US20020159913A1 - Sn-Ag-Cu solder and surface treatment and parts mounting methods using the same - Google Patents

Sn-Ag-Cu solder and surface treatment and parts mounting methods using the same Download PDF

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US20020159913A1
US20020159913A1 US10/127,927 US12792702A US2002159913A1 US 20020159913 A1 US20020159913 A1 US 20020159913A1 US 12792702 A US12792702 A US 12792702A US 2002159913 A1 US2002159913 A1 US 2002159913A1
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solder
content
copper
liquidus temperature
pwb
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Toshihide Ito
Shiro Hara
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Kyocera Circuit Solutions Inc
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Assigned to NEC TOPPAN CIRCUIT SOLUTIONS, INC. reassignment NEC TOPPAN CIRCUIT SOLUTIONS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NEC CORPORATION
Assigned to NEC TOPPAN CIRCUIT SOLUTIONS, INC. reassignment NEC TOPPAN CIRCUIT SOLUTIONS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NEC CORPORATION
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Definitions

  • the present invention relates to a solder containing tin (Sn), silver (Ag) and copper (Cu) and surface treatment and parts mounting methods using the solder and more particularly, to a Sn—Ag—Cu solder that suppresses copper (Cu) of circuit layers of Printed Wiring Boards (PWBs) to dissolve into the molten solder in soldering processes, a method of surface-treating a PWB using the solder, and a method of mounting electronic parts or components on a PWB using the solder.
  • Sn—Ag—Cu solder that suppresses copper (Cu) of circuit layers of Printed Wiring Boards (PWBs) to dissolve into the molten solder in soldering processes
  • PWBs Printed Wiring Boards
  • Sn—Cu solder alloys have a disadvantage of a high melting point.
  • the melting point is as high as 227° C.
  • PWBs and electronic parts or components mounted thereon are unable to withstand the heat applied during the soldering process, because typical PWBs have heat resistance against temperatures of approximately 260° C. or lower.
  • Sn—Zn solder alloys have an advantage of a proper melting point. With a 91Sn-9Sn alloy containing 91 wt % Sn and 9 wt % Zn that has a eutectic composition, the melting point is 199° C., which is near the melting point (183° C.) of a 63Sn-37Pb alloy having a eutectic composition. Therefore, Sn—Zn solder alloys are preferred from the viewpoint of soldering temperatures. However, Sn—Zn solder alloys have a problem that they tend to be oxidized conspicuously because they contain an active element of Zn. As a result, they are unable to provide solder joints with desired quality or state.
  • Sn—Ag—Cu solder alloys have an acceptable melting point.
  • the melting point is 217° C.
  • the melting point of 217° C. is higher than the melting point (183° C.) of a 63Sn-37Pb alloy, it is sufficiently low from the viewpoint of the heat resistance of PWBs.
  • solder alloys when Sn—Ag—Cu solder alloys are used while the heat treatment temperature for forming the coating on the circuit layers of PWBs or the footprint thereof, or mounting electronic parts or components onto PWBs is set at 250° C., a desired soldering quality or state as well as a desired mechanical characteristic can be realized.
  • solder composition that contains 92.5 to 96.9 wt % of Sn, 3 to 5 wt % of Cu, 0.1 to 2 wt % of Ni, and 0 to 0.5 wt % of Ag.
  • An object of this solder composition was to provide a Pb-free solder for piping.
  • the Japanese Non-Examined Patent Publication No 2-179388 published in 1990 discloses a “low melting-point Ag solder” that contains 10 to 30 wt % of Ag, 70 to 90 wt % of Sn, 0.05 to 5 wt % of at least one of Cu, In, and Ga, and 0.05 to 1 wt % of at least one of Fe and Ni.
  • An object of this solder was to improve its corrosion resistance and electrical and thermal conductivity.
  • the Japanese Non-Examined Patent Publication No. 4-333391 published in 1992 discloses a “Pb-alloy brazing material” that contains 0.5 to 10 wt % of Sn, 1 to 6 wt % of Ag, 0.01 to 0.5 wt % of Ni, and a balance of Pb and inevitable impurity. An object of this material was to improve its creep characteristic.
  • the Japanese Non-Examined Patent Publication No. 6-269983 published in 1994 discloses a “Ag solder” that contains 5 to 20 wt % of Ag, 70 to 90 wt % of Sn, 0.05 to 10 wt % of Cu, 0.05 to 2 wt % of palladium (Pd), and 0.05 to 1 wt % of at least one of Fe, Co, and Ni.
