US20060042954A1 - Method for plating resin material - Google Patents

Method for plating resin material Download PDF

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Publication number
US20060042954A1
US20060042954A1 US11/214,971 US21497105A US2006042954A1 US 20060042954 A1 US20060042954 A1 US 20060042954A1 US 21497105 A US21497105 A US 21497105A US 2006042954 A1 US2006042954 A1 US 2006042954A1
Authority
US
United States
Prior art keywords
resin material
plating
ozone water
metal catalyst
adsorb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/214,971
Other languages
English (en)
Inventor
Fumitaka Yoshinaga
Takeshi Bessho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Assigned to TOYOTA JIDOSHA KABUSHIKI KAISHA reassignment TOYOTA JIDOSHA KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BESSHO, TAKESHI, YOSHINAGA, FUMITAKA
Publication of US20060042954A1 publication Critical patent/US20060042954A1/en
Abandoned legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
US11/214,971 2004-09-01 2005-08-31 Method for plating resin material Abandoned US20060042954A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004254747A JP2006070319A (ja) 2004-09-01 2004-09-01 樹脂めっき方法
JP2004-254747 2004-09-01

Publications (1)

Publication Number Publication Date
US20060042954A1 true US20060042954A1 (en) 2006-03-02

Family

ID=35941497

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/214,971 Abandoned US20060042954A1 (en) 2004-09-01 2005-08-31 Method for plating resin material

Country Status (3)

Country Link
US (1) US20060042954A1 (ja)
JP (1) JP2006070319A (ja)
CN (1) CN100519838C (ja)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070128366A1 (en) * 2005-12-05 2007-06-07 Rohm And Haas Electronic Materials Llc Metallization of dielectrics
US20080053834A1 (en) * 2006-06-09 2008-03-06 Rohm And Haas Electronic Materials Llc Electroless plating method for resin surfaces
WO2008142541A2 (en) * 2007-05-22 2008-11-27 Toyota Jidosha Kabushiki Kaisha Resin board to be subjected to ozone treatment, wiring board, and method of manufacturing the wiring board
WO2008145229A2 (de) * 2007-05-25 2008-12-04 Gebr. Schmid Gmbh Verfahren zur behandlung von flachen substraten sowie verwendung des verfahrens
US20110305839A1 (en) * 2010-06-09 2011-12-15 Kurita Water Industries Ltd Ozone gas treatment process and treatment apparatus
US20120073978A1 (en) * 2009-06-08 2012-03-29 Basf Se Use of ionic liquids for the pretreatment of surfaces of plastics for metallization
CN105839159A (zh) * 2016-05-23 2016-08-10 无锡市嘉邦电力管道厂 一种聚乙烯塑料电镀工艺
CN108884569A (zh) * 2016-04-28 2018-11-23 栗田工业株式会社 塑料表面的处理方法
US20190032220A1 (en) * 2017-07-25 2019-01-31 Rohm And Haas Electronic Materials Llc Chrome-free etch solutions for chemically resistant polymer materials
CN115282789A (zh) * 2022-01-24 2022-11-04 浙江师范大学 一种ABS-Ni复合分离膜及其制备方法与应用

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008294077A (ja) * 2007-05-22 2008-12-04 Toyota Motor Corp 配線基板の製造方法及び配線基板
JP4918123B2 (ja) * 2009-09-17 2012-04-18 トヨタ自動車株式会社 無電解めっき素材の製造方法
JP5875195B2 (ja) * 2013-08-22 2016-03-02 柿原工業株式会社 オゾン水処理を用いた樹脂めっき処理方法
JP7160306B2 (ja) * 2018-05-23 2022-10-25 奥野製薬工業株式会社 無電解めっきの前処理用組成物、無電解めっきの前処理方法、無電解めっき方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4082557A (en) * 1975-07-25 1978-04-04 Alfachimici S.P.A. Silver base activating solutions for electroless copper deposition
US5071517A (en) * 1989-11-21 1991-12-10 Solution Technology Systems Method for directly electroplating a dielectric substrate and plated substrate so produced
US5376248A (en) * 1991-10-15 1994-12-27 Enthone-Omi, Inc. Direct metallization process
US6286207B1 (en) * 1998-05-08 2001-09-11 Nec Corporation Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing it
US20040115353A1 (en) * 2001-04-12 2004-06-17 Masatsugu Nakanishi Method of pretreatment of material to be electrolessly plated
US20050153059A1 (en) * 2002-02-28 2005-07-14 Yasuhiro Wakizaka Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04187781A (ja) * 1990-11-21 1992-07-06 Sumitomo Metal Mining Co Ltd 無電解めっき法
JPH06152126A (ja) * 1992-11-09 1994-05-31 Hitachi Chem Co Ltd 配線板の製造方法
JPH10317153A (ja) * 1997-05-14 1998-12-02 Taiyo Ink Mfg Ltd 光硬化性無電解めっき用プライマー組成物及びそれを用いた無電解めっき方法
JP2000124583A (ja) * 1998-10-19 2000-04-28 Nec Kansai Ltd 配線基板の製造方法および配線基板構体
JP2001316834A (ja) * 2000-04-28 2001-11-16 Sony Corp 無電解メッキ装置および導電膜の形成方法
JP4940512B2 (ja) * 2001-07-18 2012-05-30 トヨタ自動車株式会社 樹脂の無電解メッキ被膜形成方法
JP2004068119A (ja) * 2002-08-08 2004-03-04 Sumitomo Osaka Cement Co Ltd 金属パターン膜の製造方法
JP3999623B2 (ja) * 2002-10-10 2007-10-31 トヨタ自動車株式会社 無電解めっき素材の前処理方法及びめっき被覆部材の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4082557A (en) * 1975-07-25 1978-04-04 Alfachimici S.P.A. Silver base activating solutions for electroless copper deposition
US5071517A (en) * 1989-11-21 1991-12-10 Solution Technology Systems Method for directly electroplating a dielectric substrate and plated substrate so produced
US5376248A (en) * 1991-10-15 1994-12-27 Enthone-Omi, Inc. Direct metallization process
US6286207B1 (en) * 1998-05-08 2001-09-11 Nec Corporation Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing it
US20040115353A1 (en) * 2001-04-12 2004-06-17 Masatsugu Nakanishi Method of pretreatment of material to be electrolessly plated
US20050153059A1 (en) * 2002-02-28 2005-07-14 Yasuhiro Wakizaka Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070128366A1 (en) * 2005-12-05 2007-06-07 Rohm And Haas Electronic Materials Llc Metallization of dielectrics
US20100323115A1 (en) * 2005-12-05 2010-12-23 Rohm And Haas Electronic Materials Llc Metallization of dielectrics
US7780771B2 (en) 2005-12-05 2010-08-24 Rohm And Haas Electronic Materials Llc Metallization of dielectrics
US20080053834A1 (en) * 2006-06-09 2008-03-06 Rohm And Haas Electronic Materials Llc Electroless plating method for resin surfaces
WO2008142541A3 (en) * 2007-05-22 2009-01-29 Toyota Motor Co Ltd Resin board to be subjected to ozone treatment, wiring board, and method of manufacturing the wiring board
US8784638B2 (en) 2007-05-22 2014-07-22 Toyota Jidosha Kabushiki Kaisha Resin board to be subjected to ozone treatment, wiring board, and method of manufacturing the wiring board
US20100059259A1 (en) * 2007-05-22 2010-03-11 Takeshi Bessho Resin board to be subjected to ozone treatment, wiring board, and method of manufacturing the wiring board
WO2008142541A2 (en) * 2007-05-22 2008-11-27 Toyota Jidosha Kabushiki Kaisha Resin board to be subjected to ozone treatment, wiring board, and method of manufacturing the wiring board
WO2008145229A2 (de) * 2007-05-25 2008-12-04 Gebr. Schmid Gmbh Verfahren zur behandlung von flachen substraten sowie verwendung des verfahrens
WO2008145229A3 (de) * 2007-05-25 2009-04-09 Schmid Gmbh Gebr Verfahren zur behandlung von flachen substraten sowie verwendung des verfahrens
US20120073978A1 (en) * 2009-06-08 2012-03-29 Basf Se Use of ionic liquids for the pretreatment of surfaces of plastics for metallization
US9090966B2 (en) * 2009-06-08 2015-07-28 Basf Se Use of ionic liquids for the pretreatment of surfaces of plastics for metallization
US20110305839A1 (en) * 2010-06-09 2011-12-15 Kurita Water Industries Ltd Ozone gas treatment process and treatment apparatus
CN108884569A (zh) * 2016-04-28 2018-11-23 栗田工业株式会社 塑料表面的处理方法
US20190136380A1 (en) * 2016-04-28 2019-05-09 Kurita Water Industries Ltd. Method for treating surface of plastic
CN105839159A (zh) * 2016-05-23 2016-08-10 无锡市嘉邦电力管道厂 一种聚乙烯塑料电镀工艺
US20190032220A1 (en) * 2017-07-25 2019-01-31 Rohm And Haas Electronic Materials Llc Chrome-free etch solutions for chemically resistant polymer materials
CN115282789A (zh) * 2022-01-24 2022-11-04 浙江师范大学 一种ABS-Ni复合分离膜及其制备方法与应用

Also Published As

Publication number Publication date
CN1743502A (zh) 2006-03-08
CN100519838C (zh) 2009-07-29
JP2006070319A (ja) 2006-03-16

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Legal Events

Date Code Title Description
AS Assignment

Owner name: TOYOTA JIDOSHA KABUSHIKI KAISHA, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YOSHINAGA, FUMITAKA;BESSHO, TAKESHI;REEL/FRAME:016931/0836

Effective date: 20050824

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION