M284036 八、新型說明： 【新型所屬之技術領域】 本新型係有關於一種具熱導、液冷散熱之電腦電源供應器， 尤指-種可將該電職祕應!I之電子元件所產生之熱能，傳遞 至第-散熱座後’藉由與冷卻液之熱交換，及以熱傳遞作用將熱 傳遞至第二散熱座向外散熱者。 【先前技術】 目月ίι應用於電腦主機箱中之電腦電源供應器，由於所需之供 電要求曰益增加，因此於啟動後所產±的熱能也S來越高，一般 菩知的電職賴應II，都是於電腦電源供顧之紐—側，裝 1風扇’藉由風扇產生之冷线流，將電腦電驗脑中之電子 元件冷卻、散熱。 然而，這種以風扇達到散熱的方式，會隨著瓦特數的增加而 • 產生更夕的％音’緣此，目前已有業者，於電腦電源供應器中裝 置散熱鰭片，並使該散熱鰭片連接於會產生高溫之電子元件一 側，藉由熱傳導作用，將電子元件之熱能傳遞至散熱鰭片上，以 進行政熱#者藉由熱導;|>將這些電子元件之熱能，傳遞至電腦 ^祕應11之殼體外散熱。惟上述單以熱傳遞_將熱能傳遞至 散熱鰭片上散熱的方式，其散熱效果還未能滿I肖費者之實用需 求’而有改進的必要。 本案創作人有鑑於此，乃加予研就創新，揭示出具熱導、液 5 M284036 冷散熱之電腦電源供應器。 【新型内容】 岸哭竹之目的旨在提供—種具鱗、液冷賴之_電源供 腦電源供應器係含有:一殼體以及-電源供應電路，M284036 8. Description of the new type: [Technical field to which the new type belongs] This new type relates to a computer power supply with thermal conductivity and liquid-cooling heat dissipation, in particular-a kind of electronic component that can be used to produce electrical components! After transferring the heat energy to the first heat sink, the heat is exchanged with the cooling liquid, and the heat is transferred to the second heat sink to dissipate heat. [Previous technology] The power supply of the computer used in the computer main box is increased because the required power supply requirements have increased. Therefore, the thermal energy produced after startup is higher. Lai Ying II is installed on the side of the computer power supply. One fan is used to cool and dissipate the electronic components in the computer's brain through the cold wire flow generated by the fan. However, this way to achieve heat dissipation by fans will increase with the increase of wattage. • Even more% sounds are generated. At present, there are already industry players who install cooling fins in computer power supplies and make the heat dissipation. The fins are connected to the side of the electronic components that generate high temperature, and the thermal energy of the electronic components is transferred to the radiating fins by thermal conduction to conduct political heat. Those who use the thermal conduction; | > Passed to the computer ^ Mystery 11 case to dissipate heat. However, the above method of heat transfer_transferring heat energy to the heat dissipation fins for heat dissipation has not yet fulfilled the practical needs of consumers, and therefore needs to be improved. In view of this, the creator of this case has researched and innovated and revealed a computer power supply with thermal conductivity and liquid cooling. [New content] The purpose of the shore crying bamboo is to provide-a kind of scale, liquid cooling, _ power supply brain power supply system contains: a housing and-power supply circuit,
:，裝置於該殼體中；其_在於：該電腦電源供應 Μ 3有一第一散熱座，連接於電源供應電路之熱源上，於該 第-散熱座巾，係設有—冷躲料，則丨人冷卻液，與該第二 散熱座所夾帶之熱能進行熱交換，並於該第—散熱座中， 熱導管’並令各熱導管之末端，嵌接第二散熱座者；如是，入使該 電腦電源供應n之電子元件所產生之熱能，傳遞至第—散熱座 後’錯由與冷魏之熱錢，及轉傳遞作⑽熱傳遞至位於殼 體外的第二散熱座向外散熱，即本新型所揭示之電腦電源供應器 中’以多種不同的散熱方式散熱，明其散熱效率者。 本新里之可取貫體，可由町之說明及所附各圖式，而得以 明晰。 【實施方式】 凊參閱第-、二、三圖所示，本新型係有關於—種具熱導、 液冷散熱之f腦f源供應H，該電腦電源供應雜含有：殼體⑽ 以及-電源供應電路⑽），該電源供應電路⑽裝置⑽殼體⑽ 中；其特徵在於：該電腦電源供應器係包括有-第-散熱座⑽， 連接該電源供應電路之熱源⑻，於該第一散熱座⑽中，係設 有一冷躲释⑽’㈣人冷输，與該第-散熱座⑽所夾 M284036 帶之熱能進行熱交換，並於該第—散熱座⑽巾，嵌置有熱導管 (60)，並令各熱導管⑽)之末端’嵌接第二散熱座⑺)者；如是， 麟電腦電源供應器所產生之熱能，傳遞至第—散驗⑽後， 藉由與冷魏之熱交換，及以鱗遞侧將祕遞錄於殼體⑽ 外的第二散熱座⑽向外散熱，即本新型所揭示之電腦電源供應 器中’係以多種不同的散熱方式散熱，以增進散熱效率者。 如第、一圖所示，本新型所揭示之電腦電源供應器，其中 於該電源供應電路⑽會產生高溫之電子元件，即熱源⑻一 側’係連接-導熱銜接構件(32)，並令該導熱銜接構件⑽之一 端連接該第-散熱座⑽，賴源(31)之無可經由導熱銜麟 件（32)銜接第-散熱座（4〇)上。本新型所揭示之電腦電源供應 器，其中於該導熱銜接構件(32)與第一散熱座(4〇)間，係夾置有 一層絕緣導熱層（80)，以阻隔電流，並使導熱銜接構件（32)之熱 旎，可以快速地傳遞至該第一散熱座（4〇)上者。惟本新型可免設 该導熱銜接構件(32)，可令第一散熱座（4〇)直接連接至熱源(31) 上’本新型並不予自限。 本新型揭示之第一散熱座(40)，係由多片鰭片（41)所組成， 並連接於一接熱板(410)上，於各該鰭片（41)上，穿設有第一嵌孔 (411)，以嵌接一冷卻液導管（50)，該冷卻液導管（5〇)含有一進水 口（51)及一出水口（52)，以串接於一冷卻液之循環迴路中，並於 各鰭片（41)上穿設有第二嵌孔(412)，以嵌接熱導管（6〇)於内者。 本新型揭示之第二散熱座（70)，係由多片鰭片（71)所組成，:, It is installed in the housing; its _ lies in that the computer power supply M 3 has a first heat sink, which is connected to the heat source of the power supply circuit. Then, the human coolant performs heat exchange with the heat energy carried by the second heat sink, and in the first heat sink, the heat pipes are connected to the ends of the heat pipes, and the second heat sink is embedded; if so, The heat generated by the electronic components of the computer's power supply n is transferred to the first heat sink, which is transferred to the heat source of the cold and Wei, and transferred to the second heat sink outside the housing for heat dissipation. That is, in the computer power supply disclosed in the new model, the heat is dissipated in a variety of different heat dissipation methods, and its heat dissipation efficiency is shown. Motoshinri's continuum can be made clear from the description of the town and the accompanying drawings. [Embodiment] 凊 Refer to the first, second, and third figures, the present invention relates to a kind of f brain f source supply H with thermal conductivity and liquid cooling, and the computer power supply contains: housing ⑽ and- Power supply circuit ⑽), the power supply circuit ⑽ device ⑽ housing ；; characterized in that the computer power supply includes a first heat sink ⑽, which is connected to the heat source ⑻ of the power supply circuit, in the first In the heat sink seat, there is a cold escape shelter, and the person loses heat. It exchanges heat with the heat energy carried by the first heat sink seat M284036, and a heat pipe is embedded in the first heat sink seat towel. (60), and the end of each heat pipe ⑽) is' embedded in the second heat sink ⑺); if so, the heat energy generated by the Lin computer power supply is transferred to the first-scattered test, with the cold Wei Heat exchange, and the second heat sink ⑽, which is recorded on the outer side of the case 以 on the scale side, dissipates heat outwardly, that is, the computer power supply disclosed in the new model is radiated in a variety of different ways, Improve heat dissipation efficiency. As shown in the first and first figures, the computer power supply disclosed in the present invention, wherein the power supply circuit does not generate high temperature electronic components, that is, the heat source ⑻ side is a connection-thermal conduction connection member (32), and makes One end of the heat-conducting connecting member ⑽ is connected to the first heat-dissipating base ⑽, and Lai Yuan (31) is connected to the first heat-dissipating base (40) via the heat-conducting link member (32). The computer power supply disclosed in the present invention, wherein a layer of insulating and thermally conductive layer (80) is sandwiched between the thermally conductive connecting member (32) and the first heat sink (40) to block the current and connect the thermally conductive connection. The heat of the component (32) can be quickly transferred to the first heat sink (40). However, the new model can be provided without the thermally conductive connecting member (32), and the first heat sink (40) can be directly connected to the heat source (31). The new model is not self-limiting. The first heat sink (40) disclosed in the present invention is composed of a plurality of fins (41), and is connected to a heat receiving plate (410). Each of the fins (41) is provided with a first An inserting hole (411) for inserting a coolant pipe (50), the coolant pipe (50) containing a water inlet (51) and a water outlet (52), connected in series to a circulation of a coolant In the circuit, a second inserting hole (412) is passed through each fin (41), so that the heat pipe (60) is inserted into the inside. The second heat sink (70) disclosed in the present invention is composed of multiple fins (71).
M284036 於各該鰭4(71)上’穿設有航(711)，以嵌接該鮮管⑽之末 端於内者。 本新型所揭示具熱導、液冷散熱之電腦電源供應器，其主要 結構特徵在於，該電職源供絲係含有親冷及熱傳遞方式進 订散熱之結構，使熱源(31)之熱能可減動於第—散熱座(如中 之冷卻液進行熱交換，將熱能向外帶出，並藉由第—散熱座⑽ 中之熱導管⑽）將熱能傳遞至位於殼體⑽外之第二散熱座 (70) ’進行散熱，而使本新型可獲得良好的散熱功效。 本新型所揭7F之元件結構、形狀，可於不違本触之申請專 利範圍下予⑽飾朗，本新型並不予自限。 【圖式簡單說明】 第-圖：係本新型所應用之電腦電源供應器局部分解圖。 第二圖：係本新型H熱座與第二散熱座安裝於電腦電源供 應器上之示意圖。 第三圖··侧示本新型所應用之電職源供脑之外觀示意圖。 【主要元件符號說明】 (20)殼體 (32)導熱銜接構件 (410)接熱板 (30)電源供應電路 (40)第一散熱座 (411)第一傲孔 (50)冷卻液導管 (60)熱導管 (711)嵌孔 (51)進水口 (70)第二散熱座 (別）絕緣導熱層 (31)熱源 (41)鰭片 (412)第二嵌孔 (52)出水〇 (71)鰭片 8M284036 On each of the fins 4 (71), a flight (711) is provided to engage the end of the fresh tube ⑽ inside. The main structure characteristic of the computer power supply with thermal conductivity and liquid cooling disclosed by the new model is that the electric power supply wire contains a structure for cooling by heat-cooling and heat transfer methods, so that the heat energy of the heat source (31) Can be decelerated in the first heat sink (such as the cooling liquid in the heat exchange to bring out the heat energy, and through the heat pipe ⑽ in the first heat sink ⑽) to transfer heat energy to the first The two heat sinks (70) 'perform heat dissipation, so that the new model can obtain good heat dissipation effects. The component structure and shape of the 7F disclosed by this new model can be applied to the decorative patent without violating the scope of the patent application. The new model is not self-limiting. [Schematic description] Figure-Figure: This is a partial exploded view of the computer power supply to which the new model is applied. The second picture: it is a schematic diagram of the new H heat base and the second heat sink installed on the computer power supply. The third picture shows a schematic diagram of the appearance of the electrical power supply brain used in the new model. [Description of main component symbols] (20) Housing (32) Thermally conductive connecting member (410) Heated plate (30) Power supply circuit (40) First heat sink (411) First proud hole (50) Coolant pipe ( 60) Heat pipe (711) Insertion hole (51) Water inlet (70) Second heat sink (other) Insulation and heat conduction layer (31) Heat source (41) Fin (412) Second insertion hole (52) Water outlet (71) Fins 8