US10256039B2 - Coil electronic component and method for manufacturing the same - Google Patents

Coil electronic component and method for manufacturing the same Download PDF

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Publication number
US10256039B2
US10256039B2 US14/988,924 US201614988924A US10256039B2 US 10256039 B2 US10256039 B2 US 10256039B2 US 201614988924 A US201614988924 A US 201614988924A US 10256039 B2 US10256039 B2 US 10256039B2
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Prior art keywords
coil
magnetic
electronic component
magnetic body
substrate
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US14/988,924
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US20160268040A1 (en
Inventor
You Na Kim
Moon Soo Park
Min Hee KIM
Jong Ho Lee
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD. reassignment SAMSUNG ELECTRO-MECHANICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIM, YOU NA, PARK, MOON SOO, KIM, MIN HEE, LEE, JONG HO
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H01F27/255—Magnetic cores made from particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings

Definitions

  • the present disclosure relates to a coil electronic component and a method for manufacturing the same.
  • An inductor, a coil electronic component is a representative passive element configuring an electronic circuit together with a resistor and a capacitor to remove noise.
  • the inductor may be manufactured by forming a coil part, hardening a magnetic powder-resin composite in which a magnetic powder and a resin are mixed with each other to form a magnetic body enclosing the coil part, and then forming external electrodes on outer surfaces of the magnetic body.
  • An aspect of the present disclosure may provide a coil electronic component capable of reducing chipping, and a method for manufacturing the same.
  • a coil electronic component may include: a coil part; an insulating layer covering the coil part; a magnetic body enclosing the coil part covered by the insulating layer; and an adhesive layer disposed between the insulating layer and the magnetic body to prevent chipping of the magnetic body.
  • FIG. 1 is a perspective view illustrating a coil electronic component including a coil part according to an exemplary embodiment in the present disclosure
  • FIG. 2 is a cross-sectional view taken along line I-I′ of FIG. 1 ;
  • FIG. 3 is a view illustrating the formation of coil parts according to an exemplary embodiment in the present disclosure
  • FIGS. 4A and 4B are a perspective view and a cross-sectional view illustrating the stacking of adhesive sheets and magnetic sheets according to an exemplary embodiment in the present disclosure.
  • FIG. 5 is a view illustrating the cutting of a multilayer body according to an exemplary embodiment in the present disclosure.
  • FIG. 1 is a perspective view illustrating a coil electronic component including a coil part according to an exemplary embodiment.
  • a thin film type power inductor used in a power line of a power supply circuit is disclosed.
  • a coil electronic component 100 may include a coil part 40 , an insulating layer 30 covering the coil part 40 , a magnetic body 50 enclosing the coil part 40 covered by the insulating layer 30 , and first and second external electrodes 81 and 82 disposed on an outer surface of the magnetic body 50 and electrically connected to the coil part 40 .
  • a “length direction” refers to an “L” direction of FIG. 1
  • a “width direction” refers to a “W” direction of FIG. 1
  • a “thickness direction” refers to a “T” direction of FIG. 1 .
  • the coil part 40 may be formed by connecting a first coil conductor 41 formed on one surface of a substrate 20 to a second coil conductor 42 formed on the other surface of the substrate 20 opposing one surface of the substrate 20 .
  • the first and second coil conductors 41 and 42 may each have the form of a planar coil formed on the same plane of the substrate 20 .
  • the first and second coil conductors 41 and 42 may be formed in a spiral shape.
  • the first and second coil conductors 41 and 42 may be formed by performing electroplating on the substrate 20 , but are not necessarily limited thereto.
  • the first and second coil conductors 41 and 42 may be formed of a metal having excellent electrical conductivity, such as silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), platinum (Pt), or an alloy thereof.
  • a metal having excellent electrical conductivity such as silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), platinum (Pt), or an alloy thereof.
  • the substrate 20 may be, for example, a polypropylene glycol (PPG) substrate, a ferrite substrate, or a metal based soft magnetic substrate.
  • PPG polypropylene glycol
  • a central portion of the substrate 20 may be removed to form a through hole, and the through hole may be filled with a magnetic material to form a core part 55 inwardly of the coil part 40 .
  • the core part 55 is formed of the magnetic material, an area of the magnetic body through which magnetic flux passes may be increased, thereby improving inductance L.
  • the substrate 20 is not necessarily included, and the coil part may also be formed of a metal wire without including the substrate.
  • the first and second coil conductors 41 and 42 may be coated with the insulating layer 30 so as not to directly be in contact with the magnetic material forming the magnetic body 50 , thereby preventing short circuits.
