US20060054782A1 - Apparatus for multiple camera devices and method of operating same - Google Patents

Apparatus for multiple camera devices and method of operating same Download PDF

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Publication number
US20060054782A1
US20060054782A1 US11/212,803 US21280305A US2006054782A1 US 20060054782 A1 US20060054782 A1 US 20060054782A1 US 21280305 A US21280305 A US 21280305A US 2006054782 A1 US2006054782 A1 US 2006054782A1
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United States
Prior art keywords
array
photo detectors
digital camera
light
wavelength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/212,803
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English (en)
Inventor
Richard Olsen
Darryl Sato
Borden Moller
Olivera Vitomirov
Jeffrey Brady
Ferry Gunawan
Remzi Oten
Feng-Qing Sun
James Gates
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Newport Imaging Corp
Original Assignee
Newport Imaging Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Newport Imaging Corp filed Critical Newport Imaging Corp
Priority to US11/212,803 priority Critical patent/US20060054782A1/en
Priority to US11/265,669 priority patent/US7199348B2/en
Assigned to NEWPORT IMAGING CORPORATION reassignment NEWPORT IMAGING CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OTEN, REMZI
Assigned to NEWPORT IMAGING CORPORATION reassignment NEWPORT IMAGING CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SUN, FENG-QING
Assigned to NEWPORT IMAGING CORPORATION reassignment NEWPORT IMAGING CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GATES, JAMES
Assigned to NEWPORT IMAGING CORPORATION reassignment NEWPORT IMAGING CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SATO, DARRY L.
Assigned to NEWPORT IMAGING CORPORATION reassignment NEWPORT IMAGING CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MOLLER, BORDEN
Assigned to NEWPORT IMAGING CORPORATION reassignment NEWPORT IMAGING CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BRADY, JEFFERY A.
Assigned to NEWPORT IMAGING CORPORATION reassignment NEWPORT IMAGING CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: VITOMIROV, OLIVERA
Assigned to NEWPORT IMAGING CORPORATION reassignment NEWPORT IMAGING CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OLSEN, RICHARD IAN
Assigned to NEWPORT IMAGING CORPORATION reassignment NEWPORT IMAGING CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GUNAWAN, FERRY
Priority to US11/322,959 priority patent/US20070102622A1/en
Publication of US20060054782A1 publication Critical patent/US20060054782A1/en
Priority to US11/729,132 priority patent/US8124929B2/en
Priority to US11/788,120 priority patent/US20070258006A1/en
Priority to US11/788,122 priority patent/US7564019B2/en
Priority to US11/788,279 priority patent/US7916180B2/en
Priority to US11/810,623 priority patent/US7964835B2/en
Priority to US11/825,382 priority patent/US7795577B2/en
Priority to US11/888,546 priority patent/US7714262B2/en
Priority to US11/888,582 priority patent/US7884309B2/en
Priority to US11/888,570 priority patent/US7566855B2/en
Priority to US12/496,854 priority patent/US8198574B2/en
Priority to US13/006,351 priority patent/US8415605B2/en
Priority to US13/100,725 priority patent/US8304709B2/en
Priority to US13/345,007 priority patent/US8436286B2/en
Priority to US13/465,229 priority patent/US8334494B2/en
Priority to US13/647,708 priority patent/US8629390B2/en
Priority to US13/681,603 priority patent/US8598504B2/en
Priority to US13/786,803 priority patent/US8664579B2/en
Priority to US14/063,236 priority patent/US9232158B2/en
Priority to US14/149,024 priority patent/US9294745B2/en
Priority to US14/171,963 priority patent/US9313393B2/en
Priority to US14/979,896 priority patent/US10009556B2/en
Priority to US15/074,275 priority patent/US10148927B2/en
Priority to US15/090,856 priority patent/US10142548B2/en
Priority to US16/207,099 priority patent/US10694162B2/en
Priority to US16/908,342 priority patent/US11310471B2/en
Priority to US17/576,747 priority patent/US11412196B2/en
Priority to US17/576,729 priority patent/US11425349B2/en
Priority to US17/891,755 priority patent/US11706535B2/en
Priority to US18/220,006 priority patent/US20230353886A1/en
Abandoned legal-status Critical Current

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Definitions

  • the field of the invention is digital imaging.
  • zoom As performed by the lens system, known as “optical zoom”, changes the focal length of the optics and is a highly desired feature.
  • Digital camera suppliers have one advantage over traditional film providers in the area of zoom capability.
  • digital cameras can provide “electronic zoom” which provides the zoom capability by cropping the outer regions of an image and then electronically enlarging the center region to the original size of the image.
  • electronic zoom provides the zoom capability by cropping the outer regions of an image and then electronically enlarging the center region to the original size of the image.
  • a degree of resolution is lost when performing this process.
  • digital cameras capture discrete input to form a picture rather than the ubiquitous process of film, the lost resolution is more pronounced.
  • “electronic zoom” is a desired feature, it is not a direct substitute for “optical zoom.”
  • Color separation is typically achieved by three methods: 1) a color filter array on a single integrated circuit image sensor, 2) multiple image sensors with a color separation means in the optical path (such as prisms), or 3) an imager with color separation and multiple signal collection capability within each pixel.
  • RGB red, green and blue
  • the color filter array such as the often used Bayer pattern, changes the incident color between adjacent pixels on the array and color crosstalk occurs that prevents accurate color rendition of the original image. Since the array is populated with pixels of different color capability, interpolation techniques are required to create a suitable color image.
  • the color filter array may also have low and variable optical transmission that reduces received optical signal levels and creates pixel-to-pixel image non-uniformity.
  • an image sensor comprises separate first and second arrays of photo detectors and a signal processing circuitry that combines signals from the arrays to produce a composite image.
  • Preferred embodiments include three or more arrays of photo detectors, wherein the signal processing circuitry processes the signals from each array and then combines the signals from all of the arrays to produce a composite image.
  • the signal processing circuitry processes the signals from each array and then combines the signals from all of the arrays to produce a composite image.
  • Such use of multiple arrays allows each of the arrays to be optimized in some respect, such as for receipt of particular colors.
  • the arrays can be optimized to detect light of different colors, or other wavelengths.
  • the “colors” can be narrow bands, or broad bands such as red, green, or blue. The bands can even be overlapping.
  • Optimization can be accomplished in any desired manner, including for example having different average pixel depths, column logic, analog signal logic, black level logic, exposure control, image processing techniques, and lens design and coloration.
  • a sensor having two or more different arrays could advantageously have a different lens over each of the different arrays.
  • Preferred lenses can employ a die coating, defused dye in the optical medium, a substantially uniform color filter or any other filtering technique through which light passes to the underlying array.
  • the processing circuitry can comprise any suitable mechanism and/or logic. Of particular interest are circuitries that produce multiple separate images from the different arrays, and then combines the multiple separate images to form a single image. During the process the signal processing circuitry can advantageously execute image enhancement functions, such as address saturation, sharpness, intensity, hue, artifact removal, and defective pixel correction.
  • the various arrays it is desirable for the various arrays to be physically located on the same chip.
  • the lenses can be independently positionable during manufacture, and then sealed to the frame using a sealant or other bonding technique.
  • the integration of these elements is called the “Digital Camera Subsystem” (DCS).
  • Preferred image sensors contain at least several hundred thousand of the photo detectors, and have a total thickness of no more than 10, 15, or 20 mm, including the lens and frame.
  • Such small DCS devices may be incorporated into a semiconductor “package” or directly attached to a circuit board (“packageless”), using wave soldering, die on board, or other techniques.
  • the DCS and/or board can then be incorporated into cameras or other devices having user interface elements, memory that stores images derived from the arrays, and at least one power supply that provides power to the system.
  • the DCS, cameras and other devices of the invention can be used for any suitable purpose, including especially still and video imaging, calculating a distance, and creating a 3D effect.
  • a compact solid-state camera (compact digital camera) comprises a first and second camera channel, located in close proximity to each other, where each camera channel contains its own optics, image sensor and signal processing circuitry.
  • the two camera channels (being identical or different) can combine their output signals to form a composite image or each camera channel can provide a separate image.
  • the electronics to combine images from any combination of camera channels or to display/store/transmit channels individually or combined is included in the compact solid-state camera assembly (CSSC).
  • Other embodiments include three or more camera channels (identical or different), wherein the signal processing circuitry processes the signals from each channel and then combines the signals from some or all the channels to produce a composite image or each camera channel can provide a separate image by itself in conjunction with a composite image.
  • the use of multiple camera channels allows each of the channels to be optimized in some respect, if desired, such as imaging of particular incident light colors.
  • the arrays can be optimized to detect light of different colors, or other wavelengths.
  • the “colors” of each camera channel can be narrow bands, or broad bands such as red, green, or blue. The bands can even be overlapping.
  • Each camera channel can image one or more colors.
  • optimization of each camera channel can be accomplished in any desired manner, including optics, image sensor and signal processing electronics to obtain a desired image capability, for example the optics can optimized for a certain image sensor size, wavelength (color), focal length and f-number.
  • the image sensor can be optimized by number of pixels, pixel size, pixel design (photo-detector and circuitry), frame rate, integration time, and peripheral circuitry external to the pixel circuitry.
  • the signal processing electronics can be optimized for color correction, image compression, bad pixel replacement and other imaging functions.
  • the camera channels can be identical or unique; however all located in close proximity.
  • Color filters can be incorporated into the optical materials or optics surfaces, as separate filter layers, on the image sensor surface or built into the pixel semiconductor by design.
  • Each camera channel can have its own color imaging characteristics.
  • the image sensor can have a single color capability or multiple color capability; this multiple color capability can be within a single pixel, or between adjacent pixels (or combinations of single and adjacent pixels)
  • the processing circuitry can comprise any suitable mechanism and/or logic to optimize the image quality. Of particular interest are circuitries that produce separate images from the camera channels, and then combines the multiple separate images to form a composite single image.
  • the signal processing circuitry can advantageously execute image enhancement functions, such as dynamic range management (auto gain/level), image sharpening, intensity correction, hue, artifact removal, defective pixel correction and other imaging optimization functions.
  • image enhancement functions such as dynamic range management (auto gain/level), image sharpening, intensity correction, hue, artifact removal, defective pixel correction and other imaging optimization functions.
  • the processing circuitry can operate in an analog or digital mode.
  • DCS Digital Camera Subsystem
  • Preferred camera channels contain at least several hundred thousand of the photo detectors (pixels).
  • the thickness of the camera channels can be thinner than conventional camera systems (for equivalent image resolution) where only one optical assembly is utilized.
  • Such small DCS devices may be incorporated into a semiconductor “package” or directly attached to a circuit board (“packageless”), using wave soldering, die on board, or other techniques.
  • the DCS and/or board can then be incorporated into cameras or other devices having user interface elements, memory that stores images derived from the arrays, and at least one power supply that provides power to the system.
  • the DCS, cameras and other devices of the invention can be used for any suitable purpose, including especially still and video imaging.
  • a digital camera subassembly includes two or more complete camera channels in a single layered assembly that contains all desired components (optics, mechanical structures and electronics) in one heterogeneous assembly or package.
  • the digital camera subassembly has the form of a multi-layer laminate.
  • two or more of the camera channels includes channel specific optics, optical alignment structures (mechanical frame), packaging, color filters and other optical elements, image sensors, mixed signal interface, image and/or color processing logic, memory, control and timing logic, power management logic and parallel and/or serial device interface.
  • each camera channel also includes one or more of the following: single or multi-channel image compression logic and/or image output formatting logic, wired or wireless communications, and optical display capability.
  • the output of each channel can provide either discrete processed images or integrated images comprising a color or partial color images.
  • the camera channels are co-located, in close proximity defined by number of, type of, and position of, and optical diameter constraints of the lens system, on a two-dimensional focal plane that comprises one component layer of the CSSC.
  • each camera channel further contains an image sensor to provide a photon sensing capability that makes up part of the overall compact solid-state camera using semiconductor-based detection mechanisms (no film).
  • the single assembly may be formed by two or more component layers that are assembled sequentially in the vertical dimension (orthogonal to the focal plane).
  • the assembly comprising the vertically integrated component layers, with multiple camera channel capability, provides camera system capability and performance not achievable with conventional camera systems using a single camera channel.
  • some or the entire vertically integrated component layers are be formed by methods of wafer scale integration or laminated assembly to create portions of many camera systems simultaneously.
  • the wafers or layers may contain optical, mechanical and electrical components, electrical interconnects and other devices (such as a display).
  • the electrical interconnect between component layers may be formed by lithography and metallization, bump bonding or other methods.
  • Organic or inorganic bonding methods can be used to join the component layers.
  • the layered assembly process starts with a “host” wafer with electronics used for the entire camera and/or each camera channel. Then another wafer or individual chips are aligned and bonded to the host wafer.
  • the transferred wafers or chips can have bumps to make electrical interconnect or connects can be made after bonding and thinning.
  • the support substrate from the second wafer or individual chips is removed, leaving only a few microns material thickness attached to the host wafer containing the transferred electronics.
  • Electrical interconnects are then made (if needed) between the host and the bonded wafer or die using standard integrated circuit processes. The process can be repeated multiple times.
  • the layers transferred in this fashion can contain electrical, mechanical or optical features/components. This process allows multiple layers to form a heterogeneous assembly with electrical, mechanical and optical capabilities required in a compact solid-state
  • the camera channels are comprised of linear or area array imagers, of any size, format, pixel number, pixel design or pixel pitch.
  • the camera channels provide full color, single color, multi-color or mono chromatic (black and white) capability in any wavelength range from ultraviolet (UV) to infrared (IR).
  • Color filters if desired, may be on an image sensor or within the optical component layer or a combination of both.
  • the camera channels may also provide color capability by utilizing the semiconductor absorption properties in a pixel. For example, a pixel may provide one or more color capability via the optical absorption depth properties. The pixel color separation properties may also be combined with color filters in the optical path.
  • a high spatial image resolution may be achieved by using multiple camera channels to observe the same field of view from a slightly different perspective.
  • two or more camera channels observe the same field of view, although from a different perspective as a result of a spatial offset between such camera channels.
  • images from such two or more camera channels may be combined to result in an image that provides high spatial resolution. It may be advantageous to employ a parallax correction algorithm in order to reduce and/or eliminate the effects of the parallax.
  • images from the two or more camera channels may be combined to provide three dimensional feature imaging. In this regard, it may be advantageous to increase and/or enhance the effects of the parallax, for example, by applying a parallax correction algorithm “inversely”.
  • Three dimensional feature imaging may be used, for example, in finger print and/or retinal feature imaging and/or analysis.
  • Any parallax correction algorithm whether now known or later developed may be employed in conjunction with any of the embodiments herein. Any of the previous embodiments can be employed in association with an increase in parallax and/or a decrease in parallax.
  • optical features may be added to the optical stack of one or more camera channels to provide additional imaging capability such as single, dual or tunable color filters, wave front modification for increased depth of focus and auto focus, and glare reduction polarization filters.
  • any optical feature whether now known or later developed may be incorporated in one or more of the camera channels to provide additional imaging capability.
  • the optical portion may include one or more filters, e.g., color filters, to provide one or more wavelengths or one or more bands of wavelengths to one or more associated sensor arrays.
  • filters may be for example, single or dual, fixed or tunable filters.
  • the user, operator and/or manufacturer may employ a tunable filter to control or determine the one or more wavelengths or the one or more bands of wavelengths.
  • one or more filters are employed in association with one, some or all of the camera channels. Such filters may or may not be the same as one another. For example, the filters may or may not provide the same wavelength or bands of wavelengths. In addition, some of the filters may be fixed and others may be tunable.
  • the optical portion includes a wave front modification element, for example, to increase the depth of focus and/or for use in implementing auto focus.
  • the optical portion may include one or more glare reduction polarization filters, to polarize the light and thereby reduce “glare”. Such filters may be employed alone or in combination with any of the embodiments disclosed herein.
  • any of the embodiments of the present invention may include one or more illumination units to improve and/or enhance image acquisition by the one or more camera channels (and, in particular, the one or more sensor arrays), facilitate range detection to an object, shape detection of an object, and covert imaging (i.e., imaging that is not observable to the human eye).
  • the illumination units may provide passive (for example, no illumination), active (for example, constant illumination), constant and/or gated active illumination (for example, pulsed illumination that is predetermined, preset or processor controlled, and/or pulsed illumination that is user/operator programmable).
  • the one or more illumination units may be disposed on or integrated in the support frame and/or the substrate of the sensor arrays. Indeed, the one or more illumination units may be disposed on or integrated in any element or component of the one or more of the camera channels.
  • the illumination units are dedicated to one or more camera channels.
  • the illumination unit is “enabled” cooperatively with the operation of one or more dedicated channels.
  • the illumination units are shared by all of the camera channels.
  • the illumination unit is enabled cooperatively with the operation of the camera channels.
  • one or more illumination units may be dedicated to one or more camera channels and one or more illumination units may be shared by one or more camera channels (including those channels that are associated with one or more dedicated illumination units).
  • the dedicated illumination units are “enabled” cooperatively with the operation of one or more dedicated channels and the shared illumination units are enabled cooperatively with the operation of all of the camera channels.
  • one or more of the camera channels may be optimized, modified and/or configured according to a predetermined, an adaptively determined, an anticipated and/or a desired spectral response of the one or more camera channels.
  • the dimensions, characteristics, operation, response and/or parameters of a sensor array (and/or pixels thereof) as well as image processing circuitry may be configured, designed and/or tailored in accordance with predetermined, adaptively determined, anticipated and/or desired spectral response of the one or more camera channels.
  • one or more aspects of the digital camera of the present inventions may be configured, designed and/or tailored to provide a desired, suitable, predetermined and/or particular response in the environment in which the camera is to be employed.
  • each camera channel may be uniquely configured, designed and/or tailored.
  • one or more camera channels may be configured to include a field of view that is different than one or more camera channels.
  • one or more camera channels have a first field of view and one or more other camera channels have a second field of view. In this way, a digital camera may simultaneously capture an image using different fields of view.
  • the field of view may be fixed or programmable (for example, in situ).
  • the field of view may be adjusted using a number of techniques or configurations including adjustment or modification of the optics focal length and/or adjustment or modification of the effective size of the array. Indeed, any technique or configuration to adjust the field of view, whether now known or later developed, is intended to come within the scope of the present inventions.
  • the digital camera of the present inventions may include programmable (in situ or otherwise) or fixed integration times for one or more (or all) of the camera channels.
  • integration time of one or more camera channels may be configured, designed and/or tailored to facilitate capture of, for example, a large scene dynamic range.
  • single color band camera channels may be used to create a combined color image capability (including, for example, UV and IR if desired), configuring and/or designing the integration time of each camera channel to provide desired signal collection it its wavelength acquisition band.
  • two or more integration times can be implemented to simultaneously acquire low to high light levels in the image.
  • the combined dynamic range of the multiple camera channels provides greater dynamic range than from a single camera channel (having a one integration time for all channels).
  • the image sensor(s) or array(s) of each camera channel may be configured and/or designed to operate using a specific (predetermined, pre-set or programmable) integration time range and illumination level.
  • the dimensions, characteristics, operation, response and/or parameters of the camera channels may be configured, designed and/or tailored (in situ or otherwise) in accordance with predetermined, an adaptively determined, anticipated and/or desired response of the one or more camera channels.
  • the camera channels may be configured, designed and/or tailored to include different fields of view each having the same or different frame rates and/or integration times.
  • the digital camera of the present inventions may include a first large/wide field of view camera channel capability to acquire objects and a second narrower field of view camera channel to identify objects.
  • the resolution of the first large/wide field of view camera channel and second narrower field of view camera channel may also be different in order to, for example, provide an enhanced image or acquisition.
  • the sensor array and/or pixel size may be configured, designed and/or tailored in accordance with a predetermined, an anticipated and/or a desired response of the one or more camera channels.
  • the pixel size may be configured in order to optimize, enhance and/or obtain a particular response.
  • the pixel size of associated sensor arrays may be selected in order to provide, enhance and/or optimize a particular response of the digital camera.
  • the sensor array includes a plurality of camera channels (for example, UV, B, R, G and IR)
  • implementing different pixel sizes in one or more of the sensor arrays may provide, enhance and/or optimize a particular response of the digital camera.
  • the size of the pixels may be based on a number of considerations including providing a predetermined, adaptively determined, anticipated or a desired resolution and/or obtaining a predetermined, enhanced and/or suitable acquisition characteristics for certain wavelength or bands of wavelengths) for example, reducing the size of the pixel (reducing the size of the pitch) may enhance the acquisition of shorter wavelengths of light. This may be advantageous when matching the corresponding reduction in optical blur size.
  • the pixel design and process sequence (a subset of the total wafer process) may be selected and/or determined to optimize and/or enhance photo-response of a particular camera channel color.
  • the number of pixels on the sensor array may be adjusted, selected and/or determined to provide the same field of view notwithstanding different sizes of the pixel in the plurality of arrays.
  • the image processing circuitry may be configured, designed and/or tailored to provide a predetermined, an adaptively determined, an anticipated and/or a desired response of the one or more camera channels.
  • the image processing and color processing logic may be configured to optimize, accelerate and/or reduce the complexity by “matching” the optics, sensor, and image processing when discretely applied to each channel separately. Any final sequencing of a full or partial color image may, in turn, be simplified and quality greatly improved via the elimination of Bayer pattern interpolation.
  • any of the digital camera channels may be combined with one or more full color, dual color, single color or B/W camera channels.
  • the combination of camera channels may be used to provide increased wavelength range capability, different simultaneous fields of view, different simultaneous integrations times, active and passive imaging capability, higher resolution using multiple camera channels and parallax correction, 3D imaging (feature extraction) using multiple camera channels and increased parallax, and increased color band capability.
  • different color camera channels share components, for example, data processing components.
  • one camera channel may employ a sensor array that acquires data which is representative of a first color image (for example, blue) as well as a second color image (green).
  • Other camera channels may employ sensor arrays that are dedicated to a particular/predetermined wavelength or band of wavelengths (for example, red or green) or such camera channels may employ sensor arrays that acquires data which is representative of two or more predetermined wavelengths or bands of wavelengths (for example, (i) red and green or (ii) cyan and green).
  • the camera channels, in combination, may provide full color capabilities.
  • a first sensor array may acquire data which is representative of first and second predetermined wavelengths or band of wavelengths (for example, wavelengths that are associated with red and blue) and a second sensor array may acquire data which is representative of third predetermined wavelength or band of wavelengths (for example, wavelengths that are associated with green).
  • the camera channels in combination, may provide a full color image using only two sensor array.
  • a third sensor array to acquire IR.
  • a “true” YCrCb output camera may be provided while minimizing and/or eliminating the cost complexity and/or power considerations necessary to perform the transformation in the digital image domain.
  • the pixels of the sensor array may be designed to collect photons at two or more depths or areas within the pixels of the semiconductor arrays which are associated with the two or more predetermined wavelengths or bands of wavelengths.
  • the color “selection” for such a sensor array may be based on color band separation and/or pixel design to color separate by optical absorption depth.
  • the two color capability in one or more camera channel may be accomplished or provided using color filter arrays that are disposed before the sensor array (for example, in the optical assembly).
  • additional color band separation can be provided in the optical assembly layer if desired.
  • integration time(s) of one or more camera channels may be configured, designed and/or tailored to facilitate capture of, for example, multiple predetermined wavelengths or bands of wavelengths in order to enhance, optimize and or provide an enhanced, designed, desired adaptively determined and/or predetermined acquisition technique.
  • any of the embodiments discussed herein in relation to integration times of the camera channels may be incorporated with a sensor array that acquires two or more predetermined wavelengths or bands of wavelength. For the sake of brevity, those discussions will not be repeated here.
  • the present inventions may be implemented using three sensor arrays (each acquiring one or more predetermined wavelengths or band of wavelengths for example, wavelengths that are associated with red, blue and green).
  • the three sensor arrays may be arranged in a triangular configuration (for example, a symmetrical, non-symmetrical, isosceles, obtuse, acute and/or right triangle) to provide full color (RGB) capability.
  • the triangular configuration will provide symmetry in parallax and thereby simplify the algorithm computation to address parallax.
  • the triangular configuration will also provide enhanced and/or optimal layout of a three image sensor array system/device and associated assembly layers for a more compact assembly.
  • integration time of one or more camera channels may be configured, designed and/or tailored to facilitate capture of, for example, multiple predetermined wavelengths or bands of wavelengths in order to enhance, optimize and or provide an enhanced, desired, designed adaptive determined and/or predetermined acquisition techniques.
  • any of the embodiments discussed above herein in relation to integration times of the camera channels may be incorporated with triangular configuration/layout. For the sake of brevity, those discussions will not be repeated here.
  • the digital camera according to the present inventions may include two or more camera channels.
  • the digital camera includes a plurality of sensor arrays (for example, greater than five sensor arrays) each acquiring a narrow predetermined number of wavelengths or band of wavelengths (for example, wavelengths that are associated with four to ten color bands).
  • the digital camera may provide multi-spectral (for example, 4-10 color bands) or hyper-spectral (for example, 10-100 color bands) simultaneous imaging capability.
  • the digital camera may employ black and white (B/W) sensor arrays that acquire multiple broadband B/W images.
  • B/W black and white
  • the combination of B/W camera channels may be used to provide increased wavelength range capability, different simultaneous fields of view, different simultaneous integrations times, active and passive imaging capability, higher resolution using multiple camera channels and parallax correction, 3D imaging (feature extraction) using multiple camera channels and increased parallax.
  • the multiple B/W camera channels can be combined with other camera channels for full or partial color capability.
  • gray scale sensor arrays may be employed in conjunction with or in lieu of the B/W sensor arrays described herein.
  • the digital camera subsystem includes a display.
  • the display may be disposed in a display layer and/or integrated in or on the sensor array substrate.
  • the digital camera subsystem provides one or more interfaces for communicating with the digital camera subsystem.
  • the digital camera subsystem includes the capability for wired, wireless and/or optical communication.
  • the digital camera subsystem includes one or more circuits, or portions thereof, for use in such communication. The circuits may be disposed in a layer dedicated for use in such communication and/or may be incorporated into one of the other layers (for example, integrated in or on the sensor array substrate).
  • a “scene” is imaged onto multiple sensor arrays.
  • the sensor arrays may be in close proximity and may be processed on a single integrated circuit or fabricated individually and assembled close together.
  • Each sensor array is located in or beneath an optical assembly.
  • the optical assembly can be processed of the sensor subsystem wafer, applied to the image wafer by a separate wafer transfer, transferred individually by pick and place method, or attached at die level.
  • the color filters can be built into the optical material, disposed as a layer or coating on the associated sensor array, applied as a lens coating or as a separate color filter in the optical assembly.
  • Color separation mechanisms can also be provided on each imaging area by means of color filters or by an in-pixel color separation mechanism if desired.
  • Other optical features can be added to the optical system of each sensor array to provide additional imaging capability.
  • each sensor array is optimized for sensing the incident wavelengths of light to that sensor array.
  • the use of multiple optical assemblies with individually optimized sensor arrays results is a compact camera capable of high resolution, high sensitivity and excellent color rendition.
  • the present invention is a digital camera comprising a plurality of arrays of photo detectors, including a first array of photo detectors to sample an intensity of light of, for example, light of a first wavelength (which may be associated with a first color) and a second array of photo detectors to sample an intensity of light of, for example, light of a second wavelength (which may be associated with a second color).
  • the digital camera may include signal processing circuitry, coupled to the first and second arrays of photo detectors, to generate a composite image using (i) data which is representative of the intensity of light sampled by the first array of photo detectors, and (ii) data which is representative of the intensity of light sampled by the second array of photo detectors.
  • the first array of photo detectors, the second array of photo detectors, and the signal processing circuitry are integrated on or in the same semiconductor substrate.
  • the digital camera may further include a third array of photo detectors to sample the intensity of light of a third wavelength(which may be associated with a third color).
  • the signal processing circuitry is coupled to the third array of photo detectors and generates a composite image using (i) data which is representative of the intensity of light sampled by the first array of photo detectors, (ii) data which is representative of the intensity of light sampled by the second array of photo detectors, and (ii) data which is representative of the intensity of light sampled by the third array of photo detectors.
  • the first, second and third arrays of photo detectors may be relatively arranged in a triangular configuration (for example, an isosceles, obtuse, acute or a right triangular configuration).
  • the first array of photo detectors may sample the intensity of light of the first wavelength for a first integration time; the second array of photo detectors sample the intensity of light of the second wavelength for a second integration time.
  • the digital camera includes a third array of photo detectors, the third array of photo detectors sample the intensity of light of the third wavelength for the first integration time, the second integration time, or a third integration time.
  • the digital camera may include a first array wherein each photo detector of the first array includes a semiconductor portion at which the intensity of light is sampled. Further, each photo detector of the second array includes a semiconductor portion at which the intensity of light is sampled. In certain embodiments, the semiconductor portion of each photo detector of the first array is located at a different depth, relative to a surface of each of the photo detectors, from than semiconductor portion of each photo detector of the second array.
  • the digital camera may further include a first lens disposed in and associated with an optical path of the first array of photo detectors as well as a second lens disposed in and associated with an optical path of the second array of photo detectors.
  • a substantially uniform color filter sheet may be disposed in the optical path of the first array of detectors.
  • a first colored lens disposed in and associated with an optical path of the first array of detectors.
  • the digital camera may further including a first lens (passes light of a first wavelength and filters light of a second wavelength) disposed in and associated with an optical path of the first array of photo detectors, wherein the first array of photo detectors sample an intensity of light of a first wavelength and the second array of photo detectors sample an intensity of light of a second wavelength.
  • a first lens passing light of a first wavelength and filters light of a second wavelength
  • the digital camera may include a first array of photo detectors that samples an intensity of light of a first wavelength and an intensity of light of a second wavelength and a second array of photo detectors sample an intensity of light of a third wavelength, wherein the first wavelength is associated with a first color, the second wavelength is associated with a second color and the third wavelength is associated with a third color.
  • Each photo detector of the first array may include a first semiconductor portion at which the intensity of light of the first wavelength is sampled and a second semiconductor portion at which the intensity of light of the second wavelength is sampled; and each photo detector of the second array may include a semiconductor portion at which the intensity of light of the third wavelength is sampled; and wherein the first and second semiconductor portions of each photo detector of the first array are located at a different depth, relative to each other and to a surface of each of the photo detectors from the semiconductor portion of each photo detector of the second array.
  • the digital camera may further include a first lens disposed in and associated with an optical path of the first array of photo detectors and a second lens disposed in and associated with an optical path of the second array of photo detectors wherein the first lens passes light of the first and second wavelengths and filters light of the third wavelength.
  • the digital camera may include an optical filter disposed in and associated with an optical path of the first array of photo detectors wherein the optical filter passes light of the first and second wavelengths and filters light of the third wavelength.
  • the first array of detectors may sample the intensity of light of the first wavelength for a first integration time and the intensity of light of the second wavelength for a second integration time; and the second array of photo detectors may sample the intensity of light of the third wavelength for a third integration time.
  • the signal processing circuitry of the digital camera may generate a first image using data which is representative of the intensity of light sampled by the first array of photo detectors, and a second image using data which is representative of the intensity of light sampled by the second array of photo detectors. Thereafter, the signal processing circuitry may generate the composite image using the first image and the second image.
  • the digital camera may further include a memory to store (i) data which is representative of the intensity of light sampled by the first array of photo detectors, and (ii) data which is representative of the intensity of light sampled by the second array of photo detectors.
  • the memory, the first array of photo detectors, the second array of photo detectors, and the signal processing circuitry may be integrated on or in the same semiconductor substrate.
  • timing and control logic may be included to provide timing and control information to the signal processing circuitry, the first array of photo detectors and/or the second array of photo detectors.
  • communication circuitry wireless, wired and/or optical communication circuitry to output data which is representative of the composite image.
  • the communication circuitry, memory, the first array of photo detectors, the second array of photo detectors, and the signal processing circuitry may be integrated on or in the same semiconductor substrate.
  • the first array of photo detectors may include a first surface area and the second array of photo detectors includes a second surface area wherein the first surface area is different from the second surface area.
  • the photo detectors of the first array may include a first active surface area and the photo detectors of the second array may include a second active surface area wherein the first active surface area is different from the second active surface area.
  • the first array of photo detectors may include a first surface area and the second array of photo detectors includes a second surface area wherein the first surface area is substantially the same as the second surface area.
  • the photo detectors of the first array may include a first active surface area and the photo detectors of the second array may include a second active surface area wherein the first active surface area is different from the second active surface area.
  • a digital camera comprising a plurality of arrays of photo detectors, including a first array of photo detectors to sample an intensity of light of a first wavelength (which may be associated with a first color) and a second array of photo detectors to sample an intensity of light of a second wavelength (which may be is associated with a second color).
  • the digital camera further may also include a first lens (which may pass light of the first wavelength onto an image plane of the photo detectors of the first array and may filter/attenuate light of the second wavelength) disposed in an optical path of the first array of photo detectors, wherein the first lens includes a predetermined optical response to the light of the first wavelength, and a second lens (which may pass light of the second wavelength onto an image plane of the photo detectors of the second array and may filter/attenuate light of the first wavelength) disposed in with an optical path of the second array of photo detectors wherein the second lens includes a predetermined optical response to the light of the second wavelength.
  • a first lens which may pass light of the first wavelength onto an image plane of the photo detectors of the first array and may filter/attenuate light of the second wavelength
  • the digital camera may include signal processing circuitry, coupled to the first and second arrays of photo detectors, to generate a composite image using (i) data which is representative of the intensity of light sampled by the first array of photo detectors, and (ii) data which is representative of the intensity of light sampled by the second array of photo detectors; wherein the first array of photo detectors, the second array of photo detectors, and the signal processing circuitry are integrated on or in the same semiconductor substrate.
  • the digital camera may further include a third array of photo detectors to sample the intensity of light of a third wavelength (which may be is associated with a third color) and a third lens disposed in with an optical path of the third array of photo detectors wherein the third lens includes a predetermined optical response to the light of the third wavelength.
  • the signal processing circuitry is coupled to the third array of photo detectors and generates a composite image using (i) data which is representative of the intensity of light sampled by the first array of photo detectors, (ii) data which is representative of the intensity of light sampled by the second array of photo detectors, and (ii) data which is representative of the intensity of light sampled by the third array of photo detectors.
  • the first, second and third arrays of photo detectors may be relatively arranged in a triangular configuration (for example, an isosceles, obtuse, acute or a right triangular configuration).
  • the first lens filters light of the second and third wavelengths
  • the second lens filters light of the first and third wavelengths
  • the third lens filters light of the first and second wavelengths.
  • the first array of photo detectors sample the intensity of light of the first wavelength for a first integration time and the second array of photo detectors sample the intensity of light of the second wavelength for a second integration time.
  • the third array of photo detectors may sample the intensity of light of the third wavelength for a third integration time.
  • the digital camera may further include a housing, wherein the first and second lenses, first and second arrays of photo detectors, and the signal processing circuitry are attached to the housing, and wherein the first and second lenses are independently positionable relative to the associated array of photo detectors.
  • the first array of photo detectors sample an intensity of light of the first wavelength (which is associated with a first color) and an intensity of light of a third wavelength (which is associated with a third color) and the second array of photo detectors sample an intensity of light of a second wavelength (which is associated with a second color).
  • each photo detector of the first array may include a first semiconductor portion at which the intensity of light of the first wavelength is sampled and a second semiconductor portion at which the intensity of light of the third wavelength is sampled.
  • each photo detector of the second array may include a semiconductor portion at which the intensity of light of the second wavelength is sampled.
  • the first and second semiconductor portions of each photo detector of the first array are located at a different depth, relative to each other and to a surface of each of the photo detectors from the semiconductor portion of each photo detector of the second array.
  • the first lens may pass light of the first and third wavelengths and filters light of a second wavelength.
  • an optical filter disposed in and associated with an optical path of the first array of photo detectors wherein the optical filter passes light of the first and third wavelengths and filters light of the second wavelength.
  • the first array of photo detectors may sample the intensity of light of the first wavelength for a first integration time and the intensity of light of the third wavelength for a third integration time.
  • the second array of photo detectors sample the intensity of light of the third wavelength for a second integration time.
  • the signal processing circuitry of the digital camera may generate a first image using data which is representative of the intensity of light sampled by the first array of photo detectors, and a second image using data which is representative of the intensity of light sampled by the second array of photo detectors. Thereafter, the signal processing circuitry may generate the composite image using the first image and the second image.
  • the digital camera may further include a memory to store (i) data which is representative of the intensity of light sampled by the first array of photo detectors, and (ii) data which is representative of the intensity of light sampled by the second array of photo detectors.
  • the memory, the first array of photo detectors, the second array of photo detectors, and the signal processing circuitry may be integrated on or in the same semiconductor substrate.
  • timing and control logic may be included to provide timing and control information to the signal processing circuitry, the first array of photo detectors and/or the second array of photo detectors.
  • communication circuitry wireless, wired and/or optical communication circuitry to output data which is representative of the composite image.
  • the communication circuitry, memory, the first array of photo detectors, the second array of photo detectors, and the signal processing circuitry may be integrated on or in the same semiconductor substrate.
  • the signal processing circuitry may include first signal processing circuitry and second signal processing circuitry wherein the first signal processing circuitry is coupled to and associated with the first array of photo detectors and second signal processing circuitry is coupled to and associated with the second array of photo detectors.
  • the signal processing circuitry includes first analog signal logic and second analog signal logic wherein the first analog signal logic is coupled to and associated with the first array of photo detectors and second analog signal logic is coupled to and associated with the second array of photo detectors.
  • the signal processing circuitry may include first black level logic and second black level logic wherein the first black level logic is coupled to and associated with the first array of photo detectors and second black level logic is coupled to and associated with the second array of photo detectors.
  • the signal processing circuitry includes first exposure control circuitry and second exposure control circuitry wherein the first exposure control circuitry is coupled to and associated with the first array of photo detectors and second exposure control circuitry is coupled to and associated with the second array of photo detectors.
  • the digital camera may include a frame, wherein the first and second arrays of photo detectors, the signal processing circuitry, and the first and second lenses are fixed to the frame.
  • the first array of photo detectors may include a first surface area and the second array of photo detectors includes a second surface area wherein the first surface area is different from the second surface area.
