TWM278206U - Cooling and fixing device - Google Patents

Cooling and fixing device Download PDF

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Publication number
TWM278206U
TWM278206U TW094207600U TW94207600U TWM278206U TW M278206 U TWM278206 U TW M278206U TW 094207600 U TW094207600 U TW 094207600U TW 94207600 U TW94207600 U TW 94207600U TW M278206 U TWM278206 U TW M278206U
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TW
Taiwan
Prior art keywords
heat
item
scope
fixing device
heat sink
Prior art date
Application number
TW094207600U
Other languages
English (en)
Inventor
Lie-Feng Luo
Original Assignee
Cooler Master Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooler Master Co Ltd filed Critical Cooler Master Co Ltd
Priority to TW094207600U priority Critical patent/TWM278206U/zh
Publication of TWM278206U publication Critical patent/TWM278206U/zh
Priority to DE202006007419U priority patent/DE202006007419U1/de
Priority to US11/431,401 priority patent/US7345880B2/en

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075Mechanical elements
    • H01L2023/4087Mounting accessories, interposers, clamping or screwing parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

M278206 八、新型說明: 【新型所屬之技術領域】 本創作為-種固定裳置,尤指一種使用在散熱器上, 以將散熱器固定於電路板上的固定裝置。 【先前技術】 為了降低電路板的溫度’尤其是電路板上晶片的溫 度敖s在包路板的晶片上設有散熱裝置,用以降低溫 度’散熱裝置包含有散熱器及散熱風扇,散熱器上設有散 熱轉片’冑熱器藉由固^裝置岐於電路板上,請參閱第 五圖所示’現有技術之散熱时裝置包含有設於散熱器(5 〇 )兩側端緣且具有開σ ( 5 1 1 )的滑槽(5丄),兩 固定塊(6 Q )分別滑設於滑槽(5 i )巾,兩L型片體 (7 0 )兩端分別設有穿孔(7丄)、(7 2 ),片體(7 0 )設置於滑槽(5 1 )之開口( 5 i丄”卜側,:穿孔 (7 1 )之位置相對於固定塊(6 〇 )之位置,兩螺釘(8 0 )分別穿設於穿孔(7 1 )並螺合於固定塊(6 〇 )中, 以將片體(7 0 )貞固定塊(6 〇 )相互固定,兩固定件 (9 0 )穿設於穿孔(7 2 )巾用以將片體(7 〇 )與電 路板相互固定,使得散熱器(5 〇 ) @定於電路板上,然 而,必須製造有固定塊(6 0 )及相對形成的穿孔(7丄), 且使用者必須以工具方能將螺釘(8 〇 )貫穿片體(7 〇 ) 再與固定塊(6 0 )結合,使可組裝於散熱器(5 〇 )上, 另所需的零件亦多,如此增加製造及組裝上的複雜度。 