US20060079095A1 - Method of removing a polymer coating from an etched trench - Google Patents

Method of removing a polymer coating from an etched trench Download PDF

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Publication number
US20060079095A1
US20060079095A1 US11/242,917 US24291705A US2006079095A1 US 20060079095 A1 US20060079095 A1 US 20060079095A1 US 24291705 A US24291705 A US 24291705A US 2006079095 A1 US2006079095 A1 US 2006079095A1
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etching
wafer
range
chamber
trench
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Darrell McReynolds
Kia Silverbrook
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Silverbrook Research Pty Ltd
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Silverbrook Research Pty Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B41J2/14112—Resistive element
    • B41J2/1412—Shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00841—Cleaning during or after manufacture
    • B81C1/00849—Cleaning during or after manufacture during manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/05—Microfluidics
    • B81B2201/052—Ink-jet print cartridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0323—Grooves
    • B81B2203/033—Trenches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0111—Bulk micromachining
    • B81C2201/0112—Bosch process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/013—Etching
    • B81C2201/0132—Dry etching, i.e. plasma etching, barrel etching, reactive ion etching [RIE], sputter etching or ion milling

Definitions

  • This invention relates to a process for modifying sidewalls of a trench etched into a semiconductor wafer. It has been developed primarily for incorporation into a printhead integrated circuit manufacturing process in order to provide an ink channel having improved surface properties and/or improved surface profile. However, it may equally be incorporated into any etching process.
  • MEMS Microelectromechanical Systems
  • MEMS devices have found applications in a wide variety of fields, such as in physical, chemical and biological sensing devices.
  • One important application of MEMS devices is in inkjet printheads, where micro-scale actuators for inkjet nozzles may be manufactured using MEMS techniques.
  • the present Applicant has developed printheads incorporating MEMS ink ejection devices and these are the subject of a number of patents and patent applications listed in the Cross References section above and all of which are incorporated herein by reference.
  • MEMS inkjet printhead (“MEMJET printhead”) is comprised of a plurality of integrated circuits, with each integrated circuit having several thousand nozzles.
  • Each nozzle comprises an actuator for ejecting ink, which may be, for example, a thermal bend actuator (e.g. U.S. Pat. No. 6,322,195) or a bubble-forming heater element actuator (e.g. U.S. Pat. No. 6,672,709).
  • the integrated circuits are manufactured using MEMS techniques, meaning that a high nozzle density and, hence, high resolution printheads can be mass-produced at relatively low cost.
  • Etch depths of about 3 ⁇ m to 10 ⁇ m may be termed “deep etches”, whereas etch depths of more than about 10 ⁇ m may be termed “ultradeep etches”.
  • MEMS printhead integrated circuits typically require delivery of ink to each nozzle through individual ink supply channels having a diameter of about 20 ⁇ m. These ink channels are typically etched through wafers having a thickness of about 200 ⁇ m, and therefore place considerable demands on the etching method employed. It is especially important that each ink channel is perpendicular to the wafer surface and does not contain kinks, sidewall projections (e.g. grassing) or angular junctions, which can interfere with the flow of ink.
  • the wafer typically has a thickness “B” of about 200 ⁇ m, whilst the nozzle chamber typically occupies a thickness “A” of about 20 ⁇ m.
  • the nozzle chamber 3 has an inlet 8 , which joins an ink supply channel (not shown in FIG. 1 ) in the silicon wafer 5 .
  • an ink supply channel 6 is formed in the wafer 5 by first etching a trench through the CMOS metallization layer of a TEOS interconnect 7 and partially through the wafer 5 from the ink ejection side 20 of the wafer. Once formed, the trench is plugged with photoresist 10 whilst nozzle structures are formed on the ink ejection side 20 of the wafer. After formation of the nozzle arrangement 1 , the ink supply channel 6 is formed by ultradeep etching from the ink supply side 30 of the wafer to and past the photresist plug 10 .
  • FIG. 3 the photoresist plug 10 is finally stripped away to form the inlet 8 .
