US20040256094A1 - Baking system having a heat pipe - Google Patents

Baking system having a heat pipe Download PDF

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Publication number
US20040256094A1
US20040256094A1 US10/820,157 US82015704A US2004256094A1 US 20040256094 A1 US20040256094 A1 US 20040256094A1 US 82015704 A US82015704 A US 82015704A US 2004256094 A1 US2004256094 A1 US 2004256094A1
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United States
Prior art keywords
heat pipe
cooling
control unit
storage tank
connection pipe
Prior art date
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Abandoned
Application number
US10/820,157
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English (en)
Inventor
Dong-Woo Lee
Jin-Sung Lee
Sang-kap Kim
Dong-Hwa Shin
Tae-Gyu Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Assigned to SAMSUNG ELECTRONICS CO., LTD. reassignment SAMSUNG ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIM, SANG-KAP, KIM, TAE-GYU, LEE, DONG-WOO, LEE, JIN-SUNG, SHIN, DONG-HWA
Publication of US20040256094A1 publication Critical patent/US20040256094A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor

Definitions

  • the present invention relates to a baking system for use in a process of manufacturing semiconductor devices. More particularly, the present invention relates to a baking system having a heat pipe as a cooling unit.
  • a photolithographic process which is one type of process performed during the manufacture of a semiconductor device, includes a coating process of coating a photoresist layer on a wafer, a pre-baking process of baking the coated photoresist layer before exposure, and a post-exposure baking process of baking the photoresist layer after exposure, to form a predetermined pattern in the photoresist layer.
  • a baking temperature varies according to a type of photoresist layer and a type of baking process.
  • the baking process may be performed at a temperature of 150° C. or 90° C. depending on particular circumstances.
  • a widely used baking apparatus includes a heating system and a cooling system to adjust the baking temperature according to the particular circumstances.
  • FIGS. 1 through 3 illustrate sectional views of cooling systems of conventional baking apparatuses (hereinafter, referred to as “conventional cooling systems”).
  • coolant paths 56 and 57 through which a coolant flows, are installed in a plate 54 . Coolant circulates through the coolant paths 56 and 57 and cools a heating plate 51 .
  • the first conventional cooling system additionally includes a heater 52 , a lift pin 53 , and a cooling plate 55 .
  • Coolant supply pipelines 60 and 61 include switching valves 62 and 63 , respectively, and terminate at a drain 64 .
  • the first conventional cooling system further includes a temperature sensor 65 , a unit controller 66 , a temperature adjuster 67 , a solenoid valve 68 , and a power supply 69 .
  • a system controller 80 controls operations of the entire system.
  • a second conventional cooling system as shown in FIG. 2, a plurality of nozzles 74 is installed under a heating plate 70 that acts as a baking plate. A spray of a fluid from the nozzles 74 onto the heating plate 70 is used to cool the heating plate 70 .
  • the second conventional cooling system further includes a heater 71 , a guide 83 , an inner case 85 , a support ring 87 , a cooling plate 93 , and a black plate 96 .
  • a third conventional cooling system 30 includes a cooling plate 99 in which a Peltier device 101 is embedded.
  • the Peltier device 101 adjusts a temperature of the cooling plate 99 to a predetermined temperature.
  • the third conventional cooling system 30 further includes a power controller 102 for supplying power to the Peltier device 101 , a temperature adjuster 103 for adjusting the temperature of the Peltier device 101 , and a proportional integral derivative (PID) control parameter altering unit 105 .
  • the cooling system 30 includes a flow path 111 used for radiating heat generated in the Peltier device 101 , a lifting pin 90 for lifting a wafer W, a penetration pin 91 , and a proximity pin 92 for supporting the wafer W.
  • a temperature sensor 104 senses a temperature of the cooling plate 99 .
  • the present invention provides a baking system that is able to uniformly cool an entire top surface of a hot plate and effectively reduce a cooling time.
  • a baking system including a heat pipe including a top surface for receiving a wafer to be baked, the heat pipe to be filled with a predetermined amount of working fluid and having wicks formed on sides and a ceiling thereof for supplying the working fluid, a heater for heating the top surface by heating the working fluid, a subsidiary cooling system, which contains a liquid coolant that is to be exchanged with the working fluid from the heat pipe through circulation, a connection pipe for providing fluid communication between the heat pipe and the subsidiary cooling system to circulate the working fluid and the liquid coolant, and a control unit, which is installed in the connection pipe, for controlling a flow of the working fluid and the liquid coolant through the connection pipe.