【新型内容】 5 M278206 有鏗於前述之習用的缺點,本創作係改良散熱固 置,以減少零件,且簡化組裝程序。 、 為達到上述的創作目的,本創作所採用的技術手 設計一種散熱固定裝置,其中包括: 為 一散熱器,其至少兩側分別形成至少一第一溝槽,二 於該散熱器内部相粼夂兮μ 、蓉、 亚 相郤各该弟一溝槽分別形成一寬度略小且 溝槽相通的第二溝槽,或可於散熱器至少兩側分別 別开/、成=溝槽’且各該凸型溝槽位於該散熱器外側處分 別形成有一開口; 至少兩片體,分別於一始Μ古 办 刀另J方、私叹有一卡設部,於另—端設 Γ 該卡設部可藉由各該片體進入各該第-溝槽 進而活動樞設至各該第二溝槽; 至少兩固定件,分別穿設至該等穿孔内; 片體滑移並可枢轉於凸型溝槽中,以調整片體之穿礼 位置相對於電路板之固定 疋孔位置,猎由固定件穿雜 之穿孔及電路板之固定孔中,以 、組 則散熱器相對固定於電路板上。 、 板上, ★ σ。本創作的‘點在於’藉由卡設部將片體相對固一於% 煞态的凸型溝槽内,則可節 、疋、月 設部即可達到固定效果,同^件,僅需於片體上形成卡 相對固定於散熱器上,亦J用者不需工具即可將片體 減少零件及簡化組裝步驟的程序,如此確可達到 【實施方式】 請參閱第一圖所示,本备丨 本創作包含有形成在散熱器(1 M278206 、兩片體(2 Ο )及兩固定 〇)兩側的凸型溝槽(丄工 件(3 0 )。 配合參閱第二圖所干二、— M吓不,刖述之兩凸型溝槽 別形成於散熱器(11 1)为 u H斤 兩側接近底端處,凸型溝槽(i 1 )具有一弟一溝槽(丄Ί 1 、丄丄υ)及一第二溝槽(1 第一及第二溝槽(11r , (1 1 1)之寬度略小於第一、1_ r η 第—溝槽 刑、整^ η η、 、弟/聋槽(1 1 〇 )之寬度,凸 型溝槽(1 1 )位於散埶突 凸 珂述之片體(20)一端設有一2)。 設部(2 1 )可為凸點弋 。又郤(2 1 ),卡 口(112)進入凸型溝…n”(2l)可經由開 土辱槽(1 1 )之第二溝 中,片體(2 0 )另一端 办 曰111) 而形成有一牙孔(22),只触r〇 〇)兩端端緣呈圓弧狀,前述之固 也(2 ^ μ M r 9 η ^ ^ ^ 干k d 0 )分別穿設 方、片胆(2 0 )之穿孔(2 2 )中 螺絲或插銷。 ( 3 G )可為 請麥閱第二、三及四圖所示,片體 型溝槽(1 1 )巾R ^ 0 ) /月移於凸 中且以卡設部(2 1 )為Φ w h 調整片體(2 0 )之穿孔(”…4支區轉,以 牙孔(2 2 )位置相對於雷 0)上固定孔的位置,_ 、 ( 4 )之穿孔(2 2 )及電路板(4 0 )之固定孔 片體(2 ◦)相對固定於電路板(4 〇 )上 得 件(30)的推擠,使得片體(2〇) =定 凸土溝“11)中’則散熱器(" 板(4 0 )上的發哉曰Η Η η 相對固疋於電路 Μχ热日日片(4 1 )上。 7 M278206 由於散熱器(1 Ο )的凸型溝槽(1 1 )與片體(2 〇)一端的卡設部(2 1 )相結合後,卡設部(2 1 )可 在凸型溝槽(1 1 )内滑動,如此可配合不同廠牌,不同 型式電路板上所設的固定孔;同時,卡設部(2 1 )的製 作可以沖壓的方式形成,如此可減少零件的組裝,以加速 生產效能。 【圖式簡單說明】
第一圖為本創作之立體外觀圖 第二圖為本創作之立體分解圖 第三圖為本創作之上視動作圖 第四圖為本創作之側視圖 第五圖為習用之立體分解圖
【主要元件符號說 (1〇)散熱器 (1 1 0 )第一溝槽 (1 1 2 )開口 (2 1 )卡設部 (3 0 )固定件 (4 1 )發熱晶片 (5 1 )滑槽 (6〇)固定塊 (7 1 )穿孔 (8 0 )螺釘 明】 (1 1 )凸型溝槽 (1 1 1 )第二溝槽 (2 0 )片體 (2 2 )穿孔 (4 0 )電路板 (5 0 )散熱器 (5 1 1 )開口 (7 0 )片體 (7 2 )穿孔 (9 0 )固定件 8

Claims (1)

