as small as 40 ⁇ m or less, a concern arises regarding the occurrence of connection defects, such as short-circuits between terminals, and damages to the electric component if it fails to achieve high-precision positioning (tolerances to ⁇ 1 ⁇ m) and/or stable load control because of variations in the fabrication precision of the substrate and in the formation of bumps.
  • Short circuits between terminals occur due to, for instance, excessively crushed bumps and displacement after recognition. Damages to the electronic component include failures of, for example, bumps and terminals of the electronic component and substrate.
  • a bonding apparatus which has a bonding tool provided so as to be capable of moving up and down, and a load sensor for detecting load that has been applied to an electronic component by the bonding tool.
  • the load sensor is provided on the upper side of the bonding tool support and the load sensor is allowed to contact the bonding tool support to cause both a bonding head attached with the bonding tool and load sensor to move down, bonding the electronic component to the substrate.
  • the bonding apparatus is so configured that, at this point, load (pressing force) applied by the bonding tool is detected by the load sensor that is in contact with the bonding tool.
  • a bonding apparatus in which a bonding tool support is suspended from a head unit by a spring see Japanese Patent Application Laid-Open (JP-A) No. 2000-183114
  • a bonding apparatus equipped with two different load detection mechanisms: one configured to detect decreasing load, and one configured to detect increasing load, at a time when a given level of load applied to a bonding tool support has caused a bonding tool to press an electronic component see Japanese Patent Application Laid-Open UP-A) No. 2002-76061
  • a bonding apparatus configured to carry out feedback control by previously creating a given level of thrust in a cylinder (see Japanese Patent Application Laid-Open UP-A) No.
  • the bonding tool support is provided with a number of components: mechanical sections (e.g., slide guides, a shaft, a cylinder and a spring) that constitute a lifting and lowering mechanism; mechanical sections for attaching and cooling an electronic component and for adjusting the inclination of the electronic component; and a number of parts (e.g., wires and pipes) for connecting these mechanical sections together.
  • mechanical sections e.g., slide guides, a shaft, a cylinder and a spring
  • mechanical sections for attaching and cooling an electronic component and for adjusting the inclination of the electronic component
  • a number of parts e.g., wires and pipes
  • the measured pressure value only means the load applied to the bonding tool support, and includes escaping loads such as inclined loads acting on the components, and horizontal components. For this reason, the measured load value is not necessarily equal to the value for load acting on the bonding portions, thus requiring periodical load calibration.
  • the bonding apparatus of the present invention includes at least: a bonding head configured to press an electronic component against a substrate to bond the electronic component to the substrate; a plurality of load detection mechanisms that are substantially equally spaced so as to face one another under a substrate stage which supports the substrate arranged to face the electronic component; and a pressure detection unit configured to detect a pressure on a bonding surface between the electronic component and the substrate on the basis of pressure values detected by the individual load detection mechanisms.
  • the plurality of load detection mechanisms is provided under the substrate stage in such a way that they are substantially equally spaced so as to face one another, for example, in a matrix form. For this reason, spaces on a planar surface where such load detection mechanisms are arranged can be more readily secured in the bonding apparatus of the present invention than in conventional ones where the load detection mechanisms are arranged in the vicinity of the bonding tool support.
  • the provision of the plurality of load detection mechanisms allows measurement of the pressure distributed over the substrate stage surface and high-precision control of a pressing force of the bonding head. Thus, it is possible to increase product quality.
  • the bonding method of the present invention includes at least a pressing step of pressing an electronic component against a substrate by means of a bonding head to bond the electronic component to the substrate; and a pressure detection step of detecting a pressure at a bonding surface between the electronic component and the substrate on the basis of pressure values detected by a plurality of load detection mechanisms that are substantially equally spaced so as to face one another under a substrate stage which supports the substrate arranged to face the electronic component.
  • the electronic component in the pressing step, the electronic component is first pressed against the substrate by means of the bonding head and is thereby bonded to the substrate.
  • the pressure detection step the pressure at a bonding surface between the electronic component and the substrate is detected on the basis of pressure values detected by a plurality of load detection mechanisms that are substantially equally spaced so as to face one another under a substrate stage which supports the substrate arranged to face the electronic component.
  • the net load applied to the substrate stage is detected, the pressure distributed over the substrate stage surface is measured, and the pressing force of the bonding head is controlled with high precision.
  • FIG. 1 is a cross sectional view for explaining a schematic configuration of a bonding apparatus of a first embodiment of the present invention.
