JP3100714U - Heat dissipation plate module - Google Patents

Abstract

An object of the present invention is to provide a heat dissipating plate module mounted on a heat generating component for dissipating heat from the heat generating component of an electronic device.
A heat dissipating plate module includes a heat conducting base and a plurality of heat dissipating plates. The heat transfer base is mounted directly on the heat generating component to transfer heat. Each heat dissipation plate has a plurality of pole-shaped protrusions 310 and is designed to increase the heat dissipation area. The two adjacent protrusions do not overlap, and the airflow path between the two protrusions is continuously curved. This configuration increases the heat transfer time and improves the efficiency of heat dissipation.
[Selection diagram] Fig. 1

Description

  The present invention relates to a heat dissipating structure, and more particularly, to a heat dissipating plate module for a heat-generating component in an electronic device, which is generally used with a horizontal blower.

  Heat dissipation technology has become an important issue in designing electronic devices. Usually, an electronic device is composed of many electronic components. For example, many electronic components are mounted on the motherboard of a computer and can emit a very large amount of heat during operation. Many such components include central processing units (CPUs), south / north bridge chips, graphic chips, and double (dual) in-line memory modules (DIMMs). The operating speed of these electronic components has become much faster than before. For example, the operating frequency of CPUs now exceeds 1 GHZ and has the heat dissipation power of a saw (SOW). If heat cannot be removed immediately, these electronic components will have an impact on stability and reliability due to excess heat, and will also have a reduced life. Therefore, the heat dissipation technique becomes a serious problem when the operating frequency of the electronic device is high.

  Recently, heat dissipation technology of electronic devices uses heat conduction, heat conversion, or heat radiation to dissipate heat generated outside. The main heat dissipating means includes use of a heat dissipating plate module and a fan. The heat-dissipating plate module is usually metallic and has a heat-conducting base, the bottom of which is mounted directly on the heat-producing electronics. The heat conduction base is formed with a plurality of heat dissipation plates to dissipate heat.

The heat generated by the heat-generating electronics is transferred to the heat dissipation plate via the heat conducting plate. Then, the fan generates an airflow in the heat conduction plate to perform heat conversion. The heated air is released into the environment space, and the heat dissipation plate also carries away the heat on the joule, lowering the temperature of the electronic device.
Generally, the heat dissipation efficiency of a heat dissipation plate module is determined by the substance used and its structure. The early heat dissipating plates were often made of aluminum because of their low thermal resistance, light weight and low cost.

  However, since the operating frequency of electronic devices is continuously increasing, the heat dissipation efficiency must be increased. Therefore, heat dissipating plates have also begun to use copper as a material for joules. Copper has a thermal conductivity about 1.8 times that of aluminum, while copper has about 3 times the density of aluminum. In other words, if the heat dissipating plate modules have the same volume and the same area, the copper heat dissipating plate module is three times as heavy as the aluminum heat dissipating plate module. Therefore, even though the copper heat dissipation plate module has a better heat transfer coefficient than the aluminum heat dissipation plate module, the copper heat dissipation plate module is significantly heavier than the aluminum heat dissipation plate module. It is. Therefore, when designing a heat dissipation plate, it is necessary to consider both the weight and the heat conduction coefficient.

Since the heat dissipating plate modules currently on the market are all made of the same components, the characteristics of the heat dissipating efficiency are very close. Therefore, increasing the heat dissipation by having a better structure is the main purpose of the study on heat dissipation plate manufacturing.
For example, the heat dissipation plate is usually installed vertically on the base of the heat dissipation plate module. A feature of this type of vertical heat dissipation plate module is that a flat airflow channel is formed by a flat plate.
However, this configuration has drawbacks in that the heat transfer area is very small and the heat transfer time is very short, and the parallel airflow, once away from the separation position of the plate, is Conversion is not possible. Although this type of patent has a multilayer structure, this structure and the vertical arrangement structure still have room for improvement.

  As described above, the problems of the prior art are, for example, that the heat dissipation area is small and the heat transfer time is short, and that ideal heat conversion cannot be performed with a straight air flow path. The purpose of the present invention is to solve the above-mentioned problems of the prior art.

  With this in mind, the heat dissipation plate module disclosed herein comprises a heat conducting base and a plurality of heat dissipation plates. The heat conduction base is mounted on a heat-generating component of the electronic device. The heat dissipating plates are spaced apart from each other on a heat conducting base and are installed in parallel.

  Each heat dissipation plate has a planar body and a plurality of projections, such as PILLARs, mounted thereon. The protrusions of two adjacent heat dissipating plates do not overlap and thus form a space for airflow, ie a continuously curved airflow path.

  The present invention utilizes a heat dissipation plate structure having a pole-shaped protrusion to increase the heat dissipation area. By having no overlapping portions between the adjacent heat dissipating plates, it is possible to form a continuous curved airflow path and increase heat transfer time and efficiency.

  Referring to FIG. 1 and FIG. 2 simultaneously, the heat dissipating plate module 100 according to the embodiment of the present invention is used for a heating device such as a CPU, a south / north bridge chip, a graphic chip, and a DIMM. This protects the heating device from damage due to excessive heat.

The heat dissipation plate module 100 is made of a metal having a high heat conduction coefficient (for example, aluminum and copper), and includes a heat conduction base 200 and a plurality of heat dissipation plates 300.
The heat conduction base 200 is one block and conforms to the shape of the heat generating device. Its bottom is directly attached to a heat generator (not shown). Generally, a heat dissipating gel is placed between the heat transfer base 200 and the heat generator to increase the heat transfer of the system.

The heat dissipating plate 300 is vertically installed at an interval on the upper surface of the heat conductive base 200 as shown in FIG. Each heat dissipation plate 300 has a structure in which a pole-shaped protrusion 310 having a plurality of curves is arranged on a flat body. The heat dissipating plate 300 can be fixed to the heat conductive base 200 by an adhesive or welding. Of course, various methods such as cutting and drawing can be considered.
All heat dissipating plates 300 are of the same length, each parallel and trimmed on the outside (TRIM). The two adjacent projections 310, 310 do not overlap with each other and have a space for airflow therebetween, thereby forming a continuous curved airflow path 320.

After installing the disclosed heat dissipating plate module 100 on the heat generating device, usually, a fan is provided on one side (not shown) to generate an air flow. FIG. 2 illustrates the air flow path. Since the total heat dissipating plate 300 has a plurality of curved pole-shaped protrusions, it is possible to provide a large heat dissipating area as compared to a simply flat heat dissipating plate. The airflow path will increase the heat transfer time and provide better heat dissipation.
In the first embodiment of the present invention, if a specific airflow path is desired so that a part of the airflow path is not narrowed, the distance between the respective protrusions 310 on the heat dissipation plate 300 is increased. It needs to be constant. Therefore, the protruding portions 310 are arranged in a regular pattern that unifies all airflow paths.

1, 4 to 6 illustrate second, third, fourth, and fifth embodiments of the present invention. Here, it may not be necessary to utilize a curved pole-shaped protrusion to form a continuous curved airflow path. For example, similar effects can be obtained by using an elliptical pole (FIG. 3), an octagonal pole (FIG. 4), a hexagonal pole (FIG. 5), a quadrangular pole (FIG. 6), and the like. It is possible to get.
Certain modifications may be made to the invention by those skilled in the art, and such modifications are to be considered within the spirit and scope of the claims of the invention.

  The present invention can be more completely understood with the following detailed description and drawings, but they are merely examples disclosed for explanation and do not limit the present invention.

FIG. 3 is a three-dimensional view of the first embodiment of the present invention. The top view of FIG. FIG. 4 is a schematic plan view of a local portion of the second embodiment of the present invention. FIG. 4 is a schematic plan view of a local portion of a third embodiment of the present invention. FIG. 4 is a schematic plan view of a local portion of a fourth embodiment of the present invention. FIG. 9 is a schematic plan view of a local portion of a fifth embodiment of the present invention.

Explanation of reference numerals

REFERENCE SIGNS LIST 100 heat dissipation plate module 200 heat conduction base 300 heat dissipation plate 310 projecting portion 320 airflow path

Claims (7)

A heat-conducting base mounted on heat-generating components of electronic equipment;
Vertically spaced on the heat transfer base, each having a plurality of pole-shaped protrusions on a planar body, two adjacent protrusions do not overlap, and an airflow space between them. Having a plurality of heat dissipating plates, continuously forming a curved airflow path,
Heat dissipation plate module. The heat dissipation plate module according to claim 1,
The protrusion is an elliptical, circular, polygonal, octagonal, hexagonal, or quadrangular pole,
Heat dissipation plate module. The heat dissipation plate module according to claim 1,
Characterized in that the space between two adjacent projections is the same,
Heat dissipation plate module. The heat dissipation plate according to claim 1 is also in joule,
Characterized in that the total heat dissipation plate is of the same length,
Heat dissipation plate module. The heat dissipation plate module according to claim 1,
Characterized in that the center of the heat dissipation plate is on the same line,
Heat dissipation plate module. The heat dissipation plate module according to claim 1,
Characterized in that the outside of the heat dissipation plate is trimmed,
Heat dissipation plate module. The heat dissipation plate module according to claim 1,
The heat dissipating plate is fixed to the heat conducting base by an adhesive or welding,
Heat dissipation plate module.

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