  • connection pipe may include an inlet flow path and an outlet flow path for providing fluid communication between the heat pipe and the subsidiary cooling system.
  • the connection pipe may include an outlet connection pipe for providing fluid communication from the heat pipe to the subsidiary cooling system and an inlet connection pipe for providing fluid communication from the subsidiary cooling system to the heat pipe.
  • the control unit may include an outlet fluid control unit installed in the outlet connection pipe and an inlet fluid control unit installed in the inlet connection pipe.
  • the outlet fluid control unit may be an automated pump or a valve and the inlet fluid control unit may be a valve, an automatic pump, or a manual pump.
  • the control unit may include a first outlet fluid control unit and a second outlet fluid control unit sequentially installed in the outlet connection pipe and an inlet fluid control unit installed in the inlet connection pipe.
  • the first outlet fluid control unit may be an automatic valve or a manual valve
  • the inlet fluid control unit may be an automatic valve, a manual valve, or a pump
  • the second outlet fluid control unit may be a pump.
  • the subsidiary cooling system may include a coolant storage tank for storing the liquid coolant, the coolant storage tank having a wick formed therein, a cooling unit installed at the coolant storage tank for cooling the working fluid supplied from the heat pipe, and a pressurizing unit for pressurizing the liquid coolant during a process of cooling the top surface.
  • the subsidiary cooling system may include a first coolant storage tank for storing the liquid coolant and a first cooling system installed at the first coolant storage tank for cooling the working fluid supplied from the heat pipe. Further, there may be included a second coolant storage tank in fluid communication with the first coolant storage tank, wherein the first cooling system extends to the second coolant storage tank. Alternatively, there may be included a second coolant storage tank in fluid communication with the first coolant storage tank and a second cooling system installed at the second coolant storage tank. Further, there may be included an intermediate connection pipe for providing fluid communication between the first coolant storage tank and the second coolant storage tank and an intermediate fluid control unit installed in the intermediate connection pipe. The control unit may be a pump or a valve.
  • the baking system may further include a subsidiary heater installed in the connection pipe between an inlet of the heat pipe and the subsidiary cooling system to heat a fluid flowing through the connection pipe.
  • the baking system may further include a subsidiary heater installed at the first coolant storage tank to heat a fluid supplied into the heat pipe.
  • the working fluid may be water, deionized water, acetone, or methyl.
  • a baking system including a heat pipe including a top surface for receiving a wafer to be baked and an inlet side and an outlet side, the heat pipe to be filled with a predetermined amount of working fluid and having wicks formed on sides and a ceiling thereof for supplying the working fluid, a heater for heating the top surface of the heat pipe by heating the working fluid, a connection pipe, a first end of which is connected to the outlet side of the heat pipe, and a second end of which is connected to the inlet side of the heat pipe, a cooling unit installed in the connection pipe for cooling the working fluid flowing through the connection pipe, and a control unit for controlling the working fluid.
  • the cooling unit may be installed to wrap around a portion of the connection pipe.
  • the control unit may include an outlet fluid control unit installed in the connection pipe between the outlet side of the heat pipe and the cooling unit and an inlet fluid control unit installed in the connection pipe between the inlet side of the heat pipe and the cooling unit.
  • the outlet fluid control unit and the inlet fluid control unit may be an automatic valve, a manual valve, or a pump.
  • a baking system is able to uniformly cool an entire region of a hot plate in a relatively short amount of time to stabilize the temperature of the hot plate. Further, a time required to heat the hot plate may be decreased using a subsidiary heater, thus improving semiconductor device manufacturing productivity.
  • FIGS. 1 through 3 illustrate sectional views of a first through a third conventional cooling system, respectively;
  • FIGS. 4 through 9 illustrate partial sectional views of baking systems according to a first through a sixth embodiment of the present invention, respectively;
  • FIG. 10 is a graph of simulation results showing a cooling efficiency of a conventional baking system using natural cooling
  • FIGS. 11 through 13 are graphs of simulation results showing a cooling efficiency of a conventional baking system, in which a cooling line is buried in a hot plate;
  • FIG. 14 is a graph of simulation results showing a cooling efficiency of a conventional baking system, in which a cooling line is installed under a heater;
  • FIGS. 15 and 16 illustrate a partial front view and a plan view, respectively, of the conventional baking system with the cooling line buried in the hot plate;
  • FIG. 17 illustrates a partial front view of the conventional baking system with the cooling line installed under the heater.