  • FIG. 2 is a plan view for explaining a schematic configuration of a load detection mechanism in the bonding apparatus of the first embodiment of the present invention.
  • FIG. 3A is a first schematic explanatory diagram of an example of a modification of the load detection mechanism in the bonding apparatus of the first embodiment of the present invention.
  • FIG. 3B is a second schematic explanatory diagram of an example of a modification of the load detection mechanism in the bonding apparatus of the first embodiment of the present invention.
  • FIG. 3C is a third schematic explanatory diagram of an example of a modification of the load detection mechanism in the bonding apparatus of the first embodiment of the present invention.
  • FIG. 4 is a flowchart for explaining an operation (bonding method) of the bonding apparatus of the first embodiment of the present invention.
  • FIG. 5A is a first schematic explanatory diagram showing a bonding operation by means of a bonding method using the bonding apparatus of the first embodiment of the present invention.
  • FIG. 6A is graph showing an example of a plot of reference load vs. time in the bonding apparatus of the first embodiment of the present invention.
  • FIG. 6B is graph showing an example of a plot of load vs. time, the load detected by an individual load sensor of the bonding apparatus of the first embodiment of the present invention.
  • FIG. 7A is a first schematic explanatory diagram showing an example of trouble that occurs during a bonding operation carried out by means of the bonding method using the bonding apparatus of the first embodiment of the present invention.
  • FIG. 7B is a second schematic explanatory diagram showing an example of trouble that occurs during a bonding operation carried out by means of the bonding method using the bonding apparatus of the first embodiment of the present invention.
  • FIG. 7C is a third schematic explanatory diagram showing an example of trouble that occurs during a bonding operation carried out by means of the bonding method using the bonding apparatus of the first embodiment of the present invention.
  • FIG. 7D is a fourth schematic explanatory diagram showing an example of trouble that occurs during a bonding operation carried out by means of the bonding method using the bonding apparatus of the first embodiment of the present invention.
  • FIG. 7E is a fifth schematic explanatory diagram showing an example of trouble that occurs during a bonding operation carried out by means of the bonding method using the bonding apparatus of the first embodiment of the present invention.
  • FIG. 7F is a sixth schematic explanatory diagram showing a example of trouble that occurs during a bonding operation carried out by means of the bonding method using the bonding apparatus of the first embodiment of the present invention.
  • FIG. 8A is a first graph showing another plot of load vs. time, the loads detected by the individual load sensors of the bonding apparatus of the first embodiment of the present invention.
  • FIG. 8B is a second graph showing still another plot of load vs. time, the loads detected by the individual load sensors of the bonding apparatus of the first embodiment of the present invention.
  • FIG. 9B is a second step view for explaining the substrate transportation operation carried out in the bonding apparatus of the first embodiment of the present invention.
  • FIG. 9C is a third step view for explaining the substrate transportation operation carried out in the bonding apparatus of the first embodiment of the present invention.
  • FIG. 9D is a fourth step view for explaining the substrate transportation operation carried out in the bonding apparatus of the first embodiment of the present invention.
  • FIG. 10A is a cross-sectional view for explaining an example of the schematic configuration of a conventional bonding apparatus.
  • FIG. 10B is a cross-sectional view for explaining another example of the schematic configuration of a conventional bonding apparatus.
  • FIG. 1 is a cross-sectional view showing a schematic configuration of the bonding apparatus according to the first embodiment of the present invention.
  • the bonding apparatus shown in FIG. 1 is one carrying out flip chip bonding, and has a bonding head 100 .
  • the bonding head 100 has a function of heating and pressurizing (pressing) an electronic component having bumps to bond the bumps to connection terminals of a substrate 1 .
  • the bonding head 100 includes a bonding tool support 10 having a bonding tool 7 which operates by attaching thereto an electronic component 6 by vacuum and a heat mechanism 8 for heating the bonding tool 7 to heat bumps 6 A formed on the electronic component 6 to thereby set bonding temperature to about 180° C. to 350° C.
  • a protruding part 10 A is engaged with a cylinder 11 attached to a C-shaped lifting and lowering block 12 , and is held by the lifting and lowering block 12 via a slidable slide guide 9 .
  • a ⁇ motor 13 is arranged on the top of the bonding tool support 10 . The ⁇ motor 13 carries out a ⁇ rotation correction upon positioning of the electronic component 6 .
