TWM303410U - Cooling device - Google Patents
Cooling device Download PDFInfo
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- TWM303410U TWM303410U TW95209791U TW95209791U TWM303410U TW M303410 U TWM303410 U TW M303410U TW 95209791 U TW95209791 U TW 95209791U TW 95209791 U TW95209791 U TW 95209791U TW M303410 U TWM303410 U TW M303410U
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- Prior art keywords
- heat
- dissipating
- collecting block
- fins
- bent
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
M303410 八、新型說明: 1 土屬 < 技術領域】 .本創作係關於-種散熱裝将 位置來改變搭配1w方* & Λ 尤/、係私一種可依熱沾 先前技術 配°又置方向的散熱裝置。 一般的積體電路元件在 ^ , 仕連作4均會伴隨產生高溫,雨 乍處理能力越強的積體雷 古 一 ]檟體电路兀件所產生的熱量溫度便更 门 仁疋问溫卻會對所右-M303410 VIII, new description: 1 soil <technical field]. This creation is about - the type of heat sink will change the position to match 1w square * & 尤 尤 /, the system can be used according to the heat of the previous technology Directional heat sink. The general integrated circuit components in the ^, Shilian 4 will be accompanied by high temperature, the more the rain treatment capacity of the accumulation of the body of the Leigu one] the body of the heat generated by the components of the circuit, the temperature will be even more Right-right
曰對所有的…件本身均會產生不良纪 雕曰嚴重日寸甚至會導致元件本身的損帛,因此一般的养 I電路元件在運作時,多需要搭配有對應的散熱措施來遥 /、在運作過轾中產生無法負荷的高溫而導致損壞。 曰以目前的顯示卡而言,隨著其運算能力的提升,其上 、曰曰片所產生的尚溫亦越高,因此以如同電腦運算中心之 I处里單元般’需要搭配有散熱措施來進行散熱,否 貝J將會對顯示卡的運作上有不良的影響。既有的顯示卡用 放熱措施,有如台灣發明公告第J 2 2 7 8 2 4號「影係 絲貝不轉接卡之晶片組冷卻元件」,其主要係在顯示卡之晶 片的兩側分別設置有作為散熱元件之第一及第二熱窩,兩 熱窩之間以至少一之熱管加以連接。 雖然上述的散熱措施可以將顯示卡的晶片熱量散去, 仁疋由於其結構的設計,即顯示卡之兩側均設有散熱元件 之熱窩,導致顯示卡裝設熱窩後之整體厚度加大,且由於 …、窝係设置在顯示卡的兩側,因此若有兩張顯示卡並列設 置在電腦機殼的擴充槽中,或一張顯示卡與其他驅動卡並 5 M303410 列設置在擴充槽中’便會產生顯示卡,或顯示卡與其他 驅動卡間無法同時的設置在相鄰的擴充槽之情ί兄,在使用 上十分的不方便。 ^ 本木創作人冒經提出一種優異的散熱裝置,即 =灣新型專利號第以” 5 4 6 1號「具導熱管之散熱 态」’其具有導熱塊、熱導管及散熱鰭片,其中散熱鰭片 上設有供熱導管穿設之穿孔以及複數個通孔,各通孔之一 側邊一體彎折有散熱片。 4疋上述之政熱器同樣由於結構設計上的關係,並不曰 All of the pieces will produce bad 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 一般 一般 一般 一般 一般 一般 一般 一般 一般 一般 一般 一般 一般Damage caused by unloading high temperatures during operation.曰In the current display card, as its computing power increases, the temperature generated by the upper and lower slabs is higher. Therefore, it is like a unit in the computer computing center. To dissipate heat, no J will have a bad influence on the operation of the display card. The existing display card uses heat release measures, such as the Taiwan Invention Announcement No. J 2 2 7 8 2 4, "The film set cooling element of the shadow system is not the adapter card", which is mainly on the two sides of the display card chip. The first and second heat sinks are provided as heat dissipating components, and the heat pits are connected by at least one heat pipe. Although the above heat dissipation measures can dissipate the heat of the chip of the display card, due to the design of the structure, the heat sink of the heat dissipating component is provided on both sides of the display card, resulting in the overall thickness of the display card after the heat sink is installed. Large, and because ..., the nest is set on both sides of the display card, so if there are two display cards juxtaposed in the expansion slot of the computer case, or a display card and other drive cards and 5 M303410 column set in the expansion In the slot, a display card will be generated, or the display card and other drive cards cannot be placed at the same time in the adjacent expansion slot. It is very inconvenient to use. ^ The creator of this wood has proposed an excellent heat sink, namely, the new patent number of the "Bay 5", "The heat-dissipating state of the heat-conducting pipe", which has a heat-conducting block, a heat pipe and a heat-dissipating fin. The heat dissipation fin is provided with a through hole for the heat pipe to be pierced and a plurality of through holes, and one side of each of the through holes is integrally bent with a heat sink. 4疋The above-mentioned political heaters are also due to the structural design relationship, not
