TWM303410U - Cooling device - Google Patents

Description

M303410 VIII, new description: 1 soil <technical field]. This creation is about - the type of heat sink will change the position to match 1w square * &amp; 尤 尤 /, the system can be used according to the heat of the previous technology Directional heat sink. The general integrated circuit components in the ^, Shilian 4 will be accompanied by high temperature, the more the rain treatment capacity of the accumulation of the body of the Leigu one] the body of the heat generated by the components of the circuit, the temperature will be even more Right-right

曰 All of the pieces will produce bad 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 一般 一般 一般 一般 一般 一般 一般 一般 一般 一般 一般 一般 一般Damage caused by unloading high temperatures during operation.曰In the current display card, as its computing power increases, the temperature generated by the upper and lower slabs is higher. Therefore, it is like a unit in the computer computing center. To dissipate heat, no J will have a bad influence on the operation of the display card. The existing display card uses heat release measures, such as the Taiwan Invention Announcement No. J 2 2 7 8 2 4, "The film set cooling element of the shadow system is not the adapter card", which is mainly on the two sides of the display card chip. The first and second heat sinks are provided as heat dissipating components, and the heat pits are connected by at least one heat pipe. Although the above heat dissipation measures can dissipate the heat of the chip of the display card, due to the design of the structure, the heat sink of the heat dissipating component is provided on both sides of the display card, resulting in the overall thickness of the display card after the heat sink is installed. Large, and because ..., the nest is set on both sides of the display card, so if there are two display cards juxtaposed in the expansion slot of the computer case, or a display card and other drive cards and 5 M303410 column set in the expansion In the slot, a display card will be generated, or the display card and other drive cards cannot be placed at the same time in the adjacent expansion slot. It is very inconvenient to use. ^ The creator of this wood has proposed an excellent heat sink, namely, the new patent number of the "Bay 5", "The heat-dissipating state of the heat-conducting pipe", which has a heat-conducting block, a heat pipe and a heat-dissipating fin. The heat dissipation fin is provided with a through hole for the heat pipe to be pierced and a plurality of through holes, and one side of each of the through holes is integrally bent with a heat sink. 4疋The above-mentioned political heaters are also due to the structural design relationship, not

It is suitable to use the heat dissipation on the day of the R ... and the day of the card, that is, the problem of the above-mentioned invention is also generated. [New Content] This creator has actively pursued research and development in view of the problems between the above-mentioned previous cases, with a view to improving the above-mentioned existing problems and efforts, and finally developed this creation. Saki 'Ma Shuang... The main purpose of this creation is to provide a heat sink that can be adapted to the direction of the heat source. In order to achieve the above-mentioned creative purposes, the creation is based on the following technical section f, which includes: a heat block, which is in contact with a heat source for heat conduction; a plurality of plate-shaped heat sink fins, and a heat collecting block The setting surface is set in a sag state and formed with a _set_ between the heat collecting blocks, and a plurality of through holes are provided on each of the holes. The side edges of each of the through holes are folded with a heat sink. The heat pipe is made up of a heat sink. The heat block - the side extends toward the heat sink tab, and the M303410 runs through the heat sink fins.

I wrongly designed by the above structure, this creation can change the direction of setting according to the position of the heat source, so even if it is applied in the expansion slot with narrow pitch, it can not affect the setting of other electronic component substrates. [Embodiment] Please refer to the first to fourth figures. The heat sink embodiment of the present invention includes: a heat collecting block (1 〇), which is in contact with a heat source for heat conduction, and is a hollow square block; The sheet-like heat-dissipating slit piece (1 1) is formed in a vertical state with the heat-receiving block (10) and a predetermined distance (12) between the heat collecting &amp; Each of the heat dissipation fins (11) is provided with a plurality of through holes (1 3 ). The sides of each of the through holes (1 3 ) are integrally bent with a heat sink (1 4 ); four heat pipes (15) are One of the heat collecting blocks (1〇) is bent toward the heat radiating film (1 1 ) and penetrates through the heat radiating fins (1 1 ). The internal structure of the above-described thermal conduction g (15) has been applied to the field of the existing heat sink, and the heat dissipation effect caused by the change of the cooling liquid phase is omitted here.