  • the lifting and lowering block 12 is connected to a lifting and lowering mechanism 18 which is comprised of a slide guide 15 , a feed screw 16 , and a Z motor 17 arranged on the top of the feed screw 16 , and the flat side wall of the C-shaped lifting and lowering block 12 is held by the feed screw 16 via the slidable slide guide 15 .
  • a lifting and lowering mechanism 18 which is comprised of a slide guide 15 , a feed screw 16 , and a Z motor 17 arranged on the top of the feed screw 16 , and the flat side wall of the C-shaped lifting and lowering block 12 is held by the feed screw 16 via the slidable slide guide 15 .
  • the substrate 1 having connection terminals 1 A formed thereon is placed on a substrate attachment plate 2 that holds the substrate 1 by vacuum.
  • a substrate heater 3 for heating the substrate 1 and heat insulating material 4 are provided under the substrate attachment plate 2 .
  • the heat insulating material 4 is supported by a matrix of four load sensors 5 positioned at the four corners of the heat insulating material 4 . Note in this embodiment that the substrate attachment plate 2 , substrate heater 3 and heat insulating material 4 constitute a substrate stage S.
  • Signals from these load sensors 5 are then detected by a pressure detection unit 20 (e.g., an A/D converter) and transmitted to a control unit 21 for measurement of both the total load on the bumps 6 A of the electronic component 6 and the pressure distributed over the substrate stage S surface and for control of the pressure adjustment unit 22 . In this way, set load for bonding operations is controlled.
  • a pressure detection unit 20 e.g., an A/D converter
  • the rating of a load sensor is so determined that it can support a maximum set load adopted for a bonding apparatus; within a load range up to 490,33N (50 kgf), 490,33N (50 kgf) is generally adopted for the rating of load sensors for high-pressure detection, and 49.03N (5 kgf) for the rating of load sensors for low-pressure detection. For this reason, when a set load ranges from 49.03N (5 kgf) to 147.10N (15 kgf), the load sensor is rated at 50 kgf, which results in poor precision.
  • the bonding apparatus has four load sensors 5 and thus a maximum load is equally shared by them. For this reason, even when a maximum load of 490,33N (50 kgf) is applied, the load on per one load sensor 5 is reduced by a factor of 4 (i.e., 122.58N (12.5 kgf)). Thus, it is possible to increase the linearity of the hysteresis curve and/or hysteresis characteristics by reducing the ratings of the load sensors 5 .
  • the operation frequency of the lifting and lowering mechanism that has the slide guides, spring, cylinder, etc. is very high in view of the units of the semiconductor device manufactured.
  • the lifting and lowering mechanism is susceptible to heat generated due to friction of the foregoing complex components; thus, the status of the bonding apparatus is likely to change accordingly.
  • the bonding apparatus according to the first embodiment of the present invention has no complex lifting and lowering mechanism and has a matrix of the immobilized four load sensors 5 under the substrate 1 , allowing detection of the net load applied to the portions where the bumps 6 A and corresponding connection terminals 1 A are bonded together, and of the pressure distributed over the substrate stage S surface.
  • FIG. 2 is a plan view showing the load detection mechanism in the bonding apparatus.
  • the substrate 1 is attached by vacuum to the substrate attachment plate 2 that has a vacuum aspiration groove corresponding to the shape of the substrate 1 .
  • the substrate heater 3 for heating the substrate 1 is provided under the substrate attachment plate 2 , heating the substrate 1 to about 100° C. in general.
  • the load sensors 5 are provided under the substrate heater 3 with the heat insulating material 4 interposed between them.
  • the permissible temperature range for the load sensors 5 generally ranges from about 50° C. to 100° C., and therefore, both the load sensors 5 and a drive unit (not shown) that moves the substrate stage S need to be protected against heat (about 180° C. to 350° C.) generated upon heating of the substrate 1 and bonding of the electronic component 6 .
  • the heat insulating material 4 and a cooling mechanism are arranged.
  • the four load sensors 5 are substantially equally spaced along the perimeter of the substrate attachment plate 2 so as to face one another, forming a matrix of load sensors provided at positions corresponding to the four corners of the substrate attachment plate 2 , as shown in FIG. 2 .
  • the detection signal from each of the load sensors 5 A to 5 D is outputted to the control unit 21 via the pressure detection unit 20 (e.g., an A/D converter).
  • the shape and locations of the load sensors 5 are not particularly limited; various modifications can be made as described below.
  • the substrate stage S may be immobilized by means of strain gauges as the load sensors 5 .