  • An object of this solder was to improve its wettability on a Ni-system base metal.
  • An object of this solder alloy was to improve its thermal fatigue resistance and connectivity.
  • copper leaching a phenomenon termed “copper leaching” occurs when a Sn—Ag—Cu alloy is coated on the plated Cu circuit layer of a PWB by the hot-air leveling method.
  • the “copper leaching” is a phenomenon that Cu contained in the circuit layer dissolves in the molten alloy thus coated and as a result, the thickness of the circuit layer decreases. In the worst case, the circuit layer is broken or cut due to the “copper leaching” phenomenon. This degrades the reliability of the PWB.
  • solder leaching occurs when a Sn—Ag—Cu alloy is used as a solder for mounting electronic parts or components onto the Cu circuit layer of a PWB by the flow-soldering method. In this case, soldering defects tend to occur due to the “copper leaching”, thereby degrading the reliability of the PWB.
  • the Japanese Non-Examined Patent Publication No. 11-77368 published in Mar. 23, 1999 discloses a “Pb-free solder alloy” that contains a Sn—Pb—Bi—In alloy as its main ingredient and 1 to 4 wt % of Cu.
  • the Japanese Non-Examined Patent Publication No. 9-94688 published in 1997 discloses a “Pb-free solder alloy” that contains a Sn—Zn—Ni alloy as its main ingredient and 0.1 to 3 wt % of Cu.
  • solder alloys disclosed in the above-identified Publication Nos. 11-77368 and 9-94688 have an object to prevent the “copper leaching” phenomenon by addition of Cu.
  • the solder alloy disclosed in the Publication No. 11-77368 has a disadvantage that the melting point is excessively high because its solidus and liquidus temperatures are 208° C. and 342° C., respectively.
  • the solder alloy disclosed in the Publication No. 9-94688 has a disadvantage that it is easily oxidized This is because the solder alloy is one of Sn—Zn alloys having the above-described easy oxidation property.
  • an object of the present invention is to provide a Pb-free solder that has a satisfactory low melting point and that suppresses effectively the “copper leaching” phenomenon.
  • Another object of the present invention is to provide a Pb-free solder that is difficult to be oxidized and that has high wettability.
  • Still another object of the present invention is to provide a method of surface-treating a PWB that realizes a PWB with high reliability.
  • a further object of the present invention is to provide a method of mounting electronic parts or components on a PWB that forms highly reliable solder joints.
  • a Pb-free solder which consists essentially of:
  • the solder according to the first aspect of the invention With the Pb-free solder according to the first aspect of the invention, the “copper leaching” phenomenon can be effectively suppressed due to existence of Ni and/or Fe within the specific amount range. Also, since the amount of the Ni and/or Fe is very small, the solder according to the first aspect of the invention has a composition similar to the eutectic composition of Sn—Ag—Cu solders without Ni and Fe. Thus, the solder has a low liquidus temperature (i.e., a low melting point).
  • the solder according to the first aspect of the invention is one of the Sn—Ag—Cu solders and therefore, it is difficult to be oxidized and satisfactory in wettability.
  • the content of Ni is in the range from 0.02 to 0.04 wt % and/or the content of Fe is in the range from 0.02 to 0.05 wt %.
  • the solder according to the first aspect of the invention has a copper dissolution rate of 0.15 ⁇ m or less (or 0.20 ⁇ m or less). This is to ensure the suppression of the “copper leaching” phenomenon.
  • the solder according to the first aspect of the invention has a liquidus temperature of 240° C. or lower. More preferably, the liquidus temperature is 230° C. or lower. This is to ensure a satisfactory low melting point.
  • the solder according to the first aspect of the invention has a viscosity of 2.5 cP or lower.
  • a method of surface-treating a FWD which comprises the steps of:
  • the solder can be selectively coated onto the Cu circuit layer of the PWB with high reliability.
  • a method of mounting electronic parts or components on a PWD comprises the steps of:
  • the electronic parts or components can be mounted (i.e., mechanically supported and electrically connected) on the Cu circuit layer of the PWB with highly reliable solder joints.
  • FIG. 1 is a graph showing the relationship between the content of the elements or ingredients of Sn—Ag—Cu solders and the copper dissolution rate thereof.