適合使用在上R …、不卡之日日片散熱,亦即同樣會產生上述 發明前案之問題。 【新型内容】 本創作人有鑑於上述各前案之間的問題,乃積極著手 從事研發,以期可以改進上述既有之問題, 及努力,終於開發出本創作。 崎 ' 馬双 …本創作之主要目的在於提供一種可依熱源位置來改微 才合配设置方向的散熱裝置。 為了達到上述創作目的,本創作係採取以下之技 段f以達成,其中本創作係包括有: 來熱塊,係與熱源接觸導熱之用; 複數片板狀散熱鰭片,係與聚熱塊之設置面呈垂 態設置’並與聚熱塊之間形成有_定_,各散 上設置有複數個通孔’各通孔之側邊一體f折有散熱片. 熱導管,係由聚熱塊之—侧朝散熱縛片延伸 ’、 迷 M303410 貫穿各散熱鳍片。It is suitable to use the heat dissipation on the day of the R ... and the day of the card, that is, the problem of the above-mentioned invention is also generated. [New Content] This creator has actively pursued research and development in view of the problems between the above-mentioned previous cases, with a view to improving the above-mentioned existing problems and efforts, and finally developed this creation. Saki 'Ma Shuang... The main purpose of this creation is to provide a heat sink that can be adapted to the direction of the heat source. In order to achieve the above-mentioned creative purposes, the creation is based on the following technical section f, which includes: a heat block, which is in contact with a heat source for heat conduction; a plurality of plate-shaped heat sink fins, and a heat collecting block The setting surface is set in a sag state and formed with a _set_ between the heat collecting blocks, and a plurality of through holes are provided on each of the holes. The side edges of each of the through holes are folded with a heat sink. The heat pipe is made up of a heat sink. The heat block - the side extends toward the heat sink tab, and the M303410 runs through the heat sink fins.
I 错由上述之結構設計,本創作可因應熱源位置來改變 搭配設置方向,因此即便是應用在間距較窄的擴充槽中, 也可以不會影響到其他電子元件基板的設置。 【實施方式】 請參看第一至四圖所示,本創作之散熱裝置實施例係 包括有: 聚熱塊(1 〇 ),係與熱源接觸導熱之用,係一中空 之方形塊體; 複數片板狀散熱縫片(1 1),係與聚熱塊(10) 之认置面王垂直狀態設置’並與聚熱& (丄〇)之間形成 有-定的間距(12),各散熱鰭片(11)上設置有複 數们通孔(1 3 )’各通孔(1 3 )之側邊一體彎折有散 熱片(1 4 ); 四根熱導管(15),係由聚熱塊(1〇)之一側朝 散熱籍片(1 1 )延伸彎折,並貫穿各散熱鰭片(1 1 )。 上述熱導g ( 1 5 )之内部結構已應用在既有的散熱 器領域中,其中的冷卻液體相變化所導致之散熱效應在此 便省略說明。I wrongly designed by the above structure, this creation can change the direction of setting according to the position of the heat source, so even if it is applied in the expansion slot with narrow pitch, it can not affect the setting of other electronic component substrates. [Embodiment] Please refer to the first to fourth figures. The heat sink embodiment of the present invention includes: a heat collecting block (1 〇), which is in contact with a heat source for heat conduction, and is a hollow square block; The sheet-like heat-dissipating slit piece (1 1) is formed in a vertical state with the heat-receiving block (10) and a predetermined distance (12) between the heat collecting & Each of the heat dissipation fins (11) is provided with a plurality of through holes (1 3 ). The sides of each of the through holes (1 3 ) are integrally bent with a heat sink (1 4 ); four heat pipes (15) are One of the heat collecting blocks (1〇) is bent toward the heat radiating film (1 1 ) and penetrates through the heat radiating fins (1 1 ). The internal structure of the above-described thermal conduction g (15) has been applied to the field of the existing heat sink, and the heat dissipation effect caused by the change of the cooling liquid phase is omitted here.
5)係由聚熱塊(1〇) 一側延伸而出後,直接彎折 D放曰片(1 1 ),外側兩根熱導管(1 5 )在由 塊(1 0 ) -側延伸而出彎折貫穿各散熱鰭片(⑴ 係再彎折一次並再貫穿各散熱鰭片(丄丄)而呈一 S 7 M303410 彎折結構。 另外,本創作各散熱鰭片(工丄)上之通孔(丄3) 及散熱片(14)之作用已在本案發明人之前所申請之台 灣新型專利號第Μ 2 7 5 4 6 i號「具導熱管之散熱器Y 中述及,在此便省略其效果說明。5) After extending from one side of the heat collecting block (1〇), the D piece is placed directly (1 1 ), and the outer two heat pipes (15) extend from the side of the block (10). Bending through the heat-dissipating fins ((1) is bent once again and then through the heat-dissipating fins (丄丄) to form a S 7 M303410 bending structure. In addition, the heat-dissipating fins on the creation The function of the through hole (丄3) and the heat sink (14) has been described in the Taiwan Patent No. Μ 2 7 5 4 6 i "heat sink with heat pipe Y", which is hereby applied by the inventor of the present invention. The effect description is omitted.