  • the inlet 8 provides fluid connection between the ink supply channel 6 and the nozzle chamber 3 .
  • FIGS. 2 and 3 also shows the CMOS drive circuitry 9 , which is provided between the wafer 5 and the interconnect 7 .
  • the “back-etching” of the ink supply channel avoids filling and removing an entire 200 ⁇ m long ink supply channel with resist whilst nozzle structures in the wafer are being lithographically formed.
  • the mask on the ink supply side needs to be carefully aligned so that the etched channels meet the trenches plugged with photoresist, and do not damage the drive circuitry 9 .
  • the etching needs to be perpendicular and anisotropic to a depth of about 200 ⁇ m.
  • etching ultradeep trenches into silicon are known in the art. All these methods involve deep reactive ion etching (DRIE) using a gas plasma.
  • DRIE deep reactive ion etching
  • the semiconductor substrate, with a suitable mask disposed thereon, is placed on a lower electrode in a plasma reactor, and exposed to an ionized gas plasma formed from a mixture of gases.
  • the ionized plasma gases (usually positively charged) are accelerated towards the substrate by a biasing voltage applied to the electrode.
  • the plasma gases etch the substrate either by physical bombardment, chemical reaction or a combination of both.
  • Etching of silicon is usually ultimately achieved by formation of volatile silicon halides, such as SiF 4 , which are carried away from the etch front by a light inert carrier gas, such as helium.
  • Anisotropic etching is usually achieved by depositing a passivation layer onto the base and sidewalls of the trench as it is being formed, and selectively etching the base of the trench using the gas plasma.
  • a first polymer deposition step deposits a polymer onto the base and sidewalls of the trench.
  • the polymer is deposited by a gas plasma formed from a fluorocarbon gas (e.g. CHF 3 , C 4 F 8 or C 2 F 4 ) in the presence or in the absence of an inert gas.
  • a fluorocarbon gas e.g. CHF 3 , C 4 F 8 or C 2 F 4
  • the plasma gas mix is changed to SF 6 /Ar.
  • the polymer deposited on the base of the trench is quickly broken up by ion assistance in the etching step, while the sidewalls remain protected. Hence, anisotropic etching may be achieved.
  • a major disadvantage of the Bosch process is that polymer deposition and etching steps need to be alternated, which means continuously alternating the gas composition of the plasma, thereby slowing etch rates. This alternation, in turn, leads to uneven trench sidewalls, characterized by scalloped surface formations.
  • a further disadvantage of the Bosch process is that it leaves a hydrophobic fluorocarbon polymer coating (‘Bosch polymer’) on the trench sidewalls.
  • ‘Bosch polymer’ hydrophobic fluorocarbon polymer coating
  • inkjet nozzles already fabricated the frontside of the wafer.
  • nozzles are first formed on a frontside of wafer and then ink supply channels are etched from a backside of the wafer.
  • backside processing steps e.g. wafer grinding, etching
  • the frontside of the wafer, having a protective photoresist coating is usually attached to a handle wafer using a thermal release tape.
  • the thermal release tape comprises a film having a thermal release adhesive on one side. The thermal release adhesive conveniently allows the silicon wafer to be detached from the handle wafer by controlled heating after the completion of backside processing steps.
  • FIGS. 2 and 3 show an idealized fabrication process in which the etch front continues to etch anistropically and flush against the photoresist plug 10 when the etch front meets the photoresist.
  • the etch flares radially outwards, leaving a spiked circumferential rim 13 around the photoresist plug.
  • the radially flared etch terminus 12 is undesirable in the final printhead integrated circuit when the photoresist is removed ( FIG. 5 ).
  • the flared etch terminus 12 acts as a pocket, which can trap slow-moving ink or gas bubbles. This can lead to disruption of the flow of ink from the ink channel 6 to the inlet 8 and the nozzle downstream.
  • the spiked rim 13 which faces the flow of oncoming ink, is relatively weakly supported by the bulk wafer 5 and can easily break off into one or more slivers.
  • the creation of slivers in the ink flow is highly undesirable and will typically result in failure of the nozzle downstream.
  • a method of removing a polymeric coating from sidewalls of an etched trench defined in a silicon wafer comprising etching said wafer in a biased plasma etching chamber using an O 2 plasma, wherein said chamber temperature is in the range of 90 to 180 ° C.
  • a method of etching a trench in a silicon wafer comprising the steps of:
  • the present invention provides a process for facilitating modification of an etched trench, the process comprising:
  • the present invention provides a method of fabricating an inkjet printhead integrated circuit comprising a plurality of nozzles, ejection actuators, associated drive circuitry and ink supply channels, the method comprising the steps of:
  • the present invention provides an inkjet printhead integrated circuit fabricated by the method described above.
  • the method according to the first and second aspects of the present application advantageously allow a hydrophobic polymeric sidewall residue (e.g. ‘Bosch polymer’) to be removed from a trench, without overheating the silicon wafer.
  • a hydrophobic polymeric sidewall residue e.g. ‘Bosch polymer’
  • Overheating of the silicon wafer may cause damage of sensitive MEMS structures already formed on the wafer by stresses exerted, for example, by photoresist expansion.
  • overheating typically causes delimination of the wafer from a handle wafer to which the silicon wafer is usually attached. Accordingly, it is as advantage of the present invention that polymeric residues can be removed without using potentially damaging EKCTM cleaning or O 2 plasma ashing.
  • the polymeric coating is generally replaced by more hydrophilic silicon oxide layer.
  • the O 2 plasma has sufficient energy to remove polymeric residues in deep (e.g. over 100 micron deep) trenches at a temperature lower than the release temperature of standard thermal release tape.
  • the present invention provides a method for facilitating its removal in a post-etching step.
  • a portion of the photoresist plug is removed so as to expose the circumferential rim formed around the plug during deep or ultradeep etching. Once exposed, the circumferential rim may be smoothed or rounded by ion milling.
  • printheads made by the process of the present invention generally exhibit improved ink flow through their ink supply channels and minimize the risk of nozzle failure caused by slivers of wafer blocking or damaging the nozzles.
  • the oxygen plasma etch is typically performed in a plasma etching reactor, such as an inductively coupled plasma (ICP) etching reactor.
  • a plasma etching reactor such as an inductively coupled plasma (ICP) etching reactor.
  • ICP inductively coupled plasma
  • plasma etching reactor and “plasma etching chamber” are entirely equivalent terms of art.
  • Plasma etching reactors are well known in the art and are commercially available from various sources (e.g. Surface Technology Systems, PLC).
  • the etching reactor comprises a chamber formed from aluminium, glass or quartz, which contains a pair of parallel electrode plates.
  • the present invention is suitable for use with any type of plasma etching reactor.
  • a radiofrequency (RF) energy source is used to ionize a gas mixture introduced into the chamber.
  • the resultant ionized gas plasma is accelerated towards a substrate disposed on a lower electrode (also referred to as an electrostatic chuck or a platen) by a biasing voltage.
  • the plasma etching chamber can be used for biased etches in which a gas plasma is directed towards a substrate.
  • control means are provided for controlling the ICP power, bias power, RF ionizing energy, substrate temperature, chamber pressure, chamber temperature etc.
  • the plasma etching chamber parameters may be optimized in order to achieve complete removal of polymer coatings from trench sidewalls.
  • the bias power is in the range of 10 to 100 W (preferably 30 to 70 W)
  • the ICP power is optionally in the range of 1000 to 3000 W (or 2000 to 3000 W)
  • the chamber temperature is optionally in the range of 90 to 180° C. (or 90 to 150° C., or 120 to 150° C.)
  • the O 2 flow rate is optionally in the range of 20 to 200 sccm (preferably 60 to 100 sccm)
  • the chamber pressure is optionally in the range of 5 to 200 mTorr (optionally 20 to 140 mTorr, or optionally 60 to 100 mTorr).