  • FIGS. 2A to 2 E are graphs showing the result of experiments of the sample solders in Tables 11 to 15 under the condition that the Cu content is changed from 0.2 to 1.6 wt % and the Ni content is changed from 0 to 0.1 wt % while the Ag content is fixed at 0.5, 1, 3.5, 4, or 5 wt %, respectively.
  • FIGS. 3A to 3 E are graphs showing the result of experiments of the sample solders in Tables 11 to 15 under the condition that the Ag content is changed from 0.2 to 1.6 wt % and the Ni content is changed from 0 to 0.1 wt % while the Cu content is fixed at 0.2, 0.4, 0.8, 1.2, and 1.6 wt %, respectively.
  • FIGS. 4A to 4 E are graphs showing the result of experiments of the sample solders in Tables 11 to 15 under the condition that the Cu content is changed from 0.2 to 1.6 wt % and the Fe content is changed from 0 to 0.1 wt % while the Ag content is fixed at 0.5, 1, 3.5, 4, and 5 wt %, respectively.
  • FIGS. 5A to 5 E are graphs showing the result of experiments of the sample solders in Tables 11 to 15 under the condition that the Ag content is changed from 0.2 to 1.6 wt % and the Fe content is changed from 0 to 0.1 wt % while the Cu content is fixed at 0.2, 0.4, 0.8, 1.2, and 1.6 wt %, respectively.
  • FIG. 6 is a graph showing the relationship between the liquidus temperature and the Ni content in the Sn—Ag—Cu solder that contains 3.5 wt % of Ag and 0.8 wt % of Cu.
  • FIG. 7 is a graph showing the relationship between the liquidus temperature and the Ni content in the Sn—Ag—Cu solder that contains 3.5 wt % of Ag, 0.8 wt % of Cu, and 0.02 wt % of Fe.
  • FIG. 8 is a graph showing the relationship between the copper dissolution rate and the Ni or Fe content in the Sn—Ag—Cu solder that contains 3.5 wt % of Ag and 0.8 wt % of Cu, and the relationship between the copper dissolution rate and the Ni content in the Sn—Ag—Cu solder that contains 3.5 wt % of Ag, 0.8 wt % of Cu, and 0.02 wt % of Fe.
  • FIG. 9 is a graph showing the relationship between the copper dissolution rate and the Ag content in the Sn—Ag—Cu solder when the Ni content is changed from 0 to 0.1 wt % and the Cu content if fixed at 0.8 wt %.
  • FIG. 10 is a graph showing the relationship between the copper dissolution rate and the Cu content in the Sn—Ag—Cu solder when the Ni content is changed from 0 to 0.1 wt % and the Ag content is fixed at 3.5 wt %.
  • FIG. 11 is a graph showing the relationship between the liquidus temperature and the Ag content in the Sn—Ag—Cu solder when the Ni content is changed from 0 to 0.1 wt % and the Cu content is fixed at 0.8 wt %.
  • FIG. 12 is a graph showing the relationship between the liquidus temperature and the Cu content in the Sn—Ag—Cu solder when the Ni content is changed from 0 to 0.1 wt % and the Ag content is fixed at 3.5 wt %.
  • the inventors conducted experiment and research vigorously and as a result, they found the fact that the “copper leaching” phenomenon can be effectively suppressed if proper amount of Ni and/or Fe is/are added to a Sn—Ag—Cu solder alloy. Through the fact thus found, they created the present invention.
  • the Pb-free solder according to the present invention consists essentially of:
  • Ni and/or Fe serve(s) to lower a copper dissolution rate of the solder.
  • FIG. 1 and the following Table 1 express the copper dissolution rate ( ⁇ m/sec) obtained under the condition that specific elements Ag, Cu, Bi, In, Zn, Fe, or Ni were added to Sn as its main ingredient. From FIG. 1 and Table 1, it is seen that the higher the copper dissolution rate is, the more easily the “copper leaching” phenomenon progresses.
  • the copper dissolution rate is conspicuously decreased by addition of a trace of of Ni or Fe while the decrease in the copper dissolution rate is relatively small when other elements than Ni and Fe are added.
  • the liquidus temperature decreases with the increasing amount of the added element or elements to an alloy with the eutectic composition.
  • the “copper leaching” phenomenon can be effectively suppressed by addition of Ni and/or Fe while the liquidus temperature is suppressed to rise.
  • Ag is an element having a function of enhancing or improving the wettability of the solder. In other words, the wetting time can be shortened by addition of Ag.