  • the photo detectors of the first array may include a first active surface area and the photo detectors of the second array may include a second active surface area wherein the first active surface area is different from the second active surface area.
  • the first array of photo detectors may include a first surface area and the second array of photo detectors includes a second surface area wherein the first surface area is substantially the same as the second surface area.
  • the photo detectors of the first array may include a first active surface area and the photo detectors of the second array may include a second active surface area wherein the first active surface area is different from the second active surface area.
  • FIG. 1A illustrates a prior art digital camera, and its primary components
  • FIGS. 1B-1D are schematic illustrations of the prior art image capturing elements of the prior art digital camera of FIG. 1A ;
  • FIG. 1E shows the operation of the lens assembly of the prior art camera of FIG. 1A , in a retracted mode
  • FIG. 1F shows the operation of the lens assembly of the prior art camera of FIG. 1A , in an optical zoom mode
  • FIG. 2 illustrates a digital camera, and its primary components, including a digital camera subsystem (DCS) in accordance with one embodiment of aspects of the invention
  • FIGS. 3A-3B are schematics of a digital camera subsystem (DCS);
  • FIG. 4 illustrates a digital camera subsystem having a three array/lens configuration.
  • FIGS. 5A-5C is a schematic of image capture using the digital camera subsystem (DCS) of FIGS. 2-3 ;
  • FIG. 6A is an alternative digital camera subsystem (DCS) having four arrays
  • FIG. 6B is a flow chart for the alternative digital camera subsystem (DCS) of FIG. 6A ;
  • FIGS. 7A-7C are a schematic of a four-lens system used in the DCS of FIG. 3 ;
  • FIG. 8 is a schematic representation of a digital camera apparatus in accordance with another embodiment of aspects of the present invention.
  • FIG. 9A is a schematic exploded representation of an optics portion that may be employed in a digital camera apparatus in accordance with one embodiment of the present invention.
  • FIGS. 9B-9D are schematic exploded representations of optics portions that may be employed in a digital camera apparatus in accordance with further embodiments of the present invention.
  • FIGS. 10A-10H are schematic representations of optics portions that may be employed in a digital camera apparatus in accordance with further embodiments of the present invention.
  • FIGS. 11A-11B are schematic and side elevational views, respectively, of a lens used in an optics portion adapted to transmit red light or a red band of light, e.g., for a red camera channel, in accordance with another embodiment of the present invention.
  • FIGS. 12A-12B are schematic and side elevational views, respectively, of a lens used in an optics portion adapted to transmit green light or a green band of light, e.g., for a green camera channel, in accordance with another embodiment of the present invention
  • FIGS. 13A-13B are schematic and side elevational views, respectively, of a lens used in an optics portion adapted to transmit blue light or a blue band of light, e.g., for a blue camera channel, in accordance with another embodiment of the present invention
  • FIG. 14 is a schematic view of a lens used in an optics portion adapted to transmit red light or a red band of light, e.g., for a red camera channel, in accordance with another embodiment of the present invention.
  • FIGS. 15A-15F are schematic representations of lenses that may be employed in a digital camera apparatus in accordance with further embodiments of the present invention.
  • FIG. 16A is a schematic representation of a sensor array and circuits connected thereto, which may be employed in a digital camera apparatus in accordance with one embodiment of the present invention
  • FIG. 16B is a schematic representation of a pixel of the sensor array of FIG. 16A ;
  • FIG. 16C is a schematic representation of circuit that may be employed in the pixel of FIG. 16B , in accordance with one embodiment of the present invention.
  • FIG. 17A is a schematic representation of a portion of a sensor array in accordance with another embodiment of the present invention.
  • FIGS. 17B-17K are schematic cross sectional views of various embodiments of one or more pixels in accordance with further embodiments of the present invention; such pixel embodiments may be implemented in any of the embodiments described and/or illustrated herein;
  • FIG. 17F are explanatory representations of sensor arrays in accordance with further embodiments of the present invention.
  • FIGS. 18A-18B depict an image being captured by a portion of a sensor array, in accordance with one embodiment of the present invention.
  • FIGS. 19A-19B depict an image being captured by a portion of a sensor array in accordance with another embodiment of the present invention.
  • FIGS. 20A-20B are schematic representations of a relative positioning provided for an optics portion and a respective sensor array in accordance with further embodiments of the present invention.
  • FIG. 21 is a schematic representation of a relative positioning that may be provided for four optics portions and four sensor arrays, in accordance with one embodiment of the present invention.
  • FIGS. 22A-22B are a schematic plan view and a schematic cross sectional view, respectively, of an image device in accordance with one embodiment of the present invention.
  • FIGS. 23A-23B are a schematic plan view and a schematic cross sectional view, respectively, of an image device in accordance with another embodiment of the present invention.
  • FIGS. 24A-24B are a schematic plan view and a schematic cross sectional view, respectively, of an image device in accordance with another embodiment of the present invention.
  • FIGS. 25A-25B are a schematic plan view and a schematic cross sectional view, respectively, of an image device in accordance with another embodiment of the present invention.
  • FIGS. 26A-26B are a schematic plan view and a schematic cross sectional view, respectively, of an image device in accordance with another embodiment of the present invention.
  • FIGS. 27A-27B are a schematic plan view and a schematic cross sectional view, respectively, of an image device in accordance with another embodiment of the present invention.
  • FIG. 28A is a schematic perspective view of a support and optics portions that may be seated therein, in accordance with one embodiment of the present invention.
  • FIG. 28B is an enlarged schematic plan view of the support of FIG. 28A ;
  • FIG. 28C is an enlarged schematic cross sectional view of the support of FIG. 28A , taken along the direction A-A of FIG. 28B ;
  • FIG. 28D is an enlarged exploded schematic cross sectional view of a portion of the support of FIG. 28A , taken along the direction A-A of FIG. 28B ; and a lens that may be seated therein;
  • FIG. 29A is a schematic cross sectional view of a support and optics portions seated therein, in accordance with another embodiment of the present invention.
  • FIG. 29B is a schematic cross sectional view of a support and optics portions seated therein, in accordance with another embodiment of the present invention.
  • FIG. 30A is a schematic perspective view of a support and optics portions that may be seated therein, in accordance with another embodiment of the present invention.
  • FIG. 30B is a schematic plan view of the support of FIG. 30A ;
  • FIG. 30C is a schematic cross sectional view of the support of FIG. 30A , taken along the direction A-A of FIG. 30B ;
  • FIG. 30D is a schematic cross sectional view of the support of FIG. 30A , taken along the direction A-A of FIG. 30B ; and a lens that may be seated therein;
  • FIG. 31A is a schematic perspective view of a support and optics portions that may be seated therein, in accordance with another embodiment of the present invention.
  • FIG. 31B is a schematic plan view of the support of FIG. 31A ;
  • FIG. 31C is a schematic cross sectional view of the support of FIG. 31A , taken along the direction A-A of FIG. 31B ;
  • FIG. 31D is a schematic cross sectional view of the support of FIG. 31A , taken along the direction A-A of FIG. 31B ; and a lens that may be seated therein;
  • FIG. 32 is a schematic cross-sectional view of a digital camera apparatus and a printed circuit board on which the digital camera apparatus may be mounted; in accordance with one embodiment of the present invention.
  • FIGS. 33A-33F shows one embodiment for assembling and mounting the digital camera apparatus of FIG. 32 ;
  • FIG. 33G is a schematic perspective view of a digital camera apparatus in accordance with another embodiment of the present invention.
  • FIGS. 33H-33K are schematic elevational views of mounting and electrical connector configurations that may be employed in association with a digital camera apparatus in accordance with further embodiments of the present invention.
  • FIG. 34 is a schematic cross section view of a support that may be employed to support the optics portions of FIGS. 11A-11B , 13 A- 13 B, at least in part, in accordance with another embodiment of the present invention.
  • FIGS. 35A-35C show one embodiment for assembling three lenslets of an optics portion in the support.
  • FIG. 36 is a schematic cross-sectional view of a digital camera apparatus that includes the support of FIG. 34 and the optics portions of FIGS. 11A-11B , 13 A- 13 B, and a printed circuit board on which the digital camera apparatus may be mounted; in accordance with one embodiment of the present invention
  • FIG. 37 is a schematic cross sectional view of another support that may be employed to support the optics portions of FIGS. 11A-11B , 13 A- 13 B, at least in part, in accordance with another embodiment of the present invention.
  • FIG. 38 is a schematic cross sectional view of another support that may be employed to support the optics portions of FIGS. 11A-11B , 13 A- 13 B, at least in part, in accordance with another embodiment of the present invention.
  • FIG. 39 is a schematic cross-sectional view of a digital camera apparatus that includes the support of FIG. 37 and the optics portions of FIGS. 11A-11B , 13 A- 13 B, and a printed circuit board on which the digital camera apparatus may be mounted; in accordance with one embodiment of the present invention
  • FIG. 40 is a schematic cross-sectional view of a digital camera apparatus that includes the support of FIG. 38 and the optics portions of FIGS. 11A-11B , 13 A- 13 B, and a printed circuit board on which the digital camera apparatus may be mounted; in accordance with one embodiment of the present invention
  • FIGS. 41A-41D are schematic cross sectional views of seating configurations that may be employed in a digital camera apparatus to support the lenses of FIGS. 15A-15D , respectively, at least in part, in accordance with further embodiments of the present invention;
  • FIGS. 42-44 are schematic cross sectional views of supports that employ the seating configurations of FIGS. 41B-41D , respectively, and may be employed to support the lenses shown in FIGS. 15B-15D , respectively, at least in part, in accordance with further embodiments of the present invention;
  • FIG. 45 is a schematic cross-sectional view of a digital camera apparatus that includes the support of FIG. 42 and a printed circuit board on which the digital camera apparatus may be mounted; in accordance with one embodiment of the present invention
  • FIG. 46 is a schematic cross-sectional view of a digital camera apparatus that includes the support of FIG. 43 and a printed circuit board on which the digital camera apparatus may be mounted; in accordance with one embodiment of the present invention
  • FIG. 47 is a schematic cross-sectional view of a digital camera apparatus that includes the support of FIG. 44 and a printed circuit board on which the digital camera apparatus may be mounted; in accordance with one embodiment of the present invention
  • FIG. 48 is a schematic representation of a digital camera apparatus in accordance with another embodiment of the present invention.
  • FIG. 49 is a schematic cross-sectional view of a digital camera apparatus and a printed circuit board of a digital camera on which the digital camera apparatus may be mounted, in accordance with another embodiment of the present invention.
  • FIGS. 50A-50F shows one embodiment for assembling and mounting the digital camera apparatus of FIG. 49 .
  • FIG. 51 is a schematic representation of a digital camera apparatus that includes a spacer in accordance with another embodiment of the present invention.
  • FIG. 52 is a schematic representation of a digital camera apparatus that includes a spacer, in accordance with another embodiment of the present invention.
  • FIG. 53 is a schematic cross-sectional view of a digital camera apparatus and a printed circuit board of a digital camera on which the digital camera apparatus may be mounted, in accordance with another embodiment of the present invention.
  • FIGS. 54A-54F shows one such embodiment for assembling and mounting the digital camera apparatus of FIG. 53 .
  • FIG. 55 is a schematic representation of a digital camera apparatus that includes a second device and a spacer, in accordance with another embodiment of the present invention.
  • FIG. 56 is a schematic cross-sectional view of a digital camera apparatus and a printed circuit board of a digital camera on which the digital camera apparatus may be mounted, in accordance with another embodiment of the present invention.
  • FIGS. 57A-57F shows one such embodiment for assembling and mounting the digital camera apparatus of FIG. 56 ;
  • FIGS. 58-62 are schematic cross-sectional views of digital camera apparatus and printed circuit boards of digital cameras on which the digital camera apparatus may be mounted, in accordance with further embodiments of the present invention.
  • FIGS. 63-67 are schematic cross-sectional views of digital camera apparatus and printed circuit boards of digital cameras on which the digital camera apparatus may be mounted, in accordance with further embodiments of the present invention.
  • FIGS. 68-72 are schematic cross-sectional views of digital camera apparatus and printed circuit boards of digital cameras on which the digital camera apparatus may be mounted, in accordance with further embodiments of the present invention.
  • FIGS. 73A-73B are schematic elevational and cross sectional views, respectively, of a support in accordance with another embodiment of the present invention.
  • FIG. 74 is a schematic cross sectional view of a support in accordance with another embodiment of the present invention.
  • FIG. 75 is a schematic plan view of a support in accordance with another embodiment of the present invention.
  • FIG. 76A is a schematic view of a digital camera apparatus that includes one or more output devices in accordance with another embodiment of the present invention.
  • FIGS. 76B-76C are schematic front and rear elevational views respectively, of a display device that may be employed in the digital camera apparatus of FIG. 76A , in accordance with one embodiment of the present invention
  • FIGS. 76D-76E are schematic views of digital camera apparatus that include one or more output devices in accordance with further embodiments of the present invention.
  • FIG. 77A is a schematic view of a digital camera apparatus that includes one or more input devices in accordance with another embodiment of the present invention.
  • FIGS. 77B-77C are enlarged schematic front and rear perspective views respectively, of an input device that may be employed in the digital camera apparatus of FIG. 77A , in accordance with one embodiment of the present invention
  • FIGS. 77D-77L are schematic views of digital camera apparatus that include one or more output devices in accordance with further embodiments of the present invention.
  • FIGS. 77M-77N are schematic plan and cross sectional views, respectively, of a support in accordance with another embodiment of the present invention.
  • FIG. 78A is a schematic view of a digital camera apparatus that includes one or more illumination devices in accordance with another embodiment of the present invention.
  • FIGS. 78B-78C are enlarged schematic front and rear perspective views respectively, of an illumination device that may be employed in the digital camera apparatus of FIG. 78A , in accordance with one embodiment of the present invention
  • FIGS. 78D-78L are schematic perspective views of digital camera apparatus that include one or more illumination devices in accordance with further embodiments of the present invention.
  • FIGS. 78M-78N are schematic views of digital camera apparatus that include one or illumination devices in accordance with further embodiments of the present invention.
  • FIGS. 79A-79C are schematic perspective views of digital camera apparatus that include one or more input devices and one or more output devices, in accordance with further embodiments of the present invention.
  • FIGS. 80A-80F are schematic perspective views of digital camera apparatus that include one or more input devices, one or more display devices and one or more illumination devices, in accordance with further embodiments of the present invention.
  • FIG. 81A is a schematic perspective view a digital camera apparatus that includes molded plastic packaging in accordance with one embodiment of the present invention.
  • FIGS. 81B-81C are schematic exploded perspective views of the digital camera apparatus of FIG. 81A ;
  • FIG. 82 is an enlarged schematic front perspective view of a digital camera apparatus in accordance with another embodiment of the present invention.
  • FIGS. 83A-83C are schematic front perspective views of sensor array and processor configurations, in accordance with further embodiments of the present invention.
  • FIGS. 83A-83C are schematic front perspective views of sensor array configurations, in accordance with further embodiments of the present invention.
  • FIGS. 84A-84E are schematic representations of digital camera apparatus in accordance with further embodiments of the present invention.
  • FIGS. 85A-85E are schematic representations of digital camera apparatus in accordance with further embodiments of the present invention.
  • FIGS. 86A-86E are schematic representations of digital camera apparatus in accordance with further embodiments of the present invention.
  • FIGS. 87A-8B are schematic representations of digital camera apparatus in accordance with further embodiments of the present invention.
  • FIGS. 88A-88E are schematic representations of a digital camera apparatus in accordance with another embodiment of the present invention.
  • FIGS. 88A-88E are schematic representation of digital camera apparatus in accordance with further embodiments of the present invention.
  • FIGS. 89A-89E are schematic representation of digital camera apparatus in accordance with further embodiments of the present invention.
  • FIGS. 90 A, 91 A- 91 B, 92 A- 92 B, 93 A- 93 , 94 A- 94 B, 95 A- 95 B and 96 A- 96 B are a schematic plan views and a schematic cross sectional view, respectively, of some embodiments of the image device;
  • FIG. 90A is a schematic plan view of an image device in accordance with another embodiment of the present invention.
  • FIGS. 90A-90B are a schematic plan view and a schematic cross sectional view, respectively, of an image device in accordance with one embodiment of the present invention.
  • FIGS. 91A-91B are a schematic plan view and a schematic cross sectional view, respectively, of an image device in accordance with another embodiment of the present invention.
  • FIGS. 92A-92B are a schematic plan view and a schematic cross sectional view, respectively, of an image device in accordance with another embodiment of the present invention.
  • FIGS. 93A-93B are a schematic plan view and a schematic cross sectional view, respectively, of an image device in accordance with another embodiment of the present invention.
  • FIGS. 94A-94B are a schematic plan view and a schematic cross sectional view, respectively, of an image device in accordance with another embodiment of the present invention.
  • FIGS. 95A-95B are a schematic plan view and a schematic cross sectional view, respectively, of an image device in accordance with another embodiment of the present invention.
  • FIGS. 96A-96B are a schematic plan view and a schematic cross sectional view, respectively, of an image device in accordance with another embodiment of the present invention.
  • FIG. 97A is a schematic plan view of a support and optics portions that may be seated therein, in accordance with one embodiment of the present invention.
  • FIG. 97B is a schematic cross sectional view of the support of FIG. 97A , taken along the direction A-A of FIG. 97B ;
  • FIG. 97C is an exploded schematic cross sectional view of a portion of the support of FIG. 97A and a lens that may be seated therein;
  • FIGS. 99A-99D are schematic representations of digital camera apparatus in accordance with further embodiments of the present invention.
  • FIGS. 100A-100D are schematic representations of digital camera apparatus in accordance with further embodiments of the present invention.
  • FIG. 101A is schematic front perspective view of an image device in accordance with another embodiment of the present invention.
  • FIG. 101B is a schematic representation of a sensor array and circuits connected thereto, which may be employed in the image device of FIG. 101A , in accordance with one embodiment of the present invention
  • FIG. 101C is a schematic representation of a pixel of the sensor array of FIG. 101B ;
  • FIG. 101D is a schematic representation of a sensor array and circuits connected thereto, which may be employed in the image device of FIG. 101A , in accordance with one embodiment of the present invention
  • FIG. 101E is a schematic representation of a pixel of the sensor array of FIG. 101D ;
  • FIG. 101F is a schematic representation of a sensor array and circuits connected thereto, which may be employed in the image device of FIG. 101A , in accordance with one embodiment of the present invention.
  • FIG. 101G is a schematic representation of a pixel of the sensor array of FIG. 101F ;
  • FIG. 102A is schematic front perspective view of an image device in accordance with another embodiment of the present invention.
  • FIG. 102B is a schematic representation of a sensor array and circuits connected thereto, which may be employed in the image device of FIG. 102A , in accordance with one embodiment of the present invention
  • FIG. 102C is a schematic representation of a pixel of the sensor array of FIG. 102B ;
  • FIG. 102D is a schematic representation of a sensor array and circuits connected thereto, which may be employed in the image device of FIG. 102A , in accordance with one embodiment of the present invention
  • FIG. 102E is a schematic representation of a pixel of the sensor array of FIG. 102D ;
  • FIG. 102F is a schematic representation of a sensor array and circuits connected thereto, which may be employed in the image device of FIG. 102A , in accordance with one embodiment of the present invention
  • FIG. 102G is a schematic representation of a pixel of the sensor array of FIG. 102F ;
  • FIGS. 103A-103E are schematic representations of digital camera apparatus in accordance with further embodiments of the present invention.
  • FIGS. 104A-104E are schematic representations of digital camera apparatus in accordance with further embodiments of the present invention.
  • FIGS. 105A-105E are schematic representations of digital camera apparatus in accordance with further embodiments of the present invention.
  • FIGS. 106A-106C are schematic perspective views of a system having a plurality of digital camera apparatus, in accordance with another embodiment of the present invention.
  • FIG. 107A is a schematic perspective view of a system having a plurality of digital camera apparatus, in accordance with another embodiment of the present invention.
  • FIG. 107B is a schematic elevational view of image devices that may be employed in the system of FIG. 107A ;
  • FIGS. 108A-108B are schematic representations of digital camera apparatus in accordance with further embodiments of the present invention.
  • FIGS. 109A-109E are block diagram representations showing configurations of digital camera apparatus in accordance embodiments of the present invention.
  • FIG. 110A is a block diagram of a processor in accordance with one embodiment of the present invention.
  • FIG. 110B is a block diagram of a channel processor that may be employed in the processor of FIG. 110A , in accordance with one embodiment of the present invention
  • FIG. 110C is a block diagram of an image pipeline that may be employed in the processor of FIG. 110A , in accordance with one embodiment of the present invention.
  • FIG. 110D is a block diagram of a post processor that may be employed in the processor of FIG. 110A , in accordance with one embodiment of the present invention.
  • FIG. 110E is a block diagram of a system control and other portions of a digital camera apparatus, in accordance with one embodiment of the present invention.
  • FIG. 110F is representation of an instruction format according to one embodiment of the present invention.
  • FIG. 111A is a block diagram of a channel processor in accordance with another embodiment of the present invention.
  • FIG. 111B is a graphical representation of a neighborhood of pixel values.
  • FIG. 111C shows a flowchart of operations employed in one embodiment of a double sampler
  • FIG. 111D shows a flowchart of operations employed in one embodiment of a defective pixel identifier
  • FIG. 111E is a block diagram of an image pipeline in accordance with another embodiment of the present invention.
  • FIG. 111F is a schematic diagram of an image plane integrator, in accordance with one embodiment of the present invention.
  • FIG. 111G is an explanatory representation of a multi-phase clock that may be employed in the image plane integrator of FIG. 111G ;
  • FIGS. 111H-111J are explanatory views showing representations of images generated by three camera channels, in accordance with one embodiment of the present invention.
  • FIGS. 111K-111Q are explanatory views showing a representation of a process carried out by the automatic image alignment portion for the images of FIGS. 111H-111J , in accordance with one embodiment of the present invention
  • FIG. 111R is a schematic block diagram of an automatic exposure control, in accordance with one embodiment of the present invention.
  • FIG. 111S is a schematic block diagram of a zoom controller, in accordance with one embodiment of the present invention.
  • FIGS. 111T-11V are explanatory views of a process carried out by the zoom controller of FIG. 111S , in accordance with one embodiment of the present invention.
  • FIG. 111W is a graphical representation showing an example of the operation of a gamma correction portion, in accordance with one embodiment of the present invention
  • FIG. 111X is a schematic block diagram of a gamma correction portion employed in accordance with one embodiment of the present invention.
  • FIG. 111Y is a schematic block diagram of a color correction portion, in accordance with one embodiment of the present invention.
  • FIG. 111Z is a schematic block diagram of an edge enhancer/sharpener, in accordance with one embodiment of the present invention.
  • FIG. 111A A is a schematic block diagram of a chroma noise reduction portion in accordance with one embodiment of the present invention.
  • FIG. 111A B is an explanatory view showing a representation of a process carried out by a white balance portion, in accordance with one embodiment of the present invention.
  • FIG. 111A C is a schematic block diagram of a color enhancement portion, in accordance with one embodiment of the present invention.
  • FIG. 111A D is a schematic block diagram of a scaling portion, in accordance with one embodiment of the present invention.
  • FIG. 111A E is an explanatory view, showing a representation of upscaling, in accordance with one embodiment
  • FIG. 111A F is a flowchart of operations that may be employed in the alignment portion, in accordance with another embodiment of the present invention.
  • FIG. 112 is a block diagram of a channel processor in accordance with another embodiment of the present invention.
  • FIG. 113 is a block diagram of a channel processor in accordance with another embodiment of the present invention.
  • FIG. 114A is a block diagram of an image pipeline in accordance with another embodiment of the present invention.
  • FIG. 114B is a block diagram of an image pipeline in accordance with another embodiment of the present invention.
  • FIG. 114C is a schematic block diagram of a chroma noise reduction portion in accordance with another embodiment of the present invention.
  • FIGS. 115A-115L are explanatory views showing examples of parallax
  • FIG. 115M is an explanatory view showing an image viewed by a first camera channel superimposed with an image viewed by a second camera channel if parallax is eliminated, in accordance with one embodiment of the present invention
  • FIGS. 115N-115R are explanatory representations showing examples of decreasing the parallax
  • FIGS. 115S-115V and 115 X are explanatory views showing examples of increasing the parallax
  • FIG. 116 shows a flowchart of operations that may be employed in generating an estimate of a distance to an object, or portion thereof, according to one embodiment of the present invention.
  • FIG. 117 is a schematic block diagram of a portion of a range finder, in accordance with one embodiment of the present invention.
  • FIG. 118 is a schematic block diagram of a locator portion of the range finder, in accordance with one embodiment of the present invention.
  • FIGS. 119A-119C are explanatory representations showing examples of 3D imaging
  • FIG. 120 is an explanatory representation of another type of 3D imaging
  • FIGS. 121-122 show a flowchart of operations that may be employed in 3D imaging, according to another embodiment of the present invention.
  • FIG. 123 is a schematic block diagram of a 3D effect generator in accordance with one embodiment of the present invention.
  • FIG. 124 is a schematic block diagram of a 3D effect generator in accordance with one embodiment of the present invention.
  • FIG. 125 shows a flowchart of operations that may be employed in image discrimination, according to another embodiment of the present invention.
  • FIGS. 126A-126B illustrate a flowchart of operations that may be employed in image discrimination, according to another embodiment of the present invention.
  • FIG. 127 is a schematic block diagram representation of one or more portions of a digital camera apparatus in accordance with another embodiment of the present invention.
  • FIG. 128 is a schematic block diagram representation of one or more portions of a digital camera apparatus in accordance with another embodiment of the present invention.
  • FIG. 129 is a schematic block diagram representation of one or more portions of a digital camera apparatus in accordance with another embodiment of the present invention.
  • FIG. 130 is a schematic block diagram representation of one or more portions of a digital camera apparatus in accordance with another embodiment of the present invention.
  • FIG. 131 is a schematic block diagram representation of one or more portions of a digital camera apparatus in accordance with another embodiment of the present invention.
  • FIG. 132 is a schematic block diagram representation of one or more portions of a digital camera apparatus in accordance with another embodiment of the present invention.
  • FIG. 133 is a schematic block diagram representation of one or more portions of a digital camera apparatus in accordance with another embodiment of the present invention.
  • FIG. 134 is a schematic block diagram representation of one or more portions of a digital camera apparatus in accordance with another embodiment of the present invention.
  • FIG. 135 is a schematic block diagram representation of one or more portions of a digital camera apparatus in accordance with another embodiment of the present invention.
  • FIG. 136 is a schematic block diagram representation of one or more portions of a digital camera apparatus in accordance with another embodiment of the present invention.
  • FIG. 137 is a schematic block diagram representation of one or more portions of a digital camera apparatus in accordance with another embodiment of the present invention.
  • FIG. 138 is one or more aspects/techniques/embodiments for implementing spectral optimization of one or more components of a digital camera apparatus in accordance with further embodiments of the present invention; one or more of the aspects/techniques/embodiments may be implemented in any of the embodiments described and/or illustrated herein.
  • a prior art digital camera 1 generally includes the primary image capturing elements of an image sensor 150 , a color filter sheet 160 and a series of lenses 170 (in a lens assembly). Additional electronic components typically include a circuit board 110 , a peripheral user interface electronics 120 (here represented as a shutter button, but could also include display, settings, controls, etc), power supply 130 , and electronic image storage media 140
  • the digital camera 1 further includes a housing (including housing portions 173 , 174 , 175 , 176 , 177 and 178 ) and a shutter assembly (not shown), which controls an aperture 180 and passage of light into the digital camera 1 .
  • a mechanical frame 181 is used to hold the various parts of the lens assembly together.
  • the lens assembly includes the lenses 170 and one or more electromechanical devices 182 to move the lenses 170 along an axis 183 .
  • the mechanical frame 181 and the one or more electromechanical devices 182 may be made up of numerous components and/or complex assemblies.
  • the color filter sheet 160 has an array of color filters arranged in a Bayer pattern.
  • a Bayer pattern historically uses filters of red, green, blue and typically a second green (e.g., a 2 ⁇ 2 matrix of colors with alternating red and green in one row and alternating green and blue in the other row, although other colors may be used) although patterns may vary depending on the need of the customer.
  • the Bayer pattern is repeated throughout the color filter array 112 as illustrated in FIGS. 1A-1D . This pattern is repeated over the entire array as illustrated.
  • the image sensor 150 contains a plurality of identical photo detectors (sometimes referred to as “picture elements” or “pixels”) arranged in a matrix.
  • the number of photo detectors is usually in the range of hundreds of thousands to millions.
  • the lens assembly spans the diagonal of the array.
  • the color filter array 160 is laid over the image sensor 150 such that each of the color filters in the color filter sheet 160 is disposed above a respective one of the photo detectors in the image sensor 150 , whereby each photo detector in the image sensor receives a specific band of visible light (e.g., red, green or blue).
  • a specific band of visible light e.g., red, green or blue
  • FIGS. 1B-1D illustrate the photon capture process used by the prior art digital camera 1 in creating a color image.
  • the full spectrum of visible light 184 strikes the set of lenses, which essentially passes along the full spectrum.
  • the full spectrum then strikes the color filters of the color filter sheet 160 and each of the individual color filters of the color filter sheet 160 passes its specific band of spectrum on to its specific pixel. This process is repeated for every pixel.
  • Each pixel provides a signal indicative of the color intensity received thereby.
  • Signal processing circuitry receives alternating color signals from the photo detectors, processes them in uniform fashion by integrating each set of four pixels (red/green/blue/green or variation thereof) into a single full color pixel, and ultimately outputs a color image.
  • FIG. 1E shows the operation of the lens assembly in a retracted mode (sometimes referred to as normal mode or a near focus setting).
  • the lens assembly is shown focused on a distant object (represented as a lightning bolt) 186 .
  • a representation of the image sensor 150 is included for reference purposes.
  • a field of view for the camera 1 is defined between reference lines 188 , 190 .
  • the width of the field of view may be for example, 50 millimeters (mm).
  • the one or more electromechanical devices 182 have positioned lenses 170 relatively close together.
  • the lens assembly passes the field of view through the lenses 170 and onto the image sensor 150 as indicated by reference lines 192 , 194 .
  • An image of the object (indicated at 196 ) is presented onto the image sensor 150 in the same ratio as the width of the actual image 186 relative to the actual field of view 188 , 190 .
  • FIG. 1F shows the operation of the lens assembly 110 in an optical zoom mode (sometimes referred to as a far focus setting).
  • the one or more electromechanical devices 182 of the lens assembly re-position the lens 170 so as to reduce the field of view 188 , 190 over the same image area, thus making the object 186 appear closer (i.e., larger).
  • One benefit of the lens assembly is that the resolution with the lens assembly in zoom mode is typically equal to the resolution with the lens assembly in retracted mode.
  • One drawback, however, is that the lens assembly can be costly and complex.
  • providing a lens with zoom capability results in less light sensitivity and thus increases the F-stop of the lens, thereby making the lens less effective in low light conditions.
  • the traditional lens since the traditional lens must pass all bandwidths of color, it must be a clear lens (no color filtering).
  • the needed color filtering previously described is accomplished by depositing a sheet of tiny color filters beneath the lens and on top of the image sensor. For example, an image sensor with one million pixels will require a sheet of one million individual color filters.
  • This color filter array technique is costly (non-standard integrated circuit processing), presents a limiting factor in shrinking the size of the pixels (cross-talk of colors between pixels in the imaging sensor), plus the color filter array material attenuates the in-band photon stream passing through it (i.e., reduces light sensitivity) since in-band transmission of the color filter array material is less than 100%.
  • FIG. 2 shows an example of a digital camera 2 , and components thereof, in accordance with one embodiment of certain aspects of the present invention.
  • the digital camera includes a digital camera subsystem 200 , a circuit board 110 , a peripheral user interface electronics (here represented as a shutter button, but could also include display and/or one or more other output devices, setting controls and/or one or more additional input devices etc) 120 , a power supply 130 , and electronic image storage media 140 .
  • the digital camera of FIG. 2 may further include a housing and a shutter assembly (not shown), which controls an aperture 180 and passage of light into the digital camera 2 .
  • FIGS. 3A-3B are partially exploded, schematic views of one embodiment of the digital camera subsystem 200 .
  • the digital camera subsystem includes an image sensor 210 , a frame 220 ( FIGS. 7A-7C ) and lenses 230 A- 230 D.
  • the image sensor 210 generally includes a semiconductor integrated circuit or “chip” having several higher order features including multiple arrays 210 A- 210 D and signal processing circuitries 212 , 214 . Each of the arrays 210 A- 210 D captures photons and outputs electronic signals.
  • the signal processing circuitry 212 processes signals for each of the individual arrays 210 .
  • the signal processing circuitry 214 may combine the output from signal processing 212 into output data (usually in the form of a recombined full color image). Each array and the related signal processing circuitry may be preferably tailored to address a specific band of visible spectrum.
  • Each of lenses 230 A- 230 D may be advantageously tailored for the respective wavelength of the respective array.
  • Lenses will generally be about the same size as the underlying array, and will therefore differ from one another in size and shape depending upon the dimensions of the underlying array. Of course, there is no requirement that a given lens cover all, or only, the underlying array. In alternative embodiments a lens could cover only a portion of an array, and could extend beyond the array.
  • Lenses can comprise any suitable material or materials, including for example, glass and plastic. Lenses can be doped in any suitable manner, such as to impart a color filtering, polarization, or other property. Lenses can be rigid or flexible.
  • the frame 220 ( FIGS. 7A-7C ) is used to mount the lenses 230 A- 230 D to the image sensor 210 .
  • each lens, array, and signal processing circuitry constitutes an image generating subsystem for a band of visible spectrum (e.g., red, blue, green, etc). These individual images are then combined with additional signal processing circuitry within the semiconductor chip to form a full image for output.
  • a band of visible spectrum e.g., red, blue, green, etc.
  • digital camera subsystem 210 is depicted in a four array/lens configuration, the digital camera subsystem can be employed in a configuration having any multiple numbers and shapes of arrays/lenses.
  • FIG. 4 depicts a digital camera subsystem having a three array/lens configuration.
  • the digital camera subsystem employs the separate arrays, e.g., arrays 210 A- 210 D, on one image sensor to supplant the prior art approach (which employs a Bayer pattern (or variations thereof), operations across the array (a pixel at a time) and integrates each set of four pixels (for example, red/green/blue/green or variation thereof) from the array into a single full color pixel).
  • Each of such arrays focuses on a specific band of visible spectrum. As such, each array may be tuned so that it is more efficient in capturing and processing the image in that particular color.
  • Individual lenses ( 230 A-D) can be tailored for the array's band of spectrum.
  • Each lens only needs to pass that color ( 184 A- 184 D) on to the image sensor.
  • the traditional color filter sheet is eliminated.
  • Each array outputs signals to signal processing circuitry.
  • Signal processing circuitry for each of these arrays is also tailored for each of the bands of visible spectrum. In effect, individual images are created for each of these arrays. Following this process, the individual images are combined to form one full color or black/white image. By tailoring each array and the associated signal processing circuitry, a higher quality image can be generated than the image resulting from traditional image sensors of like pixel count.
  • FIGS. 6A-6B illustrate some of the many processing operations that can be advantageously used.
  • each array outputs signals to the signal processing circuitry 212 .
  • each array can be processed separately to tailor the processing to the respective bands of spectrum. Several functions occur:
  • the column logic ( 212 . 1 A-D) is the portion of the signal processing circuitry that reads the signals from the pixels.
  • the column logic 212 . 1 A reads signals from the pixels in array 210 A.
  • Column logic 212 . 1 B reads signals from the pixels in array 210 B.
  • Column logic 212 . 1 C reads signals from the pixels in array 210 C.
  • Column logic 212 . 1 D reads signals from the pixels in array 210 D.
  • the column logic may have different integration times for each array enhancing dynamic range and/or color specificity. Signal processing circuitry complexity for each array can be substantially reduced since logic may not have to switch between extreme color shifts.
  • the Analog Signal Logic (ASL) ( 212 . 2 A-D) for each array may be color specific. As such, the ASL processes a single color and therefore can be optimized for gain, noise, dynamic range, linearity, etc. Due to color signal separation, dramatic shifts in the logic and settling time are not required as the amplifiers and logic do not change on a pixel by pixel (color to color) basis as in traditional Bayer patterned designs.
  • the black level logic ( 212 . 3 A-D) assesses the level of noise within the signal, and filters it out. With each array focused upon a narrower band of visible spectrum than traditional image sensors, the black level logic can be more finely tuned to eliminate noise.
  • the exposure control ( 212 . 4 A-D) measures the overall volume of light being captured by the array and will adjust the capture time for image quality. Traditional cameras must make this determination on a global basis (for all colors). Our invention allows for exposure control to occur for each array and targeted band of wavelengths differently.
  • the image processing logic 214 . 1 integrates the multiple color planes into a single color image.
  • the image is adjusted for saturation, sharpness, intensity, hue, artifact removal, and defective pixel correction.
  • the IPL also provides the algorithmic auto focus, zoom, windowing, pixel binning and camera functions.
  • the final two operations are to encode the signal into standard protocols 214 . 2 such as MPEG, JPEG, etc. before passing to a standard output interface 214 . 3 , such as USB.
  • standard protocols 214 . 2 such as MPEG, JPEG, etc.
  • the signal processing circuitries 212 , 214 are shown at specific areas of the image sensor, the signal processing circuitries 212 , 214 can be placed anywhere on the chip and subdivided in any fashion. The signal processing circuitries in fact will likely be placed in multiple locations.
  • the image sensor 210 ( FIGS. 3A-3B ) generally includes a semiconductor chip having several higher order features including multiple arrays ( 210 A- 210 D), and signal processing circuitry 212 , in which each array and the related signal processing circuitry is preferably tailored to address a specific band of visible spectrum.
  • the image sensor array can be configured using any multiple numbers and shapes of arrays.
  • the image sensor 210 can be constructed using any suitable technology, including especially silicon and germanium technologies.
  • the pixels can be formed in any suitable manner, can be sized and dimensioned as desired, and can be distributed in any desired pattern. Pixels that are distributed without any regular pattern could even be used.
  • any range of visible spectrum can be applied to each array depending on the specific interest of the customer. Further, an infrared array could also be employed as one of the array/lens combinations giving low light capabilities to the sensor.
  • arrays 210 A-D may be of any size or shape.