  • Etching times are typically in the range of 20 to 200 minutes, 30 to 200 minutes or 40 to 80 minutes.
  • the process removes a depth of about 1 to 15 ⁇ m, or optionally a depth of about 2 to 7 ⁇ m, from an exposed back surface of the photoresist plug.
  • the removed portion may be up to 10%, up to 20%, or up to 50% of the total plug volume.
  • the amount of photoresist removed by the process of the present invention will be sufficient to expose an inner surface of a circumferential rim formed around at least part of the original intact plug by a prior etching process.
  • the process of the invention includes the further step of ion milling exposed angular features, such as the circumferential rim described above.
  • angular surface features are tapered, smoothed and/or rounded by the ion milling.
  • ink flowing past these features approaches a curved surface rather than an angular surface, meaning that the ink can flow smoothly past, without generating excessive turbulence and/or air bubbles.
  • the resultant rounded, smoothed and/or tapered features are less frangible and are therefore less likely to cause nozzle failure by slivers breaking off and entering the nozzle chamber.
  • the ion milling is usually performed in a plasma etching reactor, such as the inductively coupled plasma etching reactor described above.
  • the ion milling is performed using a heavy inert gas selected from argon, krypton or xenon.
  • the inert gas is argon since this is widely available at relatively low cost, and, because of its relatively high mass, has excellent sputtering properties.
  • an argon ion plasma is generated in a plasma etching reactor, and the argon ions accelerated perpendicularly towards a silicon wafer having ink supply channels etched therein.
  • Plasma reactor parameters may be varied in order to achieve optimal ion milling of the wafer.
  • the bias power is in the range of 100 to 500 W (preferably 200 to 400 W)
  • the ICP power is in the range of 1000 to 3000 W (preferably about 2500 W)
  • the chamber temperature is in the range of 90 to 150° C. (preferably about 120° C.)
  • the Ar flow rate is in the range of 20 to 200 sccm (preferably 80 to 120 sccm). Milling times are typically in the range of 5 to 100 minutes, 10 to 60 minutes or 10 to 30 minutes.
  • the ion milling may be performed at any suitable pressure. Typically, the pressure will be in the range of 2 to 2000 mTorr. In other words, ion milling may be performed at low pressure (about 2 to 250 mTorr) or high pressure (about 250 to 2000 mTorr).
  • Low pressure ion milling has the advantage that most commercially available plasma etching reactors are configured for low pressure etching. Hence, low pressure ion milling does not require any special apparatus.
  • ion milling may also be performed at high pressure.
  • High pressure ion milling has the advantage that steeper tapering is usually obtainable.
  • the principle of using high pressure ion milling to produce steep taper angles may be understood as follows. Normally, sputter etching is performed at relatively low pressures (e.g. about 5 to 250 mTorr) to achieve high sputter etching efficiency. Such a low pressure produces a nearly collision-free path for silicon atoms sputtered from the surface, thereby optimizing etching efficiency.
  • U.S. Pat. No. 5,888,901 which is incorporated herein by reference, describes high pressure ion milling of a SiO 2 dielectric surface using argon as the sputtering gas. Whilst the method described in U.S. Pat. No. 5,888,901 is used for tapering a SiO 2 dielectric surface layer, rather than tapering angular surface features on the sidewalls of ultradeep channels etched into silicon, this method may be readily modified and applied to the process of the present invention.
  • Low pressure ion milling (e.g. 5 to 50 mTorr) is generally preferred in the present invention, because it is usually only necessary to round off angular sidewall features in order to achieve improved ink flow, rather than taper the whole sidewall feature. Moreover, low pressure ion milling does not require any special apparatus and can therefore be easily incorporated into a typical printhead fabrication process.
  • each ink supply channel has a depth in the range of 100 to 300 ⁇ m, optionally 150 to 250 ⁇ m, or optionally about 200 ⁇ m.
  • the width/length dimensions of the ink supply channel may vary considerably.