  • FIGS. 18 through 20 are graphs of simulation results showing a cooling efficiency of the baking systems according to the embodiments of the present invention.
  • working fluid describes a fluid in a heat pipe that operates either to heat or to cool a top surface of the heat pipe.
  • liquid coolant describes a fluid in a coolant storage tank that circulates to replace the working fluid in the heat pipe and operates to cool the top surface of the heat pipe.
  • a baking system includes a main body P 1 and a subsidiary cooling system P 2 .
  • the main body P 1 includes a heat pipe 100 and a heater 102 contacting a bottom of the heat pipe 100 .
  • the subsidiary cooling system P 2 includes a coolant storage tank 106 , which is partially filled with a liquid coolant 104 b , a cooling unit 110 for cooling the liquid coolant 104 b , and a pressurizing unit 109 for forcibly circulating the liquid coolant 104 b through the heat pipe 100 .
  • Wicks W 1 and W 2 are formed on inner sides of and on a center of the ceiling of the heat pipe 100 , respectively.
  • the term wicks may also include wick plates WP 1 and WP 2 , as shown in FIG. 4. Wicks similar to the wicks W 1 and W 2 may be formed on an inside of the coolant storage tank 106 . More specifically, the wicks may be formed on inner sides of and a ceiling of the coolant storage tank 106 so that a high-temperature working fluid, which flows into the coolant storage tank 106 , can move along the sides of the coolant storage tank 106 to the ceiling thereof due to the capillarity attraction of the wicks and evaporate.
  • the subsidiary cooling system P 2 includes the coolant storage tank 106 functioning as a heat pipe.
  • the pressurizing unit 109 heats the vapor above the liquid coolant 104 b contained in the coolant storage tank 106 and pressurizes the liquid coolant.
  • the pressurizing unit 109 does not cause physical transformation of the coolant storage tank 106 .
  • a baking process is performed, as shown in FIG. 4, a wafer W is loaded on a top surface S 1 of the heat pipe 100 , and the top surface S 1 of the heat pipe 100 , i.e., a hot plate surface, is heated to a predetermined temperature, e.g., 100° C. to 150° C.
  • a predetermined temperature e.g. 100° C. to 150° C.
  • the heat pipe 100 is filled with a predetermined amount of working fluid 104 a.
  • the working fluid 104 a transmits heat from the heater 102 to the top surface S 1 of the heat pipe 100 to heat the top surface S 1 . More specifically, the heat transmitted from the heater 102 causes the working fluid 104 a to evaporate into an upper space 112 and contact the ceiling of the heat pipe 100 , thus heating the top surface S 1 of the heat pipe 100 .
  • the working fluid 104 a is supplied along the wicks W 1 and W 2 to the ceiling of the heat pipe 100 and evaporates, thereby cooling the hot plate surface, i.e., the top surface S 1 of the heat pipe 100 . Since the wicks W 1 are uniformly formed on the entire ceiling of the heat pipe 100 , the working fluid 104 a is uniformly supplied to the entire ceiling of the heat pipe 100 . In addition, the working fluid 104 a is affected by the capillarity attraction of the wicks W 1 and W 2 and is rapidly supplied to the entire ceiling of the heat pipe 100 during the cooling process. Thus, the entire top surface S 1 of the heat pipe 100 is cooled in a relatively short amount of time. The vapor, generated in the cooling process, passes through the upper space 112 and contacts the working fluid 104 a , whose temperature is lower than that of the vapor. Thus, the vapor condenses again into the working fluid 104 a.
  • the working fluid 104 a may be water, i.e., deionized water, acetone, methyl or any suitable liquid.
  • the liquid coolant 104 b contained in the coolant storage tank 106 of the subsidiary cooling system P 2 is prepared.
  • the liquid coolant 104 b is preferably maintained at a temperature lower than that of the working fluid 104 a.
  • an outlet flow path L 1 and an inlet flow path L 2 are installed between the heat pipe 100 and the subsidiary cooling system P 2 to provide fluid communication between the heat pipe 100 and the subsidiary cooling system P 2 .
  • a valve 108 for controlling the flow of fluid is installed in the outlet and inlet flow paths L 1 and L 2 such that the fluid circulates only during the cooling process.
  • the valve 108 may be a pump.