  • FIG. 3B other mechanisms (e.g., load cells) as the load sensors 5 may be combined, and a guide part G may be provided to make the substrate stage S mobile.
  • load cells e.g., load cells
  • additional four load sensors may be provided in such a way that they are substantially equally spaced along the perimeter of the substrate attachment plate 2 so as to face one another in a matrix form.
  • the number of the load sensor 5 increases ( 8 in FIG. 3C ), so too does the number of load detection points, allowing acquisition of more detailed load detection data.
  • the bonding operation (bonding method of the present invention) carried out by the bonding apparatus will be described with reference to the flowchart shown in FIG. 4 .
  • a reference pressure and the descending speed of the bonding tool 7 are set by the control unit 21 (e.g., a microcomputer).
  • the control unit 21 e.g., a microcomputer.
  • pressure values detected by the load sensors 5 A to 5 D are used to set the upper and lower thresholds for a pressing force on each of the load sensors 5 A to 5 D.
  • the thresholds are appropriately determined according to the constitutional material, structure, size, etc. of the substrate 1 , bumps 6 A, etc.
  • they can be determined by detecting either pressure acting on one load sensor positioned at one corner of an electronic component or pressure acting on a side of the electronic component having a combination of load sensors (i.e., pressure acting on a row of load sensors), on the basis of the pressure acting on one bump, data concerning the connection terminal strength that results in defects, etc. Moreover, if the pressing force exceeds the thresholds, alarm notifications are sent and/or the apparatus operation is halted, enabling early notification of the occurrence of abnormalities.
  • the bonding tool 7 in a bonding operation, is moved down by means of the lifting and lowering mechanism 18 , so that bonding load has a reference pressure. In this way the electronic component 6 attached to the bonding tool 7 by vacuum moves down toward the connection terminals 1 A formed on the substrate 1 .
  • pressure values detected by the load sensors 5 A to 5 D during a period from the time when the electronic component 6 and substrate 1 make first contact to the time when the bonding tool 7 is completely lifted after a predetermined period of a bonding operation, are transmitted to the control unit 21 . As shown in FIG.
  • the control unit 21 compares the predetermined reference pressure with the total of the pressure values detected by the load sensors 1 to 4 (load sensors 5 A to 5 D) to perform feedback control on the pressure adjustment unit 22 .
  • a digital flow rate-regulating valve is adjusted by a pressure motor driver to adjust the flow rate in the cylinder 11 .
  • the flow rate in the cylinder 11 is detected and transmitted to the control unit 21 .
  • Each of the detected pressure values thus sampled is compared with the upper and lower thresholds for the pressing force that have been previously set for one corner and one side of the electronic component 6 .
  • the detected pressure values—even within the set reference pressure—exceeded these upper and lower thresholds it is determined that abnormalities have occurred, followed by sending of alarm notification and halt of the apparatus operation.
  • the electronic component 6 can be protected from being damaged.
  • detected pressure values sampled for each bonding operation can be monitored over time, stored as a manufacture status history. It is therefore possible to increase product quality and to ensure traceability of products.
  • a graph as shown in FIG. 6A is given by plotting the change in X, a bonding load reference pressure (reference pressure per one electronic component), versus time.
  • the bonding load reference pressure equals to the total of the pressure values, which have been detected by the load sensors 5 A to 5 D during a period from the time when a reference pressure is applied to the electronic component 6 as a result of contact between the electronic component 6 and substrate 1 to the time when the bonding tool 7 is completely lifted after a predetermined period of a bonding operation.
  • X 1 a detected pressure value per one load sensor, is four times as small as the bonding load reference pressure X, as shown in FIG. 6B . This means that load is equally distributed on the bumps 6 A of the electronic component 6 . In this state, there is no concern for damages to the electronic component 6 .
  • FIGS. 7A to 7F Troubles that occur during a bonding operation are shown in FIGS. 7A to 7F .
  • the bonding tool 7 is inclined and is out of parallelism relative to the substrate stage S.
  • the substrate stage S is inclined and is out of parallelism relative to the bonding tool 7 .
  • the bumps 6 A are different in height. In either case, connection failures have occurred between the connection terminals 1 A and bumps 6 A.
  • FIG. 7D foreign material D is trapped between the substrate 1 and substrate stage S.
  • FIG. 7E foreign material D is trapped between the electronic component 6 and bonding tool 7 .
  • FIG. 7F foreign material D is trapped between the connection terminal 1 A and bump 6 A.
  • connection failures have occurred.
  • connection failures occur due to, for example, variations in the substrate and in the chip thickness.
  • Load detection mechanisms in conventional bonding apparatus cannot find such connection failures, and a bonding operation finishes after application of a bonding load reference pressure X (total load reference pressure per one electronic component) shown in FIG. 6B .
  • X total load reference pressure per one electronic component
  • thresholds are set for each of the pressure values detected by the plurality of load sensors 5 , it is possible to detect abnormalities such as connection failures.
  • no abnormalities can be detected upon occurrence of component crash, connection failures, etc., continuing manufacturing operations. More specifically, load to be applied over the electronic component converges to a particular point, resulting in electronic component failure and reduced production yields. According to the present invention, however, it is possible to increase product quality and production yields.
  • the load sensors 5 A to 5 D in this embodiment produce different values for the detected pressure, allowing detection of such minor abnormalities.
  • the bonding apparatus is so controlled that a bonding load reference pressure is applied to them at a predetermined rate. For this reason, the load detected by the load sensors 5 A and 5 B increases first as indicated by X 2 of FIG. 8A and later on, as the bumps 6 A deforms by application of pressure, load is also applied to the load sensors 5 C and 5 D as indicated by X 3 .
  • the bonding apparatus can detect such a time lag.
  • Load sensors that are first pressed tend to produce higher values for the detected pressure than other load sensors; therefore, loads acting on components (e.g., the electronic component 6 , bumps 6 A, and connection terminals 1 A on the substrate 1 ) are compared with the upper and lower thresholds for the pressing force that are previously set for one corner and one side of the electronic component 6 , allowing monitoring whether components in the resulting products have been fabricated within the allowable strength range.
  • loads acting on components e.g., the electronic component 6 , bumps 6 A, and connection terminals 1 A on the substrate 1
  • a bonding operation has been made for one element on the substrate 1 as described above, similar bonding operations can be made for a plurality of elements arranged on one substrate.
  • the substrate stage may be fixed and then the substrate 30 may be moved for the bonding of individual electronic components 6 in the order from FIG. 9A to FIG. 9D .
  • the substrate stage may be divided into several sections before performing bonding operations.
  • a plurality of load sensors is arranged on a substrate in a matrix form.
  • Load to a bonding portion applied within the upper and lower thresholds for the allowable load that have been previously set for each position where the load sensor detects load, is feedback-controlled, and the stress distribution over the substrate stage surface can be monitored.
  • the load detection mechanism upon bonding of the electronic component to the substrate (i.e., upon production of products).
  • FIGS. 10A and 10B each shows a schematic configuration of a conventional bonding apparatus.
  • the bonding apparatus shown in FIG. 10A includes a bonding head 200 .
  • the bonding head 200 includes a bonding tool support 210 having a bonding tool 207 which operates by attaching an electronic component 206 by vacuum thereto and a heat mechanism 208 for heating the bonding tool 207 to heat bumps 206 A formed on an electronic component 206 .
  • a protruding part 210 A is engaged with a cylinder 211 attached to a C-shaped lifting and lowering block 212 , and the lower surface of the protruding part 210 A is biased against the lifting and lowering block 212 by a spring 230 .
  • the bonding tool support 210 is held by the lifting and lowering block 212 via a slidable slide guide 209 .
  • a rotary motor 213 is arranged on the top of the bonding tool support 210 .
  • the rotary motor 213 carries out a rotation correction upon positioning of the electronic component 206 .
  • a load sensor 205 for detecting the pressing force of the bonding tool 207 is arranged on the bonding tool support 210 beneath the cylinder 211 .
  • the lifting and lowering block 212 is connected to a lifting and lowering mechanism 218 which is comprised of a slide guide 215 , a feed screw 216 , and a lifting and lowering motor 217 arranged on the top of the feed screw 216 , and the flat side wall of the C-shaped lifting and lowering mechanism 212 is held by the feed screw 216 via the slidable slide guide 215 .
  • the lifting and lowering block 212 connected to the lifting and lowering mechanism 218 is allowed to move vertically, causing the bonding tool 207 to move vertically accordingly.
  • a substrate 201 having connection terminals 201 A formed thereon is placed on a substrate attachment plate 202 that holds the substrate 201 by vacuum.
  • a substrate heater 203 for heating the substrate 201 and heat insulating material 204 are provided under the substrate attachment plate 202 .
