M363613 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種散熱裝置，尤指一種應用於電腦顯 不卡散熱用途，且無風扇及可降低使用噪音的散熱裝置。 【先前技術】 一般電腦主機板上會插設一顯示卡，該顯示卡包含有 可插組於電腦主機板的電路板，並於該電路板上設有微 處理器且連接一散熱體，使微處理器運作時所產生的廢 熱及中傳至該散熱體並排出，隨著該顯示卡之微處理器的 運算速度越快，越容易產生高溫，若溫度過高會影響該顯 不卡的運作’所以會於該顯示卡上設置一散熱裝置，以降 低該顯不卡的溫度，使該顯示卡可以在適當的溫度環境下 正常運作。 -中，違散熱裝置大多係為―散熱風扇，該散熱風扇 設置於該顯示卡散熱體之一側，且電性連接電腦主機内的 電源供應件’該散熱風扇可產生風並對該散熱體吹拂，以 達=工氣對饥並散熱的目的，或進一步以該散熱風扇搭配 熱官串組之散熱鰭片，用以提高該散熱裝置的散熱效能。 然上述中，習用散熱裝置為了提高其散熱效果，會增 加放熱鰭片或熱管的數量’加上散熱裝置係設置於該顯示 卡士，使得該顯示卡承受該散熱裝置的重4，而該顯示卡 斤此豕：的重里有a,因此習用散熱裝置所能增加散熱鰭 片或熱管的數量亦有所限制’且散熱裝置的重量過重也合 影響該顯示卡的正常運作及使用壽命的長短…用散： 3 M363613 無法有效提高散熱欵果， 裝置受限於顯示卡的承載負荷而 所以在使用上仍不理想。 【新型内容】 計 本創作之主要目的在於提供—種散熱裝置，希藉此钟 改善習用散熱裝置之重量造成顯示卡負擔的缺點。°又 為達成前揭目的’本創作所設計之散熱裝置，包含有M363613 V. New description: [New technical field] This creation is about a heat sink, especially a heat sink that is used for computer display and heat dissipation, and has no fan and can reduce the noise of use. [Prior Art] A display card is inserted into a general computer motherboard, and the display card includes a circuit board that can be inserted into the computer motherboard, and a microprocessor is disposed on the circuit board and connected to a heat sink. The waste heat generated by the operation of the microprocessor is transmitted to the heat sink and discharged. The faster the calculation speed of the microprocessor of the display card, the higher the temperature is likely to be generated. If the temperature is too high, the card will be affected. Operation 'so a heat sink is placed on the display card to reduce the temperature of the card, so that the card can operate normally under the proper temperature environment. In the middle, the heat-dissipating device is mostly a "cooling fan", and the cooling fan is disposed on one side of the heat sink of the display card, and is electrically connected to a power supply member in the computer main body. The cooling fan can generate wind and the heat sink Blowing, to achieve the purpose of hunger and heat dissipation, or further use the cooling fan with the heat sink fins to improve the heat dissipation performance of the heat sink. However, in the above, the conventional heat dissipating device increases the number of radiating fins or heat pipes in order to improve the heat dissipating effect, and the heat dissipating device is disposed on the display card so that the display card bears the weight 4 of the heat dissipating device, and the display There is a weight in the weight of the card, so the number of heat sinks or heat pipes can be increased by the conventional heat sink. The weight of the heat sink is too heavy to affect the normal operation and service life of the card... With the dispersion: 3 M363613 can not effectively improve the cooling effect, the device is limited by the load carrying capacity of the display card, so it is still not ideal in use. [New content] The main purpose of this creation is to provide a kind of heat sink, which is used to improve the disadvantage of the burden of the display card caused by the weight of the conventional heat sink. ° Also for the purpose of achieving the previous purpose of the creation of the heat sink, including
接部； ^、、、塊’其包括有-具有組接孔之導熱塊體； 疋位件’其具有組設孔及—可伸人主機板插槽之插 至少一導熱件’每一導熱件的兩端分別插組於組接孔 與組設孔，並連接該聚熱塊及該定位件；以及 複數散熱鰭片，皆係間隔設置於所述之導熱件上。 -由上述可以得知，本創作散熱裝置係設置於主機板的 顯不卡上，其中該聚熱塊鄰貼該顯示卡之散熱體，並將熱 能傳導至導熱件，再透過導熱件快速地將熱傳導至散熱轉 片上並達到散熱目的，該散熱裝置利用該定位件之插接部 :入：機板的插槽中，#由該主機板承擔該散熱裝置的部 份重量咸少施加於該顯示卡上的重量，因此該散熱裝置 中散熱鰭片、導熱件之數量能有效增力口，又能避免該散熱 裝置：重量超過該顯示卡的負荷，或是避免影響該顯示卡 的正常運作，並使該聚熱塊確實抵接該顯示卡之發熱體， 因此，該散熱裝置藉由導熱件快速熱傳導至散熱鰭片進行 政熱，且因該定位件的設置使得該散熱裝置在組設定位上 4 M363613 更為穩固，也能有效藉由增加散熱鰭片的數量提高散熱面 積，進而提升散熱效果，故使用上更為理想。 【實施方式】 月 > 閱第至二圖，為本創作散熱裝置之示意圖，其 係設置於一顯示卡（50)上，並可連同該顯示卡（5〇)插組於 一主機板（60)的插槽（61)中，該散熱裝置包含有一聚熱塊 (10)、一定位件（20)、至少一導熱件（3〇)及複數散熱籍片 (40)。 该聚熱塊（10)包含有一導熱塊體，該導熱塊體包含有 一具有接觸面（13)的基部（11)及一蓋部（12),該基部（ιι) 以其接觸面（13)抵接該顯示卡（5〇)的散熱體（Η)，並於該 接觸面（13)的相對面上設有至少一第一凹槽(14)，該蓋部 (12)於鄰接該基部（11)之側面上設有至少一第二凹槽 ，且第一、第二凹槽（15)彼此相對合並形成組接孔（16)， 其中，該蓋部（12)於其角隅處設有鎖固部（17)，利用固定 件鎖固於該顯示卡（5〇)的電路板上。 该定位件（20)上設有至少一組設孔（21)，以及凸設一 插接部（22)，其中該插接部（22)可插組於該主機板（6〇)的 插槽（61)中，因此，該定位件（2〇)將該散熱裝置定位於該 主機板（60)上，並藉由該主機板（6〇)支撐該散熱裝置。 所述之V熱件（3 0)的兩端分別插組於該聚熱塊（〗〇 )之 組接孔（16)與該定位件（2〇)之組設孔（21)中，藉此連接該 聚熱塊（10)及該定位件（2〇)，且該聚熱塊（1〇)的熱能可以 利甩熱傳導的方式傳至導熱件（3〇)中，於本創作之較佳實 M363613 施例中，所述之導熱件（3 Ο )為一内部裝有工作介質的u形 熱管（如第一圖所示），或為一U形熱導板（如第六、七圖 所示），其包含有二相互平行的側段（31)及一連接段（32) ，該二側段（31)分別位於該連接段（32)之兩側端，且端部 相連接，以形成U形導熱件（3 〇 )，其中一側段（3丨）鄰接該 聚熱塊（10) ’另一侧段（31)鄰接該定位件（20)。 該些散熱.鰭片（40)係間隔設置於所述導熱件（3〇)鄰近 該定位件（20)的側段（31)上’利用該些散熱鰭片增加 • 散熱面積’所述導熱件（30)的熱能可以傳導至散熱鰭片 (40)，並可提高該些散熱鰭片（40)與空氣接觸的面積，進 而獲得較佳的散熱效果。 請參閱第一、四圖所示，該散熱裝置的聚熱塊（丨〇)係 鄰接該顯示卡（50)的散熱體（51)，且該定位件（2〇)插設於 該主機板（60)的插槽（61)中，其中，該顯示卡（5〇)運作中 產生的廢熱可以經由散熱體（51)傳導至該聚熱塊（1〇),接 著熱能會傳導至與該聚熱塊（10)接觸的導熱件（3〇)中，再 ®藉由導熱件快速地將熱能傳至該些散熱鰭片（4〇)上，由於 空氣與散熱鰭片（40)有大面積的接觸，所以能有效將該些 散熱鰭片（40)上的熱能帶出，達到為該顯示卡（5〇)散熱的 目的，另如第五圖所示，該散熱裝置可進一步增設一風扇 (7〇) ’以增加空氣的對流並加速散熱的速率。 綜上所述，本創作散熱裝置利用聚熱塊（1〇)及導熱件 (3〇)將該顯示卡（50)的廢熱帶出，進一步利用該些散熱鳍 片（40)增加與空氣的接觸面積，以提高散熱效果，該定位 件（20)插組於該主機板（60)上，並利用該主機板（6〇)支撐 6 M363613 該散熱裝置的重量，以減少該顯示卡（5〇)所承受的重量負 擔，且有效提高該散熱裝置所能增加的散熱縫片（4〇)、導 熱件（30)數量，又能在該顯示卡（5〇)的承載範圍内，所以 本創作散熱裝置能提供較大的散熱面積，因此具有良好的 散熱效果，故該散熱裝置更具有實用性。 【圖式簡單說明】 第一圖：為本創作散熱裝置之使用狀態之一立體示意 圖。 第二圖：為本創作散熱裝置之一較佳實施例之立體分 解示意圖。 第二圖：為本創作散熱裝置之一較佳實施例之立體組 合示意圖。 第四圖.為本創作散熱裝置之一較佳實施例之側視平 面示意圖。 第五圖·為本創作散熱裝置之使用狀態之另一立體示 意圖。 第六圖.為本創作散熱裝置之使用狀態之又一立體示 意圖。 弟七圖.為弟六圖之側視剖面示意圖。 【主要元件符號說明】 (1 〇)聚熱塊 (12)蓋部 (14)第一凹槽 (16)組接孔 (11)基部 (13)接觸面 (15)第二凹槽 (17)鎖固部 7 M363613 (20)定位件 (21)組設孔 (22)插接部 (30)導熱件 (31)側段 (32)連接段 (40)散熱鰭片 (5 0)顯示卡 (51)散熱體 (60)主機板 (61)插槽 (7 0)風扇a joint; ^,,, block, which includes a heat-conducting block having a set-up hole; a clamp member having a set hole and a socket for inserting at least one heat-conducting member The two ends of the device are respectively inserted into the grouping hole and the grouping hole, and the heat collecting block and the positioning member are connected; and the plurality of heat dissipating fins are disposed on the heat conducting member at intervals. - It can be known from the above that the heat sink of the present invention is disposed on the display card of the motherboard, wherein the heat collecting block is adjacent to the heat sink of the display card, and the heat energy is transmitted to the heat conducting member, and then the heat conducting member is quickly passed through the heat conducting member. The heat is transmitted to the heat-dissipating fins for heat dissipation purposes, and the heat-dissipating device utilizes the plug-in portion of the positioning member: into the slot of the board, and the part of the heat-dissipating device is used by the motherboard to apply a small amount of salt to the heat sink. The weight on the card is displayed. Therefore, the number of heat-dissipating fins and heat-conducting members in the heat-dissipating device can effectively increase the power port, and the heat-dissipating device can be avoided: the weight exceeds the load of the display card, or the normal operation of the display card is avoided. And the heat collecting block is surely abutted against the heating element of the display card. Therefore, the heat dissipating device is quickly thermally conducted to the heat dissipating fin by the heat conducting member for heating, and the heat dissipating device is set in the group due to the setting of the positioning member. The 4 M363613 is more stable, and it can also effectively increase the heat dissipation area by increasing the number of heat dissipation fins, thereby improving the heat dissipation effect, so it is more ideal for use. [Embodiment] Month> Referring to the first to second figures, a schematic diagram of the heat dissipation device is provided on a display card (50), and can be inserted into a motherboard together with the display card (5〇) ( In the slot (61) of 60), the heat sink comprises a heat collecting block (10), a positioning member (20), at least one heat conducting member (3), and a plurality of heat radiating sheets (40). The heat collecting block (10) comprises a heat conducting block body comprising a base portion (11) having a contact surface (13) and a cover portion (12), the base portion (1) being contacted by the contact surface (13) A heat sink (Η) of the display card (5〇) is abutted, and at least a first groove (14) is disposed on the opposite surface of the contact surface (13), the cover portion (12) is adjacent to the base portion At least one second groove is disposed on a side surface of the (11), and the first and second grooves (15) are combined with each other to form a grouping hole (16), wherein the cover portion (12) is disposed at a corner thereof The locking portion (17) is fastened to the circuit board of the display card (5〇) by a fixing member. The positioning member (20) is provided with at least one set of holes (21), and a plug portion (22) is protruded, wherein the plug portion (22) can be inserted into the main board (6〇) In the slot (61), therefore, the positioning member (2〇) positions the heat sink on the motherboard (60), and supports the heat sink by the motherboard (6〇). The two ends of the V heat piece (30) are respectively inserted into the grouping holes (16) of the heat collecting block (〗 〖) and the grouping holes (21) of the positioning member (2〇), The heat collecting block (10) and the positioning member (2〇) are connected, and the heat energy of the heat collecting block (1〇) can be transmitted to the heat conducting member (3〇) by means of heat conduction, which is compared with the present invention. In the example of Jiashi M363613, the heat conducting member (3 Ο ) is a U-shaped heat pipe with a working medium (as shown in the first figure) or a U-shaped heat guiding plate (such as the sixth and seventh). The figure includes two side sections (31) parallel to each other and a connecting section (32). The two side sections (31) are respectively located at two sides of the connecting section (32), and the ends are connected. To form a U-shaped heat conducting member (3 〇), wherein one side section (3 丨) abuts the heat collecting block (10) 'the other side section (31) abuts the positioning member (20). The heat dissipation fins (40) are spaced apart from the side section (31) of the heat conducting member (3) adjacent to the positioning member (20) by using the heat dissipation fins to increase the heat dissipation area. The heat energy of the component (30) can be conducted to the heat dissipation fins (40), and the area of the heat dissipation fins (40) in contact with the air can be improved, thereby obtaining a better heat dissipation effect. Referring to the first and fourth figures, the heat collecting block (丨〇) of the heat dissipating device is adjacent to the heat dissipating body (51) of the display card (50), and the positioning member (2〇) is inserted into the main board. In the slot (61) of (60), the waste heat generated in the operation of the display card (5〇) can be conducted to the heat collecting block (1〇) via the heat sink (51), and then the heat energy is transmitted to the slot In the heat conducting member (3〇) in contact with the heat collecting block (10), the heat is quickly transferred to the heat dissipating fins (4〇) by the heat conducting member, because the air and the heat dissipating fins (40) are large. The contact of the area can effectively bring out the heat energy on the heat dissipation fins (40) to achieve the purpose of dissipating heat for the display card (5〇), and as shown in the fifth figure, the heat dissipation device can be further added. Fan (7〇) 'to increase the convection of air and accelerate the rate of heat dissipation. In summary, the heat sink of the present invention utilizes a heat collecting block (1〇) and a heat conducting member (3〇) to discharge the waste tropical belt of the display card (50), and further utilizes the heat radiating fins (40) to increase the air. Contact area to improve heat dissipation, the positioning member (20) is inserted on the motherboard (60), and the weight of the heat sink is supported by the motherboard (6〇) to reduce the display card (5) 〇) The weight burden that is received, and the number of heat-dissipating slits (4〇) and heat-conducting elements (30) that can be increased by the heat-dissipating device can be effectively increased within the bearing range of the display card (5〇), so The heat sink device can provide a large heat dissipation area, and therefore has a good heat dissipation effect, so the heat sink device is more practical. [Simple description of the diagram] The first picture: a stereoscopic diagram of the state of use of the heat sink. The second figure is a schematic diagram of a stereoscopic decomposition of a preferred embodiment of the heat sink of the present invention. Second: A schematic diagram of a three-dimensional combination of a preferred embodiment of the heat sink of the present invention. Figure 4 is a side elevational view of a preferred embodiment of the present heat sink. Fig. 5 is another perspective view showing the state of use of the heat sink of the present invention. Fig. 6 is a further perspective view showing the state of use of the heat sink of the present invention. The younger brother of the seven figures. [Main component symbol description] (1 〇) heat collecting block (12) cover portion (14) first groove (16) set hole (11) base portion (13) contact surface (15) second groove (17) Locking part 7 M363613 (20) Positioning member (21) Set hole (22) Plug-in part (30) Heat-conducting part (31) Side section (32) Connection section (40) Heat-dissipating fin (50) Display card ( 51) Heat sink (60) motherboard (61) slot (70) fan