  • the valve 108 When the cooling process of the top surface S 1 of the heat pipe 100 starts, the valve 108 is opened and simultaneously, the pressurizing unit 109 , such as a Peltier device, of the subsidiary cooling system P 2 , pressurizes the liquid coolant 104 b . As a result, some of the liquid coolant 104 b is supplied via the inlet flow path L 2 to the heat pipe 100 , and the working fluid 104 a of the heat pipe 100 is supplied via the outlet flow path L 1 to the coolant storage tank 106 . This fluid circulation is conducted continuously or periodically until the top surface S 1 of the heat pipe 100 is cooled to a predetermined temperature, e.g., 100° C.
  • a predetermined temperature e.g. 100° C.
  • the heated working fluid 104 a of the heat pipe 100 flows into the coolant storage tank 106 of the subsidiary cooling system P 2 and raises the temperature of the liquid coolant 104 b stored in the coolant storage tank 106 .
  • the cooling unit 110 installed under the coolant storage tank 106 , maintains the liquid coolant 104 b at a constant temperature.
  • a baking system includes a coolant storage tank 120 in fluid communication with the heat pipe 100 .
  • An outlet of the heat pipe 100 is connected to a side, e.g., a top of the coolant storage tank 120 by an outlet connection pipe 126 .
  • An inlet of the heat pipe 100 is connected to another side of the coolant storage tank 120 by an inlet connection pipe 128 .
  • the working fluid 104 a flows from the heat pipe 100 to the coolant storage tank 120 via the outlet connection pipe 126 .
  • the working fluid 104 a which flows into the coolant storage tank 120 , is cooled to a predetermined temperature, e.g., 23° C., and is then returned to the heat pipe 100 via the inlet connection pipe 128 .
  • the fluid circulation between the heat pipe 100 and the coolant storage tank 120 may be interrupted during a baking process and restarted during a process of cooling the top surface S 1 of the heat pipe 100 .
  • an outlet fluid control unit 126 a and an inlet fluid control unit 128 a are installed in the outlet connection pipe 126 and the inlet connection pipe 128 , respectively.
  • the outlet fluid control unit 126 a may be an automated pump or a valve.
  • the inlet fluid control unit 128 a may be a valve, an automatic pump or a manual pump.
  • a level of the working fluid 104 a in the heat pipe 100 may rise over time but is preferably maintained as constant as possible. Accordingly, the flow rate of the working fluid 104 a flowing from the heat pipe 100 is preferably equal to that of the liquid coolant (not shown) flowing into the heat pipe 100 .
  • a control function of the outlet fluid control unit 126 a is preferably equal to that of the inlet fluid control unit 128 a .
  • a control function of the outlet fluid control unit 126 a may be adjusted to differ from that of the inlet fluid control unit 128 a such that the flow rate of the working fluid 104 a from the heat pipe 100 is equal to that of the liquid coolant flowing into the heat pipe 100 .
  • the working fluid 104 a flowing from the heat pipe 100 into the coolant storage tank 120 via the outlet connection pipe 126 has a relatively high temperature
  • the liquid coolant supplied from the coolant storage tank 120 to the heat pipe 100 via the inlet connection pipe 128 preferably has a relatively lower predetermined temperature, e.g., 23° C.
  • the working fluid 104 a supplied to the coolant storage tank 120 is preferably cooled to the predetermined temperature of 23° C.
  • a cooling unit 124 is installed at the coolant storage tank 120 to cool the working fluid 104 a .
  • the cooling unit 124 may be provided on a top of the coolant storage tank 120 , as shown, or may be installed under the coolant storage tank 120 as illustrated by reference numeral 124 ′.
  • the cooling unit 124 includes an evaporation unit (not shown) and a condensation unit (not shown)
  • the evaporation unit may be installed on a top, a bottom and/or a side of the coolant storage tank 120
  • the condensation unit may be installed in a region spaced apart from the evaporation unit.
  • a connection pipe 130 is installed outside the heat pipe 100 to circulate the working fluid 104 a in the heat pipe 100 during the cooling of the top surface S 1 , i.e., the hot plate surface.
  • An inlet of the connection pipe 130 is connected to the outlet of the heat pipe 100 and an outlet of the connection pipe 130 is connected to the inlet of the heat pipe 100 .
  • a cooling unit 132 is installed at a predetermined position along the connection pipe 130 so as to wrap around a portion of the connection pipe 130 .
