KR20140079192A

KR20140079192A - Heat sink

Info

Publication number: KR20140079192A
Application number: KR1020120148869A
Authority: KR
Inventors: 박혜숙
Original assignee: 주식회사 현대엠앤케이
Priority date: 2012-12-18
Filing date: 2012-12-18
Publication date: 2014-06-26

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a heat sink, and more particularly, to a heat sink attached to a hot object to lower the temperature of the object.

Description

HEAT SINK {HEAT SINK}

Generally, a heat dissipating member such as a heat sink is widely used as a means for lowering the temperature of the apparatus for generating heat in operation.

In particular, in the case of a central processing unit of a computer, if the heat generated during operation can not be removed, the operation of the computer may be interrupted and data processing errors may occur.

In addition, in the case of volatile or nonvolatile memory devices, high-voltage semiconductors, and various types of system LSI (Large-Scale Integration) circuit devices with an increased degree of integration, heat exchangers or heat dissipating members are required have.

Even in the case of an integrated circuit used for a power supply for operating a heavy equipment, it is necessary to control the heat generation. Particularly, in the case of a control circuit used for a welding machine which is continuously used for a long time, if the heating amount due to long-term use can not be controlled effectively, the use of the equipment may become impossible due to the circuit down.

As described above, various types of heat sinks are used for temperature control of individual electronic elements or control circuits.

The conventional heat sink may be made of a material having excellent ductility and good electrical properties such as aluminum. In recent years, however, there is a limit to the electric conductivity and the like to be applied to an integrated circuit device having an improved integration degree and an operation speed, and a weight increase due to an increase in size is becoming a big problem to be mounted on a control circuit of a heavy equipment.

Korean Patent No. 10-215300 (May, 24, 1999)

SUMMARY OF THE INVENTION It is an object of the present invention to provide a heat sink for attaching to a hot object to lower the temperature of the object.

According to an aspect of the present invention, there is provided a heat sink attached to an object to be installed, the heat sink comprising: a heat sink; The heat sink includes a plurality of heat dissipation fins, one end of which is connected to the heat dissipation plate and the other end extends upward. The heat dissipation fin has an elliptical column shape.

The heat sink according to the present invention is made of silver, copper, or aluminum.

The plurality of radiating fins according to the present invention are arranged in a zigzag form.

The auxiliary radiating fin further includes an auxiliary radiating fin positioned between the plurality of radiating fins according to the present invention, wherein the auxiliary radiating fin extends from one side of the upper side of the radiating plate to the other side.

The heat dissipating fin according to the present invention is characterized by being connected to the heat dissipating plate by a spot welding or a stud welding method.

The radiating fin according to the present invention is characterized in that a copper or DLC (Diamond Like Carbon) film is coated on the surface.

According to the present invention, it is possible to attach to an electric and electronic element accompanied by heat generation in a heat sink operation, for example, a central processing unit of a computer, a volatile or nonvolatile memory element, a high voltage semiconductor, a system LSI circuit element, Heat generated from the electronic device can be quickly released through the heat conduction layer having a relatively high heat transfer coefficient.

The heat radiation efficiency of the heat sink can be greatly improved by the shape of the fin formed on the heat sink, for example, the width, length, thickness, spacing, quantity, shape and the like of the fin.

Also, since the shape of the heat sink fin can be made streamlined in the form of plate made of aluminum or copper, the heat sink can greatly reduce the resistance of the air flowing into the cooling fan, The cooling efficiency can be greatly increased.

1 is a schematic plan view for explaining a heat sink according to the prior art.
2 is a state view illustrating a heat sink according to the prior art.
3 is a perspective view of a heat sink according to the present invention.
4 is a perspective view showing the base of the heat sink according to the present invention.
5 is a perspective view illustrating a sink pin in a heat sink according to the present invention.
6 is a state view showing a heat sink according to the present invention.
7 to 9 are conceptual views schematically showing a vortex generated in a heat sink according to the present invention.
10 is a conceptual view showing a sink pin in a heat sink according to the present invention.
11 is a plan view of another embodiment of a heat sink according to the present invention.
12 is a plan view of another embodiment of the heat sink according to the present invention.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the following embodiments, but may be implemented in other forms.

The embodiments disclosed herein are provided so that the disclosure may be more complete and that those skilled in the art will be able to convey the spirit and scope of the invention more fully.

In the drawings, the thickness of each device or regions is exaggerated for clarity of the present invention, and each device may have various additional devices not described herein, , Additional pins may be interposed between or formed directly on the substrate.