  • FIG. 3 shows the arrays as individual, discrete sections of the image sensor. These arrays may also be touching. There may also be one large array configured such that the array is subdivided into sections whereby each section is focused upon one band of spectrum, creating the same effect as separate arrays on the same chip.
  • the well depth of the photo detectors (for example, an area or portion of the photo detector that captures, collects, is responsive to, detects and/or senses for example, the intensity illumination of incident light; in some embodiments, the well depth is the distance from the surface of the photo detector to a doped region—see, for example, FIGS. 17 B-E) across each individual array (designated 210 A-D) may be the same, the well depth of any given array may be different from that of one or more or all of other arrays of the sensor subsystem. Selection of an appropriate well depth could depend on many factors, including most likely the targeted band of visible spectrum. Since each entire array is likely to be targeted at one band of visible spectrum (e.g., red) the well depth can be designed to capture that wavelength and ignore others (e.g., blue, green).
  • the well depth can be designed to capture that wavelength and ignore others (e.g., blue, green).
  • Doping of the semiconductor material in the color specific arrays can further be used to enhance the selectivity of the photon absorption for color specific wavelengths.
  • frame 220 is a thin plate bored to carry the individual lenses (represented by 230 A, 230 C) over each array.
  • Lenses may be fixed to the frame in a wide range of manners: adhesive, press fit, electronic bonding, etc.
  • the mounting holes may have a small “seat” at the base to control the depth of the lens position. The depth may be different for each lens and is a result of the specific focal length for the particular lens tailored for each array.
  • FIGS. 7A-7C are solid devices that offer a wide range of options for manufacturing, material, mounting, size, and shape. Of course, other suitable frames can be readily designed, all of which fall within the inventive scope.
  • the lenses could be manufactured such that the lenses per image sensor come as one mold or component. Further, this one-body construction could also act as the frame for mounting to the image sensor.
  • the lens and frame concept can be applied to traditional image sensors (without the traditional color filter sheet) to gain physical size, cost and performance advantages.
  • the digital camera subsystem can have multiple separate arrays on a single image sensor, each with its own lens (represented by 230 A, 230 C).
  • the simple geometry of smaller, multiple arrays allows for a smaller lens (diameter, thickness and focal length), which allows for reduced stack height in the digital camera.
  • Each array can advantageously be focused on one band of visible and/or detectable spectrum.
  • each lens may be tuned for passage of that one specific band of wavelength. Since each lens would therefore not need to pass the entire light spectrum, the number of elements may be reduced, for example, to one or two.
  • each of the lenses may be dyed during the manufacturing process for its respective bandwidth (e.g., red for the array targeting the red band of visible spectrum).
  • a single color filter may be applied across each lens. This process eliminates the traditional color filters (the sheet of individual pixel filters) thereby reducing cost, improving signal strength and eliminating the pixel reduction barrier.
  • Elimination of the color filter sheet allows for reductions in the physical size of the pixel for further size reductions of the overall DCS assembly.
  • FIGS. 2, 3 A- 3 B and 5 A- 5 C illustrates a 4 array/lens structure
  • FIG. 4 depicts a three array/lens configuration
  • any multiple number of arrays/lenses as well as various combinations thereof is possible.
  • the above-described devices can include any suitable number of combinations, from as few as 2 arrays/lenses or in a broader array. Examples include:
  • FIG. 2 reflects a digital still camera
  • the camera is intended to be emblematic of a generic appliance containing the digital camera subsystem.
  • FIG. 2 should be interpreted as being emblematic of still and video cameras, cell phones, other personal communications devices, surveillance equipment, automotive applications, computers, manufacturing and inspection devices, toys, plus a wide range of other and continuously expanding applications.
  • the circuit board may not be unique to the camera function but rather the digital camera subsystem may be an add-on to an existing circuit board, such as in a cell phone.
  • any or all of the methods and/or apparatus disclosed herein may be employed in any type of apparatus or process including, but not limited to still and video cameras, cell phones, other personal communications devices, surveillance equipment, automotive applications, computers, manufacturing and inspection devices, toys, plus a wide range of other and continuously expanding applications.
  • Array means a group of photo detectors, also know as pixels, which operate in concert to create one image.
  • the array captures the photons and converts the data to an electronic signal.
  • the array outputs this raw data to signal processing circuitry that generates the image sensor image output.
  • Digital Camera means a single assembly that receives photons, converts them to electrical signals on a semiconductor device (“image sensor”), and processes those signals into an output that yields a photographic image.
  • the digital camera would included any necessary lenses, image sensor, shutter, flash, signal processing circuitry, memory device, user interface features, power supply and any mechanical structure (e.g. circuit board, housing, etc) to house these components.
  • a digital camera may be a stand-alone product or may be imbedded in other appliances, such as cell phones, computers or the myriad of other imaging platforms now available or may be created in the future, such as those that become feasible as a result of this invention.
  • Digital Camera Subsystem means a single assembly that receives photons, converts them to electrical signals on a semiconductor device (“image sensor”) and processes those signals into an output that yields a photographic image.
  • image sensor semiconductor device
  • the Digital Camera Subsystem would include any necessary lenses, image sensor, signal processing circuitry, shutter, flash and any frame to hold the components as may be required.
  • the power supply, memory devices and any mechanical structure are not necessarily included.
  • Electronic media means that images are captured, processed and stored electronically as opposed to the use of film.
  • “Frame” or “thin plate” means the component of the DCS that is used to hold the lenses and mount to the image sensor.
  • Image sensor means the semiconductor device that includes the photon detectors (“pixels”), processing circuitry and output channels. The inputs are the photons and the output is the image data.
  • “Lens” means a single lens or series of stacked lenses (a column one above the other) that shape light rays above an individual array. When multiple stacks of lenses are employed over different arrays, they are called “lenses.”
  • Package means a case or frame that an image sensor (or any semiconductor chip) is mounted in or on, which protects the imager and provides a hermetic seal.
  • Packageless refers to those semiconductor chips that can be mounted directly to a circuit board without need of a package.
  • Photo-detector and “pixels” mean an electronic device that senses and captures photons and converts them to electronic signals. These extremely small devices are used in large quantities (hundreds of thousands to millions) in a matrix to capture an image much like film.
  • “Semiconductor Chip” means a discrete electronic device fabricated on a silicon or similar substrate, which is commonly used in virtually all electronic equipment.
  • Signal Processing Circuitry means the hardware and software within the image sensor that translates the photon input information into electronic signals and ultimately into an image output signal.
  • inventive subject matter can provide numerous benefits in specific applications. For example, traditional color filters are limited in their temperature range, which limits end user manufacturing flexibility. Wave soldering processes, low cost, mass production soldering processes, cannot be used due to the color filters' temperature limitations. At least some embodiments of the inventive subject matter do not have that limitation. Indeed, one, some or all of the embodiments described and illustrated herein need not employ wave soldering processes or other low cost, mass production soldering processes.
  • the assembly can be a hermetically sealed device.
  • the device does not need a “package” and as such, if desired, can be mounted directly to a circuit board which saves parts and manufacturing costs.
  • parallax is created, which can be eliminated in the signal processing circuitry or utilized/enhanced for numerous purposes, including for example, to measure distance to the object, and to provide a 3-D effect.
  • each array and the related signal processing circuitry is preferably tailored to address a specific band of visible spectrum and each lens may be tuned for passage of that one specific band of wavelength
  • each such array and the related signal processing circuitry be tailored to address a specific band of the visible spectrum.
  • each lens be tuned for passage of a specific band of wavelength or that each of the arrays be located on the same semiconductor device.
  • the embodiments described and illustrated herein, including the specific components thereof need not employ wavelength specific features.
  • the arrays and/or signal processing circuitry need not be tailored to address a specific wavelength or band of wavelengths.
  • certain components thereof may be tailored to address a specific wavelength or band of wavelengths while other components of the embodiment are not tailored to address a specific wavelength or band of wavelengths.
  • the lenses and/or arrays may be tailored to address a specific wavelength or band of wavelengths and the associated signal processing circuitry is not tailored to address a specific wavelength or band of wavelengths.
  • one or more lenses may be tailored to address a specific wavelength or band of wavelengths and the associated array and signal processing circuitry is not tailored to address a specific wavelength or band of wavelengths. All such permutations and combinations are intended to come within the scope of the present inventions. For the sake of brevity, all such permutations and combinations are not discussed in detail herein.
  • a digital camera subsystem includes any necessary lenses, image sensor, signal processing circuitry, shutter, flash and any frame to hold the components as may be required, some digital camera subsystems may not have any requirement for one or more of such. For example, some digital camera systems may not require a shutter, a flash and/or a frame to hold the components. Further, some of the digital camera subsystems may not require an image sensor that includes each of the detectors, the processing circuitry and output channels. For example, in some embodiments, one or more of the detectors (or portions thereof), one or more portions of the processing circuitry and/or one or more portions of the output channels may be included in separate devices and/or disposed in separate locations. All such permutations and combinations are intended to come within the scope of the present inventions. For the sake of brevity, all such permutations and combinations are not discussed in detail herein.
  • FIG. 8 is a schematic exploded perspective view of a digital camera apparatus 300 in accordance with another embodiment of the present invention.
  • the digital camera apparatus 300 includes one or more sensor arrays, e.g., four sensor arrays 310 A- 310 D, one or more optics portions, e.g., four optics portions 330 A- 330 D, and a processor 340 .
  • Each of the one or more optics portions, e.g., optics portions 330 A- 330 D may include, for example, but is not limited to, a lens, and may be associated with a respective one of the one or more sensor arrays, e.g., sensor arrays 310 A- 310 D.
  • a support 320 see for example, FIGS.
  • a frame is provided to support the one or more optics portions, e.g., optics portions 330 A- 330 D, at least in part.
  • Each sensor array and the respective optics portion may define a camera channel.
  • a camera channel 350 A may be defined by the optics portion 330 A and the sensor array 310 A.
  • Camera channel 350 B may be defined by the optics portion 330 B and the sensor array 310 B.
  • Camera channel 350 C may be defined by optics portion 330 C and the sensor array 310 C.
  • Camera channel 350 D may be defined by optics portion 330 D and a sensor array 310 D.
  • the optics portions of the one or more camera channels are collectively referred to herein as an optics subsystem.
  • the sensor arrays of the one or more camera channels are collectively referred to herein as a sensor subsystem.
  • the two or more sensor arrays may be integrated in or disposed on a common substrate, referred to hereinafter as an image device, on separate substrates, or any combination thereof (for example, where the system includes three or more sensor arrays, two or more sensor arrays may be integrated in a first substrate and one or more other sensor arrays may be integrated in or disposed on a second substrate).
  • the one or more sensor arrays may or may not be disposed on a common substrate with one another.
  • the sensor arrays may or may not be disposed on a common substrate with one another.
  • two or more of the sensor arrays are disposed on a common substrate.
  • one or more of the sensor arrays is not disposed on the same substrate as one or more of the other sensor arrays.
  • the one or more camera channels may or may not be identical to one another.
  • the camera channels are identical to one another.
  • one or more of the camera channels are different, in one or more respects, from one or more of the other camera channels.
  • each camera channel may be used to detect a different color (or band of colors) and/or band of light than that detected by the other camera channels.
  • one of the camera channels detects red light
  • one of the camera channels e.g., camera channel 350 B
  • one of the camera channels e.g., camera channel 350 C
  • one of the camera channels e.g., camera channel 350 D
  • one of the camera channels detects cyan light
  • one of the camera channels e.g., camera channel 350 B
  • one of the camera channels e.g., camera channel 350 C
  • one of the camera channels e.g., camera channel 350 D
  • detects clear light black and white. Any other wavelength or band of wavelengths (whether visible or invisible) combinations can also be used.
  • the processor 340 is connected to the one or more sensor arrays, e.g., sensor arrays 310 A- 310 D, via one or more communication links, e.g., communication links 370 A- 370 D, respectively.
  • a communication link may be any kind of communication link including but not limited to, for example, wired (e.g., conductors, fiber optic cables) or wireless (e.g., acoustic links, electromagnetic links or any combination thereof including but not limited to microwave links, satellite links, infrared links), and combinations thereof, each of which may be public or private, dedicated and/or shared (e.g., a network).
  • a communication link may employ for example circuit switching or packet switching or combinations thereof. Other examples of communication links include dedicated point-to-point systems, wired networks, and cellular telephone systems.
  • a communication link may employ any protocol or combination of protocols including but not limited to the Internet Protocol.
  • the communication link may transmit any type of information.
  • the information may have any form, including, for example, but not limited to, analog and/or digital (a sequence of binary values, i.e. a bit string).
  • the information may or may not be divided into blocks. If divided into blocks, the amount of information in a block may be predetermined or determined dynamically, and/or may be fixed (e.g., uniform) or variable.
  • the processor may include one or more channel processors, each which is coupled to a respective one (or more) of the camera channels and generates an image based at least in part on the signal(s) received from the respective camera channel, although this is not required.
  • one or more of the channel processors are tailored to its respective camera channel, for example, as described herein. For example, where one of the camera channels is dedicated to a specific wavelength or color (or band of wavelengths or colors), the respective channel processor may be adapted or tailored to such wavelength or color (or band of wavelengths or colors).
  • the gain, noise reduction, dynamic range, linearity and/or any other characteristic of the processor, or combinations of such characteristics may be adapted to improve and/or optimize the processor to such wavelength or color (or band of wavelengths or colors). Tailoring the channel processing to the respective camera channel may facilitate generate an image of a quality that is higher than the quality of images resulting from traditional image sensors of like pixel count.
  • providing each camera channel with a dedicated channel processor may help to reduce or simplify the amount of logic in the channel processors as the channel processor may not need to accommodate extreme shifts in color or wavelength, e.g., from a color (or band of colors) or wavelength (or band of wavelengths) at one extreme to a color (or band of colors) or wavelength (or band of wavelengths) at another extreme.
  • an optics portion of a camera channel receives light from within a field of view and transmits one or more portions of such light, e.g., in the form of an image at an image plane.
  • the sensor array receives one or more portions of the light transmitted by the optics portion and provides one or more output signals indicative thereof.
  • the one or more output signals from the sensor array are supplied to the processor.
  • the processor generates one or more output signals based, at least in part, on the one or more signals from the sensor array.
  • each of the camera channels is dedicated to a different color (or band of colors) or wavelength (or band of wavelengths) than the other camera channels and the processor generates a separate image for each of such camera channels.
  • the processor may generate a combined image based, at least in part, on the images from two or more of such camera channels.
  • each of the camera channels is dedicated to a different color (or band of colors) or wavelength (or band of wavelengths) than the other camera channels and the processor combines the images from the two or more camera channels to provide a partial or full color image.
  • the processor 340 is shown separate from the one or more sensor arrays, e.g., sensor arrays 310 A- 310 D, the processor 340 , or portions thereof, may have any configuration and may be disposed in one or more locations. In some embodiments, one, some or all portions of the processor 340 are integrated in or disposed on the same substrate or substrates as one or more of the one or more of the sensor arrays, e.g., sensor arrays 310 A- 310 D.
  • one, some or all portions of the processor are disposed on one or more substrates that are separate from (and possibly remote from) one or more substrates on which one or more of the one or more sensor arrays, e.g., sensor arrays 310 A- 310 D, may be disposed.
  • certain operations of the processor may be distributed to or performed by circuitry that is integrated in or disposed on the same substrate or substrates as one or more of the one or more of the sensor arrays and certain operations of the processor are distributed to or performed by circuitry that is integrated in or disposed on one or more substrates that are different from (whether such one or more different substrates are physically located within the camera or not) the substrates the one or more of the sensor arrays are integrated in or disposed on.
  • the digital camera apparatus 300 may or may not include a shutter, a flash and/or a frame to hold the components together.
  • FIG. 9A is a schematic exploded representation of one embodiment of an optics portion, e.g., optics portions 330 A.
  • the optics portion 330 A includes one or more lenses, e.g., a complex aspherical lens module 380 , one or more color coatings, e.g., a color coating 382 , one or more masks, e.g., an auto focus mask 384 , and one or more IR coatings, e.g., an IR coating 386 .
  • Lenses can comprise any suitable material or materials, including for example, glass and plastic. Lenses can be doped in any suitable manner, such as to impart a color filtering, polarization, or other property. Lenses can be rigid or flexible. In this regard, some embodiments employ a lens (or lenses) having a dye coating, a dye diffused in an optical medium (e.g., a lens or lenses), a substantially uniform color filter and/or any other filtering technique through which light passes to the underlying array.
  • an optical medium e.g., a lens or lenses
  • the color coating 382 helps the optics portion filter (i.e., substantially attenuate) one or more wavelengths or bands of wavelengths.
  • the auto focus mask 384 may define one or more interference patterns that help the digital camera apparatus perform one or more auto focus functions.
  • the IR coating 386 helps the optics portion 370 A filter a wavelength or band of wavelength in the IR portion of the spectrum.
  • the one or more color coatings e.g., color coating 382 , one or more masks, e.g., mask 384 , and one or more IR coatings, e.g., IR coating 386 may have any size, shape and/or configuration.
  • one or more of the one or more color coatings, e.g., the color coating 382 are disposed at the top of the optics portion (see, for example, FIG. 9B ).
  • Some embodiments of the optics portion (and/or components thereof) may or may not include the one or more color coatings, one or more masks and one or more IR coatings and may or may not include features in addition thereto or in place thereof.
  • one or more of the one or more color coatings are replaced by one or more filters 388 disposed in the optics portion, e.g., disposed below the lens (see, for example, FIG. 9C ).
  • one or more of the color coatings are replaced by one or more dyes diffused in the lens (see, for example, FIG. 9D ).
  • the one or more optics portions may or may not be identical to one another.
  • the optics portions are identical to one another.
  • one or more of the optics portions are different, in one or more respects, from one or more of the other optics portions.
  • one or more of the characteristics for example, but not limited to, its type of element(s), size, response, and/or performance
  • the characteristics for example, but not limited to, its type of element(s), size, response, and/or performance
  • the optics portion for that camera channel may be adapted to transmit only that particular color (or band of colors) or wavelength (or band of wavelengths) to the sensor array of the particular camera channel and/or to filter out one or more other colors or wavelengths.
  • the design of an optical portion is optimized for the respective wavelength or bands of wavelengths to which the respective camera channel is dedicated. It should be understood, however, that any other configurations may also be employed.
  • Each of the one or more optics portions may have any configuration.
  • each of the optics portions comprises a single lens element or a stack of lens elements (or lenslets), although, as stated above, the present invention is not limited to such.
  • a single lens element, multiple lens elements and/or compound lenses, with or without one or more filters, prisms and/or masks are employed.
  • An optical portion can also contain other optical features that are desired for digital camera functionality and/or performance. This can be things such as electronically tunable filters, polarizers, wavefront coding, spatial filters (masks), and other features not yet anticipated. Some of the new features (in addition to the lenses) can be electrically operated (such as a tunable filter) or be moved mechanically with MEMs mechanisms.
  • an optics portion such as for example, optics portion 330 A, may include, for example, any number of lens elements, optical coating wavelength filters, optical polarizers and/or combination thereof. Other optical elements may be included in the optical stack to create desired optical features.
  • FIG. 10A is a schematic representation of one embodiment of optics portion 330 A in which the optics portion 330 A comprises a single lens element 390 .
  • FIG. 10B is a schematic representation of another embodiment of the optics portion 330 A in which the optics portion 330 A includes two or more lens elements, e.g., lens elements 392 A, 392 B.
  • the portions of an optics portion may be separate from one another, integral with one another, and/or any combination thereof.
  • the two lens elements 392 A, 392 B represented in FIG. 10B may be separate from one another or integral with one another.
  • FIGS. 10C-10F show schematic representations of example embodiments of optics portion 330 A in which the optics portion 330 A has one or more lens elements, e.g., lens elements 394 A, 394 B, and one or more filters, e.g., filter 394 C.
  • the one or more lens elements and desired optical features and/or optical elements may be separate from one another, integral with one another, and/or any combination thereof.
  • the one or more lens elements features and/or elements may be disposed in any configuration and/or sequence, for example, a lens-filter sequence (see for example FIG. 10C ), lens-coding sequence (see for example FIG. 10D ), a lens-polarizer sequence (see for example FIG. 10E ), a lens-filter-coding-polarizer sequence (see for example FIG. 10F ) and combinations and/or variations thereof.
  • the filter 394 C shown in FIG. 10C is a color filter that is made within the lenses, deposited on a lens surface or in the optical system as a separate layer on a support structure.
  • the filter may be a single band pass or multiple bandpass filter.
  • the coding 396 C ( FIG. 10D ) may be applied or formed on a lens and/or provided as a separate optical element. In some embodiments, the coding 396 C is used to modify the optical wavefront to allow improved imaging capability with additional post image processing.
  • the optical polarizer 400 E ( FIG. 10E ), may be of any type to improve image quality such as glare reduction.
  • the polarizer 400 E may be applied or formed on one or more optical surfaces and/or provided as a dedicated optical element.
  • FIGS. 10G-10H are schematic representations of optics portions in accordance with further embodiments of the present invention.
  • the portions of an optics portion may be separate from one another, integral with one another and/or any combination thereof. If the portions are separate, they may be spaced apart from one another, in contact with one another or any combination thereof. For example, two or more separate lens elements may be spaced apart from one another, in contact with one another, or any combination thereof.
  • some embodiments of the optics portion shown in FIG. 10G may be implemented with the lens elements 402 A- 402 C spaced apart from one another, as is schematically represented in FIG. 10I , or with two or more of the lens elements 402 A- 402 C in contact with one another, as is schematically represented in FIG. 10I .
  • a filter e.g., 402 D
  • a filter may be implemented, for example, as a separate element 402 D, as is schematically represented in FIG. 10G , or as a coating 402 D disposed on the surface of a lens, for example, as schematically represented in FIG. 10J .
  • the coating may have any suitable thickness and may be, for example, relatively thin compared to the thickness of a lens, as is schematically represented in FIG. 10K .
  • some embodiments of the optics portion shown in FIG. 10H may be implemented with the lens elements 404 A- 404 D spaced apart from one another, as is schematically represented in FIG.
  • the filter e.g., filter 404 E
  • the filter may be implemented, for example, as a separate element 404 E, as is schematically represented in FIG. 10H , or as a coating 404 E disposed on the surface of a lens, for example, as schematically represented in FIG. 10M .
  • the coating may have any suitable thickness and may be, for example, relatively thin compared to the thickness of a lens, as is schematically represented in FIG. 10N .
  • any of the embodiments of FIGS. 10A-10N may be employed in combination with any other embodiments, or portion thereof, disclosed herein.
  • the embodiments of the optics portions shown in FIGS. 10G-10N may further include a coding and/or a polarizer.
  • One or more of the camera channels may employ an optical portion that transmits a narrower band of wavelengths (as compared to broadband), for example, R, G or B, which in some embodiments, may help to simplify the optical design.
  • a narrower band of wavelengths for example, R, G or B
  • image sharpness and focus is easier to achieve with an optics portion having a narrow color band than with a traditional digital camera that uses a single optical assembly and a Bayer color filter array.
  • the use of multiple camera channels to detect different bands of colors allows a reduction in the number of optical elements in each camera channel. Additional optical approaches such as diffractive and aspherical surfaces may result in further optical element reduction.
  • the use of optical portions that transmits a narrower band of wavelengths allows the use of color filters that can be applied directly in the optical material or as coatings.
  • the optical transmission in each band is greater than that traditionally provided by the color filters utilized with on-chip color filter arrays.
  • the transmitted light does not display the pixel to pixel variation that is observed in color filter array approaches.
  • the use of multiple optics and corresponding sensor arrays helps to simplify the optical design and number of elements because the chromatic aberration is much less in a narrower wavelength band as compared to broadband optics.
  • each optical portion transmits a single color or band of colors, multiple colors or bands of colors, or broadband.
  • one or more polarizers that polarize the light, which may enhance image quality.
  • a color filter array e.g., a color filter array with a Bayer pattern
  • the camera channel may employ a sensor array capable of separating the colors or bands of colors.
  • an optical portion may itself have the capability to provide color separation, for example, similar to that provided by a color filter array (e.g., a Bayer pattern or variation thereof).
  • a color filter array e.g., a Bayer pattern or variation thereof.
  • a wide range of optics material choices are available for the optical portions, including, for example, but not limited to, molded glasses and plastics.
  • one or more photochromic (or photochromatic) materials are employed in one or more of the optical portions.
  • the one or more materials may be incorporated into an optical lens element or as another feature in the optical path, for example, above one or more of the sensor arrays.
  • photochromatic materials may be incorporated into a cover glass at the camera entrance (common aperture) to all optics (common to all camera channels), or put into the lenses of one or more camera channels, or into one or more of the other optical features included into the optical path of an optics portion over any sensor array.
  • Some embodiments employ an optics design having a single lens element. Some other embodiments employ a lens having multiple lens elements (e.g., two or more elements). Lenses with multiple lens elements may be used, for example, to help provide better optical performance over a broad wavelength band (such as conventional digital imagers with color filter arrays on the sensor arrays). For example, some multi-element lens assemblies use a combination of single elements to help minimize the overall aberrations. Because some lens elements have positive aberrations and others have negative aberrations, the overall aberrations can be reduced. The lens elements may be made of different materials, may have different shapes and/or may define different surface curvatures. In this way, a predetermined response may be obtained. The process of determining a suitable and/or optimal lens configuration is typically performed by a lens designer with the aid of appropriate computer software.
  • Some embodiments employ an optics portion having three lens elements or lenslets.
  • the three lenslets may be arranged in a stack of any configuration and spaced apart from one another, wherein each of the lenslets defines two surface contours such that the stack collectively defines six surface curvatures and two spaces (between the lenslets).
  • a lens with three lenslets provides sufficient degrees of freedom to allow the designer to correct all third order aberrations and two chromatic aberrations as well as to provide the lens with an effective focal length, although this is not a requirement for every embodiment nor is it a requirement for embodiments having three lenslets arranged in a stack.
  • FIGS. 11A-11B are schematic and side elevational views, respectively, of a lens 410 used in an optics portion adapted to transmit red light or a red band of light, e.g., for a red camera channel, in accordance with another embodiment of the present invention.
  • the lens 410 includes three lenslets, i.e., a first lenslet 412 , a second lenslet 414 and a third lenslet 416 , arranged in a stack 418 .
  • the lens 410 receives light from within a field of view and transmits and/or shapes at least a portion of such light to produce an image in an image area at an image plane 419 .
  • the first lenslet 412 receives light from within a field of view and transmits and/or shapes at least a portion of such light.
  • the second lenslet 414 receives at least a portion of the light transmitted and/or shaped by the first lenslet and transmits and/or shapes a portion of such light.
  • the third lenslet 416 receives at least a portion of the light transmitted and/or shaped by the second lenslet and transmits and/or shapes a portion of such light to produce the image in the image area at the image plane 419 .
  • FIGS. 12A-12B are schematic and side elevational views, respectively, of a lens 420 used in an optics portion adapted to transmit green light or a green band of light, e.g., for a green camera channel, in accordance with another embodiment of the present invention.
  • the lens 420 includes three lenslets, i.e., a first lenslet 422 , a second lenslet 424 and a third lenslet 426 , arranged in a stack 428 .
  • the stack 428 receives light from within a field of view and transmits and/or shapes at least a portion of such light to produce an image in an image area at an image plane 429 .
  • the first lenslet 422 receives light from within a field of view and transmits and/or shapes at least a portion of such light.
  • the second lenslet 424 receives at least a portion of the light transmitted and/or shaped by the first lenslet and transmits and/or shapes a portion of such light.
  • the third lenslet 426 receives at least a portion of the light transmitted and/or shaped by the second lenslet and transmits and/or shapes a portion of such light to produce the image in the image area at the image plane 429 .
  • FIGS. 13A-13B are schematic and side elevational views, respectively, of a lens 430 used in an optics portion adapted to transmit blue light or a blue band of light, e.g., for a blue camera channel, in accordance with another embodiment of the present invention.
  • the lens 430 includes three lenslets, i.e., a first lenslet 432 , a second lenslet 434 and a third lenslet 436 , arranged in a stack 438 .
  • the lens 430 receives light from within a field of view and transmits and/or shapes at least a portion of such light to produce an image in an image area at an image plane 439 .
  • the first lenslet 432 receives light from within the field of view and transmits and/or shapes at least a portion of such light.
  • the second lenslet 434 receives at least a portion of the light transmitted and/or shaped by the first lenslet and transmits and/or shapes a portion of such light.
  • the third lenslet 436 receives at least a portion of the light transmitted and/or shaped by the second lenslet and transmits and/or shapes a portion of such light to produce the image in the image area at the image plane 439 .
  • FIG. 14 is a schematic view of a lens 440 used in an optics portion adapted to transmit red light or a red band of light, e.g., for a red camera channel, in accordance with another embodiment of the present invention.
  • the lens 440 in this embodiment may be characterized as 60 degree, full field of view.
  • the lens 440 includes three lenslets, i.e., a first lenslet 442 , a second lenslet 444 , and a third lenslet 446 , arranged in a stack 448 .
  • the lens 440 receives light from within a field of view and transmits and/or shapes at least a portion of such light to produce an image in an image area at an image plane 449 .
  • the first lenslet 442 receives light from within a field of view and transmits and/or shapes at least a portion of such light.
  • the second lenslet 444 receives at least a portion of the light transmitted and/or shaped by the first lenslet and transmits and/or shapes a portion of such light.
  • the third lenslet 446 receives at least a portion of the light transmitted and/or shaped by the second lenslet and transmits and/or shapes a portion of such light to produce the image in the image area at the image plane 449 .
  • FIGS. 15A-15F are schematic representations of some other types of lenses that may be employed. More particularly, FIGS. 15A-15E are schematic representations of other lenses 450 - 458 that include a stack having three lenslets 450 A- 450 C, 452 A- 452 C, 454 A- 454 C, 456 A- 456 C, 458 A- 458 C. FIG. 15F is a schematic representation of a lens 460 having only one lens element. It should be understood however, that an optics portion may have any number of components and configuration.
  • FIGS. 16A-16C are representations of one embodiment of a sensor array, e.g., sensor array 310 A, and circuits connected thereto, e.g., 470 - 476 .
  • the purpose of the sensor array, e.g., sensor array 310 A is to capture light and convert it into one or more signals (e.g., electrical signals) indicative thereof, which are supplied to one or more of the circuits connected thereto, for example as described below.
  • the sensor array includes a plurality of sensor elements such as for example, a plurality of identical photo detectors (sometimes referred to as “picture elements” or “pixels”), e.g., pixels 480 1,1 - 480 n,m .
  • the photo detectors e.g., photo detectors 480 1,1 - 480 n,m , are arranged in an array, for example a matrix type array.
  • the number of pixels in the array may be, for example, in a range from hundreds of thousands to millions.
  • the pixels may be arranged for example, in a 2 dimensional array configuration, for example, having a plurality of rows and a plurality of columns, e.g., 640 ⁇ 480, 1280 ⁇ 1024, etc.
  • the pixels can be sized and dimensioned as desired, and can be distributed in any desired pattern. Pixels that are distributed without any regular pattern could even be used. Referring to FIG.
  • a pixel e.g., pixel pixels 480 1,1
  • the sensor elements are disposed in a plane, referred to herein as a sensor plane.
  • the sensor may have orthogonal sensor reference axes, including for example, an x axis, a y axis, and a z axis, and may be configured so as to have the sensor plane parallel to the xy plane XY and directed toward the optics portion of the camera channel.
  • Each camera channel has a field of view corresponding to an expanse viewable by the sensor array.
  • Each of the sensor elements may be, for example, associated with a respective portion of the field of view.
  • the sensor array may employ any type of technology, for example, but not limited to MOS pixel technologies (meaning that one or more portions of the sensor are implemented in “Metal Oxide Semiconductor” technology), charge coupled device (CCD) pixel technologies or combination of both (hybrid) and may comprise any suitable material or materials, including, for example, silicon, germanium and/or combinations thereof.
  • MOS pixel technologies meaning that one or more portions of the sensor are implemented in “Metal Oxide Semiconductor” technology
  • CCD charge coupled device
  • hybrid may comprise any suitable material or materials, including, for example, silicon, germanium and/or combinations thereof.
  • the sensor elements or pixels may be formed in any suitable manner.
  • the sensor array e.g., sensor array 310 A
  • the sensor array is exposed to light, for example, on a sequential line per line basis (similar to scanner) or globally (similar to conventional film camera exposure).
  • the pixels e.g., pixels 480 1,1 - 480 n,m
  • the pixels may be read out, e.g., on a sequential line per line basis.
  • circuitry sometimes referred to as column logic is used to read the signals from the pixels, e.g., pixels 480 1,1 - 480 n,m .
  • the sensor elements e.g., pixel 480 1,1
  • the sensor elements may be accessed one row at a time by asserting one of the word lines, e.g., word line 482 , which run horizontally through the sensor array, e.g., sensor array 310 A.
  • Data may passed into and/or out of the sensor elements, e.g., pixel 480 1,1 , via bit lines which run vertically through the sensor array, e.g., sensor array 310 A.
  • pixels are not limited to the configurations shown in FIGS. 16A-16C .
  • each of the one or more sensor arrays may have any configuration (e.g., size, shape, pixel design).
  • the sensor arrays may or may not be identical to one another.
  • the sensor arrays are identical to one another.
  • one or more of the sensor arrays are different, in one or more respects, from one or more of the other sensor arrays.
  • one or more of the characteristics for example, but not limited to, its type of element(s), size (for example, surface area), and/or performance) of one or more of the sensor arrays is tailored to the respective optics portion and/or to help achieve a desired result.
  • the sensor array for that camera channel may be adapted to have a sensitivity that is higher to that particular color (or band of colors) or wavelength (or band of wavelengths) than other colors or wavelengths and/or to sense only that particular color (or band of colors) or wavelength (or band of wavelengths).
  • the design, operation, array size for example, surface area of the active portion of the array
  • shape of the pixel of a sensor array for example, the shape of the active area (surface area of the pixel that is sensitive to light) of the pixel
  • pixel size of a sensor array for example, the active area of the surface of the pixel
  • each sensor array may be, for example, dedicated to a specific band of light (visible and/or invisible), for example, one color or band of colors. If so, each sensor array may be tuned so as to be more efficient in capturing and/or processing an image or images in its particular band of light.
  • the well depth of the photo detectors across each individual array is the same, although in some other embodiments, the well depth may vary.
  • the well depth of any given array can readily be manufactured to be different from that of other arrays of the sensor subsystem. Selection of an appropriate well depth could depend on many factors, including most likely the targeted band of visible spectrum. Since each entire array is likely to be targeted at one band of visible spectrum (e.g., red) the well depth can be designed to capture that wavelength and ignore others (e.g., blue, green).
  • Doping of the semiconductor material in the color specific arrays may enhance the selectivity of the photon absorption for color specific wavelengths.
  • the pixels may be responsive to one particular color or band of colors (i.e., wavelength or band of wavelengths).
  • the optics portion may include lenses and/or filters that transmit only the particular color or band of colors and/or attenuate wavelength or band of wavelengths associated with other colors or band of colors.
  • a color filter and/or color filter array is disposed over and/or on one or more portions of one or more sensor arrays.
  • the sensor array separates colors or bands of colors.
  • the sensor array may be provided with pixels that have multiband sensing capability, e.g., two or three colors.
  • each pixel may comprise two or three photodiodes, wherein a first photodiode is adapted to detect a first color or first band of colors, a second photodiode is adapted to detect a second color or band of colors and a third photodiode is adapted to detect a third color or band of colors.
  • One way to accomplish this is to provide the photodiodes with different structures/characteristics that make them selective, such that first photodiode has a higher sensitivity to the first color or first band of colors than to the second color or band of colors, and the second photodiode has a higher sensitivity to the second color or second band of colors than to the first color or first band of colors.
  • Another way is to dispose the photodiodes at different depths in the pixel, which takes advantage of the different penetration and absorption characteristics of the different colors or bands of colors. For example, blue and blue bands of colors penetrate less (and are thus absorbed at a lesser depth) than green and green bands of colors, which in turn penetrate less (and are thus absorbed at a lesser depth) than red and red bands of colors.
  • such a sensor array is employed even though the pixels may see only one particular color or band of colors, for example, to in order to adapt such sensor array to the particular color or band of colors.
  • a layer of material that attenuates certain wavelengths and passes other wavelengths may be disposed on or integrated into the surface of the photodiode. In this way, each pixel function as a plurality of photodiodes that is adapted to sense multiple wavelengths.
  • FIG. 17A is a schematic plan view of a portion of a sensor array, e.g., a portion of sensor array 310 A, in accordance with one embodiment of the present invention.
  • the portion of the array includes six unit cells, e.g., cells 490 i,j - 490 i+2,j+1 .
  • Each unit cell has a pixel region, e.g., unit cell 490 i+2,j+1 has a pixel region 492 i+2,j+1 .
  • the pixel region may be, for example, but is not limited to, a p implant region.
  • the sensor elements may be accessed one row at a time by asserting one of the word lines, e.g., word lines 494 , which may run, for example, horizontally through the sensor array, e.g., sensor array 310 A.
  • Power may be provided on power lines, e.g., power lines 496 , which may for example, run vertically through the sensor array.
  • Data may passed into and/or out of the sensor elements, e.g., pixels 492 i,j - 492 i+2,j+1 , via bit lines, e.g., bit lines 498 , which may run, for example, vertically through the sensor array, e.g., sensor array 310 A.
  • Reset may be initiated via reset lines, e.g., reset lines 500 , which may run, for example, horizontally through the sensor array.
  • each sensor array has 1.3 M pixels.
  • three camera channels may provide an effective resolution of about 4 M pixels.
  • Four camera channels may provide an effective resolution of about 5.2 M pixels.
  • each sensor array has 2 M pixels.
  • three camera channels may provide an effective resolution of about 6 M pixels.
  • Four camera channels may provide an effective resolution of about 8 M pixels.
  • each of the one or more sensor arrays may have any configuration (e.g., size, shape, pixel design).
  • FIG. 17B is exemplary schematic cross section of the implant portion of a pixel having a single well to capture all wavelengths.
  • FIG. 17C is exemplary schematic cross section of an implant portion of a pixel having a well formed “deep” in the semiconductor (for example, silicon) such that the depth of the implant is adapted or suitable to improve capture or collect of light having wavelengths in the range associated with the color red (among others).