  • the cooling unit 132 of the third embodiment performs the same function as the cooling unit 124 of the second embodiment.
  • the cooling unit 132 cools the working fluid 104 a flowing from the heat pipe 100 through the connection pipe 130 to a predetermined temperature.
  • the outlet fluid control unit 126 a as described in connection with the second embodiment, is installed in the connection pipe 130 between the outlet of the heat pipe 100 and the cooling unit 132 .
  • the inlet fluid control unit 128 a is installed in the connection pipe 130 between the inlet of the heat pipe 100 and the cooling unit 132 .
  • a first coolant storage tank 134 and a second coolant storage tank 136 are installed outside the heat pipe 100 .
  • the first coolant storage tank 134 and the second coolant storage tank 136 store the high-temperature working fluid 104 a supplied from the heat pipe 100 during a cooling process of the hot plate and cool the working fluid 104 a to a predetermined temperature.
  • a first cooling unit 144 and a second cooling unit 146 are installed at the first coolant storage tank 134 and the second coolant storage tank 136 , respectively.
  • the working fluid 104 a flows from the heat pipe 100 and simultaneously, the liquid coolant (not shown) is supplied to the heat pipe 100 , preferably at a flow rate equal to that of the working fluid 104 a . Therefore, a predetermined amount of liquid coolant may be maintained at a predetermined temperature, e.g., 2° C. to 3° C., and stored in the first coolant storage tank 134 and the second coolant storage tank 136 . In particular, the liquid coolant is stored in the second coolant storage tank 136 , which is closer to the inlet side of the heat pipe 100 .
  • the first cooling unit 144 and the second cooling unit 146 of the fourth embodiment perform the same function as the cooling unit of the second embodiment ( 124 of FIG. 5).
  • the first cooling unit 144 and the second cooling unit 146 may be integrated into a single cooling unit as illustrated by reference numeral 148 .
  • a liquid coolant flowing into the second coolant tank 136 necessarily flows through the first coolant storage tank 134 .
  • the liquid coolant flowing into the second coolant storage tank 136 has a lower temperature than the working fluid 104 a flowing into the first coolant storage tank 134 .
  • the first cooling unit 144 may have a same or higher cooling efficiency than the second cooling unit 146 .
  • the outlet of the heat pipe 100 is connected to the first coolant storage tank 134 by an outlet connection pipe 138 , the first coolant storage tank 134 is connected to the second coolant storage tank 136 by an intermediate connection pipe 140 , and the inlet of the heat pipe 100 is connected to the second coolant storage tank 136 by an inlet connection pipe 142 .
  • An outlet fluid control unit 126 a is installed in the outlet connection pipe 138 .
  • An inlet fluid control unit 128 a is installed in the inlet connection pipe 142 .
  • an intermediate fluid control unit 140 a may be an automatic valve, a manual valve, an automatic pump, or a manual pump.
  • the outlet, inlet, and intermediate fluid control units 126 a , 128 a , and 140 a are opened when cooling of the hot plate starts and are closed when the cooling of the hot plate is finished or when the hot plate is heated again to bake a new wafer.
  • a cooling process of the hot plate occurs as follows.
  • all of the fluid control units 126 a , 128 a , and 140 a are opened, and a hot working fluid 104 a flows from the heat pipe 100 into the first coolant storage tank 134 via the outlet connection pipe 138 .
  • the first cooling unit 144 cools the hot working fluid 104 a supplied to the first coolant storage tank 134 .
  • the working fluid 104 a then flows through the intermediate connection pipe 140 into the second coolant storage tank 136 .
  • a liquid coolant supplied to the second coolant storage tank 136 is cooled to a desired temperature by the second cooling unit 146 and then flows into the heat pipe 100 via the inlet connection pipe 142 .
  • Fluid circulation may be continuously conducted until cooling of the hot plate is completed or may be repeated several times for a predetermined time duration, e.g., 15 seconds, each time.
  • the liquid coolant flowing from the second coolant storage tank 136 into the heat pipe 100 may be maintained at any temperature lower than that of the hot working fluid 104 a in the heat pipe 100 .
  • the temperature of the liquid coolant is preferably lower than about 80° C. This aspect of the process will be subsequently described in greater detail.
  • the hot working fluid 104 a is cooled to a previous temperature thereof in the heat pipe 100 before the hot plate was heated.
  • the first coolant storage tank 134 and/or the second coolant storage tank 136 may be used to cool the hot working fluid 104 a . More specifically, the hot working fluid 104 a may be gradually cooled while passing through both the first and second coolant storage tanks 134 and 136 . Alternatively, the hot working fluid 104 a may be cooled to a desired temperature using only one of the first and second coolant storage tanks 134 and 136 .
  • a baking system according to a fifth embodiment of the present invention is similar to that of the fourth embodiment except that the first coolant storage tank 134 and the second cooling unit 144 are removed from the subsidiary cooling system of the baking system in the fifth embodiment.
  • a coolant storage tank 150 and a cooling system 156 installed at the coolant storage tank 150 correspond to the second coolant storage tank 136 and second cooling system 146 of the fourth embodiment.
  • the coolant storage tank 150 is connected to the outlet side of a heat pipe 100 by an outlet connection pipe 152 and to the inlet side of the heat pipe 100 by an inlet connection pipe 154 .
  • a first outlet fluid control unit 152 a and a second outlet fluid control unit 152 b are sequentially installed in the outlet connection pipe 152 , through which a hot working fluid 104 a flows from the heat pipe 100 into the coolant storage tank 150 .
  • An inlet fluid control unit 154 a is installed in the inlet connection pipe 154 , through which a cooled liquid coolant flows from the coolant storage tank 150 into the heat pipe 100 .
  • the first outlet fluid control unit 152 a and the inlet fluid control unit 154 a may be automatic valves or manual valves, and the second outlet fluid control unit 152 b may be a pump.
  • the inlet fluid control unit 154 a may be a pump.
  • a coolant storage tank 160 is installed outside the heat pipe 100 .
  • the coolant storage tank 160 is connected to the outlet side of the heat pipe 100 by an outlet connection pipe 162 and to the inlet side of the heat pipe 100 by an inlet connection pipe 164 .
  • the hot working fluid 104 a flows from the heat pipe 100 into the coolant storage tank 160 via the outlet connection pipe 162 .
  • the hot working fluid 104 a is cooled while passing through the coolant storage tank 160 .
  • the cooled working fluid 104 a is then returned to the heat pipe 100 via the inlet connection pipe 164 .
  • An outlet fluid control unit 162 a is installed in the outlet connection pipe 162 .
  • An inlet fluid control unit 164 a is installed in the inlet connection pipe 164 .
  • the outlet fluid control unit 162 a and the inlet fluid control unit 164 a may be automatic valves, manual valves, or pumps.
  • a cooling system 160 b is installed under the coolant storage tank 160 and a subsidiary heater 160 a is mounted on the coolant storage tank 160 .
  • the cooling system 160 b performs the same function as the foregoing cooling systems.
  • the subsidiary heater may be installed in the inlet connection pipe 164 between an inlet of the heat pipe 100 and the subsidiary cooling system 160 to heat a fluid flowing through the inlet connection pipe 164 .
  • the subsidiary heater 160 a is used to heat the top surface S 1 of the heat pipe 100 , i.e., the hot plate surface, along with the heater 102 installed under the heat pipe 100 .
  • the outlet fluid control unit 162 a and the inlet fluid control unit 164 a remain open in the same manner as when the top surface S 1 is cooled. Accordingly, the heater 102 heats some of the working fluid 104 a in the heat pipe 100 , and the subsidiary heater 160 a heats the working fluid 104 a in the coolant storage tank 160 .
  • the subsidiary heater 160 a facilitates heating of the top surface S 1 of the heat pipe 100 and reduces a time necessary to heat the top surface S 1 .
  • the baking system shown in FIG. 4 as used as a simulation model and the conventional baking system shown in FIGS. 15 through 17 was used as a contrastive example (hereinafter, referred to as the “contrastive baking system”).
  • a top surface of a heat pipe, i.e., a hot plate, included in the baking system of the present invention, and a hot plate of the contrastive baking system were heated to a temperature of 150° C. and then cooled to a temperature of 100° C.
  • FIGS. 15 and 16 illustrate a partial front view and a plan view, respectively, of a hot plate 200 of the contrastive baking system, in which a first cooling line 206 and a second cooling line 208 for supplying liquid coolant, such as water, are buried.
  • FIG. 15 illustrates a left half of the hot plate 200 , wherein the first cooling line 206 is buried.
  • FIG. 16 illustrates a plan view of the entire hot plate, in which the first cooling line 206 and the second cooling line 208 are buried.
