US20040170524A1 - Unleaded solder - Google Patents

Unleaded solder Download PDF

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Publication number
US20040170524A1
US20040170524A1 US10/480,759 US48075903A US2004170524A1 US 20040170524 A1 US20040170524 A1 US 20040170524A1 US 48075903 A US48075903 A US 48075903A US 2004170524 A1 US2004170524 A1 US 2004170524A1
Authority
US
United States
Prior art keywords
solder
proportion
solder according
percent
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/480,759
Other languages
English (en)
Inventor
Petra Lambracht
Markus Rettenmayr
Christoph Tschudin
Souad Arsalane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Besi Switzerland AG
Original Assignee
Esec Trading AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Trading AG filed Critical Esec Trading AG
Assigned to ESEC TRADING SA reassignment ESEC TRADING SA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ARSALANE, SOUAD, LAMBRACHT, PETRA BENDER NEE, RETTENMAYR, MARKUS, TSCHUDIN, CHRISTOPH
Publication of US20040170524A1 publication Critical patent/US20040170524A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Definitions

  • the invention concerns a lead-free solder.
  • Solder is used in a variety of types for the assembly of electronic components, in particular printed-circuit boards.
  • electronic components are formed from discrete components in particular resistors, capacitors, diodes and transistors.
  • the respective electronic circuits are integrated into integrated circuits (IC).
  • IC integrated circuits
  • Such integrated circuits have a high integration level of electrical circuits and connections.
  • the individual integrated circuits are applied to printed-circuit boards or similar in a high packing density whereby the printed-circuit board itself comprises a large number of conductor layers.
  • solder In doing so, considerable mechanical demands are also put on the solder.
  • the solder must be resistant to shear and compressive forces.
  • the solder must demonstrate a good thermal fatigue strength, that means the solder must be insensitive to volumetric changes with large temperature fluctuations.
  • solder that contains lead as the principle component.
  • Alloys of the type PbSn(x)Ag(y) are especially used for the electrical bonding of electronic components on printed-circuit boards.
  • Solder of this type has a solidus temperature that lies above 260° C. Solder of this type is therefore also particularly suited for the bonding of power semiconductors by the operation of which a considerable heat generation develops.
  • solder of this type exists in that the lead in this solder has strongly toxic characteristics and therefore presents a danger to human health. Therefore, strict safety measures have to be met for the disposal of components with solder containing lead. The trend in the legislation goes towards setting high requirements for the disposal of materials of this kind.
  • Lead-free solder of this type is typically formed from tin-based alloys.
  • solder have unsatisfactory mechanical characteristics.
  • such types of solder have insufficient ductility, strength and durability with thermal loads.
  • solder In DE 195 38 992 A1, a lead-free solder is suggested that is improved with respect to these mechanical characteristics.
  • This solder consists of an alloy that has effective amounts of bismuth and tin as well as gold. At the same time, the alloy has a melting temperature of around 138° C.
  • the alloy preferably consists of a percentage by mass of 42% tin, a percentage by mass of less than 1% gold and a percentage by mass of around 58% bismuth.
  • solder that consists of an alloy of tin, bismuth and silver.
  • the tin proportion of the alloy lies between 70% and 93%.
  • the solder contains 5% to 27.5% bismuth and 2% to 7.5% silver.
  • the alloy available in powder form is particularly used for the manufacture of solder pastes.
  • solder based on tin is described.
  • the solder contains silver with a proportion of 3% to 4%, bismuth with a proportion of 2% to 6% and indium with a proportion of 2% to 6%.
  • the solidus temperature of this solder alloy lies at a maximum of 211° C.
  • the object of the invention is to provide a lead-free solder with high thermal and mechanical capacity.
  • the lead-free solder in accordance with the invention consists of an alloy on the basis of bismuth with a proportion of at least 80 percent by weight bismuth and with a solidus temperature of at least 260° C.
  • solder in accordance with the invention contains no proportions of lead, it is extremely environmentally compatible.
  • the solder in accordance with the invention has a high solidus temperature which makes it possible to use the solder for the bonding of integrated circuits.
  • the solidus temperature of at least 260° C. lies in a range in which normally only solidus temperatures of solder containing lead lie.
  • the liquidus temperature of the solder in accordance with the invention lies preferably below 450° C. Based on these thermal characteristics, the solder in accordance with the invention can be used in an extremely wide range for the bonding of electronic components, in particular highly integrated circuits.
  • solder in accordance with the invention is particularly suited for the bonding of power semiconductors by the operation of which considerable quantities of heat are released.
  • solder in accordance with the invention can be used particularly for modern soldering techniques that are used for the bonding of highly integrated circuits. This especially includes flip-chip connecting techniques and so-called die-attach techniques with which chips and things of that kind are applied to a substrate for mechanical bonding by means of the solder.
  • a further important parameter is the wettability of the solder.
  • This parameter is particularly significant for the electrical bonding of highly integrated circuits as in applications of this type extremely small amounts of solder have to be applied with positioning accuracy onto the substrate. In doing so, it must be guaranteed that these small amounts of solder demonstrate a high retention strength on the substrate. For this, in particular a high wettability of the solder is of importance.
  • solder Further mechanical parameters of the solder are its shear strength and flexural strength. This means that with force influences on electronic components secured to a substrate by means of the solder, the solder must not be damaged by lateral forces or shear forces. The strength of the solder ultimately forms an essential mechanical parameter.
  • solder in accordance with the invention demonstrates good values so that the solder has a high resistance to thermal and mechanical loads.
  • thermal and mechanical characteristics can be flexibly and reproducibly given by the selection of further solder components.
  • the thermal and mechanical characteristics can be altered by the addition of silver.
  • the solder in accordance with the invention is especially used for the manufacture of semi-finished products such as pastes, wires and tapes for example.
  • FIG. 1 shows a schematic presentation of a semiconductor chip that is bonded to a substrate by means of the solder in accordance with the invention.
  • FIG. 1 shows schematically a semiconductor chip 1 that is soldered to a substrate 2 , preferably a substrate made of metal, a so-called leadframe, or to a ceramic substrate.
  • Copper is often used as material for the leadframe.
  • the metallic substrate can, but does not have to be, coated with an additional metallic layer 3 .
  • a metallic layer 3 is necessary. This preferably consists of copper, nickel, silver or gold.
  • a single-layer or multi-layer printed-circuit board with one or several printed conductor layers can also serve as the substrate. It is important that the printed-circuit board can be heated to at least the solidus temperature of the lead-free solder that, with the solder in accordance with the invention, amounts to at least 260° C.
  • the back of the semiconductor chip 1 is also coated with a metallic layer 4 or with a series of several layers.
  • the materials gold, silver, nickel and titanium are used for this whereby the outermost layer generally consists of gold.
  • a solder layer 5 formed from the lead-free solder in accordance with the invention is foreseen for the mechanical and thermal bonding of the semiconductor chip 1 to the substrate 2 .
  • the semiconductor chip 1 is attached to the substrate 2 or to the layer 3 of the substrate by means of the solder layer 5 .
  • solder in accordance with the invention is not restricted to the arrangement according to FIG. 1.
  • the solder in accordance with the invention is generally suited for the bonding of electrical and electronic components, in particular also discrete components such as diodes, transistors, resistors and things of that kind.
  • solder in accordance with the invention is used with particular advantage for the bonding of power semiconductors by the operation of which a high heat generation occurs. Furthermore, the solder in accordance with the invention is used for the bonding of highly integrated circuits. In doing so, the bonding of circuits of this type takes place on substrates with, for example, flip-chip techniques, die-attach techniques or similar.
  • the lead-free solder in accordance with the invention consists of an alloy on the basis of bismuth whereby the proportion of bismuth amounts to at least 80 percent by weight.
  • the solder in accordance with the invention has a solidus temperature of at least 260° C. and preferably a liquidus temperature that lies below 450° C.
  • solder Because of these thermal characteristics, components such as power semiconductors with which large amounts of heat are released can also be bonded with the solder in accordance with the invention. At the same time, the solder with high long-term stability can also be used for arrangements of components of high package density. In particular, integrated circuits with a high number of electrical connections can also be safely bonded.
  • solder in accordance with the invention has good mechanical characteristics.
  • the alloy on a bismuth basis has a high strength.
  • the solder in accordance with the invention also has good characteristics with a view to the thermal fatigue strength. Furthermore, the solder in accordance with the invention has a good wettability in particular on substrate layers 3 in accordance with the embodiment in accordance with FIG. 1.
  • the solder in accordance with the invention also has silver.
  • the silver proportion of the alloy amounts to between 0.5 and 15 percent by weight.
  • the ductility of the solder increases with increasing silver content.
  • the elasticity of the solder also increases by means of which ultimately the shear strength, the flexural strength and the breaking elongation of the solder are also increased.
  • a significant improvement in the named mechanical characteristics is obtained with a proportion of at least 1.5 percent by weight of silver.
  • a first component of this type is formed by copper which is preferably contained in the solder in accordance with the invention with a proportion of 5 percent by weight.
  • Tin can also be contained as a component in the solder in accordance with the invention.
  • tin does not form the main component of the alloy but is limited to a proportion of maximum 3%. By limiting the tin proportion in the alloy, it is guaranteed that the solidus temperature of the solder lies above 260° C.
  • antimony and/or zinc and/or indium and/or magnesium are contained in the solder.
  • the proportion of these components is limited respectively to a maximum of 3 percent by weight.
  • arsenic and/or phosphorus can be foreseen. Their proportion is limited respectively to a maximum of 1 percent by weight.
  • solder in accordance with the invention is used for the manufacture of semi-finished products such as pastes, wires and tapes for example.
  • solder pastes For the manufacture of solder pastes, powders comprising the solder are necessary that have defined particle sizes and which are charged with oxygen to the smallest possible extent.
  • the solder in accordance with the invention is also well suited for this.
  • the proportion of the individual components of the alloy on the basis of bismuth are selected so that simultaneously with good workability a high strength of the solder is obtained.
  • the tapes made of the solder in accordance with the invention have a good mechanical load capability.
  • the tapes can be well rolled and bent without fractures occurring in the tapes.
  • the proportions of the individual components of the solder are selected so that the wires can be easily rolled.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
US10/480,759 2001-06-12 2002-06-04 Unleaded solder Abandoned US20040170524A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EP01810566 2001-06-12
EP01810566.8 2001-06-12
EP01810612A EP1266975A1 (de) 2001-06-12 2001-06-22 Bleifreies Lötmittel
EP01810612.0 2001-06-22
PCT/EP2002/006102 WO2002101105A1 (de) 2001-06-12 2002-06-04 Bleifreies lötmittel

Publications (1)

Publication Number Publication Date
US20040170524A1 true US20040170524A1 (en) 2004-09-02

Family

ID=26077386

Family Applications (1)

Application Number Title Priority Date Filing Date
US10/480,759 Abandoned US20040170524A1 (en) 2001-06-12 2002-06-04 Unleaded solder

Country Status (5)

Country Link
US (1) US20040170524A1 (zh)
EP (1) EP1266975A1 (zh)
JP (1) JP2004528992A (zh)
CN (1) CN1463294A (zh)
WO (1) WO2002101105A1 (zh)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040099958A1 (en) * 2002-11-21 2004-05-27 Schildgen William R. Crack resistant interconnect module
US20090166876A1 (en) * 2007-12-27 2009-07-02 Panasonic Corporation Semiconductor device and die bonding material
US20090242249A1 (en) * 2006-05-24 2009-10-01 Akio Furusawa Bonding material, electronic component, bonding structure and electronic device
US20090301607A1 (en) * 2005-11-11 2009-12-10 Kosuke Nakano Solder Paste and Solder Joint
US20100294550A1 (en) * 2007-12-27 2010-11-25 Akio Furusawa Bonding material, electronic component and bonded structure
US8421246B2 (en) 2008-06-23 2013-04-16 Panasonic Corporation Joint structure and electronic component
US20130121874A1 (en) * 2010-06-30 2013-05-16 Minoru Ueshima Bi-Sn Based High-Temperature Solder Alloy
US20150037087A1 (en) * 2013-08-05 2015-02-05 Senju Metal Industry Co., Ltd. Lead-Free Solder Alloy
US9656351B2 (en) * 2013-12-03 2017-05-23 Hiroshima University Solder material and connected structure
US10189119B2 (en) * 2013-01-28 2019-01-29 Nihon Handa Co., Ltd. Solder alloy for die bonding
WO2021140370A1 (zh) * 2019-11-07 2021-07-15 罗伯特•博世有限公司 焊料、基板组件及其装配方法
US20220088723A1 (en) * 2019-05-27 2022-03-24 Senju Metal Industry Co., Ltd. Solder alloy, solder paste, solder ball, solder preform, solder joint, and substrate