  • each ink supply is substantially cylindrical having a diameter in the range of 5 to 30 ⁇ m, optionally 14 to 28 ⁇ m, or optionally 17 to 25 ⁇ m. With such designs, etch flaring is usually significant as the etch front meets the frontside photoresist plug.
  • each ink supply channel has a width of 40 to 120 ⁇ m (or 60 to 100 ⁇ m), and a length of over 200 ⁇ m or over 500 ⁇ m.
  • etch flaring is usually insignificant due to dispersion of charge away from the etch front. Notwithstanding this avoidance of etch flaring, the present invention is still used to remove polymeric coatings from trench sidewalls by biased oxygen plasma etching.
  • each nozzle inlet has a depth in the range of 5 to 40 ⁇ m, optionally 10 to 30 ⁇ m, or optionally 15 to 25 ⁇ m.
  • each nozzle inlet is substantially cylindrical having a diameter in the range of 3 to 28 ⁇ m, optionally 8 to 24 ⁇ m, or optionally 12 to 20 ⁇ m.
  • each nozzle inlet is substantially cuboid having width/length dimensions in the range of 5 to 40 ⁇ m.
  • each ink supply channel has a larger diameter than its corresponding nozzle inlet, and the process of the present invention may be used to taper, smooth and/or round off shoulders defined by the junction of the inlet and the ink supply channel.
  • the present invention provides a process for facilitating modification of an etched trench, the process comprising:
  • the wafer comprises a plurality of etched trenches.
  • the biased oxygen plasma etch removes a depth of 1 to 15 ⁇ m from an exposed surface of the photoresist plug.
  • trench sidewalls are concomitantly hydrophilized by the biased oxygen plasma etch.
  • Optionally concomitant hydrophilization includes removal of a polymeric layer from the trench sidewalls.
  • the biased oxygen plasma etch is performed in a plasma etching reactor
  • the plasma etching reactor has a bias power in the range of 10 to 100 W.
  • the plasma etching reactor has a chamber pressure in the range of 20 to 140 mTorr.
  • Optionally forms part of a printhead fabrication process.
  • the etched trench is an ink supply channel for a printhead.
  • the ink supply channel has a depth in the range of 100 to 300 ⁇ m.
  • the present invention provides a method of fabricating an inkjet printhead integrated circuit comprising a plurality of nozzles, ejection actuators, associated drive circuitry and ink supply channels, the method comprising the steps of:
  • the angular sidewall features include a circumferential rim around at least a part of the photoresist plug, the circumferential rim being exposed by removing a portion of each plug.
  • the exposed angular sidewall features are modified by argon ion milling.
  • the argon ion milling smoothes and/or rounds the exposed angular sidewall features.
  • the argon ion milling is performed in a plasma etching reactor.
  • ink supply channel sidewalls are concomitantly hydrophilized by the biased oxygen plasma etch.
  • an inkjet printhead integrated circuit fabricated by the above-mentioned method.
  • a method of removing a polymeric coating from sidewalls of an etched trench defined in a silicon wafer comprising etching said wafer in a biased plasma etching chamber using an O 2 plasma, wherein a chamber temperature is in the range of 90 to 180° C.
  • said etching chamber is an inductively coupled plasma (ICP) etching chamber.
  • ICP inductively coupled plasma
  • an ICP power is in the range of 2000 to 3000 W.
  • said wafer is attached to a platen, and a biasing platen power is in the range of 10 to 100 W.
  • said chamber temperature is in the range of 120 to 150° C.
  • a chamber pressure is in the range of 30 to 120 mTorr.
  • a chamber pressure is in the range of 60 to 100 mTorr.
  • said platen has a temperature in the range of 5 to 20° C.
  • said platen is cooled using backside helium cooling.
  • an oxygen flow rate to said chamber is in the range of 20 to 200 sccm.
  • an etching time is in the range of 40 to 80 minutes.
  • said polymeric coating is a hydrophobic fluoropolymer.
  • said trench is an ink supply channel for an inkjet printhead.
  • said ink supply channel has a width in the range of 20 to 120 microns
  • said ink supply channel has a depth of at least 100 microns.