  • the insulating layer 30 may include, for example, a polymer material such as an epoxy resin, a polyimide resin, or the like, a photo resist (PR), or a metal oxide, but is not necessarily limited thereto.
  • a polymer material such as an epoxy resin, a polyimide resin, or the like, a photo resist (PR), or a metal oxide, but is not necessarily limited thereto.
  • PR photo resist
  • any material may be used as long as it covers the first and second coil conductors 41 and 42 to prevent short circuits.
  • the magnetic body 50 enclosing the coil part 40 may include any material as long as the material is a magnetic material that exhibits magnetic properties.
  • the magnetic body 50 may include ferrite or magnetic metal powder.
  • an adhesive layer (not illustrated in FIG. 1 ) preventing chipping of the magnetic body may be formed between the insulating layer 30 and the magnetic body 50 .
  • a detailed description of the adhesive layer according to the exemplary embodiment will be provided below.
  • One end portion of the first coil conductor 41 may be extended to form a first lead portion 41 ′, and the first lead portion 41 ′ may be exposed to one end surface of the magnetic body 50 in a length L direction of the magnetic body 50 .
  • One end portion of the second coil conductor 42 may be extended to form a second lead portion 42 ′, and the second lead portion 42 ′ may be exposed to the other end surface of the magnetic body 50 in the length L direction of the magnetic body 50 .
  • first and second lead portions 41 ′ and 42 ′ are not necessarily limited thereto.
  • the first and second lead portions 41 ′ and 42 ′ may be exposed to at least one surface of the magnetic body 50 .
  • the first and second external electrodes 81 and 82 may be formed on at least one outer surface of the magnetic body 50 so as to be connected to the first and second lead portions 41 ′ and 42 ′, respectively.
  • the first and second external electrodes 81 and 82 may be formed of a metal having excellent electrical conductivity, such as copper (Cu), silver (Ag), nickel (Ni), and tin (Sn), or an alloy thereof.
  • a metal having excellent electrical conductivity such as copper (Cu), silver (Ag), nickel (Ni), and tin (Sn), or an alloy thereof.
  • FIG. 2 is a cross-sectional view taken along line I-I′ of FIG. 1 .
  • the magnetic body 50 of the coil electronic component 100 may include a magnetic metal powder 58 .
  • the magnetic metal powder 58 may be a crystalline or amorphous metal including one or more selected from the group consisting of iron (Fe), silicon (Si), boron (B), chromium (Cr), aluminum (Al), copper (Cu), niobium (Nb), and nickel (Ni).
  • the magnetic metal powder 58 may include an Fe—Si—Cr based amorphous metal, but is not necessarily limited thereto.
  • the magnetic metal powder 58 may have a particle diameter of 0.1 ⁇ m to 30 ⁇ m, and two or more kinds of magnetic metal powders having different average particle diameters may be mixed with each other.
  • the magnetic metal powder 58 may be dispersed in a thermosetting resin.
  • thermosetting resin may be, for example, an epoxy resin, polyimide, or the like.
  • a volume of the magnetic metal powder 58 in the magnetic body 50 may be equal to 60% or more.
  • the filling rate of the magnetic metal powder 58 is increased, the content of the thermosetting resin forming the magnetic body 50 may be decreased. Further, as the coil electronic component is gradually miniaturized, thicknesses of cover parts 51 and 52 formed on the coil part 40 are reduced, and thus chipping may occur in thin portions of the cover parts.
  • an adhesive layer 60 preventing the chipping of the magnetic body may be formed between the insulating layer 30 and the magnetic body 50 .
  • the occurrence of chipping in the magnetic body 50 particularly, in the thin cover parts 51 and 52 , may be reduced.
  • the adhesive layer 60 may have adhesion greater than that of the magnetic body 50 .
  • any material may be used as long as the material improves adhesion between the insulating layer 30 and the magnetic layer 50 to prevent chipping of the magnetic body 50 and does not disturb characteristics of the coil electronic component 100 .
  • FIG. 2 illustrates the adhesive layer 60 in a shape covering the insulating layer 30
  • the shape of the adhesive layer 60 is not necessarily limited thereto.
  • the adhesive layer 60 may be formed in a portion between the insulating layer 30 and the magnetic body 50 and may also be partially formed in the core part 55 .
  • FIG. 3 is a view illustrating the formation of coil parts according to an exemplary embodiment in the present disclosure.
  • a plurality of coil parts 40 may be formed.
  • the first and second coil conductors 41 and 42 , and a via (not illustrated) connecting the first and second coil conductors 41 and 42 may be formed by forming a via hole (not illustrated) in the substrate 20 , forming a plating resist having an opening on the substrate 20 , and then filling the via hole and the opening with a conductive metal by plating.
  • the first and second coil conductors 41 and 42 and the via may be formed of a conductive metal having excellent electrical conductivity, such as silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), platinum (Pt), or an alloy thereof.
  • a conductive metal having excellent electrical conductivity such as silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), platinum (Pt), or an alloy thereof.
  • the coil parts 40 may be formed of a metal wire and may be formed in any form as long as it may generate magnetic flux by applied current.