  • the embodiment illustrated in FIG. 17C includes a deep implant formation of the junction to create a high efficiency red detector in which photons are collected, detected or captured deep in the semiconductor.
  • the well depth of the pixel or photo detector may be predetermined, selected and/or designed to tune the response to the photo detector.
  • a pixel “tuned” to capture, collect or respond to photons having wavelengths in the range associated with the color blue is illustrated.
  • the exemplary schematic cross section of an implant portion of a pixel includes a well formed “near the surface” in the semiconductor (for example, silicon) such that the depth of the implant is adapted or suitable to improve capture or collect of light having wavelengths in the range associated with the color blue. Accordingly, relative to FIG.
  • a shallow junction is formed in the semiconductor which is optimized for collecting, detecting or capturing wavelengths in the range associated with the color blue near the surface of the detector (relative to FIG. 17C ).
  • a filter may be omitted due to selectively implanting the region at a particular depth. That is, filter material may be unnecessary as both green and red photons pass through the collection region collecting, detecting or capturing mainly the blue signal (photons having wavelengths in the range associated with the color blue).
  • the pixel or photo detector may be “tuned” to capture, collect or respond to photons having wavelengths primarily in the range associated with the color red.
  • the well region is formed and/or confined at a depth that is associated primarily with wavelengths of the color red.
  • the pixel or photo detector may be “tuned” to capture, collect or respond to photons having wavelengths primarily in the range associated with the color green.
  • the well region is formed and/or confined at a depth that is associated primarily with wavelengths of the color green.
  • the pixel or photo detector may be “tuned” to capture, collect or respond to photons having wavelengths primarily in the range associated with any color.
  • the well region of the pixel or photo detector is formed and/or confined at a depth that is associated primarily with wavelengths of the color to be captured or collected.
  • the specific regions for collection can be formed by buried junctions within the semiconductor base material. In this case by varying the buried junction depth and shape, wavelength selectivity can be achieved. Together with the optical path further selectivity and wavelength responsivity can allow for single or multiple band pass detectors.
  • the pixel or photo detector may be “tuned” to capture, collect or respond to photons having wavelengths primarily in the range associated with more than one color.
  • a first pixel located on the left
  • a second pixel includes well regions formed and/or confined at a depth that are associated primarily with wavelengths of the colors red (deep) and blue (more shallow).
  • this pixel or photo detector is “tuned” to capture or collect incident photons having wavelengths primarily in the range associated with two colors.
  • the pixel on the right includes a well region formed and/or confined at a depth that is associated primarily with wavelengths of one color, here green.
  • the sensor array may include one, some or all of the pixels (located on the left or the right). Moreover, the sensor array may include a pattern of both types of pixels.
  • the pixel or photo detector may be “tuned” to capture, collect or respond to photons having wavelengths primarily in the range associated with any two or more colors (provided that such colors are sufficiently spaced to permit appropriate sensing). (See for example, FIG. 17H —blue and green sensed via the pixel located on the left and green and red sensed via the pixel located on the right).
  • ⁇ 3/ ⁇ 2/ ⁇ 1 e.g. R/G/B
  • ⁇ 3/ ⁇ 2/ ⁇ 1 e.g. R/G/B photodiodes in individual pixels
  • ⁇ 3/ ⁇ 1 e.g. R/B
  • ⁇ 2 e.g. G
  • ⁇ 3/ ⁇ 2/ ⁇ 1 e.g. R/G/B photodiodes in one pixel
  • ⁇ 4/ ⁇ 2 e.g. R/G1
  • ⁇ 3/ ⁇ 1 e.g. G2/B
  • ⁇ 4/ ⁇ 3/ ⁇ 2/ ⁇ 1 e.g. R/G2/G1/B
  • ⁇ 4/ ⁇ 3/ ⁇ 2/ ⁇ 1 e.g. R/G2/G1/B photodiodes in one pixel
  • ⁇ 4/ ⁇ 3/ ⁇ 2/ ⁇ 1 e.g. R/G2/G1/B photodiodes in individual pixels
  • wavelength bands from ⁇ 1 to ⁇ 4 represent increasing wavelengths and can range from the UV to IR (e.g. 200-1100 nm for silicon photodiodes)
  • each array of photo detectors is separate from the other, and unlike conventional arrays which can only be processed in a like manner due to the proximity of adjacent photo detectors, various implant and junction configurations may be achieved by this invention.
  • various photo detector topologies can be achieved.
  • FIGS. 18A-18B are explanatory representations depicting an image being captured by a portion of a sensor array, e.g., 310 A. More particularly, FIG. 18A is a explanatory view of an image of an object (a lightning bolt) striking a portion of the sensor array.
  • the photon capturing portions (or active area), e.g., photon capturing portion 502 , of the sensor elements are represented generally represented by circles although in practice, a pixel can have any shape including for example, an irregular shape.
  • photons that strike the photon capturing portion or active area of the pixel or photo detector e.g., photons that strike within the circles XX
  • FIG. 18B shows the portion of the photons, e.g., portion 504 , that are captured by the sensor in this example. Photons that do not strike the sensor elements (e.g., photons that striking outside circles XX) are not sensed/captured.
  • FIGS. 19A-19B are explanatory representations depicting an image being captured by a portion of a sensor, e.g., sensor array 310 A, that has more sensor elements and closer spacing of such elements than is provided in the sensor of FIG. 18A .
  • FIG. 19A shows an image of an object (a lightning bolt) striking the sensor.
  • photons that strike the photon capturing portion e.g., photon capturing portion 506
  • FIG. 19B shows the portions of the photons, e.g., portion 508 , that are captured by the sensor in this example.
  • the sensor of FIG. 19A captures more photons than the sensor of FIG. 18A .
  • FIGS. 20A-20B are schematic representations of a relative positioning provided for an optics portion, e.g., optics portion 330 A, and a respective sensor array, e.g., sensor array 310 A, in some embodiments.
  • an optics portion e.g., optics portion 330 A
  • a respective sensor array e.g., sensor array 310 A
  • FIGS. 20A-20B shows the optics portion having an axis, e.g., axis 510 A, aligned with an axis, e.g., axis 512 A, of the sensor array, some embodiments may not employ such an alignment.
  • the optics portion and/or the sensor array may not have an axis.
  • FIG. 21 is a schematic representation of a relative positioning provided for four optics portions, e.g., optics portions 330 A- 330 D, and four sensor arrays, e.g., sensor arrays 310 A- 310 D, in some embodiments.
  • FIG. 21 shows each of the optics portions, e.g., optics portion 330 B, having an axis, e.g., axis 510 B, aligned with an axis, e.g., axis 512 B, of the respective sensor array, e.g., sensor array 310 B, it should be understood that some embodiments may not employ such an alignment.
  • the one or more of the optics portions and/or one or more of the sensor arrays may not have an axis.
  • the optics portion is generally about the same size as the respective sensor array, and may therefore differ from one another in size and shape depending upon the dimensions of the underlying array. There is, however, no requirement that a given optics portion cover all, or only, the underlying array. In some alternative embodiments an optics portion could cover only a portion of an array and/or could extend beyond the array.
  • FIGS. 22A-22B are a schematic plan view and a schematic cross sectional view, respectively, of one embodiment of an image device 520 in or on which one or more sensor arrays, e.g., sensor arrays 310 A- 310 D, may be disposed and/or integrated, and the image areas of the respective optics portions, e.g., optics portions 330 A- 330 D, in accordance with one embodiment of the present invention.
  • the image device 520 has first and second major surfaces 522 , 524 and an outer perimeter defined by edges 526 , 528 , 530 and 532 .
  • the image device 520 defines the one or more regions, e.g., regions 534 A- 534 D, for the active areas of the one or more sensor arrays, e.g., sensor arrays 310 A- 310 D, respectively.
  • the image device further defines one or more regions, e.g., regions 536 A- 536 D, respectively, and 538 A- 538 D, respectively, for the buffer and/or logic associated with the one or more sensor arrays, e.g., sensor arrays 310 A- 310 D, respectively.
  • the image device may further define one or more additional regions, for example, regions 540 , 542 , 544 , 546 disposed in the vicinity of the perimeter of the image device (e.g., extending along and adjacent to one, two, three or four of the edges of the image device) and/or between the regions for the sensor arrays.
  • one or more electrically conductive pads e.g., pads 550 , 552 , 554 , 556 , one or more portions of the processor, one or more portions of additional memory, and/or any other types of circuitry or features may be disposed in one or more of these regions, or portions thereof.
  • One or more of such pads may be used in supplying one or more electrical signals and/or from one or more circuits on the image device to one or more other circuits located on or off of the image device.
  • the major outer surface defines one or more support surfaces to support one or more portions of a support, e.g., support 320 .
  • Such support surfaces may be disposed in any region, or portion thereof, e.g., regions 540 - 546 , however in some embodiments, it is advantageous to position the support surfaces outside the active areas of the sensor array so as not to interfere with the capture of photons by pixels in such areas.
  • the one or more optics portions e.g., optics portions 330 A- 330 D, produce image areas, e.g., image areas 560 A- 560 D, respectively, at an image plane.
  • the image device, sensor arrays and image areas may each have any size(s) and shape(s).
  • the image areas are generally about the same size as the respective sensor arrays, and therefore, the image areas may differ from one another in size and shape depending upon the dimensions of the underlying sensor arrays.
  • an image area cover all, or only, the underlying array.
  • an image area could cover only a portion of an array, and could extend beyond the array.
  • the image areas extend beyond the outer perimeter of the sensor arrays, e.g., sensor arrays 310 A- 310 D, respectively.
  • the image device has a generally square shape having a first dimension 562 equal to about 10 mm and a second dimension 564 equal to about 10 mm, with each quadrant having a first dimension 566 equal to 5 mm and a second dimension 568 equal to 5 mm.
  • Each of the image areas has a generally circular shape and a width or diameter 570 equal to about 5 millimeters (mm).
  • Each of the active areas has a generally rectangular shape having a first dimension 572 equal to about 4mm and a second dimension 574 equal to about 3mm.
  • the active area may define for example, a matrix of 1200 ⁇ 900 pixels (i.e., 1200 columns, 900 rows).
  • FIGS. 23A-23B are a schematic plan view and a schematic cross sectional view, respectively, of the image device and image areas in accordance with another embodiment.
  • the image device 520 has one or more pads, e.g., 550 - 556 , disposed in a configuration that is different than the configuration of the one or more pads in the embodiments shown above.
  • the image device 520 , sensor arrays, and image areas 560 A- 560 D may have, for example, the same shape and dimensions as set forth above with respect to the embodiment of the image device shown in FIGS. 22A-22B .
  • FIGS. 24A-24B are a schematic plan view and a schematic cross sectional view, respectively, of the image device 520 and image areas in accordance with another embodiment.
  • the image device 520 has a vertically extending region, disposed between the sensor arrays, that is narrower than a vertically extending region, disposed between the sensor arrays, in the embodiment of the image device shown in FIGS. 22A-22B .
  • Horizontally extending regions 542 , 546 , disposed along the perimeter are wider than horizontally extending regions 542 , 546 , disposed along the perimeter of the image device 520 shown in FIGS. 22A-22B .
  • the image device 520 may have, for example, the same shape and dimensions as set forth above with respect to the embodiment of the image device shown in FIGS. 22A-22B .
  • FIGS. 25A-25B are a schematic plan view and a schematic cross sectional view, respectively, of the image device 520 and image areas, e.g., image areas 560 A- 560 D, in accordance with another embodiment.
  • the image areas e.g., image areas 560 A- 560 D
  • the image device 520 and the sensor arrays may have, for example, the same shape and dimensions as set forth above with respect to the embodiment of the image device 520 shown in FIGS. 22A-22B .
  • FIGS. 26A-26B are a schematic plan view and a schematic cross sectional view, respectively, of the image device and image areas in accordance with another embodiment.
  • regions 540 - 546 disposed between the sensor arrays and the edges of the image device are wider than the regions 540 - 546 disposed between the sensor arrays and the edge of the image device in the embodiments of FIGS. 22A-22B .
  • Such regions may be used, for example, for one or more pads, one or more portions of the processor, as a seat and/or mounting region for a support and/or any combination thereof.
  • a horizontally extending region 564 disposed between the sensor arrays is wider than the horizontally extending region 546 between the sensor arrays in the embodiment of FIGS. 22A-22B .
  • Such region 546 may be used, for example, for one or more pads, one or more portions of the processor, as a seat and/or mounting region for a support and/or any combination thereof.
  • the image device and the sensor arrays may have, for example, the same shape and dimensions as set forth above.
  • this embodiment may be employed alone or in combination with one or more of the other embodiments disclosed herein, or portions thereof.
  • FIGS. 27A-27B are a schematic plan view and a schematic cross sectional view, respectively, of the image device 540 and image areas 560 A- 560 D in accordance with another embodiment.
  • This embodiment of the image device 520 and image areas 560 A- 560 D is similar to the embodiment of the image device and image areas shown in FIGS. 26A-26B , except that the image areas, e.g., image areas 560 A- 560 D, do not extend beyond the outer perimeter of the sensor arrays, e.g., sensor arrays 310 A- 310 D, respectively.
  • FIG. 28A is a schematic perspective view of a support 320 in accordance with another embodiment of the present invention.
  • the support 320 may have any configuration and may comprise, for example, but is not limited to, a frame.
  • FIGS. 28B-28D are enlarged cross sectional views of the support 320 .
  • the optics portions of the one or more camera channels e.g., optics portions 330 A- 330 D
  • the support 320 which position(s) each of the optics portions in registration with a respective sensor array, at least in part.
  • optics portion 330 A is positioned in registration with sensor array 310 A.
  • Optics portion 330 B is positioned in registration with sensor array 310 B.
  • Optics portion 330 C is positioned in registration with sensor array 310 C.
  • Optics portion 330 B is positioned in registration with sensor array 310 B.
  • Optics portion 330 D is positioned in registration with sensor array 310 D.
  • the support 320 may also help to limit, minimize and/or eliminate light “cross talk” between the camera channels and/or help to limit, minimize and/or eliminate “entry” of light from outside the digital camera apparatus.
  • the support 320 defines one or more support portions, e.g., four support portions 600 A- 600 D, each of which supports and/or helps position a respective one of the one or more optics portions.
  • support portion 600 A supports and positions optics portion 330 A in registration with sensor array 310 A.
  • Support portion 600 B supports and positions optics portion 330 B in registration with sensor array 310 B.
  • Support portion 600 C supports and positions optics portion 330 C in registration with sensor array 310 C.
  • Support portion 600 D supports and positions optics portion 330 D in registration with sensor array 310 D.
  • each of the support portions e.g., support portions 600 A- 600 D
  • the aperture 616 defines a passage for the transmission of light for the respective camera channel.
  • the seat 618 is adapted to receive a respective one of the optics portions (or portion thereof) and to support and/or position the respective optics portion, at least in part.
  • the seat 618 may include one or more surfaces (e.g., surfaces 620 , 622 ) adapted to abut one or more surfaces of the optics portion to support and/or position the optics portion, at least in part, relative to the support portion and/or one or more of the sensor arrays 310 A- 310 D.
  • surface 620 is disposed about the perimeter of the optics portion to support and help position the optics portion in the x direction and the y direction).
  • Surface 622 (sometimes referred to herein as “stop” surface) positions or helps position the optics portion in the z direction.
  • the position and/or orientation of the stop surface 622 may be adapted to position the optics portion at a specific distance (or range of distance) and/or orientation with respect to the respective sensor array.
  • the seat 618 controls the depth at which the lens is positioned (e.g., seated) within the support 320 .
  • the depth may be different for each lens and is based, at least in part, on the focal length of the lens. For example, if a camera channel is dedicated to a specific color (or band of colors), the lens or lenses for that camera channel may have a focal length specifically adapted to the color (or band of colors) to which the camera channel is dedicated. If each camera channels is dedicated to a different color (or band of colors) than the other camera channels, then each of the lenses may have a different focal length, for example, to tailor the lens to the respective sensor array, and each of the seats have a different depth.
  • Each optics portion may be secured in respective seat 618 in any suitable manner, for example, but not limited to, mechanically (e.g., press fit, physical stops), chemically (e.g., adhesive), electronically (e.g., electronic bonding) and/or combination thereof.
  • the seat 618 may include dimensions adapted to provide a press fit for the respective optics portion.
  • the aperture may have any configuration (e.g., shape and/or size) including for example, cylindrical, conical, rectangular, irregular and/or any combination thereof.
  • the configuration may be based, for example, on the desired configuration of the optical path, the configuration of the respective optical portion, the configuration of the respective sensor array and/or any combination thereof.
  • the support 320 may or may not have exactly four support portions, e.g., support portions 600 A- 600 D. In some embodiments, for example, the support includes fewer than four support portions (e.g., one, two or three support portions) are used. In some other embodiments, the support includes more than four support portions. Although the support portions, 630 A- 630 D are shown as being identical to one another, this is not required. Moreover, in some embodiments, one or more of the support portions may be isolated at least in part from one or more of the other support portions. For example, the support 320 may further define clearances or spaces that isolate the one or more inner support portions, in part, from one or more of the other support portions.
  • the support 320 may comprise any type of material(s) and may have any configuration and/or construction.
  • the support 320 comprises silicon, semiconductor, glass, ceramic, plastic, or metallic materials and/or a combination thereof. If the support 320 has more than one portion, such portions may be fabricated separate from one another, integral with one another and/or any combination thereof. If the support defines more than one support portion, each of such support portions, e.g., support portions 600 A- 600 D, may be coupled to one, some or all of the other support portions, as shown, or completely isolated from the other support portions.
  • the support may be a solid device that may offer a wide range of options for manufacturing and material, however other forms of devices may also be employed.
  • the support 320 comprises a plate (e.g., a thin plate) that defines the one or more support portions, with the apertures and seats being formed by machining (e.g., boring) or any other suitable manner.
  • the support 320 is fabricated as a casting with the apertures defined therein (e.g., using a mold with projections that define the apertures and seats of the one or more support portions).
  • the lens and support are manufactured as a single molded component.
  • the lens may be manufactured with tabs that may be used to form the support.
  • the support 320 is coupled and/or affixed directly or indirectly, to the image device.
  • the support 320 may be directly coupled and affixed to the image device (e.g., using adhesive) or indirectly coupled and/or or affixed to the image device via an intermediate support member (not shown).
  • the x and y dimensions of the support 320 may be, for example, approximately the same (in one or more dimensions) as the image device, approximately the same (in one or more dimensions) as the arrangement of the optics portions 330 A- 330 D and/or approximately the same (in one or more dimensions) as the arrangement of the sensor arrays 310 A- 310 D.
  • One advantage of such dimensioning is that it helps keep the x and y dimensions of the digital camera apparatus as small as possible.
  • the seat 618 may be advantageous to provide the seat 618 with a height A that is the same as the height of a portion of the optics that will abut the stop surface 620 . It may be advantageous for the stop surface 622 to be disposed at a height B (e.g., the distance between the stop surface 622 and the base of the support portion) that is at least as high as needed to allow the seat 618 to provide a firm stop for an optics portion (e.g., the lens) to be seated thereon.
  • a height B e.g., the distance between the stop surface 622 and the base of the support portion
  • the width or diameter C of the portion of the aperture 616 disposed above the height of the stop surface 622 may be based, for example, on the width or diameter of the optics portion (e.g., the lens) to be seated therein and the method used to affix and/or retain that optics portion in the seat 618 .
  • the width of the stop surface 622 is preferably large enough to help provide a firm stop for the optics portion (e.g., the lens) yet small enough to minimize unnecessary blockage of the light transmitted by the optics portion. It may be desirable to make the width or diameter D of the portion of the aperture 616 disposed below the height of the stop surface 622 large enough to help minimize unnecessary blockage of the light transmitted by the optics portion.
  • the support may have a length J and a width K.
  • the seat 618 with a height A equal to 2.2 mm, to provide the stop surface 622 at a height B in the range of from 0.25 mm to 3 mm, to make the width or diameter C of the portion of the aperture above the height B of the stop surface 622 equal to approximately 3 mm, to make the width or diameter D of the lower portion of the aperture approximately 2.8 mm, to provide the support portion with a height E in the range from 2.45 mm to 5.2 mm and to space the apertures apart by a distance F of at least 1 mm.
  • one or more of the optics portions comprises a cylindrical type of lens, e.g., a NT45-090 lens manufactured by Edmunds Optics, although this is not required.
  • a cylindrical type of lens e.g., a NT45-090 lens manufactured by Edmunds Optics, although this is not required.
  • Such lens has a cylindrical portion with a diameter G up to 3 millimeters (mm) and a height H of 2.19 mm.
  • G millimeters
  • H height
  • the support has a length J equal to 10 mm and a width K equal to 10 mm. In some other embodiments, it may be desirable to provide the support with a length J equal to 10 mm and a width K equal to 8.85 mm.
  • FIG. 29A is a schematic cross sectional view of a support 320 and optics portions, e.g., 330 A- 330 D, seated therein in accordance with another embodiment.
  • the optics portions have an orientation that is inverted compared to the orientation of the optics portions in the embodiment of FIGS. 7A-7C .
  • FIG. 29B is a schematic cross sectional view of a support and optics portions, e.g., 330 A- 330 D, seated therein in accordance with another embodiment.
  • each of the optics portions includes a single lens element having a shank portion 702 A- 702 D, respectively.
  • the support 320 has an orientation that is inverted compared to the orientation of the support in the embodiment of FIGS. 6A-6C , such that the optics portions are seated on stop surfaces 622 A- 622 D, respectively, that face in a direction away from the sensor arrays (not shown).
  • FIGS. 30A-30D show a support 320 having four support portions 600 A- 600 D each defining an aperture, e.g., aperture 616 A- 616 D, for a respective optics portion, wherein the seat, e.g., seat 618 A, defined by one or more of the support portions, e.g., support portion 600 A, is disposed at a depth 710 A that is different than the depths, e.g., depth 710 C, of the seat, e.g., seat 618 C, of one or more other support portions, for example, to adapt the one or more support portions to the focal length of the respective optics portions.
  • the position and/or orientation of the stop surface 622 may be adapted to position the optics portion at a specific distance (or range of distance) and/or orientation with respect to the respective sensor array.
  • the seat 618 controls the depth at which the lens is positioned (e.g., seated) within the support 320 .
  • one of the optics portions is adapted for blue light or a band of blue light and another one of the optics portions is adapted for red light or a band of red light, however other configurations may also be employed.
  • FIGS. 31A-31D show a support 320 having four support portions 600 A- 600 D each defining an aperture 616 A- 616 D and a seat 618 A- 618 D, respectively, for a respective optics portion, wherein the aperture, e.g., aperture 616 A, of one or more of the support portions, e.g., support portion 600 A, has a diameter 714 A that is less than the diameter 714 C of the aperture 616 of one or more of the other support portions, e.g., support portion 600 C.
  • this embodiment may be employed alone or in combination with one or more of the other embodiments disclosed herein, or portions thereof.
  • the seat defined by one or more of the support portions is at a depth that is different than the depths of the seats of the other support portions so as to adapt such one or more support portions to the focal length of the respective optics portions, as in the embodiment of the support shown in FIGS. 30A-30D .
  • one of the optics portions is adapted for blue light or a band of blue light and another one of the optics portions is adapted for red light or a band of red light, however other configurations may also be employed.
  • FIG. 32 is a schematic cross-sectional view of a digital camera apparatus 300 and a printed circuit board 720 of a digital camera on which the digital camera apparatus 300 may be mounted, in accordance with one embodiment of the present invention.
  • the one or more optics portions e.g., optics portions 330 A- 330 D are seated in and/or affixed to the support 320 .
  • the support 320 is disposed superjacent a first bond layer 722 , which is disposed superjacent an image device, e.g., image device 520 , in or on which the one or more sensor portions, e.g., sensor portions 310 A- 310 D, are disposed and/or integrated.
  • the image device 520 is disposed superjacent a second bond layer 724 which is disposed superjacent the printed circuit board 110 .
  • the printed circuit board includes a major outer surface 730 that defines a mounting region on which the image device is mounted.
  • the major outer surface 730 may further define and one or more additional mounting regions (not shown) on which one or more additional devices used in the digital camera may be mounted.
  • One or more pads 732 are provided on the major outer surface 730 of the printed circuit board to connect to one or more of the devices mounted thereon.
  • the image device 520 includes the one or more sensor arrays, e.g., sensor arrays 310 A- 310 D, and one or more electrically conductive layers. In some embodiments, the image device further includes one, some or all portions of the processor for the digital camera apparatus. The image device 520 further includes a major outer surface 740 that defines a mounting region on which the support 320 is mounted.
  • the one or more electrically conductive layers may be patterned to define one or more pads 742 and one or more traces (not shown) that connect the one or more pads to one or more of the one or more sensor arrays.
  • the pads 742 are disposed, for example, in the vicinity of the perimeter of the image device 520 , for example, along one, two, three or four sides of the image device.
  • the one or more conductive layers may comprise, for example, copper, copper foil, and/or any other suitably conductive material(s).
  • a plurality of electrical conductors 750 may connect one or more of the pads 742 on the image device 520 to one or more of the pads 732 on the circuit board 720 .
  • the conductors 750 may be used, for example, to connect one or more circuits on the image device to one or more circuits on the printed circuit board.
  • the first and second bond layers 722 , 724 may comprise any suitable material(s), for example, but not limited to adhesive, and may comprise any suitable configuration.
  • the first and second bond layers 722 , 724 may comprise the same material(s) although this is not required.
  • a bond layer may be continuous or discontinuous.
  • a conductive layer may be an etched printed circuit layer.
  • a bond layer may or may not be planar or even substantially planar.
  • a conformal bond layer on a non-planar surface will be non-planar.
  • a plurality of optics portions e.g., optics portions 330 A- 330 D are seated in and/or affixed to the support.
  • the digital camera apparatus 300 has dimensions of about 2.5 mm ⁇ 6 mm ⁇ 6 mm.
  • the thickness may be equal to about 2.5 mm
  • the length may be equal to about 6 mm
  • the width may be equal to about 6 mm.
  • the digital camera apparatus has one or more sensor arrays having a total of 1.3 M pixels, although other configurations may be employed (e.g., different thickness, width, length and number of pixels).
  • one or more of the circuits on the image device 520 may communicate with one or more devices through one or more wireless communication links.
  • the image device 520 may define one or more circuits for use in such wireless communication link and/or one or more mounting regions for one or more discrete devices employed in such wireless communication link(s).
  • FIGS. 33A-33F shows one embodiment for assembling and mounting the digital camera apparatus.
  • the image device 520 is provided.
  • a first bond layer 722 is provided on one or more regions of one or more surfaces of the image device 520 . Such regions define one or more mounting regions for the support.
  • the support 520 is thereafter positioned on the bond layer 722 .
  • force may be applied to help drive any trapped air out from between the image device and support.
  • heat and/or force may be applied to provide conditions to activate and/or cure the bond layer to form a bond between the image device 520 and the support 320 .
  • one or more optics portions e.g., optics portions 330 A- 330 D may thereafter be seated in and/or affixed to the support 320 .
  • a bond layer 724 is provided on one or more regions of one or more surfaces of the printed circuit board 720 . Such regions define one or more mounting regions for the digital camera apparatus 300 .
  • the digital camera apparatus 300 is thereafter positioned on the bond layer 724 .
  • One or more electrical conductors 750 may be installed to connect one or more of pads 742 on the image device to one or more pads on circuit board 732 .
  • the electrical interconnect between component layers may be formed by lithography and metallization, bump bonding or other methods.
  • Organic or inorganic bonding methods can be used to join the component layers.
  • the layered assembly process may start with a “host” wafer with electronics used for the entire camera and/or each camera channel. Then another wafer or individual chips are aligned and bonded to the host wafer. The transferred wafers or chips can have bumps to make electrical interconnect or connects can be made after bonding and thinning. The support substrate from the second wafer or individual chips is removed, leaving only a few microns material thickness attached to the host wafer containing the transferred electronics. Electrical interconnects are then made (if needed) between the host and the bonded wafer or die using standard integrated circuit processes. The process can be repeated multiple times.
  • FIGS. 33G-33K are schematic views of a digital camera apparatus, mechanical mountings and electrical connections employed in accordance with further embodiments of the present invention. More particularly, FIG. 33G is a schematic perspective view of the digital camera apparatus 300 . FIG. 33H is a schematic elevational view of the digital camera 300 mounted to a major lower surface of a printed circuit board 720 . One or more electrical conductors 750 are used to connect pads 732 on the printed circuit 720 to pads on the major outer surface of the image device 520 .
  • FIG. 33H is a schematic elevational view of the digital camera 300 mounted to a major lower surface of a printed circuit board 720 .
  • the support 320 is disposed in a through hole defined by the printed circuit board.
  • One or more electrical conductors 750 connect pads 732 on the printed circuit 720 to pads on the major outer lower of the image device 520 .
  • FIG. 33I is a schematic elevational view of the digital camera 300 mounted to a major lower surface of a printed circuit board 720 .
  • the support 320 is disposed in a through hole defined by the printed circuit board.
  • a bump bond 752 connects one or more of the pads 742 on the surface 740 of the image device 520 to pads 732 on the major lower surface of the printed circuit board 720 .
  • FIG. 33J is a schematic elevational view of the digital camera 300 mounted to a major upper surface of a printed circuit board 720 .
  • One or more electrical conductors 750 connect pads 732 on the printed circuit 720 to pads 742 on the major outer surface 740 of image device 520 .
  • FIG. 33I is a schematic elevational view of the digital camera 300 mounted to a major lower surface of a printed circuit board 720 .
  • the support 320 is disposed in a through hole defined by the printed circuit board.
  • a bump bond 752 connects one or more pads on a major lower surface of the image device 520 to pads on the major upper surface of the printed circuit board 720 .
  • the manufacture of the optical stacks, and image sensors are done on a single wafer, fabricated on separate wafers (perhaps up to two wafers: one for the IC, and one for optics) and bonded together at the wafer level. It is also possible to use pick and place methods and apparatus to attach the optical assemblies to the wafer IC, or the image sensor die and other assemblies can be assembled individually.
  • manufacture of the optical stacks, MEMs and image sensors may be done on a single wafer, fabricated on separate wafers (perhaps up to three wafers: one for the IC, one for MEMs and one for optics) and bonded together at the wafer level. It is also possible to use pick and place methods and apparatus to attach the optical assemblies and MEMs to the wafer IC, or the image sensor die and other assemblies (MEMs and optical stack) can be assembled individually.
  • FIG. 34 is a schematic cross section view of a support that may be employed to support one or more lenses having three lens elements, e.g., lenses 410 , 430 ( FIGS. 11A-11B , 13 A- 13 B), and to position such lenses in registration with a respective sensor array, at least in part, in accordance with another embodiment of the present invention.
  • the support 320 defines one or more support portions, e.g., four support portions 600 A- 600 D, each of which supports and/or helps position a respective one of the one or more optics portions.
  • the support may also help to limit, minimize and/or eliminate light “cross talk” between the camera channels and/or may also help to limit, minimize and/or eliminate “entry” of light from outside the digital camera apparatus.
  • Each of the support portions 600 A- 600 D defines an aperture 616 and a plurality of seats 618 - 1 to 618 - 3 . More particularly, support portion 600 A defines an aperture 616 A and seats 618 - 1 A to 618 - 3 C. Support portion 600 B defines an aperture 616 B and seats 618 - 1 B to 618 - 3 B. Support portion 600 C defines an aperture 616 C and seats 618 - 1 C to 618 - 3 C. Support portion 600 D defines an aperture 616 D and seats 618 - 1 D to 618 - 3 D. Referring for example, to support portion 600 A, the aperture 616 A defines a passage for the transmission of light for the respective camera channel.
  • Each of the plurality of seats 618 - 1 A to 618 - 3 A is adapted to receive a respective one of the lenslets of the respective optics portion (or portion thereof) and to support and/or position the respective lenslet, at least in part.
  • each of the seats 618 - 1 A to 618 - 3 A may include one or more surfaces (e.g., surfaces 620 - 1 A to 620 - 3 A, respectively, and surfaces 622 - 1 A to 622 - 3 A, respectively) adapted to abut one or more surfaces of the respective lenslet to support and/or position the lenslet, at least in part, relative to the support portion and/or one or more of the sensor arrays 310 A- 310 D.
  • each of the surfaces 620 - 1 A to 620 - 3 A is disposed about the perimeter of the respective lenslet to support and help position such lenslet in the x direction and the y direction).
  • Each of the surfaces 622 - 1 A to 622 - 3 A (sometimes referred to herein as “stop” surface) positions or helps position the respective lenslet in the z direction.
  • the positions and/or orientations of the stop surfaces 622 - 1 A to 622 - 3 A may be adapted to position the respective lenslet at a specific distance (or range of distance) and/or orientation with respect to the respective sensor array.
  • the seats 618 - 1 A to 618 - 3 A control the depth at which each of the lenslets is positioned (e.g., seated) within the support.
  • the depth may be different for each lenslet and is based, at least in part, on the focal length of the lens. For example, if a camera channel is dedicated to a specific color (or band of colors), the lens or lenses for that camera channel may have a focal length specifically adapted to the color (or band of colors) to which the camera channel is dedicated. If each camera channels is dedicated to a different color (or band of colors) than the other camera channels, then each of the lenses may have a different focal length, for example, to tailor the lens to the respective sensor array, and each of the seats have a different depth.
  • each of the support portions includes an elongated portion adapted to help position the respective optics portions at a desired distance from the respective sensor arrays.
  • the elongated portions extend in an axial direction and define walls 760 , which in turn define the lower portions of apertures, respectively, which help limit, minimize and/or eliminate light “cross talk” between the camera channels and help limit, minimize and/or eliminate “entry” of light from outside the digital camera apparatus.
  • the a spacer is provided, separately fabricated from the support portions and adapted to be disposed between the support portions and the one or more sensor arrays to help position the one or more optics portions at a desired distance from the one or more sensor arrays.
  • the spacer and support collectively define one or more passages for transmission of light, help to limit, minimize and/or eliminate light “cross talk” between the camera channels and/or help to limit, minimize and/or eliminate “entry” of light from outside the digital camera apparatus.
  • the support 320 may comprise any type of material(s) and may have any configuration and/or construction.
  • the support 320 comprises silicon, semiconductor, glass, ceramic, plastic, or metallic materials and/or a combination thereof. If the support 320 has more than one portion, such portions may be fabricated separate from one another, integral with one another and/or any combination thereof. If the support defines more than one support portion, each of such support portions, e.g., support portions 600 A- 600 D, may be coupled to one, some or all of the other support portions, as shown, or completely isolated from the other support portions.
  • the support 320 may be a solid device that may offer a wide range of options for manufacturing and material, however other forms of devices may also be employed.
  • the support 320 comprises a plate (e.g., a thin plate) that defines the support and one or more support portions, with the apertures and seats being formed by machining (e.g., boring) or any other suitable manner.
  • the support 320 is fabricated as a casting with the apertures defined therein (e.g., using a mold with projections that define the apertures and seats of the one or more support portions).
  • Each optics portion e.g., optics portions 330 A- 330 D, may be secured in the respective seats in any suitable manner, for example, but not limited to, mechanically (e.g., press fit, physical stops), chemically (e.g., adhesive), electronically (e.g., electronic bonding) and/or any combination thereof.
  • each of the seats 618 - 1 A to 618 C- 3 A has dimensions adapted to provide a press fit for the respective lenslets.
  • the lenslets of the optics portions may be assembled into the support in any suitable manner.
  • FIGS. 35A-35C show one embodiment for assembling the lenslets of the optics portions in the support.
  • the support 320 is turned upside down and the bottom lenslets 410 C, 430 C of each lens 410 , 430 , respectively, is inserted into the bottom of a respective aperture, seated in a respective seat 618 - 3 and affixed thereto, if desired.
  • the support 320 is thereafter turned right side up and the middle lenslet 410 B, 430 B, of each lens 410 , 430 , respectively, is inserted into the top of the respective aperture, seated in a respective seat 618 - 2 and affixed thereto, if desired.
  • the top lenslet 410 A, 430 A, of each lens 410 , 430 , respectively, is inserted into the top of the respective aperture, seated in a respective seat 618 - 1 and affixed thereto, if desired.
  • the top lenslet and the middle lenslet are built into one assembly, and inserted together.
  • the bottom lenslet may be advantageous to insert the bottom lenslet through a bottom portion of the aperture because the stop surface for the bottom lenslet faces toward the bottom of the aperture.
  • the top lenslet and the middle lenslet may be advantageous to insert the top lenslet and the middle lenslet through a top portion of the aperture because the stop surface for the top lenslet and the stop surface for the middle lenslet each face toward the top portion of the aperture.
  • the stop surface for the middle lenslet may face toward the bottom portion of the aperture, such that the middle lenslet may be inserted into the support portion through the bottom portion of the aperture, e.g., prior to inserting the bottom lenslet into the support.
  • each of the stop surfaces may face in one direction, such that all of the lenslets are inserted through the same portion of the aperture.
  • the lens and support are manufactured as a single molded component.
  • the lens may be manufactured with tabs that may be used to form the support.
  • the support 320 is coupled and/or affixed directly or indirectly, to the image device.
  • the support 320 may be directly coupled and affixed to the image device (e.g., using adhesive) or indirectly coupled and/or or affixed to the image device via an intermediate support member (not shown).
  • the x and y dimensions of the support 320 may be, for example, approximately the same (in one or more dimensions) as the image device, approximately the same (in one or more dimensions) as the arrangement of the optics portions 330 A- 330 D and/or approximately the same (in one or more dimensions) as the arrangement of the sensor arrays 310 A- 310 D.
  • One advantage of such dimensioning is that it helps keep the x and y dimensions of the digital camera apparatus as small as possible.
  • the support may have dimensions similar to one or more of the dimensions of the embodiment of the support shown in FIGS. 28A-28D .
  • FIG. 36 is a schematic cross-sectional view of a digital camera apparatus 300 and a printed circuit board 720 of a digital camera on which the digital camera apparatus 300 may be mounted, in accordance with another embodiment of the present invention.
  • This embodiment is similar to the embodiment of the digital camera apparatus and printed circuit board shown in FIG. 32 except that this embodiment employs the support 320 and lens elements 410 , 430 shown in FIGS. 35A-35C .