  • reference numerals 202 and 204 are a heater and a lower plate, respectively.
  • reference character Lc denotes a central line that bisects the hot plate 200 shown in FIG. 16.
  • FIG. 17 illustrates a partial front view of the contrastive baking system, in which cooling lines 210 for supplying cooling water are buried only in a lower plate 204 under a heater.
  • FIGS. 10 through 14 are graphs showing simulation results of the contrastive baking system.
  • FIGS. 18 through 20 are graphs showing simulation results of the baking system according to the first embodiment of the present invention.
  • FIGS. 10, 11, 13 , and 14 show variation of average temperature and greatest temperature deviation, versus time, of a hot plate surface of the contrastive baking system.
  • FIG. 10 shows a case where the hot plate is cooled naturally (hereinafter, Example 1).
  • FIG. 11 shows a case where the hot plate is cooled by supplying cooling water at a temperature of 23° C. to each of a first cooling line 206 and a second cooling line 208 at a rate of 1.5 liters per minute (total 3 liters/min) (hereinafter, Example 2).
  • FIG. 10 shows a case where the hot plate is cooled naturally (hereinafter, Example 1).
  • FIG. 11 shows a case where the hot plate is cooled by supplying cooling water at a temperature of 23° C. to each of a first cooling line 206 and a second cooling line 208 at a rate of 1.5 liters per minute (total 3 liters/min) (hereinafter, Example 2).
  • FIG. 10 shows a case where the hot plate
  • FIG. 13 shows a case where the hot plate is cooled by supplying air at a temperature of 23° C., instead of cooling water, to each of the first cooling line 206 and the second cooling line 208 (hereinafter, Example 3).
  • FIG. 14 shows a case where the hot plate is cooled by supplying cooling water at a temperature of 18° C. to each of cooling lines 210 buried in a lower plate 204 installed under the heater 202 , at a rate of 1.5 liters per minute (total 3 liters/min) (hereinafter, Example 4).
  • FIG. 12 shows an amount of time necessary to stabilize the temperature in Example 2.
  • Reference characters G 1 of FIG. 10, G 3 of FIG. 11, G 5 of FIG. 12, G 7 of FIG. 13, and G 9 of FIG. 14 indicate first, third, fifth, seventh, and ninth curves, respectively, showing a variation of average temperature of the top surface of the hot plate 200 with time during a cooling process.
  • Reference characters G 2 of FIG. 10, G 4 of FIG. 11, G 6 of FIG. 12, G 8 of FIG. 13, and G 10 of FIG. 14 indicate second, fourth, sixth, eighth, and tenth curves showing a variation of greatest temperature deviation of the hot plate with time during the cooling process.
  • Example 2 As a result, in Example 2, as shown in the fifth and sixth curves G 5 and G 6 of FIG. 12, it took about 5 minutes to stabilize the temperature after the hot plate 200 was cooled to 100° C.
  • FIGS. 18 through 20 are graphs showing simulation results of the baking system according to the first embodiment of the present invention.
  • Eleventh and twelfth curves G 11 and G 12 of FIG. 18 show a variation in average temperature and greatest temperature deviation of the top surface of a hot plate, respectively, with time in a case where a liquid coolant at a temperature of 23° C. circulates three times at 15-second intervals (hereinafter, Example 5).
  • thirteenth and fourteenth curves G 13 and G 14 show a variation in average temperature and greatest temperature deviation of the top surface of the hot plate, respectively, with time in a case where a liquid coolant at a temperature of 50° C. circulates four times at 15-second intervals (hereinafter, Example 6).
  • fifteenth and sixteenth curves G 15 and G 16 show a variation in the average temperature and greatest temperature deviation of the top surface of the hot plate, respectively, with time in a case where a liquid coolant at a temperature of 80° C. circulates six times at 15-second intervals (hereinafter, Example 7).
  • Example 5 Referring to the eleventh and twelfth curves G 1 and G 12 of FIG. 18, in Example 5, the hot plate was cooled to a temperature of 100° C. within 40 seconds, and the greatest temperature deviation AT of the hot plate was ⁇ T ⁇ 0.4° C. at the end of each interval.
  • Example 6 Further, referring to the thirteenth and fourteenth curves G 13 and G 14 of FIG. 19, in Example 6, the hot plate was cooled to a temperature of 100° C. within 45 seconds and the greatest temperature deviation ⁇ T of the hot plate was ⁇ T ⁇ 0.2° C. at the end of each interval.