  • the substrate 20 may be, for example, a polypropylene glycol (PPG) substrate, a ferrite substrate, or a metal based soft magnetic substrate.
  • PPG polypropylene glycol
  • a central portion of the substrate 20 in which the first and second coil conductors 41 and 42 are not formed is removed to form a core part hole 55 ′.
  • the removal of the substrate 20 may be performed by mechanical drilling, laser drilling, sandblasting, punching, or the like.
  • FIGS. 4A and 4B are each a perspective view and a cross-sectional view illustrating the stacking of adhesive sheets and magnetic sheets according to an exemplary embodiment.
  • the insulating layer 30 covering the first and second coil conductors 41 and 42 may be formed on the first and second coil conductors 41 and 42 .
  • the insulating layer 30 may include, for example, a polymer material such as an epoxy resin or a polyimide resin, a photo resist (PR), or a metal oxide, but is not necessarily limited thereto.
  • a polymer material such as an epoxy resin or a polyimide resin, a photo resist (PR), or a metal oxide, but is not necessarily limited thereto.
  • PR photo resist
  • any material may be used as long as it covers the first and second coil conductors 41 and 42 to prevent short circuits.
  • the insulating layer 30 may be formed by a screen printing method, an exposure development of a photoresist (PR) a spraying method, oxidation by chemical etching of the coil conductors, or the like.
  • PR photoresist
  • the insulating layer 30 may be formed by a chemical vapor deposition (CVD) or a dipping method using a polymer coating solution having low viscosity, and the insulating layer 30 formed as described above may be coated to be thin in accordance with shapes of surfaces of the first and second coil conductors 41 and 42 .
  • CVD chemical vapor deposition
  • a dipping method using a polymer coating solution having low viscosity a polymer coating solution having low viscosity
  • adhesive sheets 60 ′ may be formed on upper and lower portions of the coil parts 40 covered by the insulating layer 30 .
  • the adhesive sheets 60 ′ may have adhesion greater than that of magnetic sheets 50 ′ to be stacked later.
  • adhesion between the insulating layer 30 covering the coil part 40 and the magnetic body 50 (which is formed by stacking, compressing, and curing the magnetic sheets 50 ′) may be improved, thereby reducing chipping.
  • any material may be used as long as the material improves adhesion between the insulating layer 30 and the magnetic layer 50 to prevent chipping of the magnetic body 50 and does not disturb characteristics of the coil electronic component 100 .
  • a multilayer body may be formed by stacking the magnetic sheets 50 ′ on the adhesive sheets 60 ′ and compressing and curing the same.
  • the magnetic sheets 50 ′ may be formed by preparing slurry by mixing the metal magnetic powder 58 with an organic material such as a thermosetting resin, a binder, a solvent, and the like, applying the slurry on carrier films at a thickness of several tens of ⁇ m by a doctor blade method, and then drying the applied slurry.
  • an organic material such as a thermosetting resin, a binder, a solvent, and the like
  • the magnetic sheets 50 ′ may be prepared in a form in which the metal magnetic powder 58 is dispersed in the thermosetting resin such as an epoxy resin, polyimide, or the like.
  • the multilayer body may be formed by stacking, compressing, and curing the magnetic sheets 50 ′.
  • the core part hole 55 ′ may be filled with the magnetic sheets 50 ′ to form the core part 55 .
  • FIG. 5 is a view illustrating the cutting of a multilayer body according to an exemplary embodiment.
  • individual coil electronic components 100 each including the magnetic body 50 enclosing the coil part 40 may be formed by cutting the multilayer body along cutting lines C 1 -C 1 and C 2 -C 2 .
  • cutting and grinding operations may be performed to form individual coil electronic components 100 .
  • cover parts 51 and 52 are formed to be thin on the upper and lower portions of the coil parts 40 , while the coil electronic component is gradually miniaturized, and the filling rate of the metal magnetic powder 58 is increased such that the content of the thermosetting resin is decreased in order to implement high permeability of the magnetic body 50 , adhesion may be insufficient, and thus chipping in which the thin cover parts 51 and 52 are cracked or peeled off during the cutting and grinding operations may occur.
  • the adhesive sheets 60 ′ are formed on the upper and lower portions of the coil parts 40 covered by the insulating layer 30 , and the magnetic sheets 50 ′ may be then stacked on the magnetic sheets 60 ′, and thus adhesion between the insulating layer 30 and the magnetic body 50 (which is formed by stacking, compressing, and curing the magnetic sheets 50 ′) may be improved to prevent chipping of the magnetic body 50 , particularly of the thin cover parts 51 and 52 , which may be reduced even during the cutting and grinding operations.
  • the coil electronic component 100 may be manufactured by forming the first and second external electrodes 81 and 82 on the outer surfaces of the cut magnetic body 50 so as to be connected to the coil parts 40 .
  • chipping of the magnetic body may be reduced.
US14/988,924 2015-03-09 2016-01-06 Coil electronic component and method for manufacturing the same Active 2036-01-22 US10256039B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2015-0032374 2015-03-09
KR1020150032374A KR102184566B1 (ko) 2015-03-09 2015-03-09 코일 전자부품 및 그 제조방법