  • the digital camera apparatus 300 has dimensions of about 2.5 mm ⁇ 6 mm ⁇ 6 mm.
  • the thickness may be equal to about 2.5 mm
  • the length may be equal to about 6 mm
  • the width may be equal to about 6 mm.
  • the digital camera apparatus has one or more sensor arrays having a total of 1.3 M pixels, although other configurations may be employed (e.g., different thickness, width, length and number of pixels).
  • the digital camera apparatus 300 may be assembled and mounted to the printed circuit board in any manner.
  • the digital camera apparatus is assembled and mounted to the printed circuit board 720 in a manner that is similar to that set forth above for the embodiment of the digital camera apparatus 300 and printed circuit board shown 720 in FIGS. 33A-33F , except that the bottom lenslets 410 C, 430 C, may be seated in and affixed to the support, if desired, prior to positioning the support on the second bond layer.
  • the middle and top lenslets of the lenses, respectively may be seated in and affixed to the support, if desired, after the support is positioned on the second bond layer 724 .
  • FIG. 37 is a schematic cross section view of an alternative support 320 that may be employed to support the lenses 410 , 430 of FIGS. 11A-11B , 13 A- 13 B and to position such lenses in registration with a respective sensor array, at least in part, in accordance with another embodiment of the present invention.
  • the support 320 in this embodiment is similar to the embodiment of the support 320 shown in FIG. 34 except that the support 320 in this embodiment defines outer walls 760 A- 760 D that are wider than outer walls 760 A- 760 D defined by the embodiment of the support shown in FIG. 34 .
  • Each optics portion e.g., optics portions 330 A- 330 S, may be assembled in and secured in the respective seats in any suitable manner, for example, but not limited to, in the manner set forth above with respect to the embodiment of the support and optics portions shown in FIGS. 35A-35C .
  • FIG. 38 is a schematic cross section view of an alternative support 320 that may be employed to support the lenses 410 , 430 of FIGS. 11A-11B , 13 A- 13 B and to position such lenses in registration with a respective sensor array, at least in part, in accordance with another embodiment of the present invention.
  • the support 320 in this embodiment is similar to the embodiment of the support 320 shown in FIG. 34 except that the support 320 in this embodiment defines outer and inner walls 760 A- 760 D that are wider than outer and inner walls 760 A- 760 D defined by the embodiment of the support 320 shown in FIG. 34 .
  • Each optics portion may be assembled in and secured in the respective seats in any suitable manner, for example, but not limited to, in the manner set forth above with respect to the embodiment of the support and optics portions shown in FIGS. 35A-35C .
  • FIG. 39 is a schematic cross-sectional view of a digital camera apparatus 300 and a printed circuit board 720 of a digital camera on which the digital camera apparatus 300 may be mounted, in accordance with another embodiment of the present invention.
  • This embodiment is similar to the embodiment of the digital camera apparatus 300 and printed circuit board 720 shown in FIG. 36 except that this embodiment employs the support 320 and lens elements 410 , 430 shown in FIG. 37 .
  • the digital camera apparatus may be assembled and mounted to the printed circuit board in any manner.
  • the digital camera apparatus is assembled and mounted to the printed circuit board in a manner that is similar to that set forth for the embodiment of the digital camera apparatus and printed circuit board shown in FIG. 36 .
  • FIG. 40 is a schematic cross-sectional view of a digital camera apparatus 300 and a printed circuit board 720 of a digital camera on which the digital camera apparatus 300 may be mounted, in accordance with another embodiment of the present invention.
  • This embodiment is similar to the embodiment of the digital camera apparatus 300 and printed circuit board shown in FIG. 36 except that this embodiment employs the support 320 and lens elements 410 , 430 shown in FIG. 38 .
  • the digital camera apparatus 300 may be assembled and mounted to the printed circuit board 720 in any manner.
  • the digital camera apparatus 300 is assembled and mounted to the printed circuit board 720 in a manner that is similar to that set forth for the embodiment of the digital camera apparatus 300 and printed circuit board 720 shown in FIG. 36 .
  • FIGS. 41A-41D are schematic cross sectional views of seating configurations 770 - 776 that may be used in supporting and positioning the lenses of FIGS. 15A-15B , 15 D- 15 E, respectively, in accordance with further embodiments.
  • the top lenslet 450 A, middle lenslet 450 B and bottom lenslet 450 C are each inserted through a bottom portion of an aperture (or through a top portion of an aperture) one at a time, as an assembly, or a combination thereof.
  • top lenslet 452 A, middle lenslet 452 B and bottom lenslet 452 C are each inserted through a top portion of an aperture (or through a bottom portion of an aperture), one at a time, as an assembly, or a combination thereof.
  • the top lenslet 456 A may be inserted, for example, through a top portion of an aperture.
  • the middle lenslet 456 B and the bottom lenslet 456 C may be inserted, for example, through a bottom portion of an aperture, one at a time, or alternatively, the middle lenslet and the bottom lenslet may be built into one assembly, and inserted together.
  • the middle lenslet 458 B and the top lenslet 458 A are inserted through a top portion of an aperture, one at a time, or alternatively, the middle lenslet 458 B and the top lenslet 458 A may be built into one assembly, and inserted together.
  • the bottom lenslet 458 C is inserted through a bottom portion of an aperture.
  • FIGS. 42-44 are schematic cross section views of supports 32 that employ the seating configurations of FIGS. 41B-41D , respectively, to support the lens 452 A- 452 C, 456 A- 456 C, 458 A- 458 C, shown in FIGS. 15B-15D , respectively, and to position such lens in registration with a respective sensor array, at least in part, in accordance with further embodiments.
  • FIGS. 42-44 are schematic cross section views of supports that employ the seating configurations of FIGS. 41B-41D , respectively, to support the lens 452 A- 452 C shown in FIGS. 15B-15D , respectively, and to position such lens in registration with a respective sensor array, at least in part, in accordance with further embodiments.
  • FIG. 45 is a schematic cross-sectional view of a digital camera apparatus 300 and a printed circuit board 720 of a digital camera on which the digital camera apparatus 300 may be mounted, in accordance with another embodiment of the present invention.
  • This embodiment is similar to the embodiment of digital camera apparatus 300 and the printed circuit board shown in FIG. 36 except this embodiment employs support 320 and lens elements shown in FIG. 42 .
  • the digital camera apparatus 300 may be assembled and mounted to the printed circuit board in any manner.
  • the digital camera apparatus is assembled 300 and mounted to the printed circuit board 720 in a manner that is similar to that set forth for the embodiment of the digital camera apparatus and printed circuit board shown in FIG. 36 , although it may be advantageous to assemble the lenslets into the support using a manner similar to the manner set forth above for the seating configuration shown in FIG. 41B .
  • FIG. 46 is a schematic cross-sectional view of digital camera apparatus 300 and printed circuit board 720 of a digital camera on which digital camera apparatus 300 may be mounted, in accordance with another embodiment of the present invention.
  • This embodiment is similar to the embodiment of the digital camera apparatus and printed circuit board shown in FIG. 36 except this embodiment employs the support and lens elements shown in FIG. 43 .
  • the digital camera apparatus 300 may be assembled and mounted to the printed circuit board 720 in any manner.
  • the digital camera apparatus 300 is assembled and mounted to the printed circuit board in a manner that is similar to that set forth for the embodiment of the digital camera apparatus and printed circuit board shown in FIG. 36 , although it may be advantageous to assemble the lenslets into the support using a manner similar to the manner set forth above for the seating configuration shown in FIG. 41C .
  • FIG. 47 is a schematic cross-sectional view of a digital camera apparatus 300 and a printed circuit board 720 of a digital camera on which the digital camera apparatus 720 may be mounted, in accordance with another embodiment of the present invention.
  • This embodiment is similar to the embodiment of the digital camera apparatus 300 and printed circuit board 720 shown in FIG. 36 except that this embodiment employs the support and lens elements shown in FIG. 44 .
  • the digital camera apparatus 300 may be assembled and mounted to the printed circuit board 720 in any manner.
  • the digital camera apparatus 300 is assembled and mounted to the printed circuit board 720 in a manner that is similar to that set forth for the embodiment of the digital camera apparatus and printed circuit board shown in FIG. 36 , although it may be advantageous to assemble the lenslets into the support using a manner similar to the manner set forth above for the seating configuration shown in FIG. 41D .
  • the digital camera apparatus 300 includes one or more additional structures and/or devices, for example, but not limited to, one or more additional integrated circuits, one or more output devices and/or one or more input devices.
  • the one or more output devices may include any type or types of output devices, for example, but not limited to one or more display devices, one or more speakers and/or any combination thereof.
  • the one or more input devices may include any type or types of input devices, for example, but not limited to one or more microphones.
  • the additional structures and/or devices may be disposed, in any suitable location, for example, but not limited to, adjacent to the image device.
  • the additional structures and/or devices may comprise any type of material(s) and may have any configuration and/or construction.
  • the additional structures and/or devices may comprise silicon, semiconductor, glass, ceramic, plastic, or metallic materials and/or a combination thereof.
  • the one or more additional structures and/or devices may be fabricated separate from one another, integral with one another and/or any combination thereof.
  • the one or more additional structures and/or devices may be fabricated separate from the camera channels, integral with the camera channels and/or any combination thereof.
  • the one or more additional structures and/or devices may or may not be physically connected to the processor, the one or more camera channels or any portions thereof.
  • the one or more additional structures and/or devices may or may not be electrically connected to the processor and/or one or more camera channels or portions thereof.
  • FIG. 48 is a schematic representation of a digital camera apparatus 300 that includes a second device 780 in accordance with another embodiment of the present invention.
  • the second device 780 may comprise, for example, but is not limited to, an integrated circuit including any type of circuit or circuits, for example, but not limited to, one or more portions of the processor, one or more portions of a memory or an additional memory, one or more portions of the processor (e.g., one or more portions of a post processor) and/or any other types of circuits.
  • the digital camera apparatus 300 includes a memory section that is supplied with and/or stores one, some or all of the images and/or other information generated or used by the digital camera apparatus and/or or any other information from any source and desired to be stored for any duration.
  • the memory section may supply one or more of such images and/or such other information to one or more other devices and/or to one or more portions of the processor, for example, to be further processed and/or to be supplied to one or more other devices.
  • the memory section may be integrated into or disposed on (for example, as a discrete component) the same or different substrate as one some or all of the sensor arrays.
  • the memory section may be, for example, part of or integrated into the processor (which may be integrated into or disposed on (for example, as a discrete component) the same or different substrate as one some or all of the sensor arrays) and/or coupled to one or more portions of the processor via one or more communication links.
  • the memory section is also coupled to one or more other devices via one or more communication links.
  • the memory section may supply one or more of the stored images and/or other information to one or more of the one or more other devices, directly (i.e., without passing through the any other portion of the processor) via one or more of the one or more communication links, although this is not required.
  • the second device 780 may be disposed in any suitable location or locations. However, in some embodiments, the second device 780 is disposed generally adjacent to or in the vicinity of an associated image device, e.g., image device 520 , or associated processor.
  • an associated image device e.g., image device 520 , or associated processor.
  • the circuit or circuits of the second device 780 may be connected, e.g., via one or more communication links, to one or more portions of the processor 340 , one or more of the camera channels, one or more other devices and/or any combination thereof.
  • the one or more communication links include one or more pads on the image device and the second device 780 and one or more electrical connectors having one or more electrically conductive members connecting one or more of the pads on the image device to one or more of the pads on the second device.
  • the one or more communication links include one or more bump bonds that electrically connect one or more circuits on the image device to one or more circuits on the second device.
  • the second device 780 may have any size and shape and may or may not have the same configuration as the image device. In some embodiments, the second device 780 has a length and a width that are less than or equal to the length and width, respectively of the optical assembly, the sensor subassembly and/or the image device. In some other embodiments, the second device 780 has a length or a width that is greater than the length or width, respectively of the optical assembly, the sensor subassembly and/or the image device.
  • the processor is shown separate from the image device and second device, it should be understood that the processor may have any configuration and that the processor, or portions thereof, may be disposed in any location or locations. In some embodiments, one, some or all portions of the processor are disposed on or integrated into the image device. In some embodiments one, some or all portions of the processor are disposed on or integrated into the second device. In some of such embodiments one or more portions of the processor are disposed on the image device and one or more portions of the processor are disposed on or integrated into the second device.
  • certain operations of the processor may be distributed to or performed by circuitry that is integrated in or disposed on the same substrate or substrates as one or more of the one or more of the sensor arrays and certain operations of the processor are distributed to or performed by circuitry that is integrated in or disposed on one or more substrates that are different from (whether such one or more different substrates are physically located within the camera or not) the substrates the one or more of the sensor arrays are integrated in or disposed on.
  • the digital camera apparatus may further include one or more addition integrated circuits devices, e.g., a third integrated circuit device (not shown).
  • the one or more additional integrated circuits device may have any size and shape and may or may not have the same configuration as one another, the image device or the second device.
  • the third integrated circuit device has a length and a width that are equal to the length and width, respectively of the optical assembly, the sensor subassembly and/or the image device.
  • the third integrated circuit device has a length or a width that is greater than or less than the length or width, respectively of the optical subassembly, the sensor subassembly and/or the image device.
  • FIG. 49 is a schematic cross-sectional view of a digital camera apparatus 300 and a printed circuit board 720 of a digital camera on which the digital camera apparatus may be mounted, in accordance with another embodiment of the present invention.
  • This embodiment is similar to the embodiment of the digital camera apparatus and printed circuit board shown in FIG. 36 except that this embodiment includes a second device 780 such as, for example, as shown in FIG. 48 .
  • the second device 780 is disposed superjacent a third bond layer 782 , which is disposed superjacent the printed circuit board.
  • the third bond layer 782 may comprise any suitable material(s), for example, but not limited to adhesive, and may comprise any suitable configuration.
  • the third bond layer 782 may comprise the same material(s) as the first and/or second bond layers 722 , 724 , although this is not required.
  • the digital camera apparatus 300 has dimensions of about 2.5 mm ⁇ 6 mm ⁇ 6 mm.
  • the thickness may be equal to about 2.5 mm
  • the length may be equal to about 6 mm
  • the width may be equal to about 6 mm.
  • the digital camera apparatus has one or more sensor arrays having a total of 1.3 M pixels, although other configurations may be employed (e.g., different thickness, width, length and number of pixels).
  • FIGS. 50A-50F shows one such embodiment for assembling and mounting the digital camera apparatus.
  • the second device is provided.
  • a bond layer 724 is provided on one or more regions of one or more surfaces of the second device. Such regions define one or more mounting regions for the image device.
  • the image device 520 is thereafter positioned on the bond layer 724 .
  • force may be applied to help drive any trapped air out from between the image device 520 and second device 780 .
  • heat and/or force may be applied to provide conditions to activate and/or cure the bond layer to form a bond between the image device and the second device.
  • a bond layer 722 is provided on one or more regions of one or more surfaces of the image device 520 . Such regions define one or more mounting regions for the support 320 .
  • the support 320 is thereafter positioned on the bond layer 722 .
  • force may be applied to help drive any trapped air out from between the image device 520 and support 320 .
  • heat and/or force may be applied to provide conditions to activate and/or cure the bond layer to form a bond between the image device and the support. Referring to FIG.
  • one or more optics portions e.g., optics portions 330 A- 330 D may thereafter be seated in and/or affixed to the support 320 .
  • a bond layer 782 is provided on one or more regions of one or more surfaces of the printed circuit board 720 . Such regions define one or more mounting regions for the digital camera apparatus 300 .
  • the digital camera apparatus is thereafter positioned on the bond layer 782 .
  • One or more electrical conductors 750 may be installed to connect one or more of the pads 742 on the image device 520 to one or more pads on the circuit board 732 .
  • One or more electrical conductors 790 may be installed to connect one or more of the pads on the image device 792 to one or more pads on the second device 794 .
  • FIG. 51 is a schematic representation of an exemplary digital camera apparatus
  • digital camera apparatus 300 includes a spacer 800 disposed between the support 320 and the image device 520 , in accordance with another embodiment of the present invention.
  • the spacer 800 helps position the optics portions, e.g., optics portions 330 A- 330 D, at the respective desired distance or distances from the respective sensor arrays, e.g., 310 A- 310 D, respectively.
  • the spacer 800 extend in an axial direction and defines walls 802 , which define apertures, e.g., apertures 804 - 804 D (e.g., for camera channels 350 A- 350 D, respectively), for transmission of light, to help limit, minimize and/or eliminate light “cross talk” between the camera channels and to help limit, minimize and/or eliminate “entry” of light from outside the digital camera apparatus.
  • apertures 804 - 804 D e.g., for camera channels 350 A- 350 D, respectively
  • the spacer 800 may comprise any type of material(s) and may have any configuration and/or construction.
  • the spacer 800 comprises silicon, semiconductor, glass, ceramic, plastic, or metallic materials and/or a combination thereof. If the spacer has more than one portion, such portions may be fabricated separate from one another, integral with one another and/or any combination thereof.
  • the spacer 800 may be fabricated separately from and/or integral with the support 320 or support portions 600 A- 600 D.
  • the spacer 800 may be a solid device that may offer a wide range of options for manufacturing and material, however other forms of devices may also be employed.
  • the spacer comprises a plate (e.g., a thin plate) that defines the walls and apertures of the spacer.
  • Apertures, e.g. apertures 804 A- 804 D, may be formed by machining (e.g., boring) or any other suitable manner.
  • the spacer is fabricated as a casting with the apertures defined therein (e.g., using a mold with projections that define the apertures and seats of the one or more support portions of the spacer).
  • processor is shown separate from the image device, it should be understood that the processor may have any configuration and that the processor, or portions thereof, may be disposed in any location or locations. In some embodiments, one, some or all portions of the processor are disposed on the image device.
  • this embodiment may be employed alone or in combination with one or more of the other embodiments disclosed herein, or portions thereof.
  • FIG. 52 is a schematic representation of a digital camera apparatus 300 that includes a spacer 800 disposed between the support 320 and the image device 520 , in accordance with another embodiment of the present invention.
  • This embodiment of the spacer 800 is similar to the embodiment of the spacer 500 shown in FIG. 51 except that the spacer 800 in this embodiment defines only one aperture 804 for transmission of light and may not help limit, minimize and/or eliminate light “cross talk” between the camera channels, e.g., camera channels 350 A- 350 D.
  • FIG. 53 is a schematic cross-sectional view of a digital camera apparatus 300 and a printed circuit board 720 of a digital camera on which the digital camera apparatus 300 may be mounted, in accordance with another embodiment of the present invention.
  • This embodiment is similar to the embodiment of the digital camera apparatus and printed circuit board shown in FIG. 36 except that this embodiment includes a spacer 800 such as, for example, as shown in FIG. 51 .
  • the spacer 800 is disposed superjacent a bond layer 782 , which is disposed superjacent the image device 520 .
  • the bond layer 782 may comprise any suitable material(s), for example, but not limited to adhesive, and may comprise any suitable configuration.
  • the bond layer may comprise the same material(s) as other bond layers although this is not required.
  • the digital camera apparatus has dimensions of about 2.5 mm ⁇ 6 mm ⁇ 6 mm.
  • the thickness may be equal to about 2.5 mm
  • the length may be equal to about 6 mm
  • the width may be equal to about 6 mm.
  • the digital camera apparatus has one or more sensor arrays having a total of 1.3 M pixels, although other configurations may be employed (e.g., different thickness, width, length and number of pixels).
  • FIGS. 54A-54F shows one such embodiment for assembling and mounting the digital camera apparatus 300 .
  • the image device 520 is provided.
  • a bond layer 782 is provided on one or more regions of one or more surfaces of the image device. Such regions define one or more mounting regions for the spacer 800 .
  • the spacer 800 is thereafter positioned on the bond layer 782 . In some embodiments, force may be applied to help drive any trapped air out from between the spacer 800 and the image device 520 .
  • heat and/or force may be applied to provide conditions to activate and/or cure the bond layer to form a bond between the spacer and the image device.
  • a bond layer 722 is provided on one or more regions of one or more surfaces of the spacer 800 . Such regions define one or more mounting regions for the one or more support portions of the support 320 , which is thereafter positioned on the bond layer 722 .
  • force may be applied to help drive any trapped air out from between the spacer 800 and the one or more support portions of the support 320 .
  • heat and/or force may be applied to provide conditions to activate and/or cure the bond layer to form a bond between the spacer and the one or more support portions of the support.
  • one or more optics portions e.g., optics portions 330 A- 330 D may thereafter be seated in and/or affixed to the support 320 .
  • a bond layer 724 is provided on one or more regions of one or more surfaces of the printed circuit board 720 . Such regions define one or more mounting regions for the digital camera apparatus 300 .
  • the digital camera apparatus is thereafter positioned on the bond layer 724 .
  • One or more electrical conductors 750 may be installed to connect one or more of the pads 742 on the image device to one or more pads 732 on the circuit board.
  • this embodiment may be employed alone or in combination with one or more of the other embodiments disclosed herein, or portions thereof.
  • FIG. 55 is a schematic representation of a digital camera apparatus 300 that includes a second device and a spacer 800 , in accordance with another embodiment of the present invention.
  • the processor is shown separate from the image device and second device, it should be understood that the processor 340 may have any configuration and that the processor, or portions thereof, may be disposed in any location or locations. In some embodiments, one, some or all portions of the processor are disposed on the image device. In some embodiments one, some or all portions of the processor are disposed on the second device. In some of such embodiments one or more portions of the processor are disposed on the image device and one or more portions of the processor are disposed on the second device.
  • FIG. 56 is a schematic cross-sectional view of a digital camera apparatus 300 and a printed circuit board 720 of a digital camera on which the digital camera apparatus may be mounted, in accordance with another embodiment of the present invention.
  • This embodiment is similar to the embodiment of the digital camera apparatus and printed circuit board shown in FIG. 53 except that this embodiment includes a second device 780 .
  • the second device 800 is disposed superjacent a bond layer 808 , which is disposed superjacent printed circuit board 720 .
  • the bond layer 808 may comprise any suitable material(s), for example, but not limited to adhesive, and may comprise any suitable configuration.
  • the bond layer may comprise the same material(s) as other bond layers although this is not required.
  • the digital camera apparatus has dimensions of about 2.5 mm ⁇ 6 mm ⁇ 6 mm.
  • the thickness may be equal to about 2.5 mm
  • the length may be equal to about 6 mm
  • the width may be equal to about 6 mm.
  • the digital camera apparatus has one or more sensor arrays having a total of 1.3 M pixels, although other configurations may be employed (e.g., different thickness, width, length and number of pixels).
  • FIGS. 57A-57F shows one such embodiment for assembling and mounting the digital camera apparatus.
  • the second device 780 is provided.
  • a bond layer 724 is provided on one or more regions of one or more surfaces of the second device 780 . Such regions define one or more mounting regions for the image device 520 .
  • the image device is thereafter positioned on the bond layer 724 .
  • force may be applied to help drive any trapped air out from between the image device and second device 780 .
  • heat and/or force may be applied to provide conditions to activate and/or cure the bond layer to form a bond between the image device and the second device 780 .
  • a bond layer 782 is provided on one or more regions of one or more surfaces of the image device. Such regions define one or more mounting regions for the spacer 800 .
  • the spacer 800 is thereafter positioned on the bond layer 782 .
  • force may be applied to help drive any trapped air out from between the spacer and the image device.
  • heat and/or force may be applied to provide conditions to activate and/or cure the bond layer to form a bond between the spacer and the image device. Referring to FIGS.
  • a bond layer 722 is provided on one or more regions of one or more surfaces of the spacer 800 . Such regions define one or more mounting regions for the one or more support portions of the support 320 , which is thereafter positioned on the bond layer 722 .
  • force may be applied to help drive any trapped air out from between the spacer and the one or more support portions of the support 320 .
  • heat and/or force may be applied to provide conditions to activate and/or cure the bond layer to form a bond between the spacer 800 and the one or more support portions of the support 320 .
  • One or more optics portions, e.g., optics portions 330 A- 330 D may thereafter be seated in and/or affixed to the support.
  • a bond layer 808 is provided on one or more regions of one or more surfaces of the printed circuit board 720 . Such regions define one or more mounting regions for the digital camera apparatus 300 .
  • the digital camera apparatus is thereafter positioned on the bond layer 782 .
  • One or more electrical conductors 750 may be installed to connect one or more of the pads 742 on the image device to one or more pads on the circuit board 732 .
  • One or more electrical conductors 790 may be installed to connect one or more of the pads 742 on the image device to one or more pads on the second device 780 .
  • each of the embodiments disclosed herein may be employed alone or in combination with one or more of the other embodiments disclosed herein, or portions thereof.
  • one or more of the supports shown in FIGS. 37-38 and 42 - 44 are employed in one or more of the embodiments of the digital camera apparatus shown in FIGS. 48-57 .
  • FIGS. 58-62 are schematic cross-sectional views of a digital camera apparatus and a printed circuit board of a digital camera on which the digital camera apparatus may be mounted, in accordance with further embodiments of the present invention. These embodiments are similar to the embodiment of the digital camera apparatus and printed circuit board shown in FIG. 49 except that the support and the optics portions have configurations similar to the support and optics portions shown in FIGS. 37-38 , 42 - 44 , respectively.
  • FIGS. 63-67 are schematic cross-sectional views of a digital camera apparatus and a printed circuit board of a digital camera on which the digital camera apparatus may be mounted, in accordance with further embodiments of the present invention. These embodiments are similar to the embodiment of the digital camera apparatus and printed circuit board shown in FIG. 53 except that the support and the optics portions have configurations similar to the support and optics portions shown in FIGS. 37-38 , 42 - 44 , respectively.
  • one or more electrical or electro mechanical devices are disposed in or on a support and/or spacer.
  • one or more electrical conductors may connect one or more of such devices to one or more circuits on the image device and/or another device, for example, to provide power, control signals and/or data signals to and/or from one or more of such device.
  • One or more of such electrical conductors may be in the form of an electrical connector, although this is not required.
  • the electrical conductors may be disposed on one or more outside surface and/or may extend through one or more portion of one or more portions of the digital camera apparatus, e.g., a support, a spacer, an image device, if present, or combinations thereof.
  • one or more electrical conductors e.g., conductors 810 , 812 ( FIGS. 63-72 ) are provided and extend over one or more surfaces of, or through one or more portions of, a support (e.g., over or through one or more support portions, e.g., 600 A- 600 D) and/or spacer (e.g., over or through one or more walls, e.g., walls 602 ) so as to connect to one or more circuits on or in the image device or another device.
  • a support e.g., over or through one or more support portions, e.g., 600 A- 600 D
  • spacer e.g., over or through one or more walls, e.g., walls 602
  • FIGS. 68-72 are schematic cross-sectional views of a digital camera subsystem and a printed circuit board of a digital camera on which the digital camera apparatus may be mounted, in accordance with further embodiments of the present invention. These embodiments are similar to the embodiment of the digital camera apparatus and printed circuit board shown in FIG. 56 except that the support and the optics portions have configurations similar to the support and optics portions shown in FIGS. 37-38 , 42 - 44 , respectively.
  • FIGS. 73A-73B are schematic elevational and cross sectional views, respectively, of a support in accordance with another embodiment of the present invention.
  • one or more of the support portions are spaced apart from one another and/or isolated from one another, e.g., by on or more clearances or spaces, e.g., clearance 816 .
  • FIG. 74 is a schematic cross sectional view of a support in accordance with another embodiment of the present invention.
  • the support includes one or more support portions disposed superjacent (e.g., on or above) one or more other support portions.
  • the support portions may be spaced apart from one another and/or isolated from one another in the z direction, e.g., by clearances or spaces, e.g., clearance 816 .
  • the support is adapted to receive one or more optics portions of a first size and shape and one or more optics portions of a second size and shape that is different than the first size and/or first shape.
  • optics portions of further sizes and shapes may also be received, e.g., a third size and shape, a fourth size and shape, a fifth size and shape, etc.
  • one or more of the supports disclosed herein is provided with one or more curved portions, e.g., curved portions 818 A- 818 D.
  • Such aspect may be advantageous, for example, in some embodiments in which it is desired to reduce and/or minimize the dimensions of the digital camera apparatus.
  • FIGS. 76A-76C are schematic views of a digital camera apparatus that includes one or more output devices 820 in accordance with another embodiment of the present invention.
  • FIG. 76A is a schematic perspective view of one embodiment of a digital camera apparatus that includes one or more output devices.
  • FIGS. 76B-76C are schematic front and back perspective views, respectively, of an output device 820 in accordance with one embodiment of the present invention.
  • the one or more output devices 820 are in the form of one or more display devices, however, other types of output devices may also be employed. In some embodiments, the one or more display devices are in the form of one or more micro displays.
  • the one or more display devices may be disposed in any suitable location or locations. In some embodiments, it may be advantageous to collect light (for the one or more camera channels) on one side of the digital camera assembly and to provide one or more of the one or more output displays, e.g., output display 820 , on the other side of the digital camera assembly.
  • the digital camera apparatus has first and second sides generally opposite one another.
  • the one or more camera channels are positioned to receive light through a first side of the digital camera apparatus.
  • One or more of the display devices are positioned to transmit light (e.g., one or more display images) from the second side of the digital camera apparatus.
  • such a configuration may make it possible to provide a digital camera apparatus that is very thin (e.g., in the z direction).
  • Other configurations may also be employed.
  • one or more of the display devices is positioned generally adjacent to the image device, although this is not required.
  • the one or more display devices may be connected to the processor, one or more of the camera channels or any combination thereof, via one or more communication links.
  • the one or more communication links include one or more pads on the image device and the one or more display devices and one or more electrical connectors having one or more electrically conductive members connecting one or more of the pads on the image device to one or more of the pads on the one or more display devices.
  • the one or more communication links include one or more bump bonds that electrically connect one or more circuits on the image device to one or more circuits on the one or more display devices.
  • the one or more display devices may have any size and shape and may or may not have the same configuration as one another (e.g., type, size, shape, resolution).
  • one or more of the one or more display devices has a length and a width that are less than or equal to the length and width, respectively of the optical assembly, the sensor subassembly and/or the image device.
  • one or more of the one or more display devices has a length or a width that is greater than the length or width, respectively of the optical assembly, the sensor subassembly and/or the image device.
  • each of the camera channels is connected to its own display device.
  • two or more camera channels e.g., camera channels 350 A- 350 B
  • one or more of the other camera channels e.g., camera channel 350 C- 350 D
  • one of the one or more displays is connected to the processor to display a combined image based at least in part on images from each of the camera channels.
  • the digital camera apparatus 300 further include a spacer 800 (see for example, FIG. 76D ) and/or one or more electrical conductors 822 to connect one or more circuits of the one or more output devices, e.g., output device 820 , to one or more circuits in one or more other portions of the subsystem 300 , one or more circuits of a processor 340 that may be disposed on the image device 520 (see for example, FIG. 76E ).
  • a spacer 800 see for example, FIG. 76D
  • one or more electrical conductors 822 to connect one or more circuits of the one or more output devices, e.g., output device 820 , to one or more circuits in one or more other portions of the subsystem 300 , one or more circuits of a processor 340 that may be disposed on the image device 520 (see for example, FIG. 76E ).
  • the digital camera apparatus may further include one or more illumination devices and/or a support having one or more actuators (such a support may comprise, for example, a frame having one or more actuators) (e.g., MEMS actuators, for example, comb type MEMS actuators) to move one or more of the optics portions of the camera channels.
  • the digital camera apparatus includes one or more illumination devices and/or a support having one or more actuators (such a support may comprise, for example, a frame having one or more actuators) (e.g., MEMS actuators).
  • FIGS. 77A-77C are schematic views of a digital camera apparatus that includes one or more input devices 830 in accordance with another embodiment of the present invention. More particularly, FIG. 77A is a schematic perspective view of one embodiment of a digital camera apparatus that includes one or more input devices. FIGS. 77B-77C are enlarged schematic front and back perspective views, respectively, of an input device in accordance with one embodiment of the present invention.
  • the one or more input devices are in the form of one or more audio input devices, e.g., one or more microphones, however, other types of input devices may also be employed.
  • the one or more microphones are in the form of one or more silicon microphones.
  • the one or more audio input devices may be disposed in any suitable location or locations. In some embodiments, it may be advantageous to collect light (for the one or more camera channels) on one side of the digital camera assembly and to collect sound from the same side of the digital camera subassembly.
  • the digital camera apparatus has first and second sides generally opposite one another. The one or more camera channels are positioned to receive light through a first side of the digital camera apparatus.
  • One or more of the audio input devices may be positioned to receive audio input (e.g., sound) from the first side of the digital camera apparatus. In some embodiments, such a configuration may make it possible to provide a digital camera apparatus that is very thin (e.g., in the z direction). Other configurations may also be employed.
  • one or more of the audio input devices is disposed on and/or integral with one or more portions of the support, although this is not required.
  • the one or more audio input devices may be connected to the processor via one or more communication links.
  • the one or more communication links include one or more pads on the image device and the one or more audio input devices and one or more electrical connectors having one or more electrically conductive members connecting one or more of the pads on the image device to one or more of the pads on the audio input devices.
  • the one or more communication links include one or more bump bonds that electrically connect one or more circuits on the image device to one or more circuits on the one or more audio input devices.
  • the one or more audio input devices may have any size and shape and may or may not have the same configuration as one another (e.g., type, size, shape, resolution). In some embodiments, one or more of the one or more audio input devices has a length and a width that are less than or equal to the length and width, respectively of the optical assembly, the sensor subassembly and/or the image device. In some embodiments, one or more of the one or more audio input devices has a length or a width that is greater than the length or width, respectively of the optical assembly, the sensor subassembly and/or the image device.
  • FIGS. 77G-77L are schematic perspective view of digital camera apparatus in accordance with further embodiments.
  • Such embodiments have input devices with configurations and/or in arrangements that are different than the configuration and/or arrangement of the input device shown in FIG. 77A .
  • Other configurations and/or arrangements may also be employed.
  • this embodiment of the present invention may be employed alone or in combination with one or more of the other embodiments disclosed herein, or portion thereof.
  • the digital camera apparatus 300 further include a spacer 800 , one or more electrical conductors 822 to connect one or more circuits of the one or more input devices, e.g., input device 830 , to one or more circuits in one or more other portions of the subsystem 300 , one or more circuits of a processor 340 that may be disposed on the image device 520 and/or one or more additional devices, e.g., one or more output devices 820 .
  • a spacer 800 one or more electrical conductors 822 to connect one or more circuits of the one or more input devices, e.g., input device 830 , to one or more circuits in one or more other portions of the subsystem 300 , one or more circuits of a processor 340 that may be disposed on the image device 520 and/or one or more additional devices, e.g., one or more output devices 820 .
  • FIG. 77D is a schematic perspective view of one embodiment of a digital camera apparatus that includes an input device and a spacer 800 .
  • FIG. 77E is a schematic perspective view of one embodiment of a digital camera apparatus 300 that includes spacer 800 and one or more additional devices, e.g., one or more output devices 820 .
  • the image device is shown with one or more pads connected to one or more circuits disposed on or in the image device.
  • FIG. 77F is a schematic perspective view of one embodiment of a digital camera apparatus that includes an input device, a spacer and an additional device (e.g., a display and/or a second integrated circuit device adjacent to the image device).
  • the image device is shown with one or more pads connected to one or more circuits disposed on or in the image device.
  • the digital camera apparatus may further include a support having one or more actuators (such a support may comprise, for example, a frame having one or more actuators) (e.g., MEMS actuators, for example, comb type MEMS actuators) to move one or more of the optics portions of the camera channels, one or more display devices and/or one or more illumination devices (e.g., one or more light emitting diodes (LEDs) with high output intensity.
  • actuators such as a support may comprise, for example, a frame having one or more actuators
  • MEMS actuators e.g., MEMS actuators, for example, comb type MEMS actuators
  • illumination devices e.g., one or more light emitting diodes (LEDs) with high output intensity.
  • LEDs light emitting diodes
  • the digital camera apparatus includes one or more audio input devices, a support having one or more actuators (such a support may comprise, for example, a frame having one or more actuators) (e.g., MEMS actuators, for example, comb type MEMS actuators) to move one or more of the optics portions of the camera channels, one or more display devices and one or more illumination devices.
  • a support having one or more actuators such a support may comprise, for example, a frame having one or more actuators) (e.g., MEMS actuators, for example, comb type MEMS actuators) to move one or more of the optics portions of the camera channels, one or more display devices and one or more illumination devices.
  • Figure is a schematic representation of a digital camera apparatus that includes one or more audio input devices, one or more display devices and one or more illumination devices.
  • the digital camera apparatus may be assembled and/or mounted in any manner, for example, but not limited to in a manner similar to that employed in one or more of the embodiments disclosed herein.
  • any of the embodiments of the present invention may include one or more illumination units to improve and/or enhance image acquisition by the one or more camera channels (and, in particular, the one or more sensor arrays), facilitate range detection to an object, shape detection of an object, and covert imaging (i.e., imaging that is not observable to the human eye).
  • FIGS. 78A-78B are schematic block diagrams of digital camera apparatus having one or more illumination units, e.g., illumination units 840 , in accordance with further embodiments of the present invention.
  • the illumination units may provide passive (for example, no illumination), active (for example, constant illumination), constant and/or gated active illumination (for example, pulsed illumination that is predetermined, preset or processor controlled, and/or pulsed illumination that is user/operator programmable).
  • the one or more illumination units may be disposed on or integrated in the support frame and/or the substrate of the sensor arrays. Indeed, the one or more illumination units may be disposed on or integrated in any element or component of the one or more of the camera channels.
  • FIGS. 78C-78P are schematic views of a digital camera apparatus that includes one or more output devices in accordance with another embodiment of the present invention. More particularly, FIG. 78C is a schematic perspective view of one embodiment of a digital camera apparatus that includes one or more output devices.
  • the one or more output devices are in the form of one or more illumination devices, e.g., one or more illumination devices 850 , however, other types of output devices may also be employed.
  • FIGS. 78C-78D are enlarged schematic front and back perspective views, respectively, of an illumination device 850 in accordance with one embodiment of the present invention.
  • the one or more illumination devices are in the form of one or more LED's (e.g., one or more high power LED's).
  • the one or more illumination devices may be disposed in any suitable location or locations. In some embodiments, it may be advantageous to collect light (for the one or more camera channels) on one side of the digital camera assembly and to provide illumination from the same side of the digital camera subassembly.