  • Table 2 shows the result of a test that measures the wettability of Sn—Ag—Cu solders according to the wetting balance method specified in the section 8.3.1.2 of JIS (Japan Industrial Standard) Z 3197.
  • JIS Japanese Industrial Standard
  • phosphorus-deoxidized copper plates were heated for 20 minutes at 130° C., thereby oxidizing the plates. The copper plates thus oxidized were used as samples.
  • a flux for this test was produced in the following way. Specifically, 25 mg of rosin was dissolved in isopropyl alcohol and then, 0.39 ⁇ 0.01 g of diethyl amine hydrochloride was added thereto.
  • the temperature of a soldering bath was set at 250° C., the dipping speed of the samples into the bath was set at 16 mm/sec, the dipping depth was set at 2 mm, and the dipping period was set at 10 seconds.
  • TABLE 2 COPPER COMPOSITION SOLIDUS LIQUIDUS DISSOLUTION WETTING ( wt % ) TEMPERATURE TEMPERATURE RATE TIME Sn Ag Cu ( ° C. ) ( ° C.
  • the Sn—Cu alloys without Ag have the wetting time greater than two seconds. Unlike this, almost all the Sn—Cu alloys with Ag have the wetting time less than two seconds.
  • the alloy containing 3.5 wt % of Ag and 0.8 wt % of Cu has a minimum wetting time of 1.16 second and a copper dissolution rate of 0.13 ⁇ m/sec.
  • Cu is an element having a function of suppressing the “copper leaching” phenomenon of the Cu circuit layers of the PWB.
  • Table 3 shown below shows the result of tests that measure the solidus and liquidus temperatures and the copper dissolution rate of Sn—Pb solders with the eutectic composition according to JIS H63A. The tests were conducted to find the preferred content range of Cu.
  • TABLE 3 COPPER COPPER SOLIDUS LIQUIDUS DISSOLUTION CONTENT TEMPERATURE TEMPERATURE RATE (wt %) (° C.) (° C.) ( ⁇ m/sec) 0 183 183 0.10 0.1 183 183 0.08 0.2 183 198 0.07 0.3 183 218 0.05 0.4 183 236 0.04 0.5 183 250 0.02
  • the effect to suppress the “copper leaching” phenomenon is insufficient when the Cu content is less than 0.4 wt %.
  • the Cu content is greater than 1.3 wt %, the liquidus temperature is excessively high, causing the possibility that defects tend to occur in the PWB and/or electronic components mounted thereon in the soldering process. Accordingly, it is preferred that the Cu content is in the range from 0.4 wt % to 1.3 wt %, the reason of which is explained later.
  • Tables 4 and 5 show the relationship between the Ag and Cu contents and the liquidus temperature and the copper dissolution rate of Sn—Ag—Cu solders, respectively.
  • the balance of the composition is Sn.
  • TABLE 4 COPPER DISSOLUTION Cu CONTENT RATE ( wt % ) ( ⁇ m/sec ) 0 0.2 0.4 0.8 1 1.2 1.6 Ag 0 232 230 229 227 235 244 259
  • the liquidus temperature is minimized when the Ag content is 3.5 wt % and the Cu content is 0.8 wt % and that the liquidus temperature rises if the Ag content is increased or decreased from 3.5 wt % and the Cu content is increased 0 r decreased from 0.8 wt %.
  • the alloy containing 3.5 wt % of Ag and 0.8 wt % of Cu has a minimum wetting time of 1.16 second and a copper dissolution rate of 0.13 ⁇ m/sec.
  • the liquidus temperature is relatively lower when the Cu content is in the range from 0.4 wt % to 1.2 wt %.
  • the liquidus temperature is relatively lower when the Ag content is in the range from 1 wt % to 4 wt %.
  • Ni is an element having a function of suppressing the “copper leaching” phenomenon of the Cu circuit layers of the PWB. This function becomes distinctive by addition of a trace of Ni.
  • the Ni content is less than 0.02 wt %, the effect to suppress the “copper leaching” phenomenon is insufficient.
  • the Ni content is greater than 0.06 wt %, the liquidus temperature is excessively high, causing a danger that some defect occurs in the PWB and/or electronic components.
  • the preferred content of Ni is 0.02 to 0.06 wt %, in which the liquidus temperature is set at 240° C. or lower. It is found that the more preferred content of Ni is 0.02 to 0.04 wt %, in which the liquidus temperature is set at 230° C. or lower.
