TWI772955B - Thermal conductive and electrical insulating substrate structure - Google Patents

Abstract

A thermal conductive and electrical insulating substrate structure and a method for manufacturing the same are provided. The thermal conductive and electrical insulating substrate structure includes an insulating layer, a plurality of metal layers, and a plurality of function layers. The metal layers and the function layers are disposed on the insulating layer. The sidewall of the metal layer is in contact with the corresponding function layer. The function layers between any two adjacent ones of the metal layers are not in contact.

Description

Insulating and thermally conductive substrate structure

The present invention relates to a base material structure and its manufacturing process, in particular to an insulating and thermally conductive base material structure and its manufacturing process.

At present, the power of the electronic components in the power module of the electric vehicle/hybrid electric vehicle is very high, so the thickness of the copper layer in the insulating metal substrate needs to be increased to improve the heat dissipation effect.

At present, the direct copper plating (DPC) technology is easier to achieve thick copper than the common direct copper plating (DBC) technology.

In addition, please refer to FIG. 1 , which illustrates an existing insulating metal substrate structure, and when the circuit design causes the distance G between the copper layers 20A on the insulating layer 10A to be narrow, and when the voltage is large, electrons will be driven by a copper layer. The sidewall of the layer 20A is discharged to the sidewall of the other copper layer 20A, resulting in a short circuit phenomenon.

In view of this, the inventor of the present invention has been engaged in the development and design of related products for many years, and feels that the above deficiencies can be improved, so he has devoted himself to research and application of theories, and finally proposes a reasonable design and effectively improves the above deficiencies. The present invention.

The technical problem to be solved by the present invention is to provide an insulating and thermally conductive substrate structure and a manufacturing process thereof in view of the deficiencies of the prior art.

In order to solve the above technical problems, the present invention provides an insulating and thermally conductive substrate structure. The structure includes: an insulating layer, a plurality of metal layers, and a plurality of functional layers; wherein, the plurality of the metal layers and the plurality of the functional layers are arranged on the insulating layer, and the sidewalls of the metal layers correspond to The functional layers are in contact with each other, and the two functional layers between any two adjacent metal layers are not in contact.

In a preferred embodiment, the functional layer is made of high insulating material.

In a preferred embodiment, the functional layer is formed of a polymer material.

In a preferred embodiment, the functional layer is formed of a low-binding polymer material.

In a preferred embodiment, the functional layer is made of corrosion-resistant material.

In a preferred embodiment, the functional layer is a composite layer, which includes a ceramic layer formed on the sidewall of the metal layer and a polymer layer formed on the sidewall of the ceramic layer, and the polymer layer has a low bond. made of high molecular weight materials.

The present invention further provides an insulating and thermally conductive substrate structure, comprising: an insulating layer, a plurality of metal layers, a plurality of functional layers, and a frame; wherein the plurality of the metal layers, the plurality of the functional layers, and the frame are arranged On the insulating layer, the sidewall of the metal layer is in contact with the corresponding functional layer, and the two functional layers between any two adjacent metal layers are in contact with the frame.

In a preferred embodiment, the functional layer is made of high insulating material.

In a preferred embodiment, the functional layer is formed of a polymer material.

In a preferred embodiment, the functional layer is formed of a high-binding polymer material.

In a preferred embodiment, the functional layer is made of corrosion-resistant material.

In a preferred embodiment, the functional layer is a composite layer, which includes a ceramic layer formed on the sidewall of the metal layer and a polymer layer formed on the sidewall of the ceramic layer, and the polymer layer is highly bonded. made of high molecular weight materials.

In a preferred embodiment, the frame is made of a non-metallic material with low conductivity.

The present invention further provides a manufacturing process of an insulating and thermally conductive substrate structure, comprising the steps of: (a) attaching a plurality of functional layers to the sidewalls of a plurality of metal layers; (b) attaching a frame between any two adjacent functional layers; ( c) attaching the frame and a plurality of the metal layers on the insulating layer.

In a preferred embodiment, the manufacturing process of the insulating and thermally conductive substrate structure further includes the step of: (d) removing the frame.

