US10548213B2 - Electronic controlling apparatus - Google Patents

Electronic controlling apparatus Download PDF

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Publication number
US10548213B2
US10548213B2 US16/072,999 US201616072999A US10548213B2 US 10548213 B2 US10548213 B2 US 10548213B2 US 201616072999 A US201616072999 A US 201616072999A US 10548213 B2 US10548213 B2 US 10548213B2
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Prior art keywords
circuit board
conductor layer
controlling apparatus
circuit
disposed
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US16/072,999
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US20190029107A1 (en
Inventor
Tomohiko NAGASHIMA
Yoshihito Asao
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Assigned to MITSUBISHI ELECTRIC CORPORATION reassignment MITSUBISHI ELECTRIC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ASAO, YOSHIHITO, NAGASHIMA, Tomohiko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/188—Mounting of power supply units
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/062—Means for thermal insulation, e.g. for protection of parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor

Definitions

  • the present invention relates to an electronic controlling apparatus that has a multilayered circuit board to which a power circuit is mounted that is accompanied by heat generation in particular.
  • Patent Literature 1 Japanese Patent No. 5725055 (Gazette)
  • Patent Literature 2 International Publication No. WO/2008/078739
  • the laminated circuit portion is constituted by alternately laminating conductor layers and insulating layers.
  • the laminated circuit portion has an arrangement in which the arrangement of the plurality of conductor layers in a thickness direction is biased toward upper layers.
  • Embodiments aim to solve the above problems and an object of these embodiments is to provide an electronic controlling apparatus that can improve heat-radiating characteristics, and that can also suppress occurrences of buckling of a multilayered circuit board.
  • An electronic controlling apparatus includes: a circuit board in which conductor layers and insulating layers are disposed alternately; a power circuit that includes a plurality of power elements that are each mounted to a first surface of the circuit board so as to be connected to an upper portion wiring pattern that is formed by an upper portion outer conductor layer that is disposed on the first surface of the circuit board among the conductor layers; and a control portion that is mounted to a second surface of the circuit board so as to be connected to a lower portion wiring pattern that is formed by a lower portion outer conductor layer that is disposed on the second surface of the circuit board among the conductor layers.
  • Thicknesses of the upper portion outer conductor layer and the lower portion outer conductor layer are identical and have greatest thickness among the conductor layers, or thicknesses of a first outermost position inner conductor layer that is positioned at a position that is nearest to the first surface inside the circuit board and a second outermost position inner conductor layer that is positioned at a position that is nearest to the second surface among the conductor layers are identical and have greatest thickness among the conductor layers, and the conductor layers are disposed symmetrically so as to have a central plane in a thickness direction of the circuit board as a plane of symmetry.
  • the thermal capacity of the upper portion wiring pattern or the outermost position inner conductor layer can be increased, improving heat-radiating characteristics.
  • the conductor layers are disposed symmetrically so as to have a central plane in the thickness direction of the circuit board as a plane of symmetry, the occurrence of asymmetry in thermal distribution that accompanies heat generated in the power elements is suppressed, suppressing occurrences of buckling of the circuit board.
  • FIG. 1 is an overall circuit diagram for an electric power steering apparatus that uses an electronic controlling apparatus according to Embodiment 1 of the present invention
  • FIG. 2 is a cross section that shows the electric power steering apparatus that uses the electronic controlling apparatus according to Embodiment 1 of the present invention
  • FIG. 3 is a plan that shows a circuit board in the electronic controlling apparatus according to Embodiment 1 of the present invention that is viewed from a side near a motor;
  • FIG. 4 is a side elevation that shows the circuit board in the electronic controlling apparatus according to Embodiment 1 of the present invention.
  • FIG. 5 is a top plan that shows an upper arm switching element that is used in the electronic controlling apparatus according to Embodiment 1 of the present invention
  • FIG. 6 is a partial cross section that shows a vicinity of the circuit board in the electronic controlling apparatus according to Embodiment 1 of the present invention.
  • FIG. 7 is a partial cross section that shows a vicinity of a circuit board in an electronic controlling apparatus according to Embodiment 2 of the present invention.
  • FIG. 8 is a top plan that shows a switching element in an electronic controlling apparatus according to Embodiment 3 of the present invention.
  • FIG. 9 is a side elevation that shows the switching element in an electronic controlling apparatus according to Embodiment 3 of the present invention.
  • FIG. 10 is a cross section that shows a vicinity of a circuit board in an electronic controlling apparatus according to Embodiment 4 of the present invention.
  • FIG. 11 is a cross section that shows a vicinity of a circuit board in an electronic controlling apparatus according to Embodiment 5 of the present invention.
  • FIG. 1 is an overall circuit diagram for an electric power steering apparatus that uses an electronic controlling apparatus according to Embodiment 1 of the present invention.
  • an electric power steering apparatus 100 includes: a motor 2 ; and a control unit 1 that controls driving of the motor 2 .
  • the control unit 1 corresponds to an electronic controlling apparatus that has a circuit board 4 that is equipped with a power circuit.
  • the motor 2 will be explained as a three-phase brushless motor, but the motor may have brushes, or may be a polyphase winding motor that has three or more phases.
  • the motor 2 has two sets three-phase windings, but may have a single three-phase winding.
  • the control unit 1 is mainly configured around a circuit board 4 to which are mounted: an inverter circuit 3 that supplies electric current to the motor 2 ; small-signal circuits such as an electric power supply circuit 13 , an input circuit 12 , a CPU 10 , and a driving circuit 11 ; a filter 17 ; and electric power supplying switching elements 5 a and 5 b that perform a role as electric power supply relays, the control unit 1 being disposed at an opposite end of the motor 2 from an output end of an output shaft 21 and integrated with the motor 2 .