  • the digital camera apparatus has first and second sides generally opposite one another.
  • the one or more camera channels are positioned to receive light through a first side of the digital camera apparatus.
  • One or more of the illumination devices may be positioned to illuminate (e.g., supply light) from the same side of the digital camera apparatus. In some embodiments, such a configuration may help make it possible to provide a digital camera apparatus that is very thin (e.g., in the z direction). Other configurations may also be employed.
  • one or more of the illumination devices is disposed on and/or integral with one or more portions of the support, although this is not required.
  • the one or more illumination devices may be connected to the processor via one or more communication links.
  • the one or more communication links include one or more pads on the image device and the one or more illumination devices and one or more electrical connectors having one or more electrically conductive members connecting one or more of the pads on the image device to one or more of the pads on the illumination devices.
  • the one or more communication links include one or more bump bonds that electrically connect one or more circuits on the image device to one or more circuits on the one or more illumination devices.
  • the one or more illumination devices may have any size and shape and may or may not have the same configuration as one another (e.g., type, size, shape, resolution). In some embodiments, one or more of the one or more illumination devices has a length and a width that are less than or equal to the length and width, respectively of the optical assembly, the sensor subassembly and/or the image device. In some embodiments, one or more of the one or more illumination devices has a length or a width that is greater than the length or width, respectively of the optical assembly, the sensor subassembly and/or the image device.
  • FIGS. 78H-78M are schematic perspective view of digital camera apparatus in accordance with further embodiments. Such embodiments have one or more illumination devices with configurations and/or in arrangements that are different than the configuration and/or arrangement of the illumination device shown in FIG. 78C . Other configurations and/or arrangements may also be employed.
  • this embodiment of the present invention may be employed alone or in combination with one or more of the other embodiments disclosed herein, or portion thereof.
  • FIG. 78F is a schematic perspective view of one embodiment of a digital camera apparatus that includes an output device and a spacer.
  • FIG. 78G is a schematic perspective view of one embodiment of a digital camera apparatus that includes an output device and a spacer.
  • the image device is shown with one or more pads connected to one or more circuits disposed on or in the image device.
  • FIG. 77H is a schematic perspective view of one embodiment of a digital camera apparatus that includes an output device, a spacer and an additional device (e.g., a display and/or a second device 780 adjacent to the image device).
  • the image device is shown with one or more pads connected to one or more circuits disposed on or in the image device.
  • the digital camera apparatus may further include a support having one or more actuators (such a support may comprise, for example, a frame having one or more actuators) (e.g., MEMS actuators, for example, comb type MEMS actuators) to move one or more of the optics portions of the camera channels, one or more display devices and/or one or more audio input devices.
  • a support having one or more actuators such a support may comprise, for example, a frame having one or more actuators
  • MEMS actuators e.g., MEMS actuators, for example, comb type MEMS actuators
  • the digital camera apparatus includes one or more audio input devices, a support having one or more actuators (such a support may comprise, for example, a frame having one or more actuators) (e.g., MEMS actuators, for example, comb type MEMS actuators) to move one or more of the optics portions of the camera channels, one or more display devices and one or more illumination devices.
  • a support having one or more actuators such a support may comprise, for example, a frame having one or more actuators) (e.g., MEMS actuators, for example, comb type MEMS actuators) to move one or more of the optics portions of the camera channels, one or more display devices and one or more illumination devices.
  • the digital camera apparatus may be assembled and/or mounted in any manner, for example, but not limited to in a manner similar to that employed in one or more of the embodiments disclosed herein.
  • FIG. 78R is a schematic plan view of an underside of the support 320 (e.g., a major outer surface facing toward the one or more sensor arrays) in accordance with one embodiment of the present invention.
  • one or more devices 850 are disposed on or in the. support 320 and receive/supply power, control signals and/or data signals through pads 852 disposed on a surface of the support 320 .
  • a plurality of electrical conductors may connect one or more of the pads on the support 320 to one or more circuits disposed elsewhere in the digital camera apparatus 300 .
  • an integrated circuit 854 may be disposed on the support 320 to provide, for example, but not limited to, one or more circuits to help interface (e.g., control or communicate in any other way) with any of devices disposed on the support 320 .
  • a plurality of electrically conductive traces 856 may connect the outputs of the integrated circuit 854 to one or more of the devices mounted on the support 320 . Although shown on the surface, it should be understood that one, some or all of such traces may be disposed within the support 320 so as not to reside on the outer surface thereof.
  • FIGS. 79A-79C are schematic perspective views of digital camera apparatus that include one or more input devices 830 , e.g., one or more audio input devices (e.g., a silicon microphone) and one or more output devices 820 , e.g., one or more display devices (e.g., a micro display device), in accordance with further embodiments of the present invention.
  • input devices 830 e.g., one or more audio input devices (e.g., a silicon microphone)
  • output devices 820 e.g., one or more display devices (e.g., a micro display device), in accordance with further embodiments of the present invention.
  • display devices e.g., a micro display device
  • FIGS. 80A-80F are schematic perspective views of digital camera apparatus that include one or more input devices 830 , e.g., one or more audio input devices (e.g., a silicon microphone), one or more output devices 820 , e.g., one or more display devices (e.g., a micro displays), wherein one or more of the input devices comprise one or more illumination devices (e.g., a high illumination LED), in accordance with further embodiments of the inventions.
  • input devices 830 e.g., one or more audio input devices (e.g., a silicon microphone)
  • output devices 820 e.g., one or more display devices (e.g., a micro displays)
  • one or more of the input devices comprise one or more illumination devices (e.g., a high illumination LED), in accordance with further embodiments of the inventions.
  • illumination devices e.g., a high illumination LED
  • the digital camera apparatus may be assembled and/or mounted in any manner, for example, but not limited to in a manner similar to that employed in one or more of the embodiments disclosed herein.
  • the digital camera apparatus may have any number of camera channels each of which may have any configuration.
  • the digital camera apparatus includes a housing, for example, but not limited to a hermetic package.
  • One or more portions of a housing may be defined by one or more of the structures described herein, for example, one or more of the optics portions, one or more portions of the frame, one or more portions of the image device and/or combinations thereof.
  • one or more portions of the housing are defined by plastic material(s), ceramic material(s) and/or any combination thereof.
  • FIG. 81A is a schematic perspective view a digital camera apparatus 300 that includes a housing in accordance with one embodiment of the present invention.
  • FIGS. 81B-81C are schematic exploded perspective views of the digital camera apparatus 300 .
  • the housing may comprise a molded plastic package although this is not required.
  • the digital camera apparatus includes a first housing portion (e.g., a molded plastic base or bottom) that supports an image sensor.
  • the image device may include the one or more sensor portions and may further include one or more portions of the processor.
  • a second housing portion e.g., a molded plastic top or cover
  • One or more terminals may be provided, for example, one or more terminals 860 , and may be disposed, for example, on one or more outer surfaces of the molded plastic packaging.
  • One or more electrically conductive members e.g., bond wires, may electrically connect one or more of the terminals to one or more circuits on the image device, e.g., one or more circuits of one or more portions of the processor.
  • the first housing portion, the second housing portion and the one or more optics portions define a substantial portion of the housing, for example, but not limited to a hermetic package.
  • one or more of the optics portions have a top surface that is generally flush with one or more portions of the major outer surface of the second housing portion (e.g., molded plastic top).
  • the digital camera apparatus may be assembled in any manner.
  • the image device, terminals and electrically conductive members are supported superjacent the major outer surface of the first housing portion (e.g., a molded plastic base).
  • the second housing portion e.g., a molded plastic top
  • Heat, pressure and/or bonding material may be employed before, during, and/or after the assembly process.
  • the bonding material may be any type or types of bonding material for example but not limited to a hermetic bonding material or materials.
  • the molded plastic packaging may make the digital camera subassembly more easily removable and/or installable, for example, to facilitate repair and/or upgrade, although this is not required. Molded plastic packaging may also be advantageous, for example, for digital camera apparatus employed in wearable sensors, such as, for example, a badge or broach that does not contain a display but transmits data to a base station. Molded plastic packaging may be employed in combination with any one or more of the embodiments disclosed herein.
  • first housing portion and/or the second housing portion are formed of any type of hermetic material(s), for example, but not limited to ceramic material(s).
  • ceramic packaging may be advantageous in harsh environments and/or in applications (e.g., vacuum systems) where outgassing from plastics present a problem, although this is not required. Ceramic packaging may be employed in combination with any one or more of the embodiments disclosed herein.
  • the first housing portion e.g., the base
  • the first housing portion defines a frame having one or more frame portions to receive and position a second set of one or more optics portions that face in a direction opposite the one or more optics portions seated in the second housing portion.
  • a second set of one or more sensor arrays may be associated with the second set of one or more optics portions and may be disposed, for example, on the image device or on a second image device that may also be disposed in the housing.
  • one of the camera channels e.g., camera channel 350 A
  • the optical portion may itself have the capability to provide color separation, for example, similar to that provided by a color filter array (e.g., a Bayer pattern or variation thereof). (See for example, FIG. 82 ).
  • FIG. 82 is a schematic perspective view of a digital camera apparatus having one or more optics portions with the capability to provide color separation in accordance with one embodiment of the present invention.
  • one or more of the optics portions e.g., optics portion 330 C includes an array of color filters, for example, but not limited to a Bayer patter.
  • one or more of the optics portions, e.g., optics portion 330 C has the capability to provide color separation similar to that which is provided by a color filter array.
  • the lens and/or filter of the camera channel may transmit both of such colors or bands of colors and the camera channel may include one or mechanisms elsewhere in the camera channel to separate the two colors or two bands of colors.
  • a color filter array may be disposed between the lens and the sensor array and/or the camera channel may employ a sensor capable of separating the colors or bands of colors.
  • the sensor array may be provided with pixels that have multiband capability, e.g., two or three colors.
  • each pixel may comprise two or three photodiodes, wherein a first photodiode is adapted to detect a first color or first band of colors, a second photodiode is adapted to detect a second color or band of colors and a third photodiode is adapted to detect a third color or band of colors.
  • One way to accomplish this is to provide the photodiodes with different structures/characteristics that make them selective, such that first photodiode has a higher sensitivity to the first color or first band of colors than to the second color or band of colors, and the second photodiode has a higher sensitivity to the second color or second band of colors than to the first color or first band of colors.
  • Another way is to dispose the photodiodes at different depths in the pixel, which takes advantage of the different penetration and absorption characteristics of the different colors or bands of colors. For example, blue and blue bands of colors penetrate less (and are thus absorbed at a lesser depth) than green and green bands of colors, which in turn penetrate less (and are thus absorbed at a lesser depth) than red and red bands of colors.
  • such a sensor array is employed even though the pixels may see only one particular color or band of colors, for example, to in order to adapt such sensor array to the particular color or band of colors.
  • the digital camera apparatus includes four or more camera channels, e.g., camera channels 350 A- 350 D.
  • the first camera channel, e.g., camera channel 350 A is dedicated to a first color or first band of colors (e.g., red or a red band of colors)
  • the second camera channel, e.g., camera channel 350 B is dedicated to second color or second band of colors (e.g., blue or a blue band of colors), different than the first color or first band of colors
  • the third camera channel, e.g., camera channel 350 C is dedicated to third color or third band of colors (e.g., green or a green band of colors), different than the first and second colors or band of colors
  • the fourth camera channel, e.g., camera channel 350 C is dedicated to fourth color or fourth band of colors (e.g., green or a green band of colors) different than the first, second and third colors or band of colors.
  • one or more of the camera channels employs a pixel size that matches the color optical blur for the respective camera channel, an integration time and/or other electrical characteristic of the sensor array adapted to increase or optimize performance of the respective camera channel, and/or a design/layout of the pixel circuitry and photodiode that is adapted to increase or maximize sensitivity of the respective camera channel.
  • one of the camera channels is a broadband camera channel, an infrared (IR) camera channel or an ultraviolet (UV) camera channel.
  • the sensor arrays of the one or more camera channels may or may not have the same field of view as one another. In some embodiments, each of the sensor arrays has the same field of view as one another. In some embodiments, one or more of the sensor arrays has a field of view that is different field than the field of view of one or more of the other camera channels.
  • one of the camera channels e.g., camera channel 350 A
  • the optical portion may itself have the capability to provide color separation, for example, similar to that provided by a color filter array (e.g., a Bayer pattern or variation thereof) (see for example, FIG. 82 ).
  • the lens and/or filter of the camera channel may transmit both of such colors or bands of colors and the camera channel may include one or mechanisms elsewhere in the camera channel to separate the two colors or two bands of colors.
  • a color filter array may be disposed between the lens and the sensor array and/or the camera channel may employ a sensor capable of separating the colors or bands of colors.
  • the sensor array may be provided with pixels that have multiband capability, e.g., two or three colors.
  • each pixel may comprise two or three photodiodes, wherein a first photodiode is adapted to detect a first color or first band of colors, a second photodiode is adapted to detect a second color or band of colors and a third photodiode is adapted to detect a third color or band of colors.
  • One way to accomplish this is to provide the photodiodes with different structures/characteristics that make them selective, such that first photodiode has a higher sensitivity to the first color or first band of colors than to the second color or band of colors, and the second photodiode has a higher sensitivity to the second color or second band of colors than to the first color or first band of colors.
  • Another way is to dispose the photodiodes at different depths in the pixel, which takes advantage of the different penetration and absorption characteristics of the different colors or bands of colors. For example, blue and blue bands of colors penetrate less (and are thus absorbed at a lesser depth) than green and green bands of colors, which in turn penetrate less (and are thus absorbed at a lesser depth) than red and red bands of colors.
  • such a sensor array is employed even though the pixels may see only one particular color or band of colors, for example, to in order to adapt such sensor array to the particular color or band of colors.
  • the second camera channel e.g., camera channel 350 B
  • the first camera channel may be dedicated to red or a red band and green or a green band (e.g., G 1 ).
  • the second camera channel may be dedicated to blue or a blue band and green or a green band (e.g., G 2 ).
  • the second camera channel e.g., camera channel 350 B
  • the third camera channel e.g., camera channel 350 C
  • the second camera channel is dedicated to a single color or single band of colors (e.g., green or a green band) different from the colors or bands of colors to which the first camera channel is dedicated
  • the third camera channel e.g., camera channel 350 C
  • the camera channels may or may not have the same configuration (e.g., size, shape, resolution, or degree or range of sensitivity) as one another.
  • each of the camera channels has the same size, shape, resolution and/or a degree or range of sensitivity as the other camera channels.
  • one or more of the camera channels has a size, shape, resolution and/or a degree or range of sensitivity that is different than one or more of the other camera channels.
  • each of the camera channels e.g., camera channels 350 A- 350 D, has the same resolution as one another.
  • one or more of the camera channels has a resolution that is less than the resolution of one or more of the other camera channels.
  • one or more of the camera channels may have a sensor array with fewer pixels than the sensor array of one or more of the other camera channels, e.g., camera channel 350 B, for a comparable portion of the field of view.
  • the number of pixels in one of the camera channels is forty four percent greater than the number of pixels in another camera channel, for a comparable portion of the field of view.
  • the number of pixels in one of the camera channels is thirty six percent greater than the number of pixels in the other camera channels, for a comparable portion of the field of view.
  • one or more of the camera channels may have a sensor array with a size that is different than the size of the sensor array of one or more of the other camera channels.
  • the optics portion of such one or more camera channels may have a f/# and/or a focal length that is different from the f/# and/or a focal length of the one or more of the other camera channels.
  • one or more of the camera channels are dedicated to a wavelength or band of wavelengths and the sensor array and/or optics portion of such one or more camera channels are optimized for the respective wavelength or band of wavelengths to which the respective camera channel is dedicated.
  • the design, operation, array size and/or pixel size of each sensor array is optimized for the respective wavelength or bands of wavelengths to which the camera channels are dedicated.
  • the design of each optical portion is optimized for the respective wavelength or bands of wavelengths to which the respective camera channel is dedicated.
  • the four or more camera channels may be arranged in any manner.
  • the four or more camera channels are arranged in a 2 ⁇ 2 matrix to help provide compactness and symmetry in optical collection.
  • the digital camera apparatus employs a processor that is disposed on the same integrated circuit as the sensor arrays.
  • the processor may have any layout, including for example, a layout that is the same as or similar to one or more of the layouts described herein (see for example, FIGS. 83A-83C ).
  • the processor may have one or more portions that are not integrated on the same integrated circuit as the sensor arrays and/or may not have any portions disposed on the same integrated circuit as the sensor arrays (see for example, FIGS. 83D-83E ).
  • the camera channels e.g., camera channels 350 A- 350 D
  • the camera channels are connected via one or more communication links to one or more displays.
  • each of the camera channels is connected to its own display.
  • the displays may or may not have the same characteristics as one another.
  • the four camera channels, e.g., camera channels 350 A- 350 D are each connected to the same display.
  • FIGS. 84A-84E are schematic representations of digital camera apparatus 300 in accordance with further embodiments of the present invention.
  • the digital camera apparatus includes four or more camera channels, e.g., camera channels 350 A- 350 D, wherein four of the camera channels, e.g., camera channels 350 A- 350 D, are arranged in a “Y” configuration.
  • one of the camera channels is a broadband camera channel, an infrared (IR) camera channel or an ultraviolet (UV) camera channel.
  • IR infrared
  • UV ultraviolet
  • a first one of the camera channels e.g., camera channel 350 A
  • a first color or first band of colors e.g., red or a red band of colors
  • a second one the camera channels e.g., camera channel 350 B
  • second color or second band of colors e.g., blue or a blue band of colors
  • a third one of the camera channels e.g., camera channel 350 D
  • a third color or third band of colors e.g., green or a green band of colors
  • the other camera channel e.g., camera channels 350 D
  • is a broadband camera channel e.g., using a color filter array with a Bayer pattern, an infrared (IR) camera channel or an ultraviolet (UV) camera channel.
  • one of the camera channels is dedicated to two or more colors or two or more bands of colors.
  • the optical portion may itself have the capability to provide color separation, for example, similar to that provided by a color filter array (e.g., a Bayer pattern or variation thereof) (see for example, FIG. 84B ).
  • the lens and/or filter of the camera channel may transmit both of such colors or bands of colors and the camera channel may include one or mechanisms elsewhere in the camera channel to separate the two colors or two bands of colors.
  • a color filter array may be disposed between the lens and the sensor array and/or the camera channel may employ a sensor capable of separating the colors or bands of colors.
  • the sensor array may be provided with pixels that have multiband capability, e.g., two or three colors.
  • each pixel may comprise two or three photodiodes, wherein a first photodiode is adapted to detect a first color or first band of colors, a second photodiode is adapted to detect a second color or band of colors and a third photodiode is adapted to detect a third color or band of colors.
  • One way to accomplish this is to provide the photodiodes with different structures/characteristics that make them selective, such that first photodiode has a higher sensitivity to the first color or first band of colors than to the second color or band of colors, and the second photodiode has a higher sensitivity to the second color or second band of colors than to the first color or first band of colors.
  • Another way is to dispose the photodiodes at different depths in the pixel, which takes advantage of the different penetration and absorption characteristics of the different colors or bands of colors. For example, blue and blue bands of colors penetrate less (and are thus absorbed at a lesser depth) than green and green bands of colors, which in turn penetrate less (and are thus absorbed at a lesser depth) than red and red bands of colors.
  • such a sensor array is employed even though the pixels may see only one particular color or band of colors, for example, to in order to adapt such sensor array to the particular color or band of colors.
  • the digital camera apparatus employs a processor that is disposed on the same integrated circuit as the sensor arrays.
  • the processor may have any layout, including for example, a layout that is the same as or similar to one or more of the layouts described herein (see for example, FIGS. 84C-84E ).
  • one, some or all portions of the processor are not disposed on the same integrated circuit as the sensor arrays. (see for example, FIG. 84A ).
  • FIGS. 85A-85E are schematic representations of digital camera apparatus 300 in accordance with further embodiments of the present invention.
  • the digital camera apparatus includes four or more camera channels, e.g., camera channels 350 A- 350 D.
  • Two of the camera channels, e.g., camera channels 350 A, 350 C, are each smaller in size than two of the other camera channel, e.g., camera channel 350 B, 350 D.
  • the smaller camera channels e.g., camera channels 350 A, 350 C
  • each of the smaller camera channels may have a sensor array with fewer pixels than is provided in the sensor array of each of the larger camera channels for a comparable portion of the field of view.
  • the number of pixels in one or more of the larger camera channels is forty four percent greater than the number of pixels in one or more of the smaller camera channels, for a comparable portion of the field of view.
  • the number of pixels in one or more of the larger camera channels is thirty six percent greater than the number of pixels in one or more of the smaller camera channels, for a comparable portion of the field of view. It should be understood, however, that any other sizes and/or architectures may also be employed.
  • one or more of the smaller camera channels has a resolution that is equal to the resolution of one or more of the larger camera channels.
  • one or more of the smaller camera channels e.g., camera channels 350 A, 350 C
  • the pixels in the larger camera channels are forty four percent larger in size (e.g., twenty percent larger in the x direction and twenty percent larger in the y direction) than the pixels in the smaller camera channels.
  • the pixels in the larger camera channels are thirty six percent larger in size (e.g., seventeen percent larger in the x direction and seventeen percent larger in the y direction) than the pixels in the smaller camera channels. It should be understood, however, that any other sizes and/or architectures may also be employed.
  • one or more of the camera channels may have a sensor array with a size that is different than the size of the sensor array of one or more of the other camera channels.
  • the optics portion of such one or more camera channels may have a f/# and/or a focal length that is different from the f/# and/or a focal length of the one or more of the other camera channels.
  • one of the smaller camera channels e.g., camera channel 350 A
  • a first color or first band of colors e.g., red or a red band of colors
  • one of the larger camera channel, e.g., camera channel 350 B is dedicated to second color or second band of colors (e.g., blue or a blue band of colors), different than the first color or first band of colors
  • the other larger camera channel, e.g., camera channel 350 D is dedicated to third color or third band of colors (e.g., green or a green band of colors), different than the first and second colors or band of colors.
  • the smaller camera channel, e.g., camera channels 350 A has a resolution that is equal to the resolution of the two larger camera channels, e.g., camera channels 350 B, 350 D.
  • one of the smaller camera channels e.g., camera channel 350 C
  • IR infrared
  • UV ultraviolet
  • the digital camera apparatus employs a processor that is disposed on the same integrated circuit as the sensor arrays.
  • the processor may have any layout, including for example, a layout that is the same as or similar to one or more of the layouts described herein (see for example, FIGS. 85C-85E ).
  • the processor may have one or more portions that are not disposed on the same integrated circuit as the sensor arrays and/or may not have any portions disposed on the same integrated circuit as the sensor arrays (see for example, FIG. 85B ).
  • the four or more camera channels are connected via one or more communication links to one or more displays.
  • each of the camera channels is connected to its own display.
  • the displays may or may not have the same characteristics as one another.
  • two or more camera channels e.g., camera channels 350 A- 350 B, 350 D
  • the first and second displays may or may not have the same characteristics.
  • the first display has a resolution equal to the resolution of one or more of the camera channels connected thereto.
  • the second display may have a resolution equal to the resolution of one or more camera channels connected thereto.
  • one or more of the camera channels have a resolution that is less than the resolution of one or more other camera channels.
  • the one or more display connected to the one or more lower resolution camera channels may have a resolution/resolutions that is/are lower than the resolution/resolutions of the one or more displays connected to the one or more other camera channels.
  • the first display has a resolution equal to the resolution of one or more of the camera channels connected thereto.
  • the second display may have a resolution equal to the resolution of one or more camera channels connected thereto, however, other resolutions may be employed.
  • FIGS. 86A-86E are schematic representations of digital camera apparatus 300 in accordance with further embodiments of the present invention.
  • the digital camera apparatus includes four or more camera channels, e.g., camera channels 350 A- 350 D.
  • Three of the camera channels, e.g., camera channels 350 A- 350 C, are each smaller in size than the other camera channel, e.g., camera channel 350 D.
  • the smaller camera channels each have a resolution that is less than the resolution of the larger camera channel, e.g., camera channel 350 D, although in such embodiments, the smaller camera channels may or may not have the same resolution as one another.
  • each of the smaller camera channels may have a sensor array with fewer pixels than is provided in the sensor array of the larger camera channel for a comparable portion of the field of view.
  • the number of pixels in the larger camera channels is forty four percent greater than the number of pixels in one or more of the smaller camera channels, for a comparable portion of the field of view.
  • the number of pixels in the larger camera channel is thirty six percent greater than the number of pixels in one or more of the smaller camera channels, for a comparable portion of the field of view. It should be understood, however, that any other sizes and/or architectures may also be employed.
  • one or more of the smaller camera channels has a resolution that is equal to the resolution of the larger camera channel.
  • one or more of the smaller camera channels e.g., camera channels 350 A- 350 C
  • the pixels in the larger camera channel are forty four percent larger in size (e.g., twenty percent larger in the x direction and twenty percent larger in the y direction) than the pixels in the smaller camera channels.
  • the pixels in the larger camera channel are thirty six percent larger in size (e.g., seventeen percent larger in the x direction and seventeen percent larger in the y direction) than the pixels in the smaller camera channels. It should be understood, however, that any other sizes and/or architectures may also be employed.
  • one of the camera channels is a broadband camera channel, an infrared (IR) camera channel or an ultraviolet (UV) camera channel.
  • IR infrared
  • UV ultraviolet
  • a first one of the camera channels is dedicated to a first color or first band of colors (e.g., red or a red band of colors)
  • a second one the camera channels e.g., camera channel 350 B
  • second color or second band of colors e.g., blue or a blue band of colors
  • a third one of the camera channels e.g., camera channel 350 C
  • the other camera channel is a broadband camera channel, e.g., using a color filter array with a Bayer pattern.
  • the digital camera apparatus employs a processor that is disposed on the same integrated circuit as the sensor arrays.
  • the processor may have any layout, including for example, a layout that is the same as, or similar to, the layouts described herein (see for example, FIGS. 86C-86E ).
  • the processor may have one or more portions that are not disposed on the same integrated circuit as the sensor arrays and/or may not have any portions disposed on the same integrated circuit as the sensor arrays (see for example, FIG. 86B ).
  • the four or more camera channels are connected via one or more communication links to one or more displays.
  • each of the camera channels is connected to its own display.
  • the displays may or may not have the same characteristics as one another.
  • three or more camera channels, e.g., camera channels 350 A- 350 C, are connected to a first display and the other camera channel, e.g., camera channel 350 D, is connected to a second display.
  • the first and second displays may or may not have the same characteristics as one another.
  • one or more of the camera channels have a resolution that is less than the resolution of one or more other camera channels.
  • the one or more display connected to the one or more lower resolution camera channels may have a resolution/resolutions that is/are lower than the resolution/resolutions of the one or more displays connected to the one or more other camera channels.
  • the first display has a resolution equal to the resolution of one or more of the camera channels connected thereto.
  • the second display may have a resolution equal to the resolution of one or more camera channels connected thereto, however, other resolutions may be employed.
  • FIGS. 87A-87B are schematic representation of digital camera apparatus 300 in accordance with further embodiments of the present invention.
  • the digital camera apparatus includes one or more camera channels, e.g., camera channels 350 A- 350 D, one or more of which having optical portion, e.g., optical portions 330 A- 330 D, respectively, with an elliptical or other non circular shape.
  • a first one of the camera channels e.g., camera channel 350 A
  • a first color or first band of colors e.g., red or a red band of colors
  • a second one the camera channels e.g., camera channel 350 B
  • second color or second band of colors e.g., blue or a blue band of colors
  • a third one of the camera channels e.g., camera channel 350 D
  • a third color or third band of colors e.g., green or a green band of colors
  • the other camera channel e.g., camera channels 350 D
  • is a broadband camera channel e.g., using a color filter array with a Bayer pattern, an infrared (IR) camera channel or an ultraviolet (UV) camera channel.
  • a first one of the camera channels is dedicated to a first color or first band of colors (e.g., red or a red band of colors)
  • a second one the camera channels e.g., camera channel 350 B
  • second color or second band of colors e.g., green or a green band of colors
  • a third one of the camera channels e.g., camera channel 350 C
  • a third color or third band of colors e.g., blue or a blue band of colors
  • a fourth one of the camera channels e.g., camera channel 350 D, is dedicated to a color or band of colors (e.g., green or a green band of colors), different than the first and third colors or bands of colors.
  • a first one of the camera channels e.g., camera channel 350 A
  • a second one the camera channels e.g., camera channel 350 B
  • a third one of the camera channels e.g., camera channel 350 C
  • a fourth one of the camera channels is dedicated to a green 2 or green 2 band of colors.
  • one of the camera channels is a broadband camera channel, an infrared (IR) camera channel or an ultraviolet (UV) camera channel.
  • IR infrared
  • UV ultraviolet
  • the digital camera apparatus employs a processor that is disposed on the same integrated circuit as the sensor arrays.
  • the processor may have any layout, including for example, a layout that is the same as, or similar to, the layouts described herein.
  • the processor may have one or more portions that are not disposed on the same integrated circuit as the sensor arrays and/or may not have any portions disposed on the same integrated circuit as the sensor arrays (see for example, FIGS. 87A-87B ).
  • FIGS. 88A-88E and 89 A- 89 E are schematic representation of digital camera apparatus 300 in accordance with further embodiments of the present invention.
  • the digital camera apparatus includes three or more camera channels, e.g., camera channels 350 A- 350 C.
  • the first camera channel e.g., camera channel 350 A
  • the second camera channel e.g., camera channel 350 B
  • second color or second band of colors e.g., blue or a blue band of colors
  • the third camera channel e.g., camera channel 350 C
  • third color or third band of colors e.g., green or a green band of colors
  • one or more of the camera channels employs a pixel size that matches a color optical blur for the respective camera channel, an integration time and/or other electrical characteristic of the sensor array adapted to increase or optimize performance of the respective camera channel, and/or a design/layout of the pixel circuitry and photodiode that is adapted to increase or maximize sensitivity of the respective camera channel.
  • one of the camera channels is a broadband camera channel, an infrared (IR) camera channel or an ultraviolet (UV) camera channel.
  • one of the camera channel e.g., camera channel 350 A
  • the optical portion may itself have the capability to provide color separation, for example, similar to that provided by a color filter array (e.g., a Bayer pattern or variation thereof).
  • the lens and/or filter of the camera channel may transmit both of such colors or bands of colors and the camera channel may include one or mechanisms elsewhere in the camera channel to separate the two colors or two bands of colors.
  • a color filter array may be disposed between the lens and the sensor array and/or the camera channel may employ a sensor capable of separating the colors or bands of colors.
  • the sensor array may be provided with pixels that have multiband capability, e.g., two or three colors.
  • each pixel may comprise two or three photodiodes, wherein a first photodiode is adapted to detect a first color or first band of colors, a second photodiode is adapted to detect a second color or band of colors and a third photodiode is adapted to detect a third color or band of colors.
  • One way to accomplish this is to provide the photodiodes with different structures/characteristics that make them selective, such that first photodiode has a higher sensitivity to the first color or first band of colors than to the second color or band of colors, and the second photodiode has a higher sensitivity to the second color or second band of colors than to the first color or first band of colors.
  • Another way is to dispose the photodiodes at different depths in the pixel, which takes advantage of the different penetration and absorption characteristics of the different colors or bands of colors. For example, blue and blue bands of colors penetrate less (and are thus absorbed at a lesser depth) than green and green bands of colors, which in turn penetrate less (and are thus absorbed at a lesser depth) than red and red bands of colors.
  • such a sensor array is employed even though the pixels may see only one particular color or band of colors, for example, to in order to adapt such sensor array to the particular color or band of colors.
  • the second camera channel may also be dedicated to two or more separate colors or two or more separate bands of colors.
  • the first camera channel may be dedicated to red or a red band and green or a green band (e.g., G 1 ).
  • the second camera channel may be dedicated to blue or a blue band and green or a green band (e.g., G 2 ).
  • the second camera channel e.g., camera channel 350 B
  • the third camera channel e.g., camera channel 350 C
  • the second camera channel may be dedicated to a single color or single band of colors (e.g., green or a green band) different from the colors or bands of colors to which the first camera channel is dedicated
  • the third camera channel e.g., camera channel 350 C
  • the three or more camera channels may or may not have the same configuration (e.g., size, shape, resolution, or degree or range of sensitivity) as one another.
  • each of the camera channels has the same size, shape, resolution and/or a degree or range of sensitivity as the other camera channels.
  • one or more of the camera channels has a size, shape, resolution and/or a degree or range of sensitivity that is different than one or more of the other camera channels.
  • one or more of the camera channels may have a sensor array with fewer pixels than is provided in the sensor array of one or more of the other camera channels, for a comparable portion of a field of view.
  • one or more of the camera channels may have a sensor array with a size that is different than the size of the sensor array of one or more of the other camera channels.
  • the optics portion of such one or more camera channels may have a f/# and/or a focal length that is different from the f/# and/or a focal length of the one or more of the other camera channels.
  • one or more of the camera channels are dedicated to a wavelength or band of wavelengths and the sensor array and/or optics portion of such one or more camera channels are optimized for the respective wavelength or band of wavelengths to which the respective camera channel is dedicated.
  • the design, operation, array size and/or pixel size of each sensor array is optimized for the respective wavelength or bands of wavelengths to which the camera channels are dedicated.
  • the design of each optical portion is optimized for the respective wavelength or bands of wavelengths to which the respective camera channel is dedicated.
  • the three or more camera channels may be arranged in any manner.
  • the three or more camera channels are arranged in a triangle, as shown to help provide compactness and symmetry in optical collection.
  • the digital camera apparatus employs a processor that is disposed on the same integrated circuit as the sensor arrays.
  • the processor may have any layout, including for example, a layout that is the same as, or similar to, the layouts described herein (see for example, FIGS. 98A-98B .
  • the processor may have one or more portions that are not disposed on the same integrated circuit as the sensor arrays and/or may not have any portions disposed on the same integrated circuit as the sensor arrays.
  • the camera channels e.g., camera channels 350 A- 350 C
  • the camera channels are connected via one or more communication links to one or more displays.
  • each of the camera channels is connected to its own display.
  • the displays may or may not have the same characteristics as one another.
  • the three camera channels, e.g., camera channels 350 A- 350 C are each connected to the same display.
  • FIGS. 90 A, 91 A- 91 B, 92 A- 92 B, 93 A- 93 , 94 A- 94 B, 95 A- 95 B and 96 A- 96 B are a schematic plan views and a schematic cross sectional view, respectively, of some embodiments of the image device 520 that may be employed in association with a digital camera apparatus having three or more camera channels.
  • the image device has first and second major surfaces and an outer perimeter defined by edges.
  • the image device defines the one or more regions for the active areas of the one or more sensor arrays.
  • the image device further defines one or more regions for the buffer and/or logic associated with the one or more sensor arrays.
  • the image device, sensor arrays and image areas may each have any size(s) and shape(s).
  • the image areas are generally about the same size as the respective sensor arrays, and therefore, the image areas may differ from one another in size and shape depending upon the dimensions of the underlying sensor arrays.
  • an image area cover all, or only, the underlying array.
  • an image area could cover only a portion of an array, and could extend beyond the array.
  • the image device 520 has a generally rectangular shape and dimensions equal to about 10 mm on a first side and about 8.85 mm on a second side.
  • Each of the image areas has a generally circular shape and a width or diameter equal to about 5 mm.
  • Each of the active areas has a generally rectangular shape having a first dimension equal to about 4.14 mm and a second dimension equal to about 3.27 mm.
  • the active area may define, for example, a matrix of 1200 ⁇ 900 pixels (i.e., 1200 columns, 900 rows).
  • the image device 520 has a generally square shape and dimensions equal to about 10 mm on a side, with each quadrant being 5 mm on a side.
  • Each of the image areas has a generally circular shape and a width or diameter equal to about 5 millimeters (mm).
  • Each of the active areas has a generally rectangular shape having a first dimension equal to about 4mm and a second dimension equal to about 3mm.
  • the active area may define for example, a matrix of 1200 ⁇ 900 pixels (i.e., 1200 columns, 900 rows).
  • the optics portions of the three or more camera channels are supported by one or more supports, e.g., support 320 , which position each of the optics portions in registration with a respective sensor array, at least in part.
  • optics portion 330 A is positioned in registration with sensor array 310 A.
  • Optics portion 330 B is positioned in registration with sensor array 310 B.
  • Optics portion 330 C is positioned in registration with sensor array 310 C.
  • Optics portion 330 B is positioned in registration with sensor array 310 B.
  • the support also helps to limit, minimize and/or eliminate light “cross talk” between the camera channels.
  • the support 320 includes a support that defines one or more support portions, e.g., four support portions 600 A- 600 C, each of which supports and/or helps position a respective one of the one or more optics portions.
  • support portion 600 A supports and positions optics portion 330 A in registration with sensor array 310 A.
  • Support portion 600 B supports and positions optics portion 330 B in registration with sensor array 310 B.
  • Support portion 600 C supports and positions optics portion 330 C in registration with sensor array 310 C.
  • Support portion 600 D supports and positions optics portion 330 D in registration with sensor array 310 D.
  • the support also helps to limit, minimize and/or eliminate light “cross talk” between the camera channels.
  • Each of the support portions 600 A- 600 C defines an aperture 616 and a seat 618 .
  • the aperture 616 defines a passage for the transmission of light for the respective camera channel.
  • the seat 618 is adapted to receive a respective one of the optics portions (or portion thereof) and to support and/or position the respective optics portion, at least in part.
  • the seat 618 may include one or more surfaces (e.g., surfaces 620 , 622 ) adapted to abut one or more surfaces of the optics portion to support and/or position the optics portion, at least in part, relative to the support portion and/or one or more of the sensor arrays 310 A- 310 C.
  • surface 620 is disposed about the perimeter of the optics portion to support and help position the optics portion in the x direction and the y direction).
  • Surface 622 (sometimes referred to herein as “stop” surface) positions or helps position the optics portion in the z direction.
  • the position and/or orientation of the stop surface 622 may be adapted to position the optics portion at a specific distance (or range of distance) and/or orientation with respect to the respective sensor array.
  • the seat 618 controls the depth at which the lens is positioned (e.g., seated) within the support.