  • a frontside of said silicon wafer is attached to a handle wafer using adhesive tape, said etched trench being defined in a backside of said wafer.
  • said adhesive tape is thermal release tape.
  • said adhesive tape is unaffected by said oxygen plasma etching.
  • said oxygen plasma etching does not cause delamination of said handle wafer from said silicon wafer.
  • a method of etching a trench in a silicon wafer comprising the steps of:
  • FIG. 1 is a perspective view of a printhead nozzle arrangement for a printhead
  • FIG. 2 is cutaway perspective view of an idealized, partially fabricated printhead nozzle arrangement, with the actuator assembly removed and the ink supply channel exposed;
  • FIG. 3 is a cutaway perspective view of the printhead nozzle arrangement shown in FIG. 2 after stripping away the photoresist plug;
  • FIG. 4 is a cutaway perspective view of a partially fabricated prior art printhead nozzle arrangement, with the actuator assembly removed and the ink supply channel exposed;
  • FIG. 5 is a cutaway perspective view of the prior art printhead nozzle arrangement shown in FIG. 4 after stripping away the photoresist plug;
  • FIG. 6 is a cutaway perspective view of a partially fabricated printhead nozzle arrangement according to the present invention, with the actuator assembly removed and the ink supply channel exposed;
  • FIG. 7 is a cutaway perspective view of the partially fabricated printhead nozzle arrangement shown in FIG. 6 , after ion milling the circumferential rim;
  • FIG. 8 is a cutaway perspective view of the partially fabricated printhead nozzle arrangement shown in FIG. 6 , after stripping away the photoresist;
  • FIG. 9 is an SEM micrograph of a silicon wafer having 12 trenches back-etched to within 5 ⁇ m of corresponding front plugs;
  • FIG. 10 is a magnified SEM micrograph of a silicon wafer showing a trench back-etched 5 ⁇ m beyond a front plug;
  • FIG. 11 is an SEM micrograph of a trench after biased oxygen plasma etching according to the invention.
  • FIG. 12 is a magnified view of FIG. 11 ;
  • FIG. 13 is an SEM micrograph of a trench after argon ion milling.
  • FIG. 14 is a side view of a silicon wafer attached to glass handle wafer.
  • the frontside is coated with a protective layer of photoresist 51 and attached to a glass handle wafer 52 .
  • the glass handle wafer 52 is attached using a thermal release tape 53 having a permanent adhesive layer 54 bonded to the glass handle wafer 52 , and a thermal release adhesive layer 55 bonded to the protective photoresist 50 .
  • An outermost surface of the glass handle wafer 52 is metallized for attachment to an electrotstatic platen in a plasma etching chamber.
  • the wafer 5 is back-etched in a plasma etching chamber to define backside ink supply channels.
  • Any standard anisotropic DIRE process e.g. Bosch etch may be used for backside etching.
  • FIG. 4 there is shown a partially fabricated printhead integrated circuit after back-etching from the ink supply side 30 (backside) of the wafer 5 to and past the photoresist plug 10 .
  • the etch flares radially outwards to give a radially flared etch terminus 12 and a corresponding circumferential rim 13 around part of the plug.
  • the back-etched wafer shown in FIG. 4 is subjected to a biased oxygen plasma etch.
  • the biased oxygen plasma etch is performed in a plasma etching chamber using suitably controlled gas flow, biasing power, ICP power, chamber pressure and etching time.
  • the biased oxygen plasma etch removes a portion of the photoresist plug 10 . The portion removed is sufficient to expose the spiked circumferential rim 13 .
  • the biased oxygen plasma etch removes any hydrophobic fluorocarbon polymer from the sidewalls of the ink supply channel 6 , replacing it with a hydrophilic layer of SiO 2 .
  • the fluorocarbon polymer coating on the sidewalls of the ink supply channel 6 is typically formed during the anisotropic DIRE process.
  • the surface properties of the ink supply channel 6 are generally improved, without affecting the thermal release tape which secures the wafer 5 to the handle wafer 52 .