  • Rotation sensors 9 b and 9 c for detecting rotational angle of the motor 2 are installed in a vicinity of a non-output end portion of the output shaft 21 of the motor 2 .
  • Electric power is supplied by means of a battery 6 and an ignition switch 7 that are mounted to a vehicle, and various types of information from sensors 8 such as vehicle speed sensors, a torque sensor that detects steering torque on a steering wheel, etc., are also inputted into the control unit 1 .
  • a constant voltage is supplied to the CPU 10 , the input circuit 12 , and the driving circuit 11 , etc., by the electric power supply circuit 13 .
  • An electric power supply for the inverter circuit 3 is supplied by means of the filter 17 , which includes capacitors and a coil.
  • Information from the sensors 8 such as the vehicle speed sensors, the torque sensor, etc., is conveyed to the CPU 10 by means of the input circuit 12 , and the CPU 10 computes controlling variables that supply electric power to the motor 2 based on this information, these controlling variables being outputted by means of the driving circuit 11 .
  • Respective information such as voltage or electric current from respective portions inside the inverter circuit 3 , rotational angle that is detected by the rotation sensor 9 b and 9 c , etc., is also conveyed to the CPU 10 by means of the input circuit 12 .
  • the electric power supplying switching elements 5 a and 5 b which have a relay function that opens and closes a +B line (hereafter “electric power supply line”), are also inserted into the electric power supply line.
  • These electric power supplying switching elements 5 a and 5 b are field-effect transistors (FETs), for example, and two parasitic diodes, one in a forward direction and one in a reverse direction relative to the electric current supply, are disposed in series.
  • FETs field-effect transistors
  • These electric power supplying switching elements 5 a and 5 b can forcibly shut off the electric power supply if a failure arises in the inverter circuit 3 or the motor 2 , for example.
  • the parasitic diodes can shut off the line through which the electric current flows, thereby also serving a role of battery reverse connection protection.
  • the CPU 10 also controls driving of these electric power supplying switching elements 5 a and 5 b by means of the driving circuit 11 .
  • the inverter circuit 3 has first and second inverter circuits 3 a and 3 b that have identical circuit configurations that supply electric power to each of two sets of three-phase windings (a U phase, a V phase, and a W phase) of the motor 2 .
  • the first inverter circuit 3 a includes a circuit portion that includes three switching elements and capacitors for each of the phases (a U1 phase, a V1 phase, and a W1 phase) of a three-phase winding.
  • the circuit portion for the U1 phase includes: an upper arm switching element 31 U; a lower arm switching element 32 U; and a relay switching element 34 U that has a relay function that opens and closes between a connecting point between the upper and lower arm switching elements 31 U and 32 U and the U1-phase winding.
  • a shunt resistor 33 U is also connected in series with the upper and lower arm switching elements 31 U and 32 U in order to detect the electric current that flows to the motor 2 .
  • the circuit portion for the V1 phase includes: an upper arm switching element 31 V; a lower arm switching element 32 V; and a relay switching element 34 V that has a relay function that opens and closes between a connecting point between the upper and lower arm switching elements 31 V and 32 V and the V1-phase winding.
  • a shunt resistor 33 V is also connected in series with the upper and lower arm switching elements 31 V and 32 V.
  • the circuit portion for the W1 phase includes: an upper arm switching element 31 W; a lower arm switching element 32 W; and a relay switching element 34 W that has a relay function that opens and closes between a connecting point between the upper and lower arm switching elements 31 W and 32 W and the W1-phase winding.
  • a shunt resistor 33 W is also connected in series with the upper and lower arm switching elements 31 W and 32 W.
  • capacitors 30 a and 30 b are connected in parallel to the upper and lower arm switching elements 31 U, 31 V, 31 W, 32 U, 32 V, and 32 W for purposes of noise suppression.
  • the second inverter circuit 3 b includes a circuit portion that includes three switching elements and capacitors for each of the phases (a U2 phase, a V2 phase, and a W2 phase) of a three-phase winding. Moreover, because the second inverter circuit 3 b is configured in a similar or identical manner to that of the first inverter circuit 3 a , explanation thereof will be omitted.
  • the CPU 10 By inputting terminal voltages of connecting points between the upper and lower arm switching elements, or between the three-phase windings, and the voltages of the shunt resistors, the CPU 10 ascertains differences between actual electric current and voltage values and controlling command values (target values), also called “feedback control”, and also performs failure determination for respective portions.
  • target values also called “feedback control”
  • the rotational angles that are detected by the rotation sensors 9 b and 9 c are inputted into the CPU 10 to calculate the rotational position or speed of the motor 2 , which is used to control the electric current supply to the coils.
  • the CPU 10 is constituted by a CPU 1 and a CPU 2 that are respectively dedicated to the first and second inverter circuits 3 a and 3 b , but may be constituted by a single CPU for both the first and second inverter circuits 3 a and 3 b .
  • the driving circuit 11 , the input circuit 12 , and the electric power supply circuit 13 are configured into one set for both the CPU 1 and CPU 2 , but may alternatively be configured such that two sets that each include a driving circuit 11 , an input circuit 12 , an electric power supply circuit 13 exist independently.
  • the inverter circuit 3 and the electric power supplying switching elements 5 a and 5 b control large currents, they correspond to a power circuit.
