M359800 ‘五、新型說明： 【新型所屬之技術領域】 目前電子元件功率越來越大，發出熱量也隨之越來越大，例如： 大於lw之高功率發光二極體(HIGH POWER LED)，輸入功率 僅有15〜20%轉換成光’其餘〜85%則轉換成熱能，若這些熱 能未適時排出至外界，那麼將會使LED晶粒界面溫度過高而影 響發光效率及發光壽命。本發明是一種改良型之高導散熱銘覆 _ 金屬底材，以鍍著方式鍍著一特定厚度之金屬，例如將銅鍍著 於鋁合金金屬表面’稱之為鋁覆銅底材。由於銅的高導熱性質， 因此散熱效率比僅用鋁合金當作散熱層之散熱鋁基板高很多。 Ik後再以現有多層印刷電路板(HHiayer Printed Circuit Board)之熱壓合方法將上述鋁覆銅底材，絕緣導熱膠(介電層） 與金屬線路層三者做150。〇以上，！小時之熱壓合而成為一體， 進而在銅鋁金屬間形成一緊密鍵結之銅鋁合金層，並可有效降 藝個_之介輪阻抗。如財電子元件如：高轉發光二極體 (HIGH POWER LED)於高導散熱鋁覆金屬底材表面作動發出熱量 時可促進散熱效率且各層間結合緊密’不會有剝離分層現象 產生，進而提升產品之良率與品質之信賴度。 【先前技術】 ' 财㈣散触基板如圖㈠只有齡金金屬散熱層⑸、絕緣 導熱膠層⑽)與金祕闕（25)。齡金金屬錄層⑸經陽極 處理或經虱氧化鈉浸泡，使其表面粗縫化後，再將此粗链化後 4 M359800 ' _合金金屬散熱層⑸、絕緣導熱膠層⑽與金屬線路(25)， 二者進行熱壓合使其成為-體’此錄触基板因僅用銘合金 單一金屬做為散熱材料及絕緣導熱膠體導熱速率受限而無法更 有效快速的散熱。更因市面上各種導熱膠材f不同、特性不一 且絕緣導熱♦體黏性的選擇限制’使得熱壓合條件與參數變得 非常複雜且不穩定；如目前祕最常使用商品魅產之絕緣導 熱膠層’因膠層無法更有效快速散熱，儿絕、缘導熱膠層與銘合 • 金金屬散熱層接觸面間之黏著力強度低，經高溫30(TC熱衝擊 後易產生分離或爆板問題，使得產品製作困難且品質信賴度 低’無法滿足目前市場需求。另外也有業者推出陶究基板如： 氧化鋁，LTCC(低溫共燒陶磁），氮化鋁等。鑽石基板是以鑽石 層來取代絕緣導熱膠層。以及直接銅接合基板(DBC)等技術， 發明類似相關的散熱基板，但都因製程上重量限制，機械加工 困難，技術門檻太高及製作所需成本昂貴，皆無法普及市場並 Φ 滿足市場需求。 【新型内容】 本新型主要目的： 一、提昇現有疊構散熱鋁基板使其具有更快導散熱速率，本發明 透過無電解電鍍、電鍍或真空蒸鍍技術將鋁合金金屬散熱層 表面錢著上一層金屬如:銅金屬。因銅具有良好的導電、導 熱性，其中銅的熱傳導率(400w/mk)幾乎是鋁合金代號 5〇52(150w/mk)的2倍以上。高熱傳導率意味著熱量能更容 5 M359800 易從材料的—端傳導到另一端，從而保證整個散熱裝置的散 熱面積能夠得到充分的彻。例如糊銅很高的熱傳導率把M359800 'V. New description: 【New technology field】 At present, the power of electronic components is getting bigger and bigger, and the heat generation is also getting larger and larger, for example: high power LEDs larger than lw (HIGH POWER LED), The input power is only 15~20% converted into light. The remaining ~85% is converted into heat energy. If these heat energy is not discharged to the outside world, the LED die interface temperature will be too high, which will affect the luminous efficiency and luminous lifetime. The present invention is an improved high-conductivity heat-dissipating _ metal substrate which is plated with a metal of a specific thickness, for example, copper is plated on an aluminum alloy metal surface, which is referred to as an aluminum-clad copper substrate. Due to the high thermal conductivity of copper, the heat dissipation efficiency is much higher than that of a heat-dissipating aluminum substrate using only an aluminum alloy as a heat dissipation layer. After Ik, the above-mentioned aluminum-clad copper substrate, insulating thermal conductive adhesive (dielectric layer) and metal wiring layer were made 150 by the hot pressing method of the existing multilayer printed circuit board (HHiayer Printed Circuit Board). Oh, above! The heat of the hour is integrated into one, and a tightly bonded copper-aluminum alloy layer is formed between the copper and aluminum metal, and the dielectric impedance of the wheel is effectively reduced. Such as financial electronic components such as: high-power LEDs (HIGH POWER LED) on the surface of the high-conductivity heat-dissipating aluminum-coated metal substrate to promote heat dissipation efficiency and the tight bonding between the layers 'will not have peeling delamination, and then Improve the reliability of product yield and quality. [Prior Art] 'Finance (4) The contact substrate is as shown in (1) only the gold metal heat dissipation layer (5), the insulating thermal adhesive layer (10) and