In a preferred embodiment, in step (d), the frame is removed by etching, and the functional layer is made of corrosion-resistant material.

In a preferred embodiment, in step (d), the frame is removed by peeling, and the functional layer is made of a low-bond polymer material.

In a preferred embodiment, the functional layer is a composite layer, which includes a ceramic layer attached to the sidewall of the metal layer and a polymer layer attached to the sidewall of the ceramic layer.

In a preferred embodiment, the frame is made of a non-metallic material with low conductivity.

In a preferred embodiment, the means of attachment is physical bonding or chemical forming.

The beneficial effect of the present invention is at least in that the insulating and thermally conductive substrate structure provided by the present invention is provided on the insulating layer through "a plurality of the metal layers and a plurality of the functional layers, and the sidewalls of the metal layers correspond to the The technical solution that the functional layers are in contact with each other, and the two functional layers between any two adjacent metal layers are not in contact” can effectively reduce the probability of electrical short circuit.

In order to further understand the features and technical content of the present invention, please refer to the following detailed descriptions and drawings related to the present invention, but the drawings provided are only for reference and illustration. It is not intended to limit the present invention.

[current technology]

10A: Insulation layer

20A: Copper layer

G: Spacing

[this invention]

10: Insulation layer

20: Metal layer

30: Functional Layer

31: Ceramic layer

32: polymer layer

40: Frame

W: width

FIG. 1 is a schematic side view of an insulating metal substrate structure in the prior art.

FIG. 2 is a schematic side view of the structure of the insulating and thermally conductive substrate provided by the first embodiment of the present invention.

FIG. 3 is a schematic side view of an insulating and thermally conductive substrate structure provided by a second embodiment of the present invention.

FIG. 4 is a schematic side view of an insulating and thermally conductive substrate structure provided by a third embodiment of the present invention.

5A to 5C are schematic diagrams of a manufacturing process of the insulating and thermally conductive substrate structure provided by the fourth embodiment of the present invention.

6A to 6D are schematic diagrams of the manufacturing process of the insulating and thermally conductive substrate structure provided by the fifth embodiment of the present invention.

7A to 7C are schematic diagrams illustrating the manufacturing process of the insulating and thermally conductive substrate structure provided by the sixth embodiment of the present invention.

8A to 8C are schematic diagrams of the manufacturing process of the insulating and thermally conductive substrate structure provided by the seventh embodiment of the present invention.

The following are specific specific examples to illustrate the embodiments disclosed in the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further illustrate the related art of the present invention in detail content, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

Please refer to FIG. 2 , a first embodiment of the present invention provides an insulating and thermally conductive substrate structure. As shown in the figure, the insulating and thermally conductive substrate structure provided according to the first embodiment of the present invention basically includes an insulating layer 10 , a plurality of metal layers 20 , and a plurality of function layers 30 .

On top of that, a plurality of the metal layers 20 and the plurality of functional layers 30 are disposed on the insulating layer 10 , and the sidewalls of the metal layers 20 are in contact with the corresponding functional layers 30 , and any two phases are in contact with each other. The two functional layers 30 between the adjacent metal layers 20 are not in contact. The number of the multiple metal layers 20 in this embodiment is illustrated as two, but the number of the multiple metal layers 20 may also be more than two, and in other embodiments, the multiple metal layers 20 may also be formed into a predetermined pattern. In this embodiment, the functional layer 20 has the function of preventing the electrical jump phenomenon between any two adjacent metal layers 20 .

Further, when the distance between any two adjacent metal layers 20 is narrow due to the circuit design, and when the voltage is large, electrons will be discharged from the sidewall of one of the metal layers 20 to the other of the metal layers The sidewall of 20 causes electrical short circuit, so the functional layer 30 is made of high insulating material, such as metal oxide (aluminum oxide, copper oxide, silicon oxide, etc.), or a polymer material (such as epoxy resin) , polytetrafluoroethylene, etc.), which can effectively reduce the probability of short circuit occurrence.