  • the CPU 10 , the driving circuit 11 , the input circuit 12 , and the electric power supply circuit 13 correspond to a control portion.
  • FIG. 2 is a cross section that shows the electric power steering apparatus that uses the electronic controlling apparatus according to Embodiment 1 of the present invention.
  • the electric power steering apparatus 100 is configured by integrating the control unit 1 and the motor 2 such that the control unit 1 is disposed on an upper portion of the motor 2 so as to be coaxial to the output shaft 21 .
  • the motor 2 is mounted internally into a motor case 25 .
  • This motor case 25 is made of a metal such that a mounting flange 25 a and a connecting portion 25 b that connects with a reduction gear (not shown) are integrated therein.
  • a penetrating aperture that allows passage of the output shaft 21 is formed at a central axial position of the mounting flange 25 a of the motor case 25 , and a first bearing 26 b is mounted into that penetrating aperture.
  • the motor 2 includes: a rotor 23 that is fixed to the output shaft 21 , which is inserted centrally, and on an outer circumferential surface of which a plurality of pole pairs of permanent magnets (not shown) are disposed; and a stator 22 that is disposed circumferentially outside this rotor 23 coaxially so as to have a gap interposed, the stator 22 having a winding 24 .
  • An annular connecting ring 27 is produced by insert-molding electrical wiring busbars into an insulating resin, and is disposed on an upper portion of the stator 22 so as to be in close proximity to the winding 24 .
  • Winding ends of a plurality of windings that constitute the winding 24 are connected to the busbars of the connecting ring 27 to form two sets of three-phase windings that are wye-connected, as shown in FIG. 1 .
  • Output wires (not shown) for each of the phases, i.e., six output wires, that protrude from the connecting ring 27 extend toward the control unit 1 .
  • a rotation sensor rotor 9 a is mounted to a non-output tip of the output shaft 21 .
  • a disk-shaped frame 29 is mounted to an uppermost portion of the motor case 25 in a state of internal contact.
  • This frame 29 is also made of a metal, a penetrating aperture that allows passage of the output shaft 21 is formed on a central position thereof, and a second bearing 26 a is mounted into that penetrating aperture.
  • the frame 29 serves a plurality of roles such as a partitioning wall that separates the motor 2 and the control unit 1 , a bearing holder, etc. There are also penetrating apertures in the frame 29 for passage of the six output wires.
  • the frame 29 also serves a role as a heatsink for radiating heat from the control unit 1 . Because the frame 29 is made to serve a large number of functions in this manner, the number of parts can be reduced.
  • the motor has a construction that is enveloped in the motor case 25 as far as the first and second bearings 26 a and 26 b , and can be assembled separately from the control unit 1 .
  • the electric power steering apparatus 100 can be assembled by assembling the control unit 1 and the motor 2 separately, and then integrating the two.
  • control unit 1 configuration of the control unit 1 will be explained.
  • numbering that is applied to the electric power supplying switching elements, the capacitors, the upper arm switching elements, the lower arm switching elements, and the relay switching elements will be 5 , 30 , 31 , 32 , and 34 .
  • the control unit 1 includes: the frame 29 ; a housing 16 ; and the circuit board 4 , which is housed in a space that is surrounded by the frame 29 and the housing 16 , and onto which the respective electronic components are mounted.
  • the CPU 10 , the driving circuit 11 , the input circuit 12 , the electric power supply circuit 13 , the electric power supplying switching elements 5 , and the inverter circuit 3 , etc., which are shown in FIG. 1 are disposed so as to be distributed on two surfaces of the circuit board 4 .
  • a protruding portion 29 a that functions as a heat-radiating portion is formed on the frame 29 by making a portion of an upper surface thereof protrude.
  • the housing 16 is made of a resin, for example, is produced so as to have a floored cylindrical shape, and is attached to the motor case 25 by mounting an opening edge portion by press-fitting, etc., onto the uppermost portion of the cylindrical portion of the motor case 25 .
  • At least two connectors 14 and 15 are formed integrally on a floor portion of the housing 16 .
  • the connector 14 is for a large-current electric power supply (+B and ground), and the connector 15 is for sensors.
  • Connector pins are insert-molded into these connectors 14 and 15 , first ends thereof being connected to vehicle wiring harnesses outside the control unit 1 , and second ends extending to inner wall surfaces of the housing 16 .
  • conductors 14 a which constitute electrical wiring, being for +B and for ground, respectively.
  • conductors 15 a which are for sensors, and these are extended downward in FIG. 2 so as to pass out through an inner wall in a floor portion of the housing 16 , and tip portions thereof are passed through apertures in the circuit board 4 , and are electrically connected to a wiring pattern of the circuit board 4 that is intended for connection therewith.
  • the capacitors 30 of the inverter circuit 3 are mounted to a lower surface of the circuit board 4 in FIG. 2 , so as to be disposed between the circuit board 4 and the frame 29 .
  • the filter 17 (coils and capacitors) is mounted in a vicinity of the connector 14 .
  • the filter 17 is disposed partway along the conductors 14 a of the connector 14 that extend from the connector pins, and leg portions of respective parts are connected to the conductors 14 a .
  • Portions of an inner wall surface on the floor portion of the housing 16 are made to protrude to form projecting portions 16 a that function as heat-radiating portions.
  • the CPU 10 and the driving circuit 11 that are mounted to the circuit board 4 contact the projecting portions 16 a so as to have electrically insulating heat-radiating sheets 16 b interposed, and heat generated in the CPU 10 and the driving circuit 11 is radiated to the heat-radiating portions 16 a .