the gold secret (25). The gold metal recording layer (5) is anodized or immersed in bismuth sodium oxide to make the surface rough, and then the thickened chain 4 M359800 ' _ alloy metal heat dissipation layer (5), insulating thermal conductive layer (10) and metal circuit ( 25), the two are thermocompression-bonded to become a body. This recording substrate cannot be more effectively and quickly dissipated because only the single metal of the alloy is used as the heat dissipating material and the thermal conductivity of the insulating thermal conductive gel is limited. Moreover, due to the different thermal conductivity materials on the market, different characteristics, and the choice of insulation and heat transfer ♦ body viscosity, the thermocompression conditions and parameters become very complicated and unstable; as the current secret is most often used Insulation and thermal conductive adhesive layer can not be more effectively and quickly dissipated due to the adhesive layer. The thermal conductive adhesive layer and the sealing layer of the gold metal heat dissipation layer have low adhesive strength, and the high temperature is 30 (the temperature is easily separated after the TC thermal shock or The problem of blasting makes the production difficult and the quality is low. It can't meet the current market demand. In addition, some companies have introduced ceramic substrates such as: alumina, LTCC (low temperature co-fired ceramic), aluminum nitride, etc. The diamond substrate is made of diamonds. The layer replaces the insulating and thermally conductive adhesive layer, and the direct copper bonded substrate (DBC) and other technologies, inventing similar heat-dissipating substrates, but due to the weight limitation of the process, the machining is difficult, the technical threshold is too high, and the production cost is high. Unable to popularize the market and Φ meet the market demand. [New content] The main purpose of this new type: 1. Enhance the existing laminated heat-dissipating aluminum substrate to make it faster to guide heat dissipation At the rate, the surface of the aluminum alloy metal heat dissipation layer is coated with a metal such as copper metal through electroless plating, electroplating or vacuum evaporation. Because copper has good electrical and thermal conductivity, the thermal conductivity of copper (400w/) Mk) is almost twice the aluminum alloy code 5〇52 (150w/mk). High thermal conductivity means that the heat can be more 5 M359800 is easy to conduct from the end of the material to the other end, thus ensuring the heat dissipation area of the entire heat sink Can be fully refined. For example, the paste copper has a very high thermal conductivity.
電細中央處理器（CPU)或高功率發光二極體(PJJGJJ p〇WER LED)等電子元件於工作時_產生的錢快速料至銘合 金金屬端’使整體高導散齡覆金屬底材散練置底部和0上 部溫度差日_增加，加快紐料，從而提高散触基板整 體散熱效果。 • 二、解決現有疊構散熱鋁基板， 因絕緣導熱膠(介電層）與鋁合金 金屬散熱層間，黏著性或密著性不佳而導致分離或爆板問 題。由於各種商品化之絕緣導熱較限於導熱麵緣關係之 考量’反而轉其絕緣導讎賴齡金金屬散敎層之黏 性’因此須不斷改變各種熱壓合參數條件以因應各不同種 類之絕緣導_雜但終究徒勞無功。