  • the depth may be different for each lens and is based, at least in part, on the focal length of the lens. For example, if a camera channel is dedicated to a specific color (or band of colors), the lens or lenses for that camera channel may have a focal length specifically adapted to the color (or band of colors) to which the camera channel is dedicated. If each camera channels is dedicated to a different color (or band of colors) than the other camera channels, then each of the lenses may have a different focal length, for example, to tailor the lens to the respective sensor array, and each of the seats have a different depth.
  • Each optics portion may be secured in the respective seat 618 in any suitable manner, for example, but not limited to, mechanically (e.g., press fit, physical stops), chemically (e.g., adhesive), electronically (e.g., electronic bonding) and/or any combination thereof.
  • the seat 618 has dimensions adapted to provide a press fit for the respective optics portion.
  • the aperture may have any configuration (e.g., shape and/or size) including for example, cylindrical, conical, rectangular, irregular and/or any combination thereof.
  • the configuration may be based, for example, on the desired configuration of the optical path, the configuration of the respective optical portion, the configuration of the respective sensor array and/or any combination thereof.
  • the supports 320 may comprise any type of material(s) and may have any configuration and/or construction.
  • the support 320 comprises silicon, semiconductor, glass, ceramic, plastic, or metallic materials and/or a combination thereof. If the support 320 has more than one portion, such portions may be fabricated separate from one another, integral with one another and/or any combination thereof. If the support defines more than one support portion, each of such support portions, e.g., support portions 600 A- 600 D, may be coupled to one, some or all of the other support portions, as shown, or completely isolated from the other support portions. If the support 320 is a single integral component, each of the one or more support portions define one or more portions of such integral component.
  • the positioner may be a solid device that may offer a wide range of options for manufacturing and material, however other forms of devices may also be employed.
  • the support 320 comprises a plate (e.g., a thin plate) that defines the support and one or more support portions, with the apertures and seats being formed by machining (e.g., boring) or any other suitable manner.
  • the support 320 is fabricated as a casting with the apertures defined therein (e.g., using a mold with projections that define the apertures and seats of the one or more support portions).
  • the lens and support are manufactured as a single molded component.
  • the lens may be manufactured with tabs that may be used to form the support.
  • the support 320 is coupled and/or affixed directly or indirectly, to the image device.
  • the support 320 may be directly coupled and affixed to the image device (e.g., using adhesive) or indirectly coupled and/or or affixed to the image device via an intermediate support member (not shown).
  • the x and y dimensions of the support 320 may be, for example, approximately the same (in one or more dimensions) as the image device, approximately the same (in one or more dimensions) as the arrangement of the optics portions 330 A- 330 D and/or approximately the same (in one or more dimensions) as the arrangement of the sensor arrays 310 A- 310 D.
  • One advantage of such dimensioning is that it helps keep the x and y dimensions of the digital camera apparatus as small as possible.
  • the seat 618 may be advantageous to provide the seat 618 with a height A that is the same as the height of a portion of the optics that will abut the stop surface 620 . It may be advantageous for the stop surface 622 to be disposed at a height B (e.g., the distance between the stop surface 622 and the base of the support portion) that is at least as high as needed to allow the seat 618 to provide a firm stop for an optics portion (e.g., the lens) to be seated thereon.
  • a height B e.g., the distance between the stop surface 622 and the base of the support portion
  • the width or diameter C of the portion of the aperture 616 disposed above the height of the stop surface 622 may be based, for example, on the width or diameter of the optics portion (e.g., the lens) to be seated therein and the method used to affix and/or retain that optics portion in the seat 618 .
  • the width of the stop surface 622 is preferably large enough to help provide a firm stop for the optics portion (e.g., the lens) yet small enough to minimize unnecessary blockage of the light transmitted by the optics portion. It may be desirable to make the width or diameter D of the portion of the aperture 616 disposed below the height of the stop surface 622 large enough to help minimize unnecessary blockage of the light transmitted by the optics portion.
  • the support may have a length J and a width K.
  • the seat 618 with a height A equal to 2.2 mm, to provide the stop surface 622 at a height B in the range of from 0.25 mm to 3 mm, to make the width or diameter C of the portion of the aperture above the height B of the stop surface 622 equal to approximately 3 mm, to make the width or diameter D of the lower portion of the aperture approximately 2.8 mm, to provide the support portion with a height E in the range from 2.45 mm to 5.2 mm and to space the apertures apart by a distance F of at least 1 mm.
  • one or more of the optics portions comprises a cylindrical type of lens, e.g., a NT45-090 lens manufactured by Edmunds Optics.
  • a cylindrical type of lens e.g., a NT45-090 lens manufactured by Edmunds Optics.
  • Such lens has a cylindrical portion with a diameter G up to 3 millimeters (mm) and a height H of 2.19 mm.
  • G millimeters
  • H height
  • the support has a length J equal to 10 mm and a width K equal to 10 mm. In some other embodiments, it may be desirable to provide the support with a length J equal to 10 mm and a width K equal to 8.85 mm.
  • FIGS. 99A-99D are schematic representations of digital camera apparatus 300 in accordance with further embodiments of the present invention.
  • the digital camera apparatus include three or more camera channels, e.g., camera channels 350 A- 350 C.
  • Two of the camera channels, e.g., camera channels 350 A- 350 B, are each smaller in size than a third camera channel, e.g., camera channel 350 C.
  • the smaller camera channels may or may not have the same size as one another.
  • the smaller camera channels each have a resolution that is less than the resolution of the larger camera channel, e.g., camera channel 350 C, although in such embodiments, the smaller camera channels may or may not have the same resolution as one another.
  • each of the smaller camera channels, e.g., camera channel 350 A- 350 B may have a sensor array with fewer pixels than is provided in the sensor array of the larger camera channel, e.g., camera channel 350 B, for a comparable portion of the field of view.
  • the number of pixels in the larger camera channel is forty four percent greater than the number of pixels in one or more of the smaller camera channels, for a comparable portion of the field of view.
  • the number of pixels in the larger camera channel is thirty six percent greater than the number of pixels in one or more of the smaller camera channels, for a comparable portion of the field of view. It should be understood, however, that any other sizes and/or architectures may also be employed.
  • one or more of the smaller camera channels has a resolution that is equal to the resolution of the larger camera channel.
  • one or more of the smaller camera channels e.g., camera channels 350 A- 350 B
  • the pixels in the larger camera channel are forty four percent larger in size (e.g., twenty percent larger in the x direction and twenty percent larger in the y direction) than the pixels in the smaller camera channels.
  • the pixels in the larger camera channel are thirty six percent larger in size (e.g., seventeen percent larger in the x direction and seventeen percent larger in the y direction) than the pixels in the smaller camera channels. It should be understood, however, that any other sizes and/or architectures may also be employed.
  • the first camera channel e.g., camera channel 350 A
  • the second camera channel e.g., camera channel 350 B
  • second color or second band of colors e.g., blue or a blue band of colors
  • the third camera channel e.g., camera channel 350 C
  • the two smaller camera channels e.g., camera channels 350 A- 350 B
  • one of the camera channels is a broadband camera channel, an infrared (IR) camera channel or an ultraviolet (UV) camera channel.
  • the digital camera apparatus employs a processor that is disposed on the same integrated circuit as the sensor arrays.
  • the processor may have any layout, including for example, a layout that is the same as, or similar to, the layouts described herein (see for example, 99 B- 99 D).
  • the processor may have one or more portions that are not disposed on the same integrated circuit as the sensor arrays and/or may not have any portions disposed on the same integrated circuit as the sensor arrays (see for example, FIG. 89A ).
  • the camera channels are connected via one or more communication links to one or more displays.
  • each of the camera channels is connected to its own display.
  • the displays may or may not have the same characteristics as one another.
  • the smaller camera channels, e.g., camera channels 350 A- 350 B are connected to a first display and the larger camera channel, e.g., camera channel 350 C, is connected to a second display.
  • the first and second displays may or may not have the same characteristics.
  • the first display has a resolution equal to the resolution of one or more of the camera channels connected thereto.
  • the second display may have a resolution equal to the resolution of one or more camera channels connected thereto, however, other resolutions may be employed.
  • FIGS. 100A-100D are schematic representations of digital camera apparatus 300 in accordance with further embodiments of the present invention.
  • the digital camera apparatus include three or more camera channels, e.g., camera channels 350 A- 350 C.
  • a first one of the camera channels, e.g., camera channel 350 A is smaller in size than a second one of the camera channels, e.g., camera channel 350 B, which is in turn smaller in size than a third one of the camera channels, e.g., camera channel 350 C.
  • the smallest camera channels e.g., camera channels 350 A
  • the second camera channel e.g., camera channel 350 B
  • the largest camera channel e.g., camera channel 350 C.
  • the smallest camera channels e.g., camera channel 350 A
  • the second camera channel e.g., camera channel 350 B
  • the second camera channel e.g., camera channel 350 B
  • the second camera channel may have a sensor array with fewer pixels than is provided in the sensor array of the largest camera channel, e.g., camera channel 350 C, for a comparable portion of the field of view.
  • the number of pixels in the second camera channel is forty four percent greater than the number of pixels in the smallest camera channel, e.g., camera channel 350 A, for a comparable portion of the field of view
  • the number of pixels in the largest camera channel e.g., camera channel 350 C
  • the number of pixels in the second camera channel is thirty six percent greater than the number of pixels in the second camera channel, e.g., camera channel 350 B, for a comparable portion of the field of view.
  • any other sizes and/or architectures may also be employed.
  • one or more of the smaller camera channels has a resolution that is equal to the resolution of the larger camera channel, e.g., camera channel 350 C.
  • one or more of the smaller camera channels, e.g., camera channels 350 A- 350 B may have a sensor array with the same number of pixels as is provided in the sensor array of the larger camera channel, e.g., camera channel 350 C, for a comparable portion of the field of view.
  • the pixels in the second camera channel e.g., camera channel 350 B
  • the pixels in the largest camera channel, e.g., camera channel 350 C are thirty six percent larger in size (e.g., seventeen percent larger in the x direction and seventeen percent larger in the y direction) than the pixels in the second camera channel, e.g., camera channel 350 B. It should be understood, however, that any other sizes and/or architectures may also be employed.
  • the first camera channel e.g., camera channel 350 A
  • the second camera channel e.g., camera channel 350 B
  • second color or second band of colors e.g., blue or a blue band of colors
  • the third camera channel e.g., camera channel 350 C
  • third color or third band of colors e.g., green or a green band of colors
  • the two smaller camera channels e.g., camera channels 350 A- 350 B
  • each of the camera channels, e.g., camera channels 350 A- 350 C has the same resolution.
  • the number of pixels and/or the design of the pixels in the sensor array of a camera channel are adapted to match a wavelength or band of wavelengths of incident light to which such camera channels may be dedicated.
  • the size of the sensor array and/or the design of the optics (e.g., f/# and focal length) for one or more of the camera channels are adapted to provide a desired field of view and/or sensitivity for such camera channels.
  • one of the camera channels is a broadband camera channel, an infrared (IR) camera channel or an ultraviolet (UV) camera channel.
  • one or more of the camera channels are dedicated to a wavelength or band of wavelengths and the sensor array and/or optics portion of such one or more camera channels are optimized for the respective wavelength or band of wavelengths to which the respective camera channel is dedicated.
  • the design, operation, array size and/or pixel size of each sensor array is optimized for the respective wavelength or bands of wavelengths to which the camera channels are dedicated.
  • the design of each optical portion is optimized for the respective wavelength or bands of wavelengths to which the respective camera channel is dedicated.
  • the digital camera apparatus employs a processor that is disposed on the same integrated circuit as the sensor arrays.
  • the processor may have any layout, including for example, a layout that is the same as, or similar to, the layouts described herein (see for example, FIGS. 100B-100D .
  • the processor may have one or more portions that are not disposed on the same integrated circuit as the sensor arrays and/or may not have any portions disposed on the same integrated circuit as the sensor arrays (see for example, FIG. 10A ).
  • the camera channels e.g., camera channels 350 A- 350 C
  • the camera channels are connected via one or more communication links to one or more displays.
  • each of the camera channels is connected to its own display.
  • the displays may or may not have the same characteristics.
  • one or more of the camera channels have a resolution that is less than the resolution of one or more other camera channels and the one or more display connected to the one or more lower resolution camera channels may have a resolution/resolutions that is/are lower than the resolution/resolutions of the one or more displays connected to the one or more other camera channels.
  • FIGS. 103A-103E are schematic representations of digital camera apparatus 300 in accordance with further embodiments of the present invention.
  • the digital camera apparatus include one or more camera channels, e.g., camera channels 350 A- 350 C, having an optical portion, e.g., optical portions 330 A- 330 C, respectively, with an elliptical or other type of non circular shape.
  • one or more of the camera channels are smaller in size than a third camera channel, e.g., camera channel 350 C.
  • the one or more smaller camera channels, e.g., camera channels 350 A- 350 B may each have a resolution that is less than the resolution of the larger camera channel, e.g., camera channel 350 C, although in such embodiments, the smaller camera channels may or may not have the same resolution as one another.
  • each of the smaller camera channels may have a sensor array with fewer pixels than is provided in the sensor array of the larger camera channel, e.g., camera channel 350 B, for a comparable portion of the field of view.
  • the number of pixels in the larger camera channel is forty four percent greater than the number of pixels in one or more of the smaller camera channels, for a comparable portion of the field of view.
  • the number of pixels in the larger camera channel is thirty six percent greater than the number of pixels in one or more of the smaller camera channels, for a comparable portion of the field of view. It should be understood, however, that any other sizes and/or architectures may also be employed.
  • the one or more of the smaller camera channels may have a resolution that is equal to the resolution of the larger camera channel.
  • one or more of the smaller camera channels e.g., camera channels 350 A- 350 B, may have a sensor array with the same number of pixels as is provided in the sensor array of the larger camera channel, e.g., camera channel 350 C, for a comparable portion of the field of view.
  • the pixels in the larger camera channel are forty four percent larger in size (e.g., twenty percent larger in the x direction and twenty percent larger in the y direction) than the pixels in the smaller camera channels. In another embodiment, for example, the pixels in the larger camera channel are thirty six percent larger in size (e.g., seventeen percent larger in the x direction and seventeen percent larger in the y direction) than the pixels in the smaller camera channels. It should be understood, however, that any other sizes and/or architectures may also be employed.
  • the first camera channel e.g., camera channel 350 A
  • the second camera channel e.g., camera channel 350 B
  • second color or second band of colors e.g., blue or a blue band of colors
  • the third camera channel e.g., camera channel 350 C
  • the two smaller camera channels e.g., camera channels 350 A- 350 B
  • one of the camera channels is a broadband camera channel, an infrared (IR) camera channel or an ultraviolet (UV) camera channel.
  • the digital camera apparatus employs a processor that is disposed on the same integrated circuit as the sensor arrays.
  • the processor may have any layout, including for example, a layout that is the same as, or similar to, the layouts described herein (see for example, FIGS. 103B-103E ).
  • the processor may have one or more portions that are not disposed on the same integrated circuit as the sensor arrays and/or may not have any portions disposed on the same integrated circuit as the sensor arrays (see for example, FIG. 103A ).
  • one or more of the camera channels are connected via one or more communication links to one or more displays.
  • each of the camera channels is connected to its own display.
  • the displays may or may not have the same characteristics as one another. For example, if the camera channels have different resolutions from one another, the displays may also have different resolutions from one another.
  • the smaller channels e.g., camera channels 350 A- 350 B, have a resolution that is less than the resolution of the larger channel, e.g., camera channel 350 B, and the displays connected to the smaller channels have resolution that is less than the resolution of the display connected to the larger camera channel.
  • the two smaller camera channels are connected to a first display and the larger camera channel, e.g., camera channel 350 C is connected to a second display.
  • the first and second displays may or may not have the same characteristics as one another.
  • the smaller channels e.g., camera channels 350 A- 350 B
  • the display connected to the smaller channels has a resolution that is less than the resolution of the display connected to the larger camera channel.
  • FIGS. 104A-104E are schematic representations of digital camera apparatus 300 in accordance with further embodiments of the present invention.
  • the digital camera apparatus include two or more camera channels, e.g., camera channels 350 A- 350 B.
  • the first camera channel e.g., camera channel 350 A
  • the second camera channel e.g., camera channel 350 B
  • a single color or single band of colors e.g., green or a green band
  • one or more of the camera channels employs a pixel size that matches the color optical blur for the respective camera channel, an integration time and/or other electrical characteristic of the sensor array adapted to increase or optimize performance of the respective camera channel, and/or a design/layout of the pixel circuitry and photodiode that is adapted to increase or maximize sensitivity of the respective camera channel.
  • one of the camera channels is a broadband camera channel, an infrared (IR) camera channel or an ultraviolet (UV) camera channel.
  • the first camera channel e.g., camera channel 350 A
  • the optical portion may itself have the capability to provide color separation, for example, similar to that provided by a color filter array (e.g., a Bayer pattern or variation thereof).
  • the lens and/or filter of the camera channel may transmit both of such colors or bands of colors and the camera channel may include one or mechanisms elsewhere in the camera channel to separate the two colors or two bands of colors.
  • a color filter array may be disposed between the lens and the sensor array and/or the camera channel may employ a sensor capable of separating the colors or bands of colors.
  • the sensor array may be provided with pixels that have multiband capability, e.g., two or three colors.
  • each pixel may comprise two or three photodiodes, wherein a first photodiode is adapted to detect a first color or first band of colors, a second photodiode is adapted to detect a second color or band of colors and a third photodiode is adapted to detect a third color or band of colors.
  • One way to accomplish this is to provide the photodiodes with different structures/characteristics that make them selective, such that first photodiode has a higher sensitivity to the first color or first band of colors than to the second color or band of colors, and the second photodiode has a higher sensitivity to the second color or second band of colors than to the first color or first band of colors.
  • Another way is to dispose the photodiodes at different depths in the pixel, which takes advantage of the different penetration and absorption characteristics of the different colors or bands of colors. For example, blue and blue bands of colors penetrate less (and are thus absorbed at a lesser depth) than green and green bands of colors, which in turn penetrate less (and are thus absorbed at a lesser depth) than red and red bands of colors.
  • such a sensor array is employed even though the pixels may see only one particular color or band of colors, for example, to in order to adapt such sensor array to the particular color or band of colors.
  • the second camera channel e.g., camera channel 350 B
  • the second camera channel is dedicated to a single color or a single band of colors (e.g., green or a green band), different from the colors or band of colors to which the first camera channel is dedicated.
  • the second camera channel e.g., camera channel 350 B
  • the first camera channel may be dedicated to red or a red band and green or a green band (e.g;, G 1 ).
  • the second camera channel may be dedicated to blue or a blue band and green or a green band (e.g., G 2 ).
  • the two or more camera channels may or may not have the same configuration (e.g., size, shape, resolution, or degree or range of sensitivity) as one another.
  • each of the camera channels has the same size, shape, resolution and/or degree or range of sensitivity as one another.
  • one or more of the camera channels has a size, shape, resolution and/or a degree or range of sensitivity that is different than one or more of the other camera channels.
  • one or more of the camera channels may have a sensor array with fewer pixels than is provided in the sensor array of one or more of the other camera channels, for a comparable portion of the field of view.
  • one of the camera channels may have a sensor array with a size that is different than the size of the sensor array of the other camera channels.
  • the optics portion of such one or more camera channels may have a f/# and/or a focal length that is different from the f/# and/or a focal length of the one or more of the other camera channels.
  • one or more of the camera channels are dedicated to a wavelength or band of wavelengths and the sensor array and/or optics portion of such one or more camera channels are optimized for the respective wavelength or band of wavelengths to which the respective camera channel is dedicated.
  • the design, operation, array size and/or pixel size of each sensor array is optimized for the respective wavelength or bands of wavelengths to which the camera channels are dedicated.
  • the design of each optical portion is optimized for the respective wavelength or bands of wavelengths to which the respective camera channel is dedicated.
  • the two or more camera may be arranged in any manner.
  • the two or more camera channels are arranged in linear array, as shown.
  • the digital camera apparatus employs a processor that is disposed on the same integrated circuit as the sensor arrays.
  • the processor may have any layout, including for example, a layout that is the same as, or similar to, the layouts described herein (see for example, 104 C- 104 E).
  • the processor may have one or more portions that are not disposed on the same integrated circuit as the sensor arrays and/or may not have any portions integrated in or disposed on the same integrated circuit as the sensor arrays (see for example, FIG. 104B ).
  • one or more of the camera channels are connected via one or more communication links to one or more displays.
  • each of the camera channels is connected to a separate display, i.e., the smaller camera channel, e.g., camera channel 350 A, is connected to a first display and the larger camera channel, e.g., camera channel 350 B, is connected to a second display.
  • the first and second displays may or may not have the same characteristics.
  • the first display has a resolution equal to the resolution of the camera channel connected thereto.
  • the second display may have a resolution equal to the resolution of the camera channels connected thereto, however, other resolutions may be employed. Other resolutions may also be employed.
  • FIGS. 105A-105E are schematic representations of digital camera apparatus 300 in accordance with further embodiments of the present invention.
  • the digital camera apparatus include two or more camera channels, e.g., camera channels 350 A- 350 B.
  • a first one of the camera channels, e.g., camera channel 350 A, is smaller in size than a second one of the camera channel, e.g., camera channel 350 B.
  • the smaller camera channel e.g., camera channel 350 A
  • the smaller camera channel, e.g., camera channel 350 A may have a sensor array with fewer pixels than the sensor array of the larger camera channel, e.g., camera channel 350 B, for a comparable portion of the field of view.
  • the number of pixels in the larger camera channel is forty four percent greater than the number of pixels in the smaller camera channel, for a comparable portion of the field of view.
  • the number of pixels in the larger camera channel is thirty six percent greater than the number of pixels in the smaller camera channel, for a comparable portion of the field of view. It should be understood, however, that any other sizes and/or architectures may also be employed.
  • the smaller camera channel e.g., camera channel 350 A
  • the smaller camera channel e.g., camera channel 350 A
  • the pixels in the larger camera channel are forty four percent larger in size (e.g., twenty percent larger in the x direction and twenty percent larger in the y direction) than the pixels in the smaller camera channel.
  • the pixels in the larger camera channel are thirty six percent larger in size (e.g., seventeen percent larger in the x direction and seventeen percent larger in the y direction) than the pixels in the smaller camera channel. It should be understood, however, that any other sizes and/or architectures may also be employed.
  • one of the camera channels is a broadband camera channel, an infrared (IR) camera channel or an ultraviolet (UV) camera channel.
  • the first camera channel i.e., the smaller camera channel
  • the second camera channel i.e., the larger camera channel
  • a single color or single band of colors e.g., green or a green band
  • one of the camera channels e.g., the smaller camera channel
  • the lens and/or filter of the camera channel may transmit both of such colors or bands of colors and the camera channel may include one or mechanisms elsewhere in the camera channel to separate the two colors or two bands of colors.
  • a color filter array may be disposed between the lens and the sensor array and/or the camera channel may employ a sensor capable of separating the colors or bands of colors.
  • the senor may be provided with sensor elements or pixels that each comprise two photodiodes, wherein the first photodiode is adapted to detect the a first color or first band of colors and the second photodiode is adapted to detect the second color or band of colors.
  • One way to accomplish this is to provide the photodiodes with different structures/characteristics that make them selective, such that first photodiode has a higher sensitivity to the first color or first band of colors than to the second color or band of colors, and the second photodiode has a higher sensitivity to the second color or second band of colors than to the first color or first band of colors.
  • Another way is to dispose the photodiodes at different depths in the pixel, which takes advantage of the different penetration and absorption characteristics of the different colors or bands of colors. For example, blue and blue bands of colors penetrate less (and are thus absorbed at a lesser depth) than green and green bands of colors, which in turn penetrate less (and are thus absorbed at a lesser depth) than red and red bands of colors.
  • the digital camera apparatus employs a processor that is disposed on the same integrated circuit as the sensor arrays.
  • the processor may have any layout, including for example, a layout that is the same as, or similar to, the layouts described herein (see for example, 105 C- 105 E).
  • the processor may have one or more portions that are not disposed on the same integrated circuit as the sensor arrays and/or may not have any portions integrated in or disposed on the same integrated circuit as the sensor arrays (see for example, FIG. 105B ).
  • each of the embodiments described above may be used alone or in combination with any other embodiment(s) or portion thereof described herein or known to those of ordinary skill in the art.
  • the smaller camera channel is dedicated to two or more separate colors (or two or more separate bands of colors) and in addition, has a resolution that is less than the resolution of the larger camera channel.
  • the camera channels are connected via one or more communication links to one or more displays.
  • each of the camera channels is connected to a separate display, i.e., the smaller camera channel, e.g., camera channel 350 A, is connected to a first display and the larger camera channel, e.g., camera channel 350 B, is connected to a second display, different than the first display.
  • the first and second displays may or may not have the same characteristics.
  • the first display has a resolution equal to the resolution of the camera channel connected thereto.
  • the second display may have a resolution equal to the resolution of the camera channels connected thereto, however, other resolutions may be employed.
  • FIGS. 106A-106C are schematic perspective views of a system having a plurality of digital camera apparatus, e.g., two digital camera apparatus, in accordance with another embodiment of the present invention.
  • the plurality of digital camera apparatus may be arranged in any desired manner. In some embodiments, it may be desired to collect images from opposing directions. In some embodiments, the digital camera apparatus are mounted back to back, as shown. Some of such embodiments may allow concurrent imaging in opposing directions.
  • the one or more optics portions for the first camera subsystem face in a direction that is opposite to the direction that the one or more optics portions for the second digital camera apparatus face.
  • the system has first and second sides generally opposite one another.
  • a first one of the digital camera apparatus may be positioned to receive light through a first side of the digital camera apparatus.
  • a second one of the digital camera apparatus may be positioned to receive light through the second side of the system.
  • Other configurations may also be employed.
  • each of the subsystems has its own sets of optics, filters and sensors arrays, and may or may not have the same applications and/or configurations as one another, for example, in some embodiments, one of the subsystems may be a color system and the other may be a monochromatic system, one of the subsystems may have a first field of view and the other may have a separate field of view, one of the subsystems may provide video imaging and the other may provide still imaging.
  • the plurality of digital camera subassemblies may have any size and shape and may or may not have the same configuration as one another (e.g., type, size, shape, resolution).
  • one of the subsystems has a length and a width that are equal to the length and width, respectively of the other subsystem, although this is not required.
  • one or more sensor portions for the second digital camera apparatus are disposed on the same device (e.g., image device) as one or more sensor portions for the first digital camera apparatus. In some embodiments, one or more sensor portions for the second digital camera apparatus are disposed on a second device (e.g., a second image device), which may be disposed, for example, adjacent to the image device on which the one or more sensor portions for the first digital camera apparatus are disposed.
  • a second device e.g., a second image device
  • two or more of the digital camera apparatus share a processor, or a portion thereof. In some other embodiments, each of the digital camera apparatus has its own dedicated processor separate from the processor for the other digital camera apparatus.
  • the system defines a hermetic package, although this is not required.
  • this embodiment of the present invention may be employed alone or in combination with one or more of the other embodiments disclosed herein, or portion thereof.
  • the digital camera apparatus may be assembled and/or mounted in any manner, for example, but not limited to in a manner similar to that employed in one or more of the embodiments disclosed herein.
  • FIGS. 107A-107B are a schematic representation of another embodiment.
  • This embodiment includes a plurality of image devices.
  • each of the each image devices has one or more sensor arrays for one or more camera channels.
  • the image devices may or may not be similar to one another.
  • the digital camera subassembly may or may not have such a configuration.
  • the one or more camera channels of a digital camera subassembly may have any configuration.
  • some embodiments may have the form of a layered assembly.
  • Some other embodiments may not have the form of a layered assembly.
  • FIGS. 108A-108B are a schematic representation of digital camera sub assemblies in accordance with further embodiments of the present invention.
  • the digital camera subassemblies each employ one or more of the embodiments described herein, or portions thereof. However, the digital camera subassemblies may or may not have the form of a layered assembly.
  • the digital camera assembly includes one or more camera channels.
  • the camera channels may have any configurations and may or may not have the same configuration as one another.
  • each of the camera channels comprises a 2 M pixel narrow band camera, e.g., a red camera channel, a blue camera channel and a green camera channel.
  • each of the camera channels comprises a 1.3 M pixel narrow band camera, e.g., a red camera channel, a blue camera channel and a green camera channel.
  • one of the camera channels is a broadband camera channel, an infrared (IR) camera channel or an ultraviolet (UV) camera channel.
  • this embodiment of the present invention may be employed alone or in combination with one or more of the other embodiments disclosed herein, or portion thereof.
  • each optics portion relative to the respective sensor portion is fixed.
  • one or more actuators may be provided to provide movement of one or more of the optics portions, or portions thereof, and/or one or more sensor arrays, or portions thereof.
  • one or more of such actuators are provided in the support (such a support may comprise, for example, a frame provided with one or more actuators).
  • an optics portion or one or more portions thereof
  • a sensor array or one or more portions thereof
  • relative movement between an optics portion and a sensor array including, for example, but not limited to relative movement in the x and/or y direction, z direction, tilting, rotation (e.g., rotation of less than, greater than and/or equal to 360 degrees) and/or combinations thereof, may be used in providing various features and/or in the various applications disclosed herein, including, for example, but not limited to, increasing resolution (e.g., increasing detail), zoom, 3D enhancement, image stabilization, image alignment, lens alignment, masking, image discrimination, auto focus, mechanical shutter, mechanical iris, hyperspectral imaging, a snapshot mode, range finding and/or combinations thereof.
  • Such movement may be provided for example using actuators, e.g., MEMS actuators and by applying appropriate control signal(s) to one or more of the actuators to cause the one or more actuators to move, expand and/or contract to thereby move the associated optics portion. It may be advantageous to make the amount of movement equal to a small distance, e.g., 2 microns (2 um), which may be sufficient for many applications. In some embodiments, for example, the amount of movement may be as small as about 1 ⁇ 2 of the width of one sensor element (e.g., 1 ⁇ 2 of the width of one pixel) on one of the sensor arrays. In some embodiments, for example, the magnitude of movement may be equal to the magnitude of the width of one sensor element or two times the magnitude of the width of one sensor element.
  • the relative movement is in the form of a 1 ⁇ 3 pixel ⁇ 1 ⁇ 3 pixel pitch shift in a 3 ⁇ 3 format. In other embodiments, the relative movement is in the form of dithering. In some dithered systems, it may be desirable to employ a reduced optical fill factor. In some embodiments, snap-shot integration is employed. Some embodiments provide the capability to read out a signal while integrating.
  • the digital camera apparatus employs relative movement by itself, in lieu of or in combination with one or more embodiments disclosed herein in providing various features and/or in the various applications disclosed herein, for example, but not limited to, increasing resolution (e.g., increasing detail), zoom, 3D effects, image stabilization, image alignment, lens alignment, masking, image discrimination, auto focus, auto exposure, mechanical shutter, mechanical iris, hyperspectral imaging, snapshot mode, range finding and/or combinations thereof.
  • increasing resolution e.g., increasing detail
  • zoom 3D effects
  • image stabilization image alignment
  • lens alignment masking
  • image discrimination auto focus
  • auto exposure auto exposure
  • mechanical shutter mechanical iris
  • hyperspectral imaging snapshot mode
  • range finding and/or combinations thereof range finding and/or combinations thereof.
  • FIGS. 109A-109D are block diagram representation showing configurations employed in some embodiments of the present invention.
  • the processor may have any configuration and may be disposed in any location or locations.
  • one, some or all portions of the processor are disposed on the same substrate or substrates as one or more of the one or more of the sensor arrays, e.g., sensor arrays 310 A- 310 D.
  • one, some or all portions of the processor are disposed on one or more substrates that are separate from (and possibly remote from) one or more substrates on which one or more of the one or more sensor arrays, e.g., sensor arrays 310 A- 310 D, may be disposed.
  • one or more portions of the digital camera apparatus include circuitry to facilitate wired, wireless and/or optical communication to and/or from the subsystem and/or within the subsystem.
  • Such circuitry may have any form.
  • one or more portions of such circuitry may be part of the processor 340 and may be disposed in the same integrated circuit as one or more other portions of the processor 340 and/or may be in a discrete form, separate from the processor 340 or other portions thereof.
  • FIG. 110A is a block diagram representation of the processor 340 in accordance with one embodiment of aspects of the present invention.
  • the processor 340 includes one or more channel processors, one or more image pipelines, and/or one or more image post processors.
  • Each of the channel processors is coupled to a respective one of the camera channels and generates an image based at least in part on the signal(s) received from the respective camera channel.
  • the processor 340 generates a combined imaged based at least in part on the images from two or more of the camera channels.
  • one or more of the channel processors are tailored to its respective camera channel, for example, as described herein.
  • the respective channel processor may also be adapted to such wavelength or color (or band of wavelengths or colors). Any of the other embodiments described herein or combinations thereof, may also be employed.
  • the gain, noise reduction, dynamic range, linearity and/or any other characteristic of the processor, or combinations of such characteristics may be adapted to improve and/or optimize the processor to such wavelength or color (or band of wavelengths or colors). Tailoring the channel processing to the respective camera channel may help to make it possible to generate an image of a quality that is higher than the quality of images resulting from traditional image sensors of like pixel count.
  • providing each camera channel with a dedicated channel processor may help to reduce or simplify the amount of logic in the channel processors as the channel processor may not need to accommodate extreme shifts in color or wavelength, e.g., from a color (or band of colors) or wavelength (or band of wavelengths) at one extreme to a color (or band of colors) or wavelength (or band of wavelengths) at another extreme
  • the images (and/or data which is representative thereof) generated by the channel processors are supplied to the image pipeline, which may combine the images to form a full color or black/white image.
  • the output of the image pipeline is supplied to the post processor, which generates output data in accordance with one or more output formats.
  • FIG. 110B shows one embodiment of a channel processor.
  • the channel processor includes column logic, analog signal logic, black level control and exposure control.
  • the column logic is coupled to the sensor and reads the signals from the pixels. If the channel processor is coupled to a camera channel that is dedicated to a specific wavelength (or band of wavelengths), it may be advantageous for the column logic to be adapted to such wavelength (or band of wavelengths).
  • the column logic may employ an integration time or integration times adapted to provide a particular dynamic range in response to the wavelength (or band of wavelengths) to which the color channel is dedicated.
  • the column logic in one of the channel processors may employ an integration time or times that is different than the integration time or times employed by the column logic in one or more of the other channel processors.
  • the analog signal logic receives the output from the column logic. If the channel processor is coupled to a camera channel dedicated to a specific wavelength or color (or band of wavelengths or colors), it may be advantageous for the analog signal logic to be specifically adapted to such wavelength or color (or band of wavelengths or colors). As such, the analog signal logic can be optimized, if desired, for gain, noise, dynamic range and/or linearity, etc. For example, if the camera channel is dedicated to a specific wavelength or color (or band of wavelengths or colors), dramatic shifts in the logic and settling time may not be required as each of the sensor elements in the camera channel are dedicated to the same wavelength or color (or band of wavelengths or colors). By contrast, such optimization may not be possible if the camera channel must handle all wavelength and colors and employs a Bayer arrangement in which adjacent sensor elements are dedicated to different colors, e.g., red-blue, red-green or blue-green.
  • the output of the analog signal logic is supplied to the black level logic, which determines the level of noise within the signal, and filters out some or all of such noise. If the sensor coupled to the channel processor is focused upon a narrower band of visible spectrum than traditional image sensors, the black level logic can be more finely tuned to eliminate noise. If the channel processor is coupled to a camera channel that is dedicated to a specific wavelength or color (or band of wavelengths or colors), it may be advantageous for the analog signal logic to be specifically adapted to such wavelength or color (or band of wavelengths or colors).
  • the output of the black level logic is supplied to the exposure control, which measures the overall volume of light being captured by the array and adjusts the capture time for image quality.
  • Traditional cameras must make this determination on a global basis (for all colors).
  • the exposure control can be specifically adapted to the wavelength (or band of wavelengths) to which the sensor is targeted.
  • Each channel processor is thus able to provide a capture time that is specifically adapted to the sensor and/or specific color (or band of colors) targeted thereby and different than the capture time provided by one or more of the other channel processors for one or more of the other camera channels.
  • FIG. 110C shows one embodiment of the image pipeline.
  • the image pipeline includes two portions.
  • the first portion includes a color plane integrator and an image adjustor.
  • the color plane integrator receives an output from each of the channel processors and integrates the multiple color planes into a single color image.
  • the output of the color plane integrator which is indicative of the single color image, is supplied to the image adjustor, which adjusts the single color image for saturation, sharpness, intensity and hue.
  • the adjustor also adjusts the image to remove artifacts and any undesired effects related to bad pixels in the one or more color channels.
  • the output of the image adjustor is supplied to the second portion of the pipeline, which provides auto focus, zoom, windowing, pixel binning and camera functions.
  • FIG. 110D shows one embodiment of the image post processor.
  • the image post processor includes an encoder and an output interface.
  • the encoder receives the output signal from the image pipeline and provides encoding to supply an output signal in accordance with one or more standard protocols (e.g., MPEG and/or JPEG).
  • the output of the encoder is supplied to the output interface, which provides encoding to supply an output signal in accordance with a standard output interface, e.g., universal serial bus (USB) interface.
  • a standard output interface e.g., universal serial bus (USB) interface.
  • FIG. 110E shows one embodiment of the system control.
  • the system control portion includes a serial interface, configuration registers, power management, voltage regulation and control, timing and control, a camera control interface and a serial interface.
  • the camera interface comprises an interface that processes signals that are in the form of high level language (HLL) instructions.
  • HLL high level language
  • the camera interface comprises an interface that processes control signals that are in the form of low level language (LLL) instructions and/or of any other form now known or later developed. Some embodiments may process both HLL instructions and LLL instructions.
  • communication occurs through the serial interface which is connected to a serial port.
  • signals indicative of instructions e.g., HLL camera control instructions
  • desired settings, operations and/or data are supplied to the serial interface and control portion through the through the serial port.
  • signals indicative of a HLL camera control instruction i.e., a HLL instruction having to do with the camera
  • signals indicative of the desired settings, operations and/or data are supplied to the configuration registers to be stored therein.
  • the signals are indicative of a HLL camera control instruction, then the HLL instruction is supplied to the HLL camera control interface.
  • the HLL camera control interface decodes the instruction to generate signals indicative of desired (by the user or other device) settings, operations and/or data, which are supplied to the configuration registers to be stored therein.
  • Signals indicative of the desired settings, operations and/or data are supplied to the power management, sensor timing and control portion, channel processors, image pipeline and image post processor, as appropriate.
  • the power management portion receives the signals supplied and, in response at least thereto, supplies control signals to the voltage regulation power and control portion, which in turn connects to circuits in the digital camera apparatus.
  • the sensor timing and control portion receives the signals supplied and, in response at least thereto, supplies control signals to the sensor arrays to control the operation thereof.
  • the channel processors receive the signals supplied through (or lines), and further receives one or more signals from one or more of the sensor arrays and performs, in response at least thereto, one or more channel processor operations.
  • the image pipeline receives the signals and further receives one or more signals from one or more of the channel processors and performs, in response at least thereto, one or more image pipeline operations.
  • the image post processor receives the signals and further receives one or more signals from the image pipeline and performs, in response at least thereto, one or more image post processor operations.
  • FIG. 110F shows an example of a high level language camera control instruction, according to one embodiment of the present invention.
  • the instruction format has an op code, e.g., COMBINE, which in this case identifies the instruction as a type of camera control instruction and requests that the digital camera apparatus generate a combined image.
  • the instruction format also has one or more operands fields, e.g., channel id 1 , channel id 2 , which identify the camera channels to be used in generating the combined image, at least in part.
  • the term “combined image” means an image based, at least in part, on information captured by two or more camera channels.
  • the combined image may be generated in any manner.
  • Example camera channels include but are not limited to camera channels 350 A- 350 D.
  • HLL camera control instruction that uses the instruction format of FIG. 110E is “COMBINE 1 , 2 ””—this instruction calls for an output image based at least in part on information captured by a camera channel designated as “camera channel 1 ”, e.g., camera channel 350 A, and a camera channel designated as “camera channel 2 ”, e.g., camera channel 350 B.
  • COMBINE 1 , 2 , 3 , 4 this instruction calls for an output image based at least in part on information captured by a camera channel designated as “camera channel 1 ”, e.g., camera channel 350 A, and a camera channel designated as “camera channel 2 ”, e.g., camera channel 350 B, a camera channel designated as “camera channel 3 ”, e.g., camera channel 350 C, and a camera channel designated as “camera channel 4 ”, e.g., camera channel 350 D.
  • camera channel 1 e.g., camera channel 350 A
  • camera channel 2 e.g., camera channel 350 B
  • camera channel 3 e.g., camera channel 350 C
  • camera channel 4 e.g., camera channel 350 D.
  • COMBINE and other HLL instruction for the digital camera apparatus provides instructions in a form that is closer to human language than is the form of machine language and/or assembly language, thereby helping to bring about writing, reading and/or maintaining programs for the digital camera apparatus.
  • the camera channels are not specified in the instruction, but rather are implied, for example, based on the op code.
  • the digital camera apparatus may be configured, for example, to automatically generate a combined image based at least in part on a group of predetermined camera channels whenever a COMBINE instruction is supplied.
  • a plurality of different COMBINE or other HLL instructions may be supported, each having a different op code. The different op codes may implicitly identify the particular camera channels of interest.
  • the instruction “COMBINE 12 ” may call for an output image based at least in part on information captured by a camera channel designated as “camera channel 1 ”, e.g., camera channel 350 A, and a camera channel designated as “camera channel 2 ”, e.g., camera channel 350 B.
  • the instruction “COMBINE 1234 ” may call for an output image based at least in part on information captured by a camera channel designated as “camera channel 1 ”, e.g., camera channel 350 A, and a camera channel designated as “camera channel 2 ”, e.g., camera channel 350 B, a camera channel designated as “camera channel 3 ”, e.g., camera channel 350 C, and a camera channel designated as “camera channel 4 ”, e.g., camera channel 350 D.
  • a single COMBINE instruction causes more than one combined image to be generated.
  • the camera channels of interest for the additional(s) combined images may be implied based on the opcode (e.g., as discussed above). Alternatively, for example the camera channels of interest for the additional combined images may be implied based on the supplied operands.
  • FIG. 110G shows high level language instructions in accordance with further embodiments of the present invention.
  • one or more of the instructions may cause the camera interface to initiate the operation suggested thereby. For example, if the instruction “Whte Balance Manual” is received, the camera interface may instruct the white balance control to operate in manual mode and/or initiate signals that eventually cause the camera to operate in such a mode.
  • These instructions may be used, for example, to control the camera set-up and/or the operating mode of one or more aspects of the camera that have two or more states, e.g., “on/off” and/or “manual/auto”.
  • Some embodiments include one, some or all of the instructions of FIG. 110G . Some other embodiments may not employ any of the instructions listed in FIG. 110G .
  • FIG. 110H shows high level language instructions in accordance with further embodiments of the present invention.
  • one or more of the instructions may cause the camera interface to initiate the operation suggested thereby. For example, if the instruction “Single Frame Capture” is received, the camera interface may initiate capture of a single frame.
  • Some embodiments include one, some or all of the instructions of FIG. 110H . Some other embodiments may not employ any of the instructions listed in FIG. 110H . Some embodiments may include one or more instructions from FIG. 110G and one or more instructions from FIG. 110H , alone and/or in combination with signals of any other form.
  • the camera interface can be configured to provide limited access to Low Level Commands to provide specific user defined functionality.
  • the form of the signals for the camera interface may be predetermined, adaptively determined and/or user determined.
  • a user may define an instruction set and/or a format for the interface.
  • the camera interface is not limited to embodiments that employ a HLL camera control interface.
  • the camera interface may have any configuration.
  • the camera interface comprises an interface that processes control signals that are in the form of low level language (LLL) instructions and/or of any other form now known or later developed. Some embodiments may process both HLL instructions and LLL instructions.
  • LLL low level language
  • processor 340 is not limited to the portions and/or operations set forth above.
  • the processor 340 may comprise any type of portions or combination thereof and/or may carry out any operation or operations.
  • the processor 340 may be implemented in any manner.
  • the processor 340 may be programmable or non programmable, general purpose or special purpose, dedicated or non dedicated, distributed or non distributed, shared or not shared, and/or any combination thereof. If the processor 340 has two or more distributed portions, the two or more portions may communicate via one or more communication links.
  • a processor may include, for example, but is not limited to, hardware, software, firmware, hardwired circuits and/or any combination thereof. In some embodiments, one or more portions of the processor 340 may be implemented in the form of one or more ASICs.
  • the processor 340 may or may not execute one or more computer programs that have one or more subroutines, or modules, each of which may include a plurality of instructions, and may or may not perform tasks in addition to those described herein. If a computer program includes more than one module, the modules may be parts of one computer program, or may be parts of separate computer programs. As used herein, the term module is not limited to a subroutine but rather may include, for example, hardware, software, firmware, hardwired circuits and/or any combination thereof.
  • the processor 340 includes circuitry to facilitate wired, wireless and/or optical communication to and/or from the digital camera apparatus. Such circuitry may have any form. In some embodiments, one or more portions of such circuitry is disposed in the same integrated circuit as the other portions of the processor 340 . In some embodiments, one or more portions of such circuitry are in a discrete form, separate from the integrated circuit for the other portions of the processor 340 or portions thereof.
  • the processor 340 comprises at least one processing unit connected to a memory system via an interconnection mechanism (e.g., a data bus).
  • a memory system may include a computer-readable and writeable recording medium. The medium may or may not be non-volatile. Examples of non-volatile medium include, but are not limited to, magnetic disk, magnetic tape, non-volatile optical media and non-volatile integrated circuits (e.g., read only memory and flash memory). A disk may be removable, e.g., known as a floppy disk, or permanent, e.g., known as a hard drive. Examples of volatile memory include but are not limited to random access memory, e.g., dynamic random access memory (DRAM) or static random access memory (SRAM), which may or may not be of a type that uses one or more integrated circuits to store information.
  • DRAM dynamic random access memory
  • SRAM static random access memory
  • the processor 340 executes one or more computer programs
  • the one or more computer programs may be implemented as a computer program product tangibly embodied in a machine-readable storage medium or device for execution by a computer.
  • the processor 340 is a computer, such computer is not limited to a particular computer platform, particular processor, or programming language.
  • Computer programming languages may include but are not limited to procedural programming languages, object oriented programming languages, and combinations thereof.
  • a computer may or may not execute a program called an operating system, which may or may not control the execution of other computer programs and provides scheduling, debugging, input/output control, accounting, compilation, storage assignment, data management, communication control, and/or related services.
  • a computer may for example be programmable using a computer language such as C, C++, Java or other language, such as a scripting language or even assembly language.
  • the computer system may also be specially programmed, special purpose hardware, or an application specific integrated circuit (ASIC).
  • ASIC application specific integrated circuit
  • Example output devices include, but are not limited to, displays(e.g., cathode ray tube (CRT) devices, liquid crystal displays (LCD), plasma displays and other video output devices), printers, communication devices for example modems, storage devices such as a disk or tape and audio output, and devices that produce output on light transmitting films or similar substrates.
  • An output device may include one or more interfaces to facilitate communication with the output device.
  • the interface may be any type of interface, e.g., proprietary or not proprietary, standard (for example, universal serial bus (USB) or micro USB) or custom or any combination thereof.
  • Example input devices include but are not limited to buttons, knobs, switches, keyboards, keypads, track ball, mouse, pen and tablet, light pen, touch screens, and data input devices such as audio and video capture devices.
  • An output device may include one or more interfaces to facilitate communication with the output device.
  • the interface may be any type of interface, for example, but not limited to, proprietary or not proprietary, standard (for example, universal serial bus (USB) or micro USB) or custom or any combination thereof.
  • Input signals to the processor 340 may have any form and may be supplied from any source, for example, but not limited to, one or more sources within the digital camera apparatus (e.g., the user peripheral interface on the digital camera) and/or one or more other devices.
  • the peripheral user interface includes one or more input devices by which a user can indicate one or more preferences in regard to one or more desired operating modes (e.g., resolution, manual exposure control) and the peripheral user interface generates one or more signals indicative of such preference or preferences.
  • one or more portions of the processor 340 generates one or more signals indicative of one or more desired operating mode.
  • the one or more portions of the processor 340 generates one or more of such signals in response to one or more inputs from the peripheral user interface.
  • one or more portions of the digital camera apparatus include circuitry to facilitate wired, wireless and/or optical communication to and/or from the subsystem and/or within the subsystem.
  • Such circuitry may have any form.
  • one or more portions of such circuitry may be part of the processor 340 and may be disposed in the same integrated circuit as one or more other portions of the processor 340 and/or may be in a discrete form, separate from the processor 340 or other portions thereof.
  • the digital camera apparatus includes a memory section that is supplied with and/or stores one, some or all of the images and/or other information generated or used by the digital camera apparatus and/or or any other information from any source and desired to be stored for any duration.
  • the memory section may supply one or more of such images and/or such other information to one or more other devices and/or to one or more portions of the processor 340 , for example, to be further processed and/or to be supplied to one or more other devices.
  • the memory section may be, for example, part of the processor 340 and/or coupled to one or more portions of the processor 340 via one or more communication links. In some embodiments, the memory section is also coupled to one or more other devices via one or more communication links.
  • the memory section may supply one or more of the stored images and/or other information to one or more of the one or more other devices, directly (i.e., without passing through the any other portion of the processor 340 ) via one or more of the one or more communication links, although this is not required.
  • FIG. 111A shows another embodiment of the channel processor.
  • the channel processor includes a double sampler, an analog to digital converter, a black level clamp and a deviant pixel correction.
  • An image may be represented as a plurality of picture element (pixel) magnitudes.
  • Each pixel magnitude indicates the picture intensity (relative darkness or relative lightness) at an associated location of the image.
  • a relatively low pixel magnitude indicates a relatively low picture intensity (i.e., relatively dark location).
  • a relatively high pixel magnitude indicates a relatively high picture intensity (i.e., relatively light location).
  • the pixel magnitudes are selected from a range that depends on the resolution of the sensor.
  • FIG. 111B is a graphical representation of a neighborhood of pixel values.
  • FIG. 111B further illustrates a plurality of prescribed spatial directions, namely, a first prescribed spatial direction (e.g., the horizontal direction), a second prescribed spatial direction (e.g., the vertical direction), a third prescribed spatial direction (e.g., a first diagonal direction), and a fourth prescribed spatial direction (e.g., a second diagonal direction).
  • the pixel P 22 is adjacent to pixels P 12 , P 21 , P 32 and P 23 .
  • the pixel P 22 is offset in the horizontal direction from the pixel P 32 .
  • the pixel P 22 is offset in the vertical direction from the pixel P 23 .
  • the pixel P 22 is offset in the first diagonal direction from the pixel P 11 .
  • the pixel P 22 is offset in the second diagonal direction from the pixel P 31 .
  • the double sampler determines the amount by which the value of each pixel changes during the exposure period, thereby in effect providing an estimate of the amount of light received by each pixel during an exposure period.
  • a pixel may have a first value, Vstart, prior to an exposure period.
  • the first value, Vstart may or may not be equal to zero.
  • the same pixel may have a second value, Vend, after the exposure period.
  • the difference between the first and second values, i.e., Vend-Vstart is indicative of the amount of light received by the pixel.
  • FIG. 111C shows a flowchart of operations employed in this embodiment of double sampling.
  • the value of a plurality of pixels in a sensor array are reset to an initial state prior to the beginning of an exposure period.
  • the value of each pixel is sampled prior to the start of an exposure period.
  • the value of each pixel is sampled after the exposure period and signals indicative thereof are supplied to the double sampler.
  • the double sampler generates a signal for each pixel, indicative of the difference between the start and end values for such pixel.
  • each difference signal is indicative of the amount of light received at a respective location of the sensor array.
  • a difference signal with a relatively low magnitude indicates that a relatively low amount of light is received at the respective location of the sensor array.
  • a difference signal with a relatively high magnitude indicates that a relatively high amount of light is received at the respective location of the sensor array.
  • the difference signals generated by the double sampler are supplied to an analog to digital converter, which samples each of such signals and generates a sequence of multi-bit digital signals in response thereto, each multi-bit digital signal being indicative of a respective one of the difference signals.
  • the multi-bit digital signals are supplied to a black level clamp, which compensates for drift in the sensor array of the camera channel.
  • the difference signals should have a magnitude equal to zero unless the pixels are exposed to light.
  • the value of the pixels may change (e.g., increase) even without exposure to light.
  • a pixel may have a first value, Vstart, prior to an exposure period.
  • the same pixel may have a second value, Vend, after the exposure period. If drift is present, the second value may not be equal to the first value, even if the pixel was not exposed to light.
  • the black level clamp compensates for such drift.
  • a permanent cover is applied over one or more portions (e.g., one or more rows and/or one or more columns) of the sensor array to prevent light from reaching such portions.
  • the cover is applied, for example, during manufacture of the sensor array.
  • the difference signals for the pixels in the covered portion(s) can be used in estimating the magnitude (and direction) of the drift in the sensor array.
  • the black level clamp generates a reference value (which represents an estimate of the drift within the sensor array) having a magnitude equal to the average of the difference signals for the pixels in the covered portion(s).
  • the black level clamp thereafter compensates for the estimated drift by generating a compensated difference signal for each of the pixels in the uncovered portions, each compensated difference signal having a magnitude equal to the magnitude of the respective uncompensated difference signal reduced by the magnitude of the reference value (which as stated above, represents an estimate of the drift).
  • the output of the black level clamp is supplied to the deviant pixel identifier, which seeks to identify defective pixels and help reduce the effects thereof.
  • a defective pixel is defined as pixel for which one or more values, difference signal and/or compensated difference signal fails to meet one or more criteria, in which case one or more actions are then taken to help reduce the effects of such pixel.
  • a pixel is defective if the magnitude of the compensated difference signal for the pixel is outside of a range of reference values (i.e., less than a first reference value or greater than a second reference value).
  • the range of reference values may be a predetermined, adaptively determined and/or any combination thereof.
  • the magnitude of the compensated difference signal is set equal to a value that is based, at least in part, on the compensated difference signals for one or more pixels adjacent to the defective pixel, for example, an average of the pixel offset in the positive x direction and the pixel offset in the negative x direction.
  • FIG. 111D shows a flowchart of operations employed in this embodiment of the defective pixel identifier.
  • the magnitude of each compensated difference signal is compared to a range of reference values. If a magnitude of a compensated difference signal is outside of the range of reference values, then the pixel is defective and the magnitude of difference signal is set to a value in accordance with the methodology set forth above.
  • FIG. 111E shows another embodiment of the image pipeline.
  • the image pipeline includes an image plane integrator, image plane alignment and stitching, exposure control, focus control, zoom control, gamma correction, color correction, edge enhancement, chroma noise reduction, white balance, color enhancement, image scaling and color space conversion.
  • the output of a channel processor is a data set that represents a compensated version of the image captured by the camera channel.
  • the data set may be output as a data stream.
  • the output from the channel processor for camera channel A represents a compensated version of the image captured by camera channel A and may be in the form of a data stream P A1 , P A2 , . . . P An .
  • the output from the channel processor for camera channel B represents a compensated version of the image captured by camera channel B and may be in the form of a data stream P B1 , P B2 , . . . P Bn .
  • the output from the channel processor for camera channel C represents a compensated version of the image captured by camera channel C and is in the form of a data stream P C1 , P C2 , . . . P Cn .
  • the output from the channel processor for camera channel D represents a compensated version of the image captured by camera channel D and is in the form of a data stream P D1 , P D2 , . . . P Dn .
  • the image plane integrator receives the data from each of the two or more channel processors and combines such data into a single data set, e.g., P A1 , P B1 , P C1 , P D1 , P A2 , P B 2 , P C2 , P D2 , P A3 , P B3 , P C3 , P D3 , P An , P Bn , P Cn , P Dn .
  • FIG. 111F shows one embodiment of the image plane integrator.
  • the image plane integrator includes a multiplexer and a multi-phase phase clock.
  • the multiplexer has a plurality of inputs in 0 , in 1 , in 2 , in 3 , each of which is adapted to receive a stream (or sequence) of multi-bit digital signals.
  • the data stream of multi-bit signals, P A1 , P A2 , . . . P An from the channel processor for camera channel A is supplied to input in 0 .
  • the data stream P B1 , P B2 , . . . P Bn from the channel processor for camera channel B is supplied to input in 1 .
  • the data stream P C1 , P C2 , . . . P Cn from the channel processor for camera channel C is supplied to input in 2 .
  • the multiplexer has an output, out, that supplies a multi-bit output signal. Note that in some embodiments, the multiplexer comprises of a plurality of four input multiplexers each of which is one bit wide.
  • the multi-phase clock has an input enable that receives a signal.
  • the multi-phase clock has outputs, c 0 , c 1 , which are supplied to the inputs s 0 , s 1 of the multiplexer.
  • the multi-phase clock has four phases, shown in FIG. 111G .
  • the operation of the image plane integrator is as follows.
  • the integrator has two states. One state is a wait state. The other state is a multiplexing state. Selection of the operating state is controlled by the logic state of the enable signal supplied to the multi-phase clock.
  • the multiplexing state has four phases, which correspond to the four phases of the multi-phase clock.
  • phase 0 neither of the clock signals c 1 , c 0 are asserted causing the multiplexer to output one of the multi-bit signals from the A camera channel, e.g., P A1 .
  • clock signals c 0 is asserted causing the multiplexer to output one of the multi-bit signals from the B camera channel, e.g., P B1 .
  • phase 2 clock signal c 1 , is asserted causing the multiplexer to output one of the multi-bit signals from the C camera channel, e.g., P C1 .
  • phase 0 both of the clock signals c 1 , c 0 are asserted causing the multiplexer to output one of the multi-bit signals from the D camera channel, e.g., P D1 .
  • the clock returns to phase 0 , causing the multiplexer to output another one of the multi-bit signals from the A camera channel, e.g., P A2 .
  • the multiplexer outputs another one of the multi-bit signals from the B camera channel, e.g., P B2 .
  • the multiplexer outputs another one of the multi-bit signals from the C camera channel, e.g., P C2 .
  • the multiplexer outputs another one of the multi-bit signals from the D camera channel, e.g., P D2 .
  • This operation is repeated until the multiplexer has output the last multi-bit signal from each of the camera channels, e.g., P An , P Bn , P Cn , and P Dn .
  • the output of the image plane integrator is supplied to the image planes alignment and stitching portion.
  • the purpose of this portion is to determine how the images should be aligned so that a target captured by different camera channels is aligned at the same position within the respective images e.g., to make sure that a target captured by different camera channels appears at the same place within each of the camera channel images).
  • our eyes are good example of 2 channel image plane system.
  • we hold a pencil about 1 ft in front of our eyes close our left eye and use our right eye to see the pencil, we will see the pencil at a particular location that is different than when we close our right eye and use the left eye to see the pencil.
  • our brain only receives 1 image at a time and wouldn't correlate it with the other image from the other eye that was received at different time.
  • our brain will receive the 2 images of the pencil at the same time. In this case, our brain will automatically try to align the 2 images of the same pencil and we will perceive a single image of a pencil in front of us, except this one becomes a stereo image.
  • the automatic image planes alignment and stitching portion determines how the 2, 3, 4, 5 or more image channels should be aligned.
  • FIGS. 111H-111J are explanatory views showing representations of images generated by three camera channels, e.g., camera channels 350 A, 350 B, 350 C, respectively, arranged in a triangular constellation in accordance with one embodiment of the present invention and employed in one embodiment of the automatic image planes alignment and stitching portion.
  • three camera channels e.g., camera channels 350 A, 350 B, 350 C, respectively, arranged in a triangular constellation in accordance with one embodiment of the present invention and employed in one embodiment of the automatic image planes alignment and stitching portion.
  • Each image has a plurality of pixels arranged in a plurality of rows. More particularly, the image for a first camera channel, e.g., camera channel 350 A, has rows 1 - n .
  • a reference line identifies a horizontal reference point (e.g., midpoint) in the image for the first camera channel.
  • a reference line identifies a horizontal reference point (e.g., midpoint) in the image for the second camera channel.
  • a reference line identifies a horizontal reference point (e.g., midpoint) in the image for the third camera channel.
  • An object appears in each of the three images.
  • the object appears at a different position in each image, for example as a result of spatial offset between the camera channels.
  • the object has two edges that intersect at an apex.
  • the apex appears in row 2 and in line with the horizontal reference point.
  • the apex appears in row 3 and to the left of the horizontal reference point.
  • the apex appears in row 3 and to the right of the horizontal reference point.
  • FIGS. 111K-111Q are explanatory views showing a representation of a process carried out by the automatic image alignment portion for the system with three camera channels, in accordance with one embodiment of the present invention.
  • the automatic image alignment performs vertical and horizontal alignment.
  • vertical alignment may be performed first, although any order could be employed.
  • the portion uses one of the images (e.g., the image for the first camera channel, e.g., camera channel 350 A) as a reference image for comparison with the other images.
  • the automatic image alignment portion may initially compare row 1 of the reference image to row 1 of the other images and determines whether such rows of such images defines a similar edge feature. In this example, none of the images have an edge feature in the first row and thus there is not a similar edge feature in each of such rows. As a result, the portion outputs data corresponding to such rows (i.e., row 1 of each of the three images) to the image scaling portion.
  • the automatic image alignment portion compares row 1 of the first image to row 2 of the other images.
  • none of such rows have an edge feature and thus there is not a similar edge feature in each of such rows.
  • the portion outputs data corresponding to such rows (i.e., row 1 of the first image and row 2 of each of the other images) to the image scaling portion.
  • the automatic image alignment portion compares row 1 of the first image to row 3 of the other images. Although row 3 of the images for the second and third channels each have an edge feature, row 1 the image for the first channel does not have an edge.
  • the maximum number of comparison operations that use a particular row may be selected based on the physical spacing between the camera channels. In this embodiment, for example, a particular row of the reference image is used for three comparison operations at most.
  • the automatic image alignment uses row 2 of the image for the first camera channel, rather than row 1 of the image for the first camera channel.
  • the automatic image alignment portion compares row 2 of the first image to row 2 of the other images. Although row 2 of the image for the first camera channel has an edge, row 2 of the other camera channels does not have any edge.
  • the automatic image alignment portion compares row 2 of the first image to row 3 of the other images. In this example, each of such rows has a similar edge feature.
  • the automatic image alignment portion uses this as an indication of an overlapping image (or portion thereof).
  • the portion determines the magnitude and the direction by which the image for the second channel and the image for the third channel should be shifted to align the edge feature in such images with the edge feature in the image for the first camera channel and determines the width of the overlap of the images (e.g., the extent by which the images overlap in the horizontal direction).
  • the portion compares the next row of the reference image (e.g., row 3 ) to the next rows of the other images (e.g., row 4 ) and repeats the operations set forth above to determine a minimum width of the overlap of the images.
  • the images may be cropped in accordance with the vertical overlap and the minimum horizontal overlap.
  • the output of the automatic image alignment portion is a cropped aligned image, which is supplied to the image scaling portion.
  • the image scaling portion enlarges (e.g., upsamples) the cropped aligned image to generate an image that has the same size as that of the original images.
  • Some embodiments employ additional alignment methods, alone or in combination with any of the methods described herein.
  • the above method is used in cases when the objects are relatively far from the camera and other methods are used when objects are relatively close to the camera.
  • FIG. 111A F shows a flowchart of operations that may be employed in the alignment portion, in accordance with another embodiment of the present invention.
  • This embodiment of alignment may be used for example, for images that include one or more close objects.
  • edges are extracted at one of the planes. Neighborhood pixels (kernel) are defined for each edge pixel. Thereafter, the kernels of each edge pixel may be matched with pixels in the other color planes, for example, by shifting the kernel towards the direction where the other color plane is relatively located. One or more determinations may be made as to how well the kernels of each edge pixel are matched with pixels in the other color plane. In this regard, a matching cost function may be employed to quantify how well the kernels of each edge pixel are matched with pixels in the other color plane. In the course of determining the best positions of each edge in the next plane, the relative positions of each edge may be checked to confirm that they preserve the same structure after shifting according to the best matches.
  • the intervals between edges may be mapped, for example, using a linear mapping and/or shifting.
  • Post processing may be performed on the shift amounts to confirm that there are no outliers (no unexpected shifts relative to the surrounding pixels).
  • the initial matching of the first two color planes may be employed as a reference in regard to how much shift to expect at each pixel in the other color planes.
  • the above operations may be applied, for example, between the initial color plane and all the other color planes.
  • the automatic image alignment portion is not limited to the embodiment above. For example, in some embodiments, fewer than three or more than three camera channels are aligned. Moreover, any other technique may be employed to align two or more images.
  • the alignment carried out by the automatic image alignment portion may be predetermined, processor controlled and/or user controlled.
  • the automatic alignment portion has the ability to align fewer than all of the camera channels (e.g., any two or more).
  • one or more signals may be supplied to the automatic image alignment portion to indicate the camera channels to align, and the automatic image alignment portion may align the indicated camera channels in response, at least in part, to such one or more signals.
  • the one or more signals may be predetermined or adaptively determined, processor controlled and/or user controlled.
  • the output of the image planes alignment and stitching is supplied to the exposure control, the purpose of which is to help make sure that the captured images are not over exposed or under exposed. An over exposed image is too bright. An under exposed image is too dark.
  • FIG. 111R shows one embodiment of the automatic exposure control.
  • the auto exposure control generates a brightness value indicative of the brightness of the image supplied thereto.
  • the auto exposure control compares the generated brightness value against one or more reference values, e.g., two values where the first value is indicative of a minimum desired brightness and the second value is indicative of a maximum desired brightness.
  • the minimum and/or maximum brightness may be predetermined, processor controlled and/or user controlled.
  • the minimum desired brightness and maximum desired brightness values are supplied by the user so that images provided by the digital camera apparatus will not be too bright or too dark, in the opinion of the user.
  • the auto exposure control does not change the exposure time. If the brightness value is less than the minimum desired brightness value, the auto exposure control supplies control signals that cause the exposure time to increase until the brightness is greater than or equal to the minimum desired brightness. If the brightness value is greater than the maximum brightness value, then the auto exposure control supplies control signals that cause the exposure time to decrease until the brightness is less than or equal to the maximum brightness value.
  • the auto exposure control supplies a signal that enables a capture mode, wherein the user is able to press the capture button to initiate capture of an image and the setting for the exposure time causes an exposure time that results in a brightness level (for the captured image) that is within the user preferred range.
  • the digital camera apparatus provides the user with the ability to manually adjust the exposure time directly, similar to adjusting an iris on a conventional film camera.
  • the digital camera apparatus employs relative movement between an optics portion (or one or more portions thereof) and a sensor array (or one or more portions thereof), to provide a mechanical iris for use in auto exposure control and/or manual exposure control.
  • movement may be provided for example using actuators, e.g., MEMS actuators and by applying appropriate control signal(s) to one or more of the actuators to cause the one or more actuators to move, expand and/or contract to thereby move the associated optics portion.
  • the output of the exposure control is supplied to the Auto/Manual focus control portion, which helps make the objects (e.g., the target(s) of an image) that are within the field of view appear in focus.
  • objects in an image appear blurred if the image is over focus or under focus.
  • the image may have peak sharpness when the lens is in focus point.
  • the auto focus control portion detect the amount of blurriness of an image, e.g., while the digital camera apparatus is in a preview mode, and provides control signals that cause the lens assembly to move back and forth, accordingly, until the auto focus control portion determines that the lens is at the focus point.
  • Many of the digital still cameras available today utilize such type of mechanism.
  • the auto/manual focus portion is adapted to help increase the Depth of Focus of the digital camera apparatus.
  • Depth of Focus can be viewed as a measure of how much an object that is in focus within a field of view can be moved forward or backward before the object becomes “out of focus”.
  • Depth of Focus is based at least in part on the lens employed in the optical portion.
  • Some embodiments employ one or more optical filters in combination with a one or more algorithms to increase the Depth of Focus.
  • the optical filter or filters may be conventional optical filters for increasing Depth of Focus and may be disposed superjacent (on or above) the top of the lens, although this is not required. Any type of optical filter and positioning thereof may be employed.
  • the algorithm or algorithms may be a conventional wave front encoding algorithm, although this is not required. Any type of algorithm or algorithms may be employed.
  • the auto focus mechanism increases the Depth of Focus by a factor of ten (e.g., the Depth of Focus provided with the auto focus mechanism is ten time as large as the Depth of Focus of the lens alone (without the auto focus mechanism), to make the system less sensitive or insensitive to the position of objects within a field of view.
  • the auto focus mechanism increases the Depth of Focus by a factor of twenty or more (e.g., the Depth of Focus provided with the auto focus mechanism is twenty time as large as the Depth of Focus of the lens alone (without the auto focus mechanism), to further decrease the sensitivity of the position of the object within a field of view and/or to make the system insensitive to the position of objects within a field of view.
  • the digital camera apparatus may provide the user with the ability to manually adjust the focus.
  • the digital camera apparatus employs relative movement between an optics portion (or one or more portions thereof) and a sensor array (or one or more portions thereof), to help provide an auto focus and/or manual focus.
  • movement may be provided for example using actuators, e.g., MEMS actuators and by applying appropriate control signal(s) to one or more of the actuators to cause the one or more actuators to move, expand and/or contract to thereby move the associated optics portion.
  • actuators e.g., MEMS actuators
  • appropriate control signal(s) to one or more of the actuators to cause the one or more actuators to move, expand and/or contract to thereby move the associated optics portion.
  • the auto/manual focus is not limited to the above embodiments. Indeed, any other type of auto/manual focus now known or later developed may be employed.

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Priority Applications (32)

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US11/212,803 US20060054782A1 (en) 2004-08-25 2005-08-25 Apparatus for multiple camera devices and method of operating same
US11/265,669 US7199348B2 (en) 2004-08-25 2005-11-02 Apparatus for multiple camera devices and method of operating same
US11/322,959 US20070102622A1 (en) 2005-07-01 2005-12-30 Apparatus for multiple camera devices and method of operating same
US11/729,132 US8124929B2 (en) 2004-08-25 2007-03-27 Imager module optical focus and assembly method
US11/788,279 US7916180B2 (en) 2004-08-25 2007-04-19 Simultaneous multiple field of view digital cameras
US11/788,122 US7564019B2 (en) 2005-08-25 2007-04-19 Large dynamic range cameras
US11/788,120 US20070258006A1 (en) 2005-08-25 2007-04-19 Solid state camera optics frame and assembly
US11/810,623 US7964835B2 (en) 2005-08-25 2007-06-06 Digital cameras with direct luminance and chrominance detection
US11/825,382 US7795577B2 (en) 2004-08-25 2007-07-05 Lens frame and optical focus assembly for imager module
US11/888,582 US7884309B2 (en) 2004-08-25 2007-08-01 Digital camera with multiple pipeline signal processors
US11/888,546 US7714262B2 (en) 2005-07-01 2007-08-01 Digital camera with integrated ultraviolet (UV) response
US11/888,570 US7566855B2 (en) 2005-08-25 2007-08-01 Digital camera with integrated infrared (IR) response
US12/496,854 US8198574B2 (en) 2004-08-25 2009-07-02 Large dynamic range cameras
US13/006,351 US8415605B2 (en) 2004-08-25 2011-01-13 Digital camera with multiple pipeline signal processors
US13/100,725 US8304709B2 (en) 2005-08-25 2011-05-04 Digital cameras with direct luminance and chrominance detection
US13/345,007 US8436286B2 (en) 2004-08-25 2012-01-06 Imager module optical focus and assembly method
US13/465,229 US8334494B2 (en) 2004-08-25 2012-05-07 Large dynamic range cameras
US13/647,708 US8629390B2 (en) 2005-08-25 2012-10-09 Digital cameras with direct luminance and chrominance detection
US13/681,603 US8598504B2 (en) 2004-08-25 2012-11-20 Large dynamic range cameras
US13/786,803 US8664579B2 (en) 2004-08-25 2013-03-06 Digital camera with multiple pipeline signal processors
US14/063,236 US9232158B2 (en) 2004-08-25 2013-10-25 Large dynamic range cameras
US14/149,024 US9294745B2 (en) 2005-08-25 2014-01-07 Digital cameras with direct luminance and chrominance detection
US14/171,963 US9313393B2 (en) 2004-08-25 2014-02-04 Digital camera with multiple pipeline signal processors
US14/979,896 US10009556B2 (en) 2004-08-25 2015-12-28 Large dynamic range cameras
US15/074,275 US10148927B2 (en) 2005-08-25 2016-03-18 Digital cameras with direct luminance and chrominance detection
US15/090,856 US10142548B2 (en) 2004-08-25 2016-04-05 Digital camera with multiple pipeline signal processors
US16/207,099 US10694162B2 (en) 2005-08-25 2018-12-01 Digital cameras with direct luminance and chrominance detection
US16/908,342 US11310471B2 (en) 2005-08-25 2020-06-22 Digital cameras with direct luminance and chrominance detection
US17/576,729 US11425349B2 (en) 2005-08-25 2022-01-14 Digital cameras with direct luminance and chrominance detection
US17/576,747 US11412196B2 (en) 2005-08-25 2022-01-14 Digital cameras with direct luminance and chrominance detection
US17/891,755 US11706535B2 (en) 2005-08-25 2022-08-19 Digital cameras with direct luminance and chrominance detection
US18/220,006 US20230353886A1 (en) 2005-08-25 2023-07-10 Digital cameras with direct luminance and chrominance detection

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US11/322,959 Division US20070102622A1 (en) 2005-07-01 2005-12-30 Apparatus for multiple camera devices and method of operating same
US11/729,132 Continuation-In-Part US8124929B2 (en) 2004-08-25 2007-03-27 Imager module optical focus and assembly method
US11/788,122 Continuation-In-Part US7564019B2 (en) 2004-08-25 2007-04-19 Large dynamic range cameras
US11/788,279 Continuation-In-Part US7916180B2 (en) 2004-08-25 2007-04-19 Simultaneous multiple field of view digital cameras
US11/788,120 Continuation-In-Part US20070258006A1 (en) 2005-08-25 2007-04-19 Solid state camera optics frame and assembly
US11/810,623 Continuation-In-Part US7964835B2 (en) 2005-08-25 2007-06-06 Digital cameras with direct luminance and chrominance detection
US11/810,623 Continuation US7964835B2 (en) 2005-08-25 2007-06-06 Digital cameras with direct luminance and chrominance detection
US11/825,382 Continuation-In-Part US7795577B2 (en) 2004-08-25 2007-07-05 Lens frame and optical focus assembly for imager module
US11/888,546 Division US7714262B2 (en) 2005-07-01 2007-08-01 Digital camera with integrated ultraviolet (UV) response
US11/888,582 Division US7884309B2 (en) 2004-08-25 2007-08-01 Digital camera with multiple pipeline signal processors
US11/888,570 Division US7566855B2 (en) 2005-08-25 2007-08-01 Digital camera with integrated infrared (IR) response

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US11/888,582 Active 2027-02-16 US7884309B2 (en) 2004-08-25 2007-08-01 Digital camera with multiple pipeline signal processors
US13/006,351 Active 2026-08-23 US8415605B2 (en) 2004-08-25 2011-01-13 Digital camera with multiple pipeline signal processors
US13/786,803 Active US8664579B2 (en) 2004-08-25 2013-03-06 Digital camera with multiple pipeline signal processors
US14/171,963 Active 2026-03-09 US9313393B2 (en) 2004-08-25 2014-02-04 Digital camera with multiple pipeline signal processors
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CN101427372B (zh) 2012-12-12
US10142548B2 (en) 2018-11-27
US7199348B2 (en) 2007-04-03
US20160234443A1 (en) 2016-08-11
US20100208100A9 (en) 2010-08-19
WO2006026354A2 (en) 2006-03-09
US20130277533A1 (en) 2013-10-24
US8415605B2 (en) 2013-04-09
US8664579B2 (en) 2014-03-04
US20140232894A1 (en) 2014-08-21
US7884309B2 (en) 2011-02-08
EP1812968B1 (en) 2019-01-16
EP1812968A4 (en) 2010-03-31
WO2006026354A3 (en) 2009-05-14
EP1812968A2 (en) 2007-08-01
US20110108708A1 (en) 2011-05-12
US9313393B2 (en) 2016-04-12
US20060054787A1 (en) 2006-03-16
US20080030597A1 (en) 2008-02-07

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