  • the housing 16 functions as a second heatsink.
  • the circuit board 4 is fixed to the frame 29 by posts 18 .
  • FIG. 3 is a plan that shows a circuit board in the electronic controlling apparatus according to Embodiment 1 of the present invention that is viewed from a side near a motor
  • FIG. 4 is a side elevation that shows the circuit board in the electronic controlling apparatus according to Embodiment 1 of the present invention.
  • the control portion which includes the CPU 10 , the driving circuit 11 , the input circuit 12 , and the electric power supply circuit 13 , is connected to a lower portion wiring pattern 4 c that is formed on a rear surface of the circuit board 4 , and is mounted so as to be distributed over the entire rear surface.
  • the power circuit is mounted to a front surface of the circuit board 4 . Since a large current flows through the power circuit and generates heat, the construction thereof must take heat-radiating characteristics into consideration.
  • the first and second inverter circuits 3 a and 3 b have identical circuitry.
  • groups of parts that constitute the first and second inverter circuits 3 a and 3 b are divided into an upper half and a lower half of the front surface of the circuit board 4 in FIG. 3 , and are disposed so as to be distributed uniformly so as to be spaced apart from each other.
  • the groups of parts that constitute the first and second inverter circuits 3 a and 3 b are disposed approximately symmetrically so as to have a line segment A that divides the upper half and the lower half of the front surface of the circuit board 4 in FIG. 3 as an axis of symmetry.
  • the switching elements 31 , 32 , and 34 which constitute heat-generating parts, are distributed and disposed approximately symmetrically so as to be spaced apart from each other so as to have the line segment A that divides the upper half and the lower half of the front surface of the circuit board 4 as an axis of symmetry in this manner, asymmetry in the thermal distribution of the first and second inverter circuits 3 a and 3 b is suppressed.
  • the electric power supplying switching elements 5 are similarly disposed symmetrically on the front surface of the circuit board 4 so as to have the line segment A as an axis of symmetry.
  • the capacitors 30 a and 30 b are also disposed symmetrically on the front surface of the circuit board 4 so as to have the line segment A as an axis of symmetry.
  • wiring for connections among the respective parts is also laid out approximately symmetrically so as to have the line segment A as an axis of symmetry.
  • positive terminals 14 b and 14 d that constitute electric power supply terminals and a negative terminal 14 c that constitutes a ground terminal are all disposed at a left edge of the circuit board 4 in FIG. 3 .
  • the +B conductor 14 a is connected to the positive terminals 14 b and 14 d , and a ground conductor 14 a is connected to the negative terminal 14 c .
  • Electric power supply wiring patterns 4 a that are connected to the positive terminals 14 b and 14 d by means of the electric power supplying switching elements 5 , and a ground wiring pattern 4 b that is connected to the negative terminal 14 c , can thereby be wired parallel to each other in thick, short patterns.
  • the electric power supply wiring patterns 4 a are also formed into symmetrical patterns so as to have the line segment A as an axis of symmetry.
  • the electric power supply wiring patterns 4 a and the ground wiring pattern 4 b constitute an upper portion wiring pattern.
  • the power elements that mainly constitute the power circuit include twenty-two switching elements 5 , 31 , 32 , and 34 , and six shunt resistors 33 U, 33 V, and 33 W.
  • the sensor conductors 15 a are divided into two sets, and are inserted into and connected to through-holes 15 b and 15 c that are formed on a perimeter portion of the circuit board 4 .
  • Six through-holes 28 au , 28 av , and 28 aw are for connection to the winding 24 of the motor 2 .
  • an integrated circuits (IC) that is disposed centrally on the front surface of the circuit board 4 has the rotation sensors 9 b and 9 c mounted internally therein.
  • the circuit board 4 is fixed to the frame 29 such that the surface on which the first and second inverter circuits 3 a and 3 b are mounted faces toward the frame 29 using the posts 18 , which are inserted into the apertures 18 a .
  • the circuit board 4 itself is fixed to the housing 16 by arranging the large number of conductors 15 a distributively. Not only vibration of the circuit board 4 that results from vibration of the electric power steering apparatus 100 , but also the occurrence of buckling and the occurrence of tilting of the circuit board 4 the circuit board itself can thereby be suppressed.
  • FIG. 5 is a top plan that shows an upper arm switching element that is used in the electronic controlling apparatus according to Embodiment 1 of the present invention
  • FIG. 6 is a partial cross section that shows a vicinity of the circuit board in the electronic controlling apparatus according to Embodiment 1 of the present invention.
  • FIG. 6 only the circuit board is represented in cross section.
  • the switching elements 31 are semiconductor switches, such as metal oxide semiconductor field-effect transistors (MOSFETs), for example.
  • MOSFETs metal oxide semiconductor field-effect transistors
  • the chip 31 c of the switching element 31 is mounted to a copper plate 31 d , for example, a drain terminal being connected directly to the plate 31 d .
  • the plate 31 d is the drain terminal 31 d of the switching element 31 .
  • the source terminal 31 s and the gate terminal 31 g are led out lower down than the chip 31 c . Lower surfaces of the source terminal 31 s and the gate terminal 31 g and a lowermost surface 31 dp of the plate 31 d form a common plane.
  • the circuit board 4 is a multilayered circuit board that is configured by alternately laminating conductor layers 41 a , 41 b , 41 c , 41 d , and 41 e and insulating layers 51 a , 51 b , 51 c , and 51 d .
  • the conductor layers 41 b , 41 c , 41 d , and 41 e are formed using a metal that has good thermal conductivity, such as copper, for example, and the insulating layers 51 a , 51 b , 51 c , and 51 d are formed using a composite of glass fiber and epoxy resin, for example.
  • the conductor layer 41 a is formed on the front surface of the circuit board 4
  • the conductor layers 41 b , 41 c , and 41 d are formed inside the circuit board 4
  • the conductor layer 41 e is formed on the rear surface of the circuit board 4 .
  • the conductor layer 41 a is patterned into the electric power supply wiring patterns 4 a and the ground wiring pattern 4 b .
  • the conductor layers 41 b , 41 c , 41 d , and 41 e are also patterned into desired wiring patterns.
  • the wiring patterns that are formed by the conductor layers 41 a , 41 b , 41 c , 41 d , and 41 e are electrically connected by through-holes.
  • the conductor layer 41 a constitutes an upper portion outer conductor layer
  • the conductor layer 41 e constitutes a lower portion outer conductor layer
  • the conductor layer 41 b constitutes a first outermost position inner conductor layer
  • the conductor layer 41 d constitutes a second outermost position inner conductor layer.
  • the lower portion wiring pattern 4 c is formed by the conductor layer 41 e.
  • lowermost surfaces of the gate terminal 31 g and the source terminal 31 s are electrically connected by soldering, etc., to contact pads or wiring patterns that are formed by the conductor layer 41 a .
  • the lowermost surface 31 dp of the drain terminal 31 d is also similarly electrically connected by soldering, etc., to a wiring pattern that is formed by the conductor layer 41 a .
  • the gate terminal 31 g is connected to a through-hole 41 f and is connected to the driving circuit 11 by means of the wiring patterns that are formed by the conductor layer 41 b .
  • the wiring pattern to which the source terminal 31 s is connected is connected by means of a through-hole 41 h to a heat-radiating pad 41 g that is formed by the conductor layer 41 e .
  • the heat-radiating pad 41 g contacts the projecting portion 16 a so as to have an electrically insulating heat-radiating sheet 16 b interposed.
  • the heat generated in the switching element 31 is thereby radiated to the housing 16 by means of the source terminal 31 s.
  • PWM pulse-width modulation
  • the wiring pattern that is formed by the conductor layer 41 d into a ground plate, and to pass the signal lines through to the wiring pattern that is formed by the conductor layer 41 c , provided that a multilayered circuit board is used.
  • the conductor layers 41 a and 41 e that are disposed on upper and lower surfaces of the circuit board 4 have identical thicknesses, and the conductor layers 41 b , 41 c , and 41 d that are disposed inside have identical thicknesses that are thinner than those of the conductor layers 41 a and 41 e .
  • the thicknesses and arrangements of the conductor layers 41 a , 41 b , 41 c , 41 d , and 41 e are symmetrical in the thickness direction of the circuit board 4 so as to have a central plane in the thickness direction of the circuit board 4 as a plane of symmetry.
  • thermal capacity of the electric power supply wiring patterns 4 a and the ground wiring pattern 4 b can be increased, improving heat-radiating characteristics.
  • the first and second inverter circuits 3 a and 3 b and the electric power supplying switching elements 5 are divided onto two opposite sides of a line segment A that divides the front surface of the circuit board 4 uniformly in two, and are disposed symmetrically on the front surface of the circuit board 4 so as to have the line segment A as an axis of symmetry.
  • the first and second inverter circuits 3 a and 3 b and the electric power supplying switching elements 5 are thereby disposed so as to generate approximately equal heat in each of the regions that divides the front surface of the circuit board 4 uniformly in two.
  • parts including the first and second inverter circuits 3 a and 3 b and the electric power supplying switching elements 5 are disposed symmetrically in each of the regions that divides the front surface of the circuit board 4 uniformly in two so as to have the line segment A that divides the front surface of the circuit board 4 uniformly in two as an axis of symmetry.
  • the CPU 10 outputs controlling variable commands to the first and second inverter circuits 3 a and 3 b so as to be identical. That is, rather than outputting controlling variable commands so as to pass a larger current to the first inverter circuit 3 a than to the second inverter circuit 3 b , for example, the CPU 10 outputs controlling variable commands for passage of approximately equal electric currents.
  • the occurrence of asymmetry in the thermal distribution that results from the heat generated in heat-generating parts including the first and second inverter circuits 3 a and 3 b and the electric power supplying switching elements 5 is thereby suppressed.
  • the CPU 10 , the driving circuit 11 , the input circuit 12 , and the electric power supply circuit 13 which constitute a control portion, are disposed so as to be spaced apart from each other, and so as to be distributed uniformly over the entire surface of the rear surface of the circuit board 4 .
  • “uniformly distributed arrangement” of the control portion in this case means disposing the respective parts of the control portion so as to be divided into two according to heat-generating capacity such that approximately equal heat is generated in each group, for example.
  • FIG. 7 is a partial cross section that shows a vicinity of a circuit board in an electronic controlling apparatus according to Embodiment 2 of the present invention. Moreover, in FIG. 7 , only a circuit board is represented in cross section.
  • a switching element 31 is mounted to a front surface of a circuit board 4 A so as to be connected to an upper portion wiring pattern that is formed by a conductor layer 42 a in which a drain terminal, a source terminal, and a gate terminal are disposed on the front surface of the circuit board 4 A.
  • a frame 29 contacts an upper surface of the switching element 31 so as to have an electrically insulating heat-radiating sheet 29 b interposed, and protruding portions 29 a also contact the upper portion wiring pattern that is formed by the conductor layer 42 a that is disposed on the front surface of the circuit board 4 A so as to have electrically insulating heat-radiating sheets 29 c interposed.
  • the wiring resistance of this upper portion wiring pattern is extremely small, but generates heat because large currents flow therethrough.
  • the heat generated in the upper portion wiring pattern is made to radiate to the protruding portions 29 a by means of the electrically insulating heat-radiating sheets 29 c.
  • the circuit board 4 A is a multilayered circuit board that is configured by alternately laminating conductor layers 42 a , 42 b , 42 c , 42 d , 42 e , and 42 f and insulating layers 52 a , 52 b , 52 c , 52 d , and 52 e .
  • the conductor layers 42 a , 42 b , 42 c , 42 d , 42 e , and 42 f are formed using a metal that has good thermal conductivity, such as copper, for example, and the insulating layers 52 a , 52 b , 52 c , 52 d , and 52 e are formed using a composite of glass fiber and epoxy resin, for example.
  • the conductor layer 42 a is formed on the front surface of the circuit board 4 A
  • the conductor layers 42 b , 42 c , 42 d , and 42 e are formed inside the circuit board 4 A
  • the conductor layer 41 f is formed on the rear surface of the circuit board 4 A.
  • the conductor layer 42 a is patterned into electric power supply wiring patterns 4 a and a ground wiring pattern 4 b , which constitute an upper portion wiring pattern.
  • the conductor layers 42 b , 42 c , 42 dc , 42 e , and 42 f are also patterned into desired wiring patterns.
  • the wiring patterns that are formed by the conductor layers 42 a , 42 b , 42 c , 42 d , 42 e , and 42 f are electrically connected by through-holes.
  • the conductor layer 42 a constitutes an upper portion outer conductor layer
  • the conductor layer 42 f constitutes a lower portion outer conductor layer.
  • the conductor layer 42 b constitutes a first outermost position inner conductor layer
  • the conductor layer 42 e constitutes a second outermost position inner conductor layer.
  • the lower portion wiring pattern 4 c is formed by the conductor layer 42 f.
  • the conductor layers 42 b and 42 e that are disposed at an outermost position of an internal portion of the circuit board 4 A have identical thicknesses, and the conductor layers 42 a , 42 c , 42 d , and 42 f have identical thicknesses that are thinner than those of the conductor layers 42 b and 42 e .
  • the thicknesses and arrangements of the conductor layers 42 a , 42 b , 42 c , 42 d , 42 e , and 42 f are symmetrical in the thickness direction of the circuit board 4 A so as to have a central plane B in the thickness direction of the circuit board 4 A as a plane of symmetry.
  • the conductor layers 42 a and 42 b are connected by vias 42 g .
  • a thermally conductive member fills the vias 42 g .
  • the vias 42 g are filled by the thermally conductive member by depositing copper in the vias 42 g , as in via-fill plating.
  • the state in which the thermally conductive member fills the vias 42 g is represented by the surface of the vias 42 g having a circular arc-shaped concave surface.
  • a switching element 31 has been explained as an example, but the switching elements 5 , 32 and 34 are also mounted to the circuit board 4 A in a similar manner.
  • Embodiment 2 because thicknesses and arrangements of conductor layers 42 a , 42 b , 42 c , 42 d , 42 e , and 42 f are also symmetrical in a thickness direction of the circuit board 4 A so as to have a central plane B in the thickness direction of the circuit board 4 A as a plane of symmetry, similar effects to those in Embodiment 1 above can be achieved.
  • Embodiment 2 because the thicknesses of the conductor layers 42 b and 42 e that are positioned at the outermost positions of the internal portion of the circuit board 4 A are thicker, heat-radiating characteristics are reduced compared to the circuit board 4 in Embodiment 1 above.
  • the conductor layers 42 b and 42 e are thermally connected to the conductor layers 42 a and 42 f , which are disposed on the two surfaces of the circuit board 4 A by forming the vias 42 g , ensuring the heat-radiating characteristics that are equal to those of the circuit board 4 .
  • thermally conductive member fills the vias 42 g , heat-radiating characteristics of the circuit board 4 A can be improved. Because the conductor layers 42 a , 42 b , 42 e , and 42 f , the vias 42 g , and the thermally conductive member are produced using copper, thermal resistance and electrical resistance can be reduced.
  • the thickness of the lower portion wiring pattern that is formed by the conductor layer 42 f onto which the control portion is mounted is thicker, more electric current can be passed compared to the signal lines by using this as the electric power supply system for the control portion. Furthermore, because the conductor layer 42 f that forms the negative-side ground wiring pattern in the control portion is different than the conductor layer 42 a that forms the negative-side ground wiring pattern in the power circuit, the large current on the power circuit side is less likely to flow onto the control portion side, enabling the electric potential differences to be reduced. It is possible to use not only the +B 12-volt system but also constant electric power supplies such as 5-volt systems, for example, as the positive-side electric power supply system.
  • the width of the wiring patterns can be made relatively slender so as to allow for the electric current capacity of the electric power supply system without needing to be thickened unnecessarily, the propagation of noise from the wiring patterns of the electric power supply system, which contains noise components, to other layers can be suppressed.
  • the frame 29 which functions as a heatsink, is made to contact not only heat-generating parts but also the upper portion wiring pattern thermally, heat-radiating characteristics can be further improved. Temperature deviations are thereby further suppressed, making it possible to prevent the occurrence of buckling of the circuit board 4 A due to temperature.
  • FIG. 8 is a top plan that shows a switching element in an electronic controlling apparatus according to Embodiment 3 of the present invention
  • FIG. 9 is a side elevation that shows the switching element in an electronic controlling apparatus according to Embodiment 3 of the present invention.
  • a switching element 35 has a different construction than the switching element 31 , having a construction that has an external appearance of an 8-pin molded integrated circuit (IC).
  • IC 8-pin molded integrated circuit
  • FET field-effect transistor
  • a lead frame that is connected to the drain electrode pins 35 d is mounted onto a base portion 35 e so as to have an insulating layer (not shown) interposed, and a chip 35 c is mounted to the frame.
  • An upper surface of the chip 35 c is a source 35 s , and a portion of the source 35 s is exposed through a mold main body.
  • the source 35 s is connected to the source electrode pins 35 a by means of connecting inner leads.
  • the gate electrode pin 35 b is connected to a gate portion 35 g that is disposed on an end of the chip 35 c .
  • a plurality of pins are used as the source electrode pins 35 a and the drain electrode pins 35 d so as to pass large currents.
  • a single pin is used as the gate electrode pin 35 b since it is a signal line.
  • Embodiment 3 is configured in a similar or identical manner to Embodiment 2 above except that switching elements 35 that have a different construction are used in the switching elements 5 , 31 , 32 , and 34 .
  • a base portion 35 e and a source 35 s constitute heat-radiating regions for generated heat. Because the upper surface of the switching elements 35 , that is, the source 35 s , contacts the frame 29 so as to have an electrically insulating heat-radiating sheet 29 b interposed in a similar or identical manner to Embodiment 2, heat generated in the switching elements 35 is radiated to the frame 29 .
  • a lower surface of the base portion 35 e may be covered in a molded resin, or may be exposed. If the lower surface of the base portion 35 e contacts the upper portion wiring pattern of the circuit board 4 A, heat-radiating characteristics can be improved. If protruding portions 29 a are also placed in contact with this upper portion wiring pattern, heat-radiating characteristics can be further improved.
  • the upper surfaces of the heat-generating parts are flat, heat-radiating characteristics can be improved by being placed in contact with the frame 29 , which functions as a first heatsink. Furthermore, it is necessary to make the width thicker in upper portion wiring patterns through which large currents flow. Thus, heat transfer from the upper portion wiring pattern can be promoted by placing these thicker portions of the upper portion wiring patterns in contact with the frame 29 that functions as the first heatsink.
  • FIG. 10 is a cross section that shows a vicinity of a circuit board in an electronic controlling apparatus according to Embodiment 4 of the present invention. Moreover, in FIG. 10 , only a circuit board is represented in cross section.
  • a circuit board 4 B is a multilayered circuit board that is configured by alternately laminating conductor layers 43 a , 43 b , 43 c , 43 d , and 43 e and insulating layers 53 a , 53 b , 53 c , and 53 d .
  • the conductor layers 43 a , 43 b , 43 c , 43 d , and 43 e are formed using a metal that has good thermal conductivity, such as copper, for example, and the insulating layers 53 a , 53 b , 53 c , and 53 d are formed using a composite of glass fiber and epoxy resin, for example.
  • the conductor layer 43 a is formed on the front surface of the circuit board 4 B, the conductor layers 43 b , 43 c , and 43 d are formed inside the circuit board 4 B, and the conductor layer 43 e is formed on the rear surface of the circuit board 4 B.
  • the conductor layer 43 a is patterned into electric power supply wiring patterns 4 a and a ground wiring pattern 4 b , which constitute an upper portion wiring pattern.
  • the conductor layers 43 b , 43 c , 43 d , and 43 e are also patterned into desired wiring patterns.
  • the wiring patterns that are formed by the conductor layers 43 a , 43 b , 43 c , 43 d , and 43 e are electrically connected by through-holes.
  • the conductor layer 43 a constitutes an upper portion outer conductor layer
  • the conductor layer 43 e constitutes a lower portion outer conductor layer
  • the conductor layer 43 b constitutes a first outermost position inner conductor layer
  • the conductor layer 43 d constitutes a second outermost position inner conductor layer.
  • the lower portion wiring pattern 4 c is formed by the conductor layers 43 e.
  • the conductor layer 43 b that is disposed at the outermost position in the circuit board 4 B is thick, and the conductor layers 43 a , 43 c , 43 d , 43 e have identical thicknesses that are thinner than the conductor layer 43 b .
  • Switching elements 31 are mounted to the upper portion wiring pattern that is formed by the conductor layer 43 a . Upper surfaces of the switching elements 31 contact a frame 29 that functions as a first heatsink so as to have electrically insulating heat-radiating sheets 29 b interposed, and the upper portion wiring pattern that is formed by the conductor layer 43 a contacts protruding portions 29 a of the frame 29 so as to have electrically insulating heat-radiating sheets 29 b interposed.
  • An upper portion wiring pattern that is formed by the conductor layer 43 a and a wiring pattern that is formed by the conductor layer 43 b are connected by vias 43 f that are formed at a plurality of positions to improve heat-radiating characteristics.
  • a switching element 31 has been explained as an example, but the switching elements 5 , 32 and 34 are also mounted to the circuit board 4 B in a similar manner.
  • the conductor layer 43 b which has the greatest thickness, is disposed at an outermost position inside the circuit board 4 B, and the thicknesses of the rest of the conductor layers 43 a , 43 c , 43 d , and 43 e are thinner in this manner, the thicknesses and arrangements of the conductor layers 43 a , 43 b , 43 c , 43 d , and 43 e are not symmetrical in the thickness direction of the circuit board 4 B so as to have a central plane in the thickness direction of the circuit board 4 B as a plane of symmetry.