*本發明於銘合金金 屬散…層表面鍍著上一層金屬如:銅，再於此錢著銅金屬表Electronic components such as a low-power central processing unit (CPU) or a high-power LED (PJJGJJ p〇WER LED) work at the time of production - the money is quickly expected to the metal end of the alloy - making the overall high-distribution age-old metal substrate The temperature difference between the bottom and the upper part of the 0 is increased, and the new material is accelerated, thereby improving the overall heat dissipation effect of the scattering substrate. • 2. Solve the problem of separation or explosion of the existing laminated heat-dissipating aluminum substrate due to poor adhesion or adhesion between the insulating thermal conductive adhesive (dielectric layer) and the aluminum alloy metal heat dissipation layer. Since various commercial insulation heat conduction is limited to the relationship of the thermal conductive surface relationship, the heat conductivity of the insulating layer is changed. Therefore, the various thermal compression parameters must be constantly changed to meet the different types of insulation. Guide _ miscellaneous but in vain. * The surface of the invention is coated with a layer of metal such as copper on the surface of the metal layer of Yuming alloy.
面做壓合前處理，如:標、黑（氧)化等方式以增加表面積再 與絕緣導熱膠做熱屋合處理而形成絕緣導熱膠與錢著銅金 屬間強有力之鍵結，而銅銘交接面會因於熱壓合時高溫⑽ °C以上透子遷移而自鋪成—銅齡金層，讓銅與紹合 金更緊密且牢固結合，且經冷熱衝擊試驗0〜12(TC 300次後 完全不會有分離的現象產生。 三、大幅提昇各_之鍵結力，麟絕料_财更寬廣的選 擇I·生不’又限於特定絕緣導熱膠材之特性，讓製作參數容 M359800 -· 易掌握，進而達成更佳之良率與產率。 【實施方式】 請參看第(二)圖所示，本發明高導散熱鋁覆金屬底材其中包括 一鋁合金金屬散熱層（5)，一鍍著金屬導熱層（10)，一鍍著金屬 導熱層粗缝面（15)，一絕緣導熱膠層（2〇)，一金屬線路層（25)， 如單面銅箔、銅板、雙面（導熱）印刷電路板如第（三)圖（25)、 多層（導熱）印刷電路板或高密度互連印刷電路板(HDI板）。先 • 將欲鍍著之鋁合金金屬散熱層（5)以氫氧化鉀或氫氧化鈉i〇〇g 〜200g/l ’ 50〜80°C，30〜60秒浸泡，使其表面粗糙化，再以 無電解電鍍、電鍍或真空蒸鍍方式，將金屬鍍著於已粗糙化之 單面，雙面或多面銘合金金屬散熱層表面（5);將此鑛著於銘 合金表面之鑛著金屬導熱層（1〇)如鍍著金屬銅表面經刷磨、微 蝕刻、超微姓、喷金剛砂、黑（氧)化、黑（氧)化加還原轉化、 棕化、水平微餘棕化’化學鑛錫或化學鏡銀等方法，使鍍著金 鲁屬銅表面粗糙化並形成一鍍著銅導熱層粗糙面（15)，以增加表 面積後再用現有印刷電路板(PCB)熱壓合方式15〇<t以上熱壓 1小時’將絕緣_膠層⑽之—面熱壓合並黏著於鍍著金屬 銅導熱層粗糖面（15)表面’同時同步以相同熱壓合方式將金屬 線路層（25)如單面銅箔、銅板、雙面（導熱）印刷電路板如第㈢ 圖（25)、多層（導熱)印刷電路板或高密度互連印刷電路板 (HDI板）熱壓合並黏著於絕緣導熱膠層（2〇)之另一面使成為一 體’-電子元件(30)的導線、導腳、焊墊(35)以焊錫焊接至金 M359800 屬線路層（25)，則該電子元件⑽即可於本發明之高導散熱銘 覆金屬底材表面運作；其電子元件(3〇)運作時會產生高轨量， 熱由金屬線路層（25)傳至絕緣導熱膠層⑽，再贿著金屬導 熱層OG)做快速吸附熱能並加速導熱_合金金屬散熱層⑸ 做有效快速陳熱，秘電子元件⑽)翻比親有疊構散熱 紹基板更低溫且具有更良好的運作效率。 【圖式簡單說明】 第一圖為現有疊構散熱鋁基板之剖面圖 第一圖為本發明單面金屬線路層之剖面圖 第三圖為本發明雙面金屬線路層之剖面圖（雙面 【主要元件符號說明】 (5)...紹合金金屬散熱層 (10)...鍍著金屬導熱層 (15)...鍍著金屬導熱層粗糖面 (20)...絕緣導熱膠層 (25)...金屬線路層 (30)...電子元件或功率元件 (35)...導線The surface is pre-pressed, such as: standard, black (oxygen) and other methods to increase the surface area and then heat-bonded with the thermal conductive adhesive to form a strong bond between the insulating thermal adhesive and the copper metal, while copper The Mingjiao junction will be self-laid due to the high temperature (10) °C or higher through the thermo-compression bonding. The copper age gold layer will make the copper and Shao alloy more tightly and firmly combined, and the thermal shock test 0~12 (TC 300 times) After that, there will be no separation phenomenon. Third, greatly improve the bond strength of each _, the ruthless material _ richer choice I · raw not 'is limited to the characteristics of specific insulation thermal conductive rubber, let the production parameters capacity M359800 -· Easy to master, and thus achieve better yield and yield. [Embodiment] Please refer to the figure (2), the high-conductivity heat-dissipating aluminum-coated metal substrate of the present invention includes an aluminum alloy metal heat dissipation layer (5) a metal-plated heat-conducting layer (10), a metal heat-conducting layer rough surface (15), an insulating thermal conductive layer (2 〇), a metal circuit layer (25), such as a single-sided copper foil, a copper plate, Double-sided (thermal) printed circuit board as shown in (3) (25), multi-layer (thermal) Circuit board or high-density interconnect printed circuit board (HDI board). First • The aluminum alloy metal heat sink layer (5) to be plated with potassium hydroxide or sodium hydroxide i〇〇g ~200g/l ' 50~80 °C, 30~60 seconds soaking, roughening the surface, and then plating the metal on the roughened single-sided, double-sided or multi-faceted alloy metal heat sink surface by electroless plating, electroplating or vacuum evaporation. (5); the mineral-bearing metal heat-conducting layer (1〇) on the surface of the alloy is brushed, micro-etched, super-applied, sprayed with diamond, black (oxygenated), black ( Oxygenation plus reduction, browning, horizontal micro-browning, chemical ore, or chemical silver, to roughen the surface of the gold-plated copper and form a rough surface coated with copper (15). After increasing the surface area, the existing printed circuit board (PCB) is thermocompression-bonded by 15 〇<t hot pressing for 1 hour. The surface of the insulating layer (10) is hot-pressed and adhered to the metal-coated copper heat-conducting layer. (15) Surface 'simultaneously synchronizing the metal circuit layer (25) such as single-sided copper foil, copper plate, double (thermal) printed circuit board such as (3) (25), multi-layer (thermal conductive) printed circuit board or high-density interconnect printed circuit board (HDI board) hot pressed and adhered to the other side of the insulating thermal conductive layer (2〇) The wire, the lead, and the pad (35) which become the integrated electronic component (30) are solder-welded to the gold M359800 circuit layer (25), and the electronic component (10) can be coated with the metal of the present invention. The surface of the substrate operates; its electronic components (3〇) operate with high rail volume, heat is transferred from the metal circuit layer (25) to the insulating thermal conductive layer (10), and the metal thermal layer OG is bribed to quickly absorb heat and accelerate Heat conduction _ alloy metal heat sink layer (5) to make effective and rapid heat, the secret electronic components (10)) turn over the heat of the substrate to lower the temperature and have better operating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a cross-sectional view of a conventional stacked heat-dissipating aluminum substrate. The first figure is a cross-sectional view of a single-sided metal circuit layer of the present invention. The third figure is a cross-sectional view of the double-sided metal circuit layer of the present invention (double-sided [Main component symbol description] (5)...Shand alloy metal heat dissipation layer (10)...metallized heat conduction layer (15)...metal heat conduction layer rough sugar surface (20)...insulation thermal adhesive Layer (25)...metal circuit layer (30)...electronic component or power component (35)...wire