Please refer to FIG. 3 , a second embodiment of the present invention provides an insulating and thermally conductive substrate structure. As shown in the figure, the insulating and thermally conductive substrate structure provided according to the second embodiment of the present invention basically includes an insulating layer 10 , a plurality of metal layers 20 , a plurality of functional layers 30 , and a frame 40 .

On top of that, a plurality of the metal layers 20 , the plurality of functional layers 30 , and the frame 40 are disposed on the insulating layer 10 , and the sidewalls of the metal layers 20 correspond to the corresponding functional layers. 30 are in contact, and the two functional layers 30 between any two adjacent metal layers 20 are in contact with the frame 40 . The shape of the frame 40 can be appropriately changed according to needs, and is not limited. In this embodiment, the frame 40 has the function of precisely controlling the line width.

Further, when the width W of the frame 40 between any two adjacent metal layers 20 is narrow due to the circuit design, and when the voltage is large, electrons will be discharged from the sidewall of one of the metal layers 20 to the Another sidewall of the metal layer 20 causes electrical short circuit, so the functional layer 30 can be made of high insulating material, such as metal oxide (aluminum oxide, copper oxide, silicon oxide, etc.), or a high insulating material. Molecular materials (such as epoxy resin, polytetrafluoroethylene, etc.), which can effectively reduce the probability of electrical short circuit.

In addition, in the case where the frame 40 does not need to be removed, the functional layer 30 can be made of a high-bond polymer material, such as epoxy resin, to increase the bond with the frame 40, thereby The frame 40 is prevented from falling off. Furthermore, the frame 40 may be made of a non-metallic material with low conductivity, such as polytetrafluoroethylene.

Referring to FIG. 4 , a third embodiment of the present invention provides an insulating and thermally conductive substrate structure. As shown in the figure, the insulating and thermally conductive substrate structure provided according to the third embodiment of the present invention basically includes an insulating layer 10 , a plurality of metal layers 20 , a plurality of functional layers 30 , and a frame 40 .

In this embodiment, the functional layer 30 may be a composite layer. Further, the functional layer 30 may include a ceramic layer 31 formed on the sidewall of the metal layer 20 to increase insulation, and a polymer layer 32 formed on the sidewall of the ceramic layer 31 to increase the connection with the frame 40 . associativity.

In other embodiments, when the frame 40 needs to be removed, the functional layer 30 can be made of a low-bond polymer material, such as a special type of silicone, so that the frame 40 can be easily removed. stripped.

In other embodiments, where the frame 40 needs to be chemically removed Next, the functional layer 30 may be formed of anti-corrosion materials, such as ceramic materials (alumina, copper oxide, silicon oxide, etc.) to reduce lateral erosion caused by chemical liquids.

Referring to FIGS. 5A to 5C , a fourth embodiment of the present invention provides an insulating and thermally conductive substrate structure manufacturing process, which mainly includes the following steps:

(a) Attaching the plurality of functional layers 30 to the sidewalls of the plurality of metal layers 20 .

(b) Attaching the frame 40 between any two adjacent functional layers 30 .

(c) attaching the frame 40 and the plurality of metal layers 20 on the insulating layer 10 .

Furthermore, the means of attachment may be physical bonding or chemical forming. For example, the metal layer 20 may be adhered to the insulating layer 10 by physical or chemical means such as pressing metal sheets/blocks, spraying, electroplating, etc. FIG.

The functional layer 30 can be made of high insulating materials, such as metal oxides (aluminum oxide, copper oxide, silicon oxide, etc.), or made of polymer materials (such as epoxy resin, polytetrafluoroethylene, etc.) , which can effectively reduce the probability of short circuit occurrence.

In addition, in the case where the frame 40 does not need to be removed, the functional layer 30 can be made of a high-bond polymer material, such as epoxy resin, to increase the bond with the frame 40, thereby The frame 40 is prevented from falling off. Furthermore, the frame 40 may be made of a non-metallic material with low conductivity, such as polytetrafluoroethylene. In addition, the functional layer 30 may be a composite layer. Further, the functional layer 30 may include a ceramic layer attached to the sidewall of the metal layer 20 and a polymer layer attached to the sidewall of the ceramic layer, and the polymer layer is made of a high-binding polymer material constituted.