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KR101832614B1 (ko) * 2016-07-14 2018-02-26 삼성전기주식회사 코일 부품 및 그 제조방법
KR20180022199A (ko) * 2016-08-23 2018-03-06 삼성전기주식회사 박막형 코일 부품
JP6296407B1 (ja) * 2017-02-02 2018-03-20 株式会社伸光製作所 多列型プリント基板とその製造方法
KR20190042225A (ko) * 2017-10-16 2019-04-24 삼성전기주식회사 코일 전자 부품
KR102505437B1 (ko) 2017-12-26 2023-03-03 삼성전기주식회사 권선형 인덕터 및 이의 제작 방법
JP6590327B2 (ja) 2018-02-22 2019-10-16 サムソン エレクトロ−メカニックス カンパニーリミテッド． コイル部品
JP2019165169A (ja) * 2018-03-20 2019-09-26 太陽誘電株式会社 コイル部品及び電子機器
KR102300014B1 (ko) * 2019-07-03 2021-09-09 삼성전기주식회사 코일 부품
JP2021057477A (ja) 2019-09-30 2021-04-08 株式会社村田製作所 コイル部品の製造方法
JP7379066B2 (ja) * 2019-10-09 2023-11-14 株式会社村田製作所 インダクタ部品

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JP2004146655A (ja) * 2002-10-25 2004-05-20 Taiyo Yuden Co Ltd コイル部品及びそれを利用した回路装置
JP2006278479A (ja) 2005-03-28 2006-10-12 Tdk Corp コイル部品
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JP6750776B2 (ja) 2020-09-02
KR102184566B1 (ko) 2020-12-02
KR20160108927A (ko) 2016-09-21
US20160268040A1 (en) 2016-09-15
JP2016167578A (ja) 2016-09-15

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