  • Fe is an element having a function of suppressing the “copper leaching” phenomenon of the Cu circuit layers of the PWB. This function becomes distinctive by addition of a trace of Fe.
  • the first problem is that the thickness of the coated solder on the copper circuit layers of the PWB is not uniform when the solder is coated by the hot-air leveling method. Moreover, there is a possibility that the circuit layers are not partially coated by the solder and that unwanted solder bridges are formed between the adjoining circuit lines.
  • the second problem is that the soldering yield lowers in the flow-soldering process because of instable flow of the solder and that the connection reliability of the solder joints degrades due to solder amount fluctuation in the joints.
  • the preferred range of the Fe content is 0.02 to 0.06 wt %. From the viewpoint of the viscosity, the more preferred range of the Fe content is 0.02 to 0.05 wt %.
  • the copper dissolution rate can be further lowered compared with that of the solder to which only one of Ni and Fe is added.
  • the liquidus temperature is approximately the same as that of the solder to which only Ni is added.
  • the preferred range of the Ni content is 0.02 to 0.06 wt % or 0.02 to 0.04 wt % and at the same time, the preferred range of the Fe content is 0.02 to 0.06 wt % or 0.02 to 0.05 wt %.
  • sample solders having the composition specified in the following Tables 6 to 10 were produced, in which the balance of the composition of each solder was Sn and inevitable impurity.
  • the sample solders thus produced were respectively termed the sample Nos. 1 to 105, respectively.
  • the solidus temperature was measured by the “differential thermal analysis” method. Also, each sample solder was melted and stored in a measurement cup. Then, while the viscosity of the sample solder thus melted was measured by using a “VISCOTESTER VT-04” (produced by RION CO. LTD.), the solder was gradually cooled in such a way that the temperature of the solder was lowered from the temperature of approximately 310° C. toward room temperature. The temperature at which the viscosity of the solder suddenly rises was found during the cooling process. The temperature at which the viscosity of the solder suddenly rises was defined as the liquidus temperature. Therefore, the viscosity of the sample solders was measured during the measurement of the melting temperature.
  • the symbol “ ⁇ ” was added. If it was in the range from 0.15 ⁇ m/sec to 0.20 ⁇ m/sec, the symbol “ ⁇ ” was added. If it was higher than 0.20 ⁇ m/sec, the symbol “X” was added.
  • FIGS. 2A to 2 E and FIGS. 3A to 3 E show the result of the samples containing Ni only.
  • the total evaluation result is “ ⁇ ” or “ ⁇ ” for all the corresponding samples when the Cu content is in the range from 0.4 wt % to 1.3 wt % and the Ni content is in the range from 0.02 wt % to 0.06 wt %.
  • the total evaluation result is not changed even if the Ag content varies within the range from 1.0 wt % to 4.0 wt %.
  • the total evaluation result is “ ⁇ ”or “ ⁇ ” for all the corresponding samples when the Ag content is in the range from 1.0 wt % to 4.0 wt % and the Ni content is in the range from 0.02 wt % to 0.06 wt %.
  • the total evaluation result is not changed even if the Cu content varies within the range from 0.4 wt % to 1.3 wt %.
  • the total evaluation result is “ ⁇ ” for all the corresponding samples when the Ni content is in the range from 0.02 wt % to 0.06 wt %.
  • the total evaluation result is not changed even if the Ag content varies within the range from 0.4 wt % to 1.3 wt % and the Cu content varies within the range from 0.4 wt % to 1.3 wt %.
  • FIGS. 4A to 4 E and FIGS. 5A to 5 E show the result of the samples containing Fe only.
  • the total evaluation result is “ ⁇ ” or “ ⁇ ” for all the corresponding samples when the Cu content is in the range from 0.4 wt % to 1.3 wt % and the Fe content is in the range from 0.02 wt % to 0.06 wt %.
  • the total evaluation result is not changed even if the Ag content varies within the range from 1.0 wt % to 4.0 wt %.
  • the total evaluation result is “ ⁇ ” or “ ⁇ ” for all the corresponding samples when the Ag content is in the range from 1.0 wt % to 4.0 wt % and the Fe content is in the range from 0.02 wt % to 0.06 wt %.
  • the total evaluation result is not changed even if the Cu content varies within the range from 0.4 wt % to 1.3 wt %.