5) After extending from one side of the heat collecting block (1〇), the D piece is placed directly (1 1 ), and the outer two heat pipes (15) extend from the side of the block (10). Bending through the heat-dissipating fins ((1) is bent once again and then through the heat-dissipating fins (丄丄) to form a S 7 M303410 bending structure. In addition, the heat-dissipating fins on the creation The function of the through hole (丄3) and the heat sink (14) has been described in the Taiwan Patent No. Μ 2 7 5 4 6 i "heat sink with heat pipe Y", which is hereby applied by the inventor of the present invention. The effect description is omitted.

Please refer to the fourth and fifth figures. When the application is applied to the chip (2 1 ) on the display card (20), the display card (2 〇) can be placed in the creative heat block (1 〇). And the spacing between the heat sink fins (工 2), one side of the 5 襄 heat collecting block (1 〇) is closely attached to the wafer (2 1 ), so that the heat of the wafer (2 1 ) can be used The heat pipe (丄5) is conducted to the heat sink fin (1 1 ) for heat dissipation. Please refer to the fourth and sixth figures. In addition to the setting of the fifth figure, the creation of the heat collecting block (i 〇) can be directly contacted with the wafer by one side of the spacing (丄2), that is, heat collecting. The block (worker) and the heat sinking scale (1) are all on the side of the display card (2 〇) (4), so that the heat of the wafer can be transmitted by the heat pipe (1 5 ) to cause the heat sink fins (丄丄) to be scattered. Hey. Please refer to the seventh figure. When two display cards (2〇) are set in the adjacent computer expansion # (not shown), the unique structure design of this creation is used to change the setting direction of the heat sink. As shown in the above fifth and sixth diagrams, the heat dissipation device with a large heat dissipation device (1 Μ is staggered, so it does not affect the setting of the display card or other expansion substrate, and is extremely convenient to use. [Simple diagram Description: The figure is a perspective view of the present embodiment. M303410 The second figure is the original figure of the creation of the second part of the system. 'Partially exploded part of the detailed example. Wall', the bending state of the heat pipe of the present embodiment

The four-figure 4»A^ is a side view of the embodiment.

The fifth figure of the younger brother is to I ’, and the creation is a three-dimensional view of the state of use. The first/picture is another perspective view of the use state. The seventh figure is a side view of the use state of the present application applied to two adjacent substrates.

[Main component symbol description] (1 〇) Heat collecting block (1 1 ) Heat sink fin (1 2 ) Spacing (1 3 ) Through hole (1 4 ) Heat sink (1 5 ) Heat pipe (2 〇) display card ( 21) Wafer

9

Claims (1)

M303410 IX. Scope of application for patents: 丄, - kind of heat dissipating device, including: heat collecting block's contact with heat source for heat conduction; multiple plate-shaped dilated 敎 energy shortage μ w,, 4 ... one (three) piece, with The setting surface of the heat collecting block is vertical and erected, and the sub-and heat-collecting block is provided with a plurality of through-holes on the straight line, and: a distance of one: the heat-dissipating heat pipes of the heat-dissipating fins are: The side is integrated and bent with a heat sink; 4 - the side of the heat dissipation piece stretches and bends, and 2. For the heat sink described in the scope of the patent application, the number of conduits is four. "Heat-heating, such as the heat-dissipating device described in item 2 of the patent scope of Shen 4, in the cabinet", I, the two inner heat pipes are extended from the side of the heat collecting block, and then directly bent through the heat-dissipating fins In addition, the outer two heat pipes are extended from one side of the heat collecting block and bent out through the heat radiating fins, and then folded again green and then penetrate through the heat radiating fins to form an S-shaped bent structure. X. Schema: as the next page 10