請參看第四、五圖所示,當本創作應用在顯示卡(2 0 )上之晶片(2 1 )散熱時,可以將顯示卡(2 〇 )置 於本創作聚熱塊(1 〇 )及散熱鰭片(丄丄)間的間距(工 2 )中,5襄聚熱塊(1 〇 )之一側面緊貼晶片(2 1 ), 如此便可將晶片(2 1 )之熱藉由導熱管(丄5 )傳導至 散熱鰭片(1 1 )處散熱。 再請參看第四、六圖所示,本創作除了第五圖之設置 方式,亦可以將聚熱塊(i 〇 )異於間距(丄2 )之一側 面直接與晶片接觸,亦即聚熱塊(工〇 )與散熱鱗片㈠ 上)均位在顯示卡(2 〇 )㈣一側,如此便可藉由熱導 管(1 5 )將晶片的熱量傳導致散熱鰭片(丄丄)處散埶。 請參看第七圖所示,當兩片顯示卡(2〇)設置在相 鄰的電腦擴充# (圖中未示)中時,經由本創作獨特之結 構設計,彳以改變散熱裝置之設置方向,如上述第五、六 圖之設置方式一般,讓散熱裝置體積較大的散熱結片(1 Μ錯開,故不會影響顯示卡或其他擴充基板之設置,使 用上極為方便。 【圖式簡單說明】 第 圖係本創作實施例之立體圖。 M303410 第二圖係本創^〜 第三圖係 · '細例之部分立體分解圖。 墙 ’、本創作實施例之熱導管的彎折狀態立體圖Please refer to the fourth and fifth figures. When the application is applied to the chip (2 1 ) on the display card (20), the display card (2 〇) can be placed in the creative heat block (1 〇). And the spacing between the heat sink fins (工 2), one side of the 5 襄 heat collecting block (1 〇) is closely attached to the wafer (2 1 ), so that the heat of the wafer (2 1 ) can be used The heat pipe (丄5) is conducted to the heat sink fin (1 1 ) for heat dissipation. Please refer to the fourth and sixth figures. In addition to the setting of the fifth figure, the creation of the heat collecting block (i 〇) can be directly contacted with the wafer by one side of the spacing (丄2), that is, heat collecting. The block (worker) and the heat sinking scale (1) are all on the side of the display card (2 〇) (4), so that the heat of the wafer can be transmitted by the heat pipe (1 5 ) to cause the heat sink fins (丄丄) to be scattered. Hey. Please refer to the seventh figure. When two display cards (2〇) are set in the adjacent computer expansion # (not shown), the unique structure design of this creation is used to change the setting direction of the heat sink. As shown in the above fifth and sixth diagrams, the heat dissipation device with a large heat dissipation device (1 Μ is staggered, so it does not affect the setting of the display card or other expansion substrate, and is extremely convenient to use. [Simple diagram Description: The figure is a perspective view of the present embodiment. M303410 The second figure is the original figure of the creation of the second part of the system. 'Partially exploded part of the detailed example. Wall', the bending state of the heat pipe of the present embodiment
弟四圖佐4» A ^ 作實施例之側視圖。The four-figure 4»A^ is a side view of the embodiment.
弟五圖往I ’、本創作一使用狀態立體圖。 第/、圖係本創作另一使用狀態立體圖。 第七圖係本創作應用在兩鄰近設置之基板上的使用狀 態側視圖。The fifth figure of the younger brother is to I ’, and the creation is a three-dimensional view of the state of use. The first/picture is another perspective view of the use state. The seventh figure is a side view of the use state of the present application applied to two adjacent substrates.
【主要元件符號說明】 (1 〇 )聚熱塊 (1 1 )散熱鰭片 (1 2 )間距 (1 3 )通孔 (1 4 )散熱片 (1 5 )熱導管 (2 〇 )顯示卡 (21)晶片[Main component symbol description] (1 〇) Heat collecting block (1 1 ) Heat sink fin (1 2 ) Spacing (1 3 ) Through hole (1 4 ) Heat sink (1 5 ) Heat pipe (2 〇) display card ( 21) Wafer
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Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95209791U TWM303410U (en) | 2006-06-05 | 2006-06-05 | Cooling device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW95209791U TWM303410U (en) | 2006-06-05 | 2006-06-05 | Cooling device |
Publications (1)
Publication Number | Publication Date |
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TWM303410U true TWM303410U (en) | 2006-12-21 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW95209791U TWM303410U (en) | 2006-06-05 | 2006-06-05 | Cooling device |
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TW (1) | TWM303410U (en) |
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2006
- 2006-06-05 TW TW95209791U patent/TWM303410U/en not_active IP Right Cessation
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