  • delamination is avoided.
  • the wafer 5 shown in FIG. 6 is subjected to argon ion milling in a plasma etching reactor.
  • argon ion milling the exposed circumferential rim 13 is smoothed down, which improves the robustness and surface profile of the ink supply channel 6 .
  • the extent to which the circumferential rim 13 is smoothed, rounded and/or tapered will depend on the pressure, bias power and/or the milling time in the plasma etching reactor.
  • the rim 13 may be either rounded down (as shown in FIG. 7 ) or fully tapered by argon ion milling. In either case, the removal of this spiked projection generally improves ink flow through the channel 6 and minimizes the likelihood of slivers breaking off and blocking the nozzle downstream.
  • the wafer shown in FIG. 7 is ashed, which completely strips away the photoresist plug 10 and provides fluid connection between the inlet 8 and the ink supply channel 6 .
  • a silicon wafer having a thickness of 200 ⁇ m was prepared as follows. Using a standard anisotropic DRIE process a trench, having a diameter of 14 ⁇ m and a depth of 28 ⁇ m, was etched into a frontside of the wafer. The trench was filled with photoresist to form a front plug. With the frontside of the wafer attached to a glass handle wafer, the backside is then etched to within 5 ⁇ m of the back surface of the front plug. Again, a standard anisotropic DRIE process is used for backside etching. The back-etched main trench had a depth of about 170 ⁇ m and a diameter of about 21 ⁇ m.
  • FIG. 9 is an SEM micrograph of the silicon wafer after back-etching to within 5 ⁇ m of the front plug.
  • FIG. 10 is an SEM micrograph of part of the trench after back-etching past the front plug. As shown in FIG. 10 , a spiked circumferential rim extends around the front plug, where the back-etch did not etch completely flush against the front plug.
  • a standard inductively coupled plasma DRIE reactor (“HRM Pro” tool, supplied by Surface Technology Systems) was configured as follows: ICP top power: 2500 W Bias power 50 W Plasma gas: O 2 Chamber temperature: 120° C. Cooling: Backside helium cooling, 9.5 Torr, 10° C. Chamber pressure: 80 mTorr O 2 flow rate: 80 sccm
  • FIGS. 11 and 12 are SEM micrographs of part of the silicon wafer, showing in detail the 7 ⁇ m portion of front plug removed by the oxygen plasma etch.
  • FIG. 12 also shows a spiked circumferential projection (formerly a rim around the front plug), having a thickness of 1.7 ⁇ m, extending towards the back side of the wafer.
  • the plasma reactor was reconfigured as follows: ICP top power: 2500 W Bias power 300 W Plasma gas: Ar Chamber temperature: 120° C. Cooling: Backside helium cooling, 9.5 Torr, 10° C. Chamber pressure: 10 mTorr O 2 flow rate: 100 sccm
  • FIG. 13 is an SEM micrograph of the resultant trench, which shows the spiked circumferential projection rounded down to a smooth surface.
  • the absence of spiked projections at the junctions of the front-etched and back-etched trenches significantly improves the surface profile of the resultant channel, once the photoresist has been stripped away.

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  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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US11/242,917 2004-10-08 2005-10-05 Method of removing a polymer coating from an etched trench Abandoned US20060079095A1 (en)

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US12/542,659 Expired - Fee Related US7837887B2 (en) 2004-10-08 2009-08-17 Method of forming an ink supply channel
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US20110024389A1 (en) 2011-02-03
EP1800334A4 (en) 2012-07-04
KR100857629B1 (ko) 2008-09-08
US7588693B2 (en) 2009-09-15
US20060076312A1 (en) 2006-04-13
WO2006037151A3 (en) 2006-10-19
WO2006037151A2 (en) 2006-04-13
EP1800334A2 (en) 2007-06-27
US7837887B2 (en) 2010-11-23
US20090301999A1 (en) 2009-12-10
KR20070088584A (ko) 2007-08-29
JP4638499B2 (ja) 2011-02-23

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