  • Example 7 the hot plate was cooled to a temperature of 100° C. within 75 seconds, and the greatest temperature deviation AT of the hot plate was ⁇ T ⁇ 0.2° C. at the end of each interval.
  • the cooling time was similar or slightly longer and the temperature stabilizing time was shorter than in the contrastive baking system and the temperature deviation was the same as in a natural cooling method (Example 1).
  • Example 1 using the natural cooling method, the cooling time and the stabilizing time were much longer than in the baking system of the present invention. Therefore, despite the small temperature deviation, Example 1 is not suitable for practical use.
  • the baking system of the present invention performed better than any contrastive baking system in consideration of overall productivity, cooling effect, and temperature uniformity.
  • the baking system of the present invention includes a heat pipe, a top surface of which is used as a hot plate where a wafer to be baked is loaded, and on sides and a ceiling of which wicks for supplying a working fluid are installed.
  • a heat pipe a top surface of which is used as a hot plate where a wafer to be baked is loaded
  • wicks for supplying a working fluid are installed.
  • the heat pipe is connected to a subsidiary cooling system, which is used to circulate a working fluid through the heat pipe to cool the top surface.
  • the subsidiary cooling system includes a coolant storage tank, which is filled with a predetermined amount of liquid coolant to be exchanged with the working fluid to cool the top surface, and a cooling unit, which prevents an increase in temperature of the liquid coolant due to inflow of the working fluid.
  • the coolant storage tank may further include a pressurizing unit, a second cooling system, or a subsidiary heater, if necessary.
  • the subsidiary cooling system is able to maintain the working fluid in the heat pipe at a low temperature during cooling of the top surface of the heat pipe, thus improving the cooling efficiency of the heat pipe.
  • the coolant storage tank includes a subsidiary heater, a time required for heating the top surface of the heat pipe, i.e., a hot plate surface, may be reduced to improve semiconductor device manufacturing productivity.

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  • Life Sciences & Earth Sciences (AREA)
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US10/820,157 2003-04-08 2004-04-08 Baking system having a heat pipe Abandoned US20040256094A1 (en)

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KR100746231B1 (ko) * 2006-08-18 2007-08-03 삼성전자주식회사 보조 칠러를 갖는 냉각장치 및 이를 이용하는 반도체 소자제조방법
JP4996184B2 (ja) * 2006-09-19 2012-08-08 東京エレクトロン株式会社 ウエハの温度制御装置及びウエハの温度制御方法
CN101889241B (zh) * 2007-12-07 2012-03-21 塔工程有限公司 用于加热图案框架的设备
DE102014203144A1 (de) * 2014-02-21 2015-08-27 Carl Zeiss Smt Gmbh Baugruppe eines optischen Systems, insbesondere in einer mikrolithographischen Projektionsbelichtungsanlage
CN108662930A (zh) * 2017-09-28 2018-10-16 上海微电子装备（集团）股份有限公司 一种热板装置

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US6018616A (en) * 1998-02-23 2000-01-25 Applied Materials, Inc. Thermal cycling module and process using radiant heat
US6626236B1 (en) * 1999-03-24 2003-09-30 Komatsu Ltd. Substrate temperature control plate and substrate temperature control apparatus comprising same
US6685467B1 (en) * 2000-10-24 2004-02-03 Advanced Micro Devices, Inc. System using hot and cold fluids to heat and cool plate

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US3543839A (en) * 1969-05-14 1970-12-01 Trw Inc Multi-chamber controllable heat pipe
US6018616A (en) * 1998-02-23 2000-01-25 Applied Materials, Inc. Thermal cycling module and process using radiant heat
US6626236B1 (en) * 1999-03-24 2003-09-30 Komatsu Ltd. Substrate temperature control plate and substrate temperature control apparatus comprising same
US6685467B1 (en) * 2000-10-24 2004-02-03 Advanced Micro Devices, Inc. System using hot and cold fluids to heat and cool plate

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US20210090863A1 (en) * 2017-12-21 2021-03-25 Meyer Burger (Germany) Gmbh System for electrically decoupled, homogeneous temperature control of an electrode by means of heat conduction tubes, and processing facility comprising such a system

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KR20040087499A (ko) 2004-10-14
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CN1536446A (zh) 2004-10-13
KR100528334B1 (ko) 2005-11-16

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