  • FIGS. 6 to 12 are presented on the basis of the results shown in Tables 11 to 15.
  • FIG. 6 shows the relationship between the liquidus temperature and the Ni content of the Sn—Ag—Cu solder that contains 3.5 wt % of Ag and 0.8 wt % of Cu. It is seen from FIG. 6 that the liquidus temperature is equal to or lower than 230° C. when the Ni content is 0.06 wt % or less.
  • FIG. 7 shows the relationship between the liquidus temperature and the Ni content of the Sn—Ag—Cu solder that contains 3.5 wt % of Ag, 0.8 wt % of Cu, and 0.02 wt % of Fe. It is seen from FIG. 7 that the liquidus temperature is equal to or lower than 240° C. when the Ni content is 0.06 wt % or less and equal to or lower than 230° C. when the Ni content is 0.04 wt % or less.
  • FIG. 8 shows the relationship between the copper dissolution rate and the Ni and/or Fe content(s) of the Sn—Ag—Cu solder that contains 3.5 wt % of Ag and 0.8 wt % of Cu.
  • the symbol “ ⁇ ” denotes the case of only Ni being added
  • the symbol “ ⁇ ” denotes the case of only Ni being added
  • the symbol “ ⁇ ” denotes the case of both Ni and Fe being added in which the Ni content was changed while the Fe content was fixed at 0.02 wt %.
  • the copper dissolution rate is lower than 0.15 ⁇ m/sec in these three cases when the Ni and/or Fe content(s) is/are 0.02 wt % or greater.
  • FIG. 9 shows the relationship between the copper dissolution rate and the Ag content of the Sn—Ag—Cu solder when the Ni content is changed from 0 to 0.1 wt % and the Cu content is fixed at 0.8 wt %.
  • FIG. 10 shows the relationship between the copper dissolution rate and the Cu content of the Sn—Ag—Cu solder when the Ni content is changed from 0 to 0.1 wt % and the Ag content is fixed at 3.5 wt %. It is seen from FIGS.
  • the copper dissolution rate is lower than 0.15 ⁇ m/sec when the Ni content is in the range from 0.02 wt % to 0.06 wt % while the Ag content is in the range from 1 wt % to 4 wt % and the Cu content is in the range from 0.4 wt % to 1.3 wt %.
  • FIG. 11 shows the relationship between the liquidus temperature and the Ag content of the Sn—Ag—Cu solder when the Ni content is changed from 0 to 0.1 wt % and the Cu content is fixed at 0.8 wt %.
  • FIG. 12 shows the relationship between the liquidus temperature and the Cu content of the Sn—Ag—Cu solder when the Ni content is changed from 0 to 0.1 wt % and the Ag content is fixed at 3.5 wt %. It is seen from FIGS. 11 and 12 that the liquidus temperature is equal to or lower than 240° C.
  • the liquidus temperature is equal to or lower than 230° C. if the Ni content is changed in the range from 0.02 wt % to 0.04 wt %.

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
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US20050127143A1 (en) * 2002-10-02 2005-06-16 Alps Electric Co., Ltd Solder joint structure and method for soldering electronic components
US20070018308A1 (en) * 2005-04-27 2007-01-25 Albert Schott Electronic component and electronic configuration
US20070023910A1 (en) * 2005-07-29 2007-02-01 Texas Instruments Incorporated Dual BGA alloy structure for improved board-level reliability performance
US20070117475A1 (en) * 2005-11-23 2007-05-24 Regents Of The University Of California Prevention of Sn whisker growth for high reliability electronic devices
US20070128448A1 (en) * 2004-08-10 2007-06-07 Asahi Glass Co., Ltd. Window glass for vehicle
US20080173698A1 (en) * 2006-10-17 2008-07-24 Marczi Michael T Materials for use with interconnects of electrical devices and related methods
US20090304545A1 (en) * 2006-03-09 2009-12-10 Nippon Steel Materials Co., Ltd Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member
US9780055B2 (en) 2012-06-30 2017-10-03 Senju Metal Industry Co., Ltd. Lead-free solder ball

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EP1439024B1 (en) * 2001-08-30 2005-03-30 Sumida Corporation Nonleaded solder alloy and electronic parts using it
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EP1088615A2 (en) 2001-04-04
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JP2001096394A (ja) 2001-04-10
DE60017040T2 (de) 2005-12-22
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JP3544904B2 (ja) 2004-07-21
TW476792B (en) 2002-02-21

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