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JP2005095977A (ja) * 2003-08-26 2005-04-14 Sanyo Electric Co Ltd 回路装置
WO2007018288A1 (ja) * 2005-08-11 2007-02-15 Senju Metal Industry Co., Ltd. 鉛フリーソルダペーストとその応用
US20070138442A1 (en) * 2005-12-19 2007-06-21 Weiser Martin W Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof
JP5224430B2 (ja) * 2006-03-17 2013-07-03 株式会社豊田中央研究所 パワー半導体モジュール
JP3886144B1 (ja) * 2006-05-24 2007-02-28 松下電器産業株式会社 接合材料、電子部品および接合構造体
JP4692491B2 (ja) * 2007-01-15 2011-06-01 パナソニック株式会社 接合材料
JP4692480B2 (ja) * 2006-12-27 2011-06-01 パナソニック株式会社 接合構造体および電子機器
JP2010503538A (ja) * 2006-09-13 2010-02-04 ハネウェル・インターナショナル・インコーポレーテッド 電気的相互接続のための改良されたはんだ合金、その製造方法、およびその使用
JP4822526B2 (ja) * 2006-09-15 2011-11-24 株式会社豊田中央研究所 接合体
JP4692479B2 (ja) * 2006-12-27 2011-06-01 パナソニック株式会社 接合材料およびモジュール構造体
CN101380701B (zh) * 2008-10-31 2010-11-03 河南科技大学 一种高温无铅软钎料及制备方法
JP5526720B2 (ja) * 2009-11-13 2014-06-18 株式会社村田製作所 樹脂回路基板およびその製造方法
JP4807465B1 (ja) * 2010-06-28 2011-11-02 住友金属鉱山株式会社 Ｐｂフリーはんだ合金
JP5716332B2 (ja) * 2010-09-22 2015-05-13 住友金属鉱山株式会社 Ｐｂフリーはんだ合金
JP5093373B2 (ja) 2011-03-08 2012-12-12 住友金属鉱山株式会社 Ｐｂフリーはんだペースト
CN102321829B (zh) * 2011-10-24 2012-09-19 南京信息工程大学 一种无银低熔点锡铋系无铅焊料合金及其制备方法
CN103084750B (zh) * 2013-02-25 2016-07-06 重庆科技学院 一种电子封装用高熔点无铅钎料的制备方法
JP6184731B2 (ja) 2013-04-25 2017-08-23 Ｄｏｗａエレクトロニクス株式会社 銀−ビスマス粉末、導電性ペースト及び導電膜
KR20160121562A (ko) 2014-02-20 2016-10-19 허니웰 인터내셔날 인코포레이티드 무연 솔더 조성물
JP6543890B2 (ja) * 2014-04-14 2019-07-17 富士電機株式会社 高温はんだ合金
CN106392366B (zh) * 2016-12-02 2019-07-19 北京康普锡威科技有限公司 一种BiSbAg系高温无铅焊料及其制备方法
EA039238B1 (ru) * 2018-05-20 2021-12-21 Абеятек, Ллс Светоизлучающий диод для применения при низких температурах
JPWO2020044650A1 (ja) * 2018-08-31 2021-08-10 Ｊｘ金属株式会社 はんだ合金
CN114905183B (zh) * 2022-05-11 2024-04-09 湘潭大学 一种Bi-Ag-Zn系无铅焊料及其制备方法和应用