Referring to FIGS. 6A to 6D , a fifth embodiment of the present invention provides an insulating and thermally conductive substrate structure manufacturing process, which mainly includes the following steps:

(a) Attaching the plurality of functional layers 30 to the sidewalls of the plurality of metal layers 20 .

(b) Attaching the frame 40 between any two adjacent functional layers 30 .

(c) attaching the frame 40 and the plurality of metal layers 20 on the insulating layer 10 .

(d) Remove the frame 40 .

Further, the removal method of the frame 40 may be a physical or chemical removal method. For example, the frame 40 may be removed by corrosion, and when the frame 40 is to be removed by corrosion, the functional layer 30 may be formed of corrosion-resistant materials to reduce lateral erosion caused by corrosion .

In addition, the frame 40 can be removed by a peeling method, and when the frame 40 is to be removed by a peeling method, the functional layer 30 can be made of a low-binding polymer material, so that the frame 40 can be removed by a peeling method. Easy to peel off.

It should be noted that, the above description is based on the differences between this embodiment and other embodiments, and the similarities will not be repeated.

Referring to FIGS. 7A to 7C , a sixth embodiment of the present invention provides an insulating and thermally conductive substrate structure manufacturing process, which mainly includes the following steps:

(a) Attaching a plurality of metal layers 20 on the insulating layer 10 .

(b) attaching a plurality of functional layers 30 to the sidewalls of the plurality of metal layers 20 .

(c) Attaching the frame 40 between any two adjacent functional layers 30 and on the insulating layer 10 .

Furthermore, the means of attachment may be physical bonding or chemical forming. In addition, in the case where the frame 40 does not need to be removed, the functional layer 30 in this embodiment can be made of a high-bond polymer material, and the frame 40 can be made of a low-conductivity non-metallic material composed of materials.

It should be noted that, the above description is based on the differences between this embodiment and other embodiments, and the similarities will not be repeated.

Please refer to FIG. 8A to FIG. 8C , a seventh embodiment of the present invention provides an insulating and thermally conductive The manufacturing process of the substrate structure mainly includes the following steps:

(a) Attaching the plurality of functional layers 30 to the sidewalls of the plurality of metal layers 20 .

(b) Attaching a plurality of the metal layers 20 on the insulating layer 10 .

(c) Attaching the frame 40 between any two adjacent functional layers 30 and on the insulating layer 10 .

Furthermore, the means of attachment may be physical bonding or chemical forming. In addition, in the case where the frame 40 does not need to be removed, the functional layer 30 in this embodiment can be made of a high-bond polymer material, and the frame 40 can be made of a low-conductivity non-metallic material composed of materials.

It should be noted that, the above description is based on the differences between this embodiment and other embodiments, and the similarities will not be repeated.

Based on the above, the insulating and thermally conductive base material structure provided by the present invention is provided on the insulating layer through "a plurality of the metal layers and a plurality of the functional layers, and the sidewalls of the metal layers correspond to the corresponding The technical solution that the functional layers are in contact with each other, and the two functional layers between any two adjacent metal layers are not in contact, can effectively reduce the probability of electrical short circuit.

The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

10: Insulation layer

20: Metal layer

30: Functional Layer

Claims (3)

An insulating and thermally conductive base material structure, comprising: an insulating layer, a plurality of metal layers, and a plurality of functional layers; wherein, the plurality of the metal layers and the plurality of the functional layers are arranged on the insulating layer, and the metal layers The sidewalls of the metal layers are in contact with the corresponding functional layers, and the two functional layers between any two adjacent metal layers are not in contact; wherein, the functional layers are made of high-insulation materials. The insulating and thermally conductive base material structure according to claim 1, wherein the highly insulating material constituting the functional layer is a metal oxide. The insulating and thermally conductive substrate structure according to claim 2, wherein the metal oxide constituting the functional layer is one of aluminum oxide, copper oxide and silicon oxide.

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