  • the control unit 221 controls a pressure adjustment unit 222 , causing the pressure detection unit 222 to adjust the flow rate of a valve 223 . In this way the pressing force of the bonding tool 207 is controlled.
  • a conventional bonding apparatus shown in FIG. 10B includes a bonding head 300 .
  • the bonding head 300 is similar to the bonding head 200 shown in FIG. 10A except that a load sensor 205 is arranged on a lifting and lowering block 212 beneath a protruding part 210 A of a bonding tool support 210 .
  • the conventional bonding apparatus cannot find during a bonding operation troubles (e.g., inclination of the bonding tool, contamination of foreign material, variations in the level of bumps, connection failures between substrate's connection terminals, abnormal lifting and lowering of the bonding tool, and wearing away and/or failure of the lifting and lowering mechanism) like the foregoing bonding apparatus according to the first embodiment. Accordingly, products obtained using such conventional bonding apparatus are of less quality than those obtained using the bonding apparatus according to the first embodiment, resulting in reduced production yields.
  • troubles e.g., inclination of the bonding tool, contamination of foreign material, variations in the level of bumps, connection failures between substrate's connection terminals, abnormal lifting and lowering of the bonding tool, and wearing away and/or failure of the lifting and lowering mechanism
  • the present invention it is possible to solve the foregoing conventional problems and to provide a bonding apparatus capable of increasing product quality by realizing high-precision control of a pressing force applied upon mounting of an electronic component on a substrate by bonding, and to a bonding method capable of providing high-quality products stably.
  • the bonding apparatus of the present invention controls pressing force with high precision when mounting an electronic component on a substrate by bonding, thereby increasing product quality. Moreover, when abnormalities have occurred, alarms can be issued and/or the operation of the bonding apparatus can be halted, thus ensuring the traceability of products for quality management. For these reasons, the bonding apparatus of the present invention can be suitably used for bonding of flash memories, DRAMs, and FRAMs.
  • the bonding method of the present invention controls pressing force with high precision to achieve stable mounting of an electronic component on a substrate.
  • the bonding method of the present invention it is possible to provide high-quality products with high yields without involving continued production of defected pieces.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Operations Research (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
US11/503,907 2006-03-17 2006-08-15 Bonding apparatus and bonding method Abandoned US20070215673A1 (en)

Priority Applications (2)

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US12/888,972 US20110011919A1 (en) 2006-03-17 2010-09-23 Bonding apparatus and bonding method
US14/249,852 US9010615B2 (en) 2006-03-17 2014-04-10 Bonding apparatus and bonding method

Applications Claiming Priority (2)

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JP2006-075375 2006-03-17
JP2006075375A JP4825029B2 (ja) 2006-03-17 2006-03-17 ボンディング装置及びボンディング方法

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US12/888,972 Abandoned US20110011919A1 (en) 2006-03-17 2010-09-23 Bonding apparatus and bonding method
US14/249,852 Expired - Fee Related US9010615B2 (en) 2006-03-17 2014-04-10 Bonding apparatus and bonding method

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US14/249,852 Expired - Fee Related US9010615B2 (en) 2006-03-17 2014-04-10 Bonding apparatus and bonding method

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US20150083786A1 (en) * 2012-03-28 2015-03-26 Nikon Corporation Substrate Bonding Apparatus and Substrate Bonding Method
US20160279915A1 (en) * 2015-03-24 2016-09-29 Fuk Co., Ltd. Bonding Apparatus
CN109872958A (zh) * 2017-12-04 2019-06-11 美光科技公司 半导体工具和用于形成半导体装置组合件的方法
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JP6439138B2 (ja) * 2014-10-27 2018-12-19 パナソニックＩｐマネジメント株式会社 電子部品実装システム
JP6722689B2 (ja) * 2015-11-04 2020-07-15 株式会社Ｆｕｊｉ 荷重計測装置及び荷重計測方法
EP3644700B1 (en) * 2017-06-20 2022-08-24 Fuji Corporation Electronic component mounting machine
JP7270119B2 (ja) * 2018-06-11 2023-05-10 パナソニックＩｐマネジメント株式会社 部品実装装置
CN109696897B (zh) * 2019-02-18 2021-05-28 中联恒通机械有限公司 一种多点顶升机构载荷检测方法及其检测装置

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US20110011919A1 (en) 2011-01-20
US20140217153A1 (en) 2014-08-07
JP2007251051A (ja) 2007-09-27
US9010615B2 (en) 2015-04-21
JP4825029B2 (ja) 2011-11-30

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