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Publication number Priority date Publication date Assignee Title
US5368814A (en) * 1993-06-16 1994-11-29 International Business Machines, Inc. Lead free, tin-bismuth solder alloys
US20020012608A1 (en) * 2000-06-12 2002-01-31 Murata Manufacturing Co., Ltd. Pb-free solder composition and soldered article

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JP3249774B2 (ja) * 1997-06-05 2002-01-21 トヨタ自動車株式会社 摺動部材

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5368814A (en) * 1993-06-16 1994-11-29 International Business Machines, Inc. Lead free, tin-bismuth solder alloys
US20020012608A1 (en) * 2000-06-12 2002-01-31 Murata Manufacturing Co., Ltd. Pb-free solder composition and soldered article
US6703113B2 (en) * 2000-06-12 2004-03-09 Murata Manufacturing Co. Ltd Pb-free solder composition and soldered article

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040099958A1 (en) * 2002-11-21 2004-05-27 Schildgen William R. Crack resistant interconnect module
US9162324B2 (en) * 2005-11-11 2015-10-20 Senju Metal Industry Co., Ltd. Solder paste and solder joint
US20090301607A1 (en) * 2005-11-11 2009-12-10 Kosuke Nakano Solder Paste and Solder Joint
US20090242249A1 (en) * 2006-05-24 2009-10-01 Akio Furusawa Bonding material, electronic component, bonding structure and electronic device
US8227090B2 (en) 2006-05-24 2012-07-24 Panasonic Corporation Bonding material, electronic component, bonding structure and electronic device
US20090166876A1 (en) * 2007-12-27 2009-07-02 Panasonic Corporation Semiconductor device and die bonding material
US20100294550A1 (en) * 2007-12-27 2010-11-25 Akio Furusawa Bonding material, electronic component and bonded structure
US7973412B2 (en) * 2007-12-27 2011-07-05 Panasonic Corporation Semiconductor device using lead-free solder as die bonding material and die bonding material not containing lead
US8421246B2 (en) 2008-06-23 2013-04-16 Panasonic Corporation Joint structure and electronic component
US20130121874A1 (en) * 2010-06-30 2013-05-16 Minoru Ueshima Bi-Sn Based High-Temperature Solder Alloy
EP2589459A4 (en) * 2010-06-30 2015-08-05 Senju Metal Industry Co BI-SN-BASED HIGH-TEMPERATURE SOLDERING ALLOY
US9205513B2 (en) * 2010-06-30 2015-12-08 Senju Metal Industry Co., Ltd. Bi—Sn based high-temperature solder alloy
US10189119B2 (en) * 2013-01-28 2019-01-29 Nihon Handa Co., Ltd. Solder alloy for die bonding
US20150037087A1 (en) * 2013-08-05 2015-02-05 Senju Metal Industry Co., Ltd. Lead-Free Solder Alloy
US9656351B2 (en) * 2013-12-03 2017-05-23 Hiroshima University Solder material and connected structure
US20220088723A1 (en) * 2019-05-27 2022-03-24 Senju Metal Industry Co., Ltd. Solder alloy, solder paste, solder ball, solder preform, solder joint, and substrate
US11813686B2 (en) * 2019-05-27 2023-11-14 Senju Metal Industry Co., Ltd. Solder alloy, solder paste, solder ball, solder preform, solder joint, and substrate
WO2021140370A1 (zh) * 2019-11-07 2021-07-15 罗伯特•博世有限公司 焊料、基板组件及其装配方法

Also Published As

Publication number Publication date
JP2004528992A (ja) 2004-09-24
CN1463294A (zh) 2003-12-24
WO2002101105A1 (de) 2002-12-19
EP1266975A1 (de) 2002-12-18

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AS Assignment

Owner name: ESEC TRADING SA, SWITZERLAND

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LAMBRACHT, PETRA BENDER NEE;RETTENMAYR, MARKUS;TSCHUDIN, CHRISTOPH;AND OTHERS;REEL/FRAME:014677/0046

Effective date: 20031025

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION