200937175 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種雷 種利 用水冷系崎記憶卡散熱之電I置⑽係有關於 【先前技術】 習知用於電子裝置之記憶 Ο 用兩片散熱片分別設置於兮己情卡=散熱機制’通常係利 俾卡腎㈣ &又直於°己匕卡之兩側’並使散舞片血々 再經由散熱片散出。 得¥至散熱片後， 卡模!華之民散國號華92_ :熱片分別設置於記憶卡之兩側的； 於上述習知技術中，兩個散熱片分 φ 卡上。然而’散熱片於相互卡 組裝時，操作者必須-手扶著散熱片， 夾，、扣入散熱片上之凹射’影響組裝時的便利性。 中國新型專利號ZL 2酬·2964 g揭露一種散教 ^置’該散熱裝置直择於具有散熱鰭片之兩個散熱器上裝 °又紋鏈與彈簧，使散熱器可相對旋轉，且利用彈簧的力量 便可使散熱器穩固地挾持記憶卡。但是此一方法僅限於將 絞，裝設於散熱器之偏中心位置’且操作部份（絞鍵至施 力知）必須保持一定的距離，才能使操作者不需施以過多 的力里便將散熱器禮開，而操作部份的設計使散熱器整體 200937175 體積增加，不利於微小化的趨勢。 【發明内容】 有鑑於此，本發明提供一種電子裝置，包括一 I電路板、-記憶卡以及—水m 二娜 中’，設置於電路板上，水冷系統設置 〃本明提供—種散熱模組，包括—第—散 :第二散熱片。第-散熱片包括-凹槽以及一突、出部，突 出部設置於凹槽之邊緣，第二散熱^ ❹部具有-内表面以及-外表面，並以卡合的 槽中’彎曲部可於凹槽中轉動 〜°又置於凹 片相㈣轉，並保持突出部與内表面相對。 I、、、 【實施方式】 -卓ΐβ圖，本發明之電子裝置1〇〇為 晉ϊηί) 或疋其他具有記憶卡之電子裝置。電子裝 ❹ 卡120^:殼體（未圖示）、一電路板110、至少—記憶 發明電子额13ϋ°纽⑽是，為清楚顯示本 板殼體中，記憶卡】2〇設置於電路 憶卡120 直接設置於記憶卡120上，對記 散熱模組130包括一第—散熱片 放熱片131Β以及一杰且如楚ιη 所示）。應注音的3 I❹丈具ϊ32(如第1β圖中 的數量並盈^矣 片i31A與第二散熱片 裳一二、，僅係配合記憶卡120的數量而定。 月熱片131A包括一凹槽N以及一突出部p，第 200937175 散熱片131B包括—彎曲部B， Βϊ以及一外表面B2。藉由弯曲部B以可轉勒有—内表面 :凹槽N中，使第—散熱片 ？=的方式設置 合，並使第二散熱片13ΐβ以可於—第弟——=片咖結 所示）以及一第二位置（如第ΐβ ，置（如第1Α圖 片131Α旋轉，且在旋轉時，f曲部相對於第一散熱 與突出部Ρ相對。 勺内表面Β1可維持 ❹ *屮邱田散熱片ί31β由第一位置轉動至第-位Β 犬出可防止第二散熱片則與 位置後’ 離，也就是說第二散熱片咖可少許地^右j 131Α分 會與第-散熱片地分離，因此 ^動，並不 131Α舆第二散熱片131Β結合後，僅需用^^—散熱片 散熱片13U與第二散熱片 二用一手便可將第― 120，輕易地將第—散教'' B之間隙對準記憶卡 設置於記情卡12ηΛ片331A與第二散熱片咖分別 ❿ 側’即使不提供支樓，第-散4 =與弟一伽31β亦不會輕易地分離，可加㈡ 將彎曲部Β設置於凹槽 二散熱片131Β連接，並將，一放熱片咖與第 131β對準記憶卡120之兩側，V著片再：^散熱片 第一散熱片131A盥第二$埶1^ 再用夾〜132挾持 120更緊密貼入'β散…片131Β，使散熱片與記憶卡 ^更緊4貼合。讀可將鎖合件l把夾具 一為 …片131A鎖合以更加固定整體結構。 配合參見第2A、2Rfii，士丄 達成更佳的散熱功效，气使本發明之散熱模組130 133,水冷系統：= Γ更包括一水冷系統 稭由第一放熱片131A的連接而直接設 200937175 置於記憶卡120上。 ，見第3A至3C圖，第3八至3(：圖顯示第一散200937175 IX. Description of the Invention: [Technical Field] The present invention relates to an electric device for dissipating heat using a water-cooled Kawasaki memory card (10) relating to [previously] conventionally used for electronic devices. The two heat sinks are respectively set in the card. The heat dissipation mechanism is usually the same as the two sides of the card, and the blood is scattered on the sides of the card. After getting ¥ to the heat sink, the card model! Huazhimin Sanguohua 92_: hot sheets are respectively placed on both sides of the memory card; in the above-mentioned conventional technology, the two heat sinks are divided into φ cards. However, when the heat sinks are assembled with each other, the operator must - hold the heat sink, the clip, and the recessed on the heat sink to affect the convenience of assembly. China's new patent number ZL 2 paid · 2964 g reveals a kind of dispersal teaching. The heat sink is directly selected from the two heat sinks with heat sink fins and the chain and the spring, so that the heat sink can be rotated relative to each other. The force of the spring allows the heat sink to hold the memory card firmly. However, this method is limited to the installation of the twisting device in the center position of the heat sink and the operating portion (twisting to the force) must be kept at a certain distance so that the operator can dissipate heat without applying excessive force. The device is opened, and the design of the operating part increases the overall volume of the heat sink 200937175, which is not conducive to miniaturization. SUMMARY OF THE INVENTION In view of this, the present invention provides an electronic device including an I circuit board, a memory card, and a water m-na, installed on a circuit board, and provided with a water cooling system. Group, including - first - scattered: second heat sink. The first heat sink includes a groove and a protrusion and a protrusion. The protrusion is disposed at an edge of the groove, and the second heat dissipation portion has an inner surface and an outer surface, and the curved portion is formed in the engaged groove. Rotating ~° in the groove is placed in the concave phase (four) to rotate, and the projection is kept opposite to the inner surface. I,,, and [Embodiment] - The electronic device of the present invention is an electronic device having a memory card. Electronic device card 120^: housing (not shown), a circuit board 110, at least - memory invention electronic 13 ϋ ° button (10), in order to clearly show the board in the board, the memory card 2 〇 set in the circuit memory The card 120 is directly disposed on the memory card 120, and the pair of heat-dissipating modules 130 includes a first heat-dissipating heat-dissipating film 131 and a singularity and is shown in FIG. The 3 I 应 ϊ ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( The groove N and a protrusion p, the 200937175 heat sink 131B includes a curved portion B, a meandering surface and an outer surface B2. The curved portion B can be rotated to have an inner surface: the groove N, so that the first heat sink The pattern of ? = is set, and the second heat sink 13 ΐ β can be displayed in the first-----the second position (such as the ΐβ, set (as the first picture 131Α rotates, and When rotating, the f-curved portion is opposite to the first heat-dissipating portion and the protruding portion 。. The inner surface of the spoon Β1 can maintain the ❹*屮Qiutian heat sink ί31β is rotated from the first position to the first position 犬 the dog can prevent the second heat sink from being After the position, it is separated, that is to say, the second heat sink can be slightly removed. The right j 131Α will be separated from the first heat sink. Therefore, if the second heat sink 131 is combined, only ^ ^—The heat sink fin 13U and the second heat sink can use the first 120 to easily move the first to the 120th. ''B gap alignment memory card is set on the symphony card 12n Λ 331A and the second heat sink ❿ ❿ side 'even if the branch is not provided, the first - scatter 4 = and the brother gamma 31β will not be easily separated, (2) The bending portion is disposed on the groove 2 heat sink 131Β, and a heat release tablet and the 131# are aligned on both sides of the memory card 120, and the V piece is again: the heat sink first heat sink 131A盥The second $埶1^ is further clamped into the 'β散片片131Β with the clip~132挟120, so that the heat sink and the memory card ^ are tighter. 4 The reading can be used to lock the piece l to the ... The 131A locks to fix the overall structure. For the cooperation, see 2A, 2Rfii, the gentry achieves better heat dissipation, and the heat dissipation module 130 133 of the present invention, the water cooling system: = Γ includes a water cooling system straw by the first The connection of the heat radiating piece 131A is directly placed on the memory card 120. 2009, see Figures 3A to 3C, the third to third (the figure shows the first scattered
乂，冷系、统133的結合方式，其中第3A、3B圖;二 ^ 3C圖為俯視圖。於第3A圖中，水冷系統⑶J :由與第一散熱片131A以鎖合 : ❹ ❿ f圖中，第—散熱片刪更包括-突出二 犬山出端部S1穿過水冷系、統133後，再由一塾片犯盘 1端部S1卡合，以固定水冷系統133與第執片、 3C圖中’水冷系統133具有-滑槽T，；： ;入滑槽T中，並與滑槽T卡合，得以固定^8 33 片㈣。應注意的是，於上述實施例；乂, the combination of cold system and system 133, of which 3A and 3B are; 2^3C is a top view. In Fig. 3A, the water cooling system (3) J is locked by the first heat sink 131A: ❹ ❿ f, the first heat sink is further included - the second tail portion S1 is passed through the water cooling system, the system 133 Then, by a piece of disc, the end of the disc 1 is engaged with the S1 to fix the water cooling system 133 with the first piece, the 3C picture of the 'water cooling system 133 has a chute T,;:; into the chute T, and slippery When the slot T is engaged, it is possible to fix ^8 33 pieces (four). It should be noted that in the above embodiment;
=鎖合或卡合的方式與第—散熱片⑶A 要使水冷系統m與第一散熱片 =參見第ΙΑ、IB、2A與2B圖，水冷系統133包 、f件1332以及風扇F，其中風扇h 置^冷排卿上。第—散熱片131a更包括1 J 13 =及-進水α 13Η。水冷排13 ，由管件_與第一散熱片聰之出水σ1Π 1331^,, 1332 及第一放熱片131Α中楯環流通。 二卡120運作時產生的熱量傳先導至第一散孰片 水、人排片131β，由循環的冷卻液體吸收並帶至 :二置於水冷排1331上之風扇f運轉並對 7 進仃散熱，且風扇F所提供之風量在經過 200937175 水冷排13 31後，吟a始 131β，增加散埶模έ/ 月熱片131A以及第二散熱片 S双"，、衩組13〇整體的散熱效率。 力 本毛明第一散熱片13u、 固且組裝方便。再者，筮 一放"，、片131B之結構穩 以及夾且132 J且ttf熱片13U、第二散熱片_ 及L132之組合可早獨使用於記憶卡⑽， ~糸統133搭配使用，加強散熱模組散熱的功效一。” 雖然本發明已以較佳實施例揭露如上，然盆並 以限定本發明，任何熟習此項技蓺者二 Ο= lock or snap and the heat sink (3) A to make the water cooling system m and the first heat sink = see Figure IB, IB, 2A and 2B, water cooling system 133 package, f piece 1332 and fan F, where the fan h Set ^ cold row on the Qing. The first heat sink 131a further includes 1 J 13 = and - water inlet α 13Η. The water-cooling row 13 is circulated by the tube-shaped _ ring and the first heat-dissipating sheet σ1Π 1331^, 1332 and the first heat-dissipating sheet 131. The heat generated during the operation of the second card 120 is firstly led to the first diffused piece of water and the person's row piece 131β, which is absorbed by the circulating cooling liquid and brought to the following: the fan f placed on the water-cooled row 1331 operates and dissipates heat into the 7-inch heat sink. Moreover, after the air volume provided by the fan F is 1331 after the water cooling row 1331 of 200937175, the first heat dissipation efficiency is increased by 131β, and the heat dissipation efficiency of the first and second heat sinks 131A and the second heat sink S is increased. . The first heat sink 13u of the body is solid and easy to assemble. Furthermore, the combination of 筮一放", slice 131B is stable and the combination of 132 J and ttf hot film 13U, second heat sink _ and L132 can be used alone in memory card (10), ~ 糸 system 133 To enhance the heat dissipation of the heat dissipation module. Although the present invention has been disclosed above in the preferred embodiments, the invention is not limited thereto, and any skilled person is skilled in the art.
精砷和範圍内，仍可作些許的更動與潤飾，因此本發明之 保護範圍當視後附之申請專利範圍所界定者為準。X 200937175 【圖式簡單說明】 第1A圖顯示本發明電子裝置之内部示意圖，其中第二 散熱片係位於第一位置； 第1B圖顯示本發明電子裝置之内部示意圖，其中第二 散熱片係位於第二位置； 第2A圖顯示本發明電子裝置之一變化例之前視圖； 第2B圖顯示第2A圖中電子裝置之侧視圖； 第3A與3B圖顯示本發明水冷系統與第一散熱片結合方 式之侧視圖，以及 ® 第3C圖顯示本發明水冷系統與第一散熱片結合方式之 俯視圖。 【主要元件符號說明】 100〜電子裝置； 110〜電路板； 120〜記憶卡； 130〜散熱模組； 131A〜第一散熱片； 131B〜第二散熱片； 13 li〜進水口； 131〇〜出水口； 132〜爽具， 133〜水冷系統； 1331〜水冷排； 1332〜管件； B〜彎曲部； B1〜内表面； B2〜外表面； F〜風扇； L〜鎖合件； N〜凹槽； P〜突出部； S~螺絲； S卜S1，〜突出端部； S2〜墊片； T〜滑槽。 10Within the scope of arsenic and arsenic, some modifications and refinements may be made, and the scope of protection of the present invention is defined by the scope of the appended claims. X 200937175 [Simplified description of the drawings] FIG. 1A is a schematic diagram showing the internal structure of the electronic device of the present invention, wherein the second heat sink is located at the first position; FIG. 1B is a schematic view showing the internal portion of the electronic device of the present invention, wherein the second heat sink is located 2A is a front view showing a modification of the electronic device of the present invention; FIG. 2B is a side view showing the electronic device in FIG. 2A; and FIGS. 3A and 3B are views showing a combination of the water cooling system and the first heat sink of the present invention; The side view, and the 3C chart, show a top view of the manner in which the water cooling system of the present invention is combined with the first heat sink. [Main component symbol description] 100~ electronic device; 110~ circuit board; 120~ memory card; 130~ heat dissipation module; 131A~ first heat sink; 131B~ second heat sink; 13 li~ water inlet; Outlet; 132~Shuangshui, 133~ water cooling system; 1331~ water cooled row; 1332~ pipe fittings; B~bending part; B1~ inner surface; B2~ outer surface; F~fan; L~locking part; Slot; P~protruding; S~screw; Sb S1, ~ protruding end; S2~shield; T~ chute. 10