  • asymmetry in thermal distribution arises due to differences in the thicknesses of the conductor layers 43 a , 43 b , 43 c , 43 d , and 43 e when disposed in lamination, making buckling of the circuit board 4 B more likely to occur.
  • the thickness of the insulating layer 53 c between the conductor layers 43 c and 43 d which are adjacent to each other in the thickness direction, is made thicker than the thicknesses of the insulating layers 53 a , 53 b , and 53 d between other conductor layers that are adjacent to each other in the thickness direction. Because of that, thermal stresses that arise as a result of asymmetry in the thermal distribution are absorbed by the insulating layer 53 c that has increased thickness, suppressing the occurrence of buckling of the circuit board 4 B.
  • the thickness of the conductor layer 43 b has greatest thickness, but the thickness of the conductor layer 43 a may have greatest thickness.
  • the conductor layers 43 a , 43 c , 43 d , and 43 e have identical thicknesses, but the thicknesses of the conductor layers 43 a , 43 c , 43 d , and 43 e may be different, provided that the thickness of the conductor layer 43 b has greatest thickness.
  • the thickness of the insulating layer 53 c is increased, but the thickness of any insulating layer among the insulating layers 53 a , 53 b , and 53 d may be increased. If the thickness of the conductor layer 43 b has greatest thickness, it is not desirable for the thickness of the insulating layer 53 a to be increased from a viewpoint of heat-radiating characteristics. The thicknesses of any of the insulating layers 53 a , 53 b , 53 c , and 53 d may be increased provided that the thickness of the conductor layer 43 a has greatest thickness.
  • FIG. 11 is a cross section that shows a vicinity of a circuit board in an electronic controlling apparatus according to Embodiment 5 of the present invention. Moreover, in FIG. 11 , a state in which switching elements 31 and 32 and a shunt resistor 33 are mounted to a circuit board 4 is shown.
  • upper surfaces of the switching elements 31 and 32 contact a frame 29 that functions as a first heatsink so as to have electrically insulating heat-radiating sheets 29 b interposed.
  • An upper portion wiring pattern that is disposed on the front surface of the circuit board 4 contacts protruding portions 29 a of the frame 29 so as to have electrically insulating heat-radiating sheets 29 c interposed.
  • a heat-radiating member 40 a in gel form fills between the frame 29 and the upper portion wiring pattern that is disposed between the switching elements 31 and 32 and the shunt resistors 33 .
  • a heat-radiating member 40 b in gel fills between the frame 29 and the shunt resistor 33 , which is lower in height than the switching elements 31 and 32 .
  • Heat-radiating members 40 c and 40 d in gel form also fill between upper surfaces of a CPU 10 and a driving circuit 11 and projecting portions 16 a of a housing 16 that functions as a second heatsink.
  • the heat-radiating members 40 a , 40 b , 40 c , and 40 d are produced into a gel form that has a low fluidity using a silicone resin, for example, to provide thermal conductivity and electrical insulation.
  • the switching elements 31 and 32 and the shunt resistor 33 are disposed so as to be in close proximity to each other, making it difficult to dispose the protruding portions 29 a on the frame 29 so as to contact the upper portion wiring pattern that is disposed between them.
  • a heat-radiating member 40 a fills between the frame 29 and the upper portion wiring pattern that is disposed between the switching elements 31 and 32 and the shunt resistors 33 , heat generated in the upper portion wiring pattern, which is disposed in a narrow space, can be radiated effectively.
  • a heat-radiating member 40 b in gel form fills between the frame 29 and the shunt resistor 33 , which is lower in height than the switching elements 31 and 32 .
  • heat generated in the shunt resistor 33 can be easily radiated without having to dispose protruding portions that have different protruding heights on the frame 29 .
  • Heat-radiating members 40 c and 40 d in gel form also fill between upper surfaces of a CPU 10 and a driving circuit 11 and projecting portions 16 a of a housing 16 .
  • heat generated in the CPU 10 and the driving circuit 11 can easily be radiated without having to dispose projecting portions that have different protruding heights on the housing 16 .
  • heat-radiating members 40 a , 40 b , 40 c , and 40 d are produced in a gel form that has low fluidity, heat generated in parts that have different heights can be radiated simply by changing the quantity applied to the surface of a part, without having to change the shape of the frame 29 and the housing 16 .
  • the electric power steering apparatus in which a motor is integrated with a control unit has been explained, but the electric power steering apparatus may have a configuration in which the control unit and the motor are separated.
  • a brushless motor has been used, but a motor with brushes may be used.
  • the motor has a stator winding that includes two sets of three-phase alternating-current windings, but the stator winding may be constituted by a single three-phase alternating-current winding.
  • the motor is not limited to a three-phase motor, and may be a motor with a polyphase winding that has more than three phases.

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International Search Report for PCT/JP2016/056984, dated May 24, 2016.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019126311B3 (de) * 2019-09-30 2020-09-24 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Stromleitendes Kühlelement, System und Verfahren zur Wärmeabführung von leistungselektronischen Bauteilen auf Platinen

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JP6795581B2 (ja) 2020-12-02
WO2017154075A1 (ja) 2017-09-14
CN108713353A (zh) 2018-10-26
EP3429323A4 (en) 2019-03-27
JPWO2017154075A1 (ja) 2018-05-24
US20190029107A1 (en) 2019-01-24
EP3429323A1 (en) 2019-01-16

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