  1. M278206 九、申請專利範圍: 置,其中包括:
    至/兩片體,分別於—端設有一卡設部,於另一端設 1 · 一種散熱固定裝置 一散熱,装5小A如, 有一穿孔, 各該卡設部可藉由各該片體進入各該第一溝槽 φ 進而活動樞設至各該第二溝槽; 至少兩固定件,分別穿設至該等穿孔内; 藉此’可自由調整各該片體的位置,進而將該等固定 件疋位至適當位置,使得該散熱器貼合至發熱元件之較佳 • 散熱位置。 2 ·如申請專利範圍第1項所述之散熱固定裝置,其 中泫等片體之兩端端緣呈圓弧狀。 3 如申请專利範圍第1項所述之散熱固定裝置,其 φ 中該卡設部可為凸點。 4 ·如申請專利範圍第1項所述之散熱固定裝置,其 中該卡設部可為鉚釘。 5如申晴專利範圍第1項所述之散熱固定裝置,其 中該固定件可為螺絲。 6 ·如申請專利範圍第2項所述之散熱 .中該固定件可為插銷。 置其 中該等片體略呈彎 一 7 ·如申請專利範圍第i項所述之散熱固定裝置,其 言曲狀卡固於該第一溝槽中。 9 M278206 8 · —種散熱固定裝置,其中包括: 一散熱為’其至少兩側分別形 α々> ^战一凸型溝槽,且各該 凸里溝槽位於該散熱器外側處分別形成有一開口· 至少兩片體,分別於一端設有一 士* 巧 卡设部,於另一端設 有一牙孔’各該卡設部可葬由夂 J錯由σ 4片體進入各該凸型溝槽 進而活動樞設至各該凸型溝槽中; 至少兩固定件,分別穿設至片體之穿孔内; ρ藉此’可自由調整該等片體之位置,進而將該等固定 件定位至適當位置走 u疋 散熱位置。 ψχ ^ 9 ·如申請專利範圍第8項所述之散熱固定裝 中該等片體之兩端沪給σ门 其 w % *而緣呈圓弧狀。 1 °如申請專利範圍第8項所述之散熱固定步署 其中該卡設部可為凸點。 1 1 ·如申請專利範圍第8項所述之散熱固定裝置, 其中δ亥卡設部可為鉚釘。 12 •士 σ 由士主 °甲請專利範圍第8項所述之散熱固定裝置 其中該固定件可為螺絲。 , 1 3 士 申睛專利範圍第8項所述之散熱固定裝詈, 其中該固定件可為插銷。 置 4 如申凊專利範圍第8項所述之散熱固定裝置, 士中=片體略呈彎曲狀卡固於該凸变溝槽中。 十、圖式: 如次頁 10
TW094207600U 2005-05-11 2005-05-11 Cooling and fixing device TWM278206U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW094207600U TWM278206U (en) 2005-05-11 2005-05-11 Cooling and fixing device
DE202006007419U DE202006007419U1 (de) 2005-05-11 2006-05-09 Kühlkörpermodul
US11/431,401 US7345880B2 (en) 2005-05-11 2006-05-10 Heat sink module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094207600U TWM278206U (en) 2005-05-11 2005-05-11 Cooling and fixing device

Publications (1)

Publication Number Publication Date
TWM278206U true TWM278206U (en) 2005-10-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW094207600U TWM278206U (en) 2005-05-11 2005-05-11 Cooling and fixing device

Country Status (3)

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US (1) US7345880B2 (zh)
DE (1) DE202006007419U1 (zh)
TW (1) TWM278206U (zh)

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CN103857260A (zh) * 2012-11-30 2014-06-11 富瑞精密组件(昆山)有限公司 基座及具有该基座的散热装置

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CN103857260A (zh) * 2012-11-30 2014-06-11 富瑞精密组件(昆山)有限公司 基座及具有该基座的散热装置
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US20070103873A1 (en) 2007-05-10
US7345880B2 (en) 2008-03-18
DE202006007419U1 (de) 2007-02-01

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