FIG. 1 is a schematic plan view for explaining a heat sink according to an embodiment of the present invention. FIG. 1 is a schematic view illustrating a heat sink of an aluminum or copper material.

FIG. 2 is a schematic plan view for explaining a heat sink according to the first embodiment of the present invention, and FIG. 3 is a base (1) substrate diagram for explaining the heat sink shown in FIG. Fig. 4 is a streamlined heat dissipating fin 3 shown in Fig. 2. Fig.

2 to 4, the heat sink according to the first embodiment of the present invention is attached to an object to be cooled to cool the object to be installed, and includes a heat sink 1, a heat sink 1, And the other end portion includes a plurality of radiating fins 3 extending upwardly.

For example, it can be used to emit high temperatures generated in a central processing unit of a computer, a highly integrated volatile or nonvolatile memory device, a high voltage semiconductor, a next-generation highly integrated memory, a system LSI circuit device,

In particular, it may be used for cooling a control circuit of a heavy equipment such as a power supply. In this case, the electronic devices constituting the control circuit may be directly attached to the heat sink itself.

The heat sink may include a heat sink 1 made of aluminum or a copper material and a streamline fin 3 formed on the entire surfaces of the heat sink 1 by a welding method.

The heat sink 1 may have a streamlined pin shape or size depending on the size and capacity of the heat sink.

For example, in the case of a heat sink used in a welding machine or a mobile communication terminal, the heat sink 1 may have a width of 0.5 mm to 50 mm, a length of 10 mm to 100 mm, and a width of 100 mm to 500 mm and a length of 100 mm to 500 mm In the case of a heat sink composed of a streamlined pin 3 having a length of 10 to 100 mm and a height of 10 to 100 mm and a small heat sink used in a computer central processing unit or an electronic part in a width of 20 mm to 99 mm and a length of 20 mm to 99 mm The heat sink may be formed as a heat sink composed of a fin 3 in the form of a streamlined shape having a length of 0.5 mm to 50 mm, a length of 10 mm to 100 mm, a length of 3 mm to 50 mm, and a height of 10 mm to 100 mm.

In order to increase the efficiency of the heat sink, it is preferable to coat the surface with a film quality of high thermal conductivity copper or silver or DLC (diamond like carbon).

5 to 10, in the fluid dynamics of air, a pressure drag and a frictional drag force are generated by the drag force due to the pressure of the object surface in the actual fluid flow. The magnitude of the drag force in the drag force depends on the shape of the object and the shape of the object The magnitude of the frictional force depends on the magnitude of the shear force due to the viscosity of the fluid along the surface of the object and the roughness of the surface. The drag coefficient that varies depending on the shape of various objects varies depending on the shape and size. different.

For example, the drag coefficient is 1.12 ~ 2.01 for rectangle, 0.34 ~ 0.51 for streamline, and more than 4 times larger for drag. Also, the swirl ((4), (6), (7) The flow of the fluid is obstructed and the efficiency of heat dissipation of the heat sink is reduced.

The streamlined heat sink has a small drag coefficient and no swirl, so the flow rate is good and the efficiency of the heat sink is high.

Lastly, according to the embodiments of the present invention as described above, it is possible to maximize another efficiency by changing the shape of the heat dissipation fin 3 as shown in FIG. 11 or 12 on the heat dissipation plate, Shape can be used.

Description of the Related Art [0002]
1: Heat dissipating substrate 2: Square pin
3: streamline pin 4: square air swirls
5: streamline airflow 6: vortex phase 1
7: Swirl Phase 2 8: Swirl Phase 3
9: streamlined airflow 10: heat dissipation pin

Claims

A heat sink attached to an installation object to cool the installation object,
Heat sink;
And a plurality of radiating fins, one end of which is connected to the heat sink and the other end of which is extended upward,
Wherein the heat dissipation fins are formed in an elliptical column shape.

The method according to claim 1,
The heat-
Wherein the heat sink is made of any one of silver, copper, and aluminum.

The method according to claim 1,
The plurality of radiating fins may include:
Wherein the heat sink is disposed in a zigzag form.

The method according to claim 1,
Further comprising an auxiliary radiating fin positioned between the plurality of radiating fins,
Wherein the auxiliary radiating fin comprises:
Wherein the heat sink is extended from one side of the heat sink to the other side.

5. The method according to any one of claims 1 to 4,
The heat-
Wherein the heat sink is connected to the heat sink by spot welding or stud welding.

5. The method according to any one of claims 1 to 4,
The heat-
And a copper or DLC (diamond like carbon) film is coated on the surface of the heat sink.