TWM274578U - Supporting rack of heat pipe cooling device - Google Patents

Supporting rack of heat pipe cooling device Download PDF

Info

Publication number
TWM274578U
TWM274578U TW94205019U TW94205019U TWM274578U TW M274578 U TWM274578 U TW M274578U TW 94205019 U TW94205019 U TW 94205019U TW 94205019 U TW94205019 U TW 94205019U TW M274578 U TWM274578 U TW M274578U
Authority
TW
Taiwan
Prior art keywords
heat
support frame
heat pipe
patent application
heat dissipation
Prior art date
Application number
TW94205019U
Other languages
Chinese (zh)
Inventor
Ming-Yau Shiue
Original Assignee
Lea Min Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lea Min Technologies Co Ltd filed Critical Lea Min Technologies Co Ltd
Priority to TW94205019U priority Critical patent/TWM274578U/en
Publication of TWM274578U publication Critical patent/TWM274578U/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

M274578 八、新型說明: 【新型所屬之技術領域】 本創作係關於一種熱導管散熱器之支撐架,尤其係指 一種成本低廉且組裝方便之熱導管散熱器之支撐架。 【先前技術】 般電子兀件在運作時,經常會伴隨著產生高熱,而 這-些高熱對電子元件卻存在著致命的傷害,若溫度過 南,電子元件便無法正常運作,甚至有燒毁之虞,因此在 儀器裝置之電子元#φ,+ 、, 电卞兀件中右有會產生高熱之電子元件,多 半會利用散熱器來將其產生之高熱散去,以確保電子元 可正常運作。 干 一般會產生高執之雷生 门…之包千兀件,如電腦之中央處理單元 (:=::PU) ’傳統使用在供cpu散熱之 :==CPU貼合接觸之導熱,鰭片以及與導熱鰭片 “風扇,藉由導熱鰭片將CPU上之高埶導出 之溫度。 …一9片之同熱吹散以降低C ρ ϋ 、父而目前CPU之作業效率越來越高、其頻 以彺咼出數倍,故傳统 _ 車乂 PU上之、、’之放熱益已經無法在短時間内將C U上之呵熱有效的加 世。 政去故有導熱管散熱器之問 請參看第八圖戶斤干,彳# CPUL 傳統之導熱管散熱器係包括有盥 CPU貼设之中空導熱塊(7〇),該中敎栝有/、 -側設置有散熱鰭片(7 4…、塊(7 0) (广1),在散熱鰭片(71)與中 4 M274578 空導熱塊(7 Ο )之間一體設置有支撐散熱韓片(7 用之連接片(7 2 )’由中空導熱塊(7 〇 )之—側延 出有貝牙至散熱鰭片(7工)内部之熱導管(?3),而 在散熱鰭片(7 1 )之—側便可組裝有風扇(圖中未示)。 熱導管散熱器在中空導熱塊(7 0 )及熱導管/7 3°M274578 8. Description of the new type: [Technical field to which the new type belongs] This creation relates to a support frame for a heat pipe radiator, especially a support frame for a heat pipe radiator with low cost and easy assembly. [Previous technology] In general, electronic components are often accompanied by high heat when they are in operation. These high heats can cause fatal damage to electronic components. If the temperature is too high, the electronic components will not work properly and may even be destroyed. There is a risk that electronic components # φ, + ,, and electronic components of the instrument and device have electronic components that generate high heat on the right. Most of them will use a heat sink to dissipate the high heat generated by them to ensure that the electronic components can function normally. Operation. Drying generally produces high-performance Raytheon gates ... contains thousands of components, such as the central processing unit of a computer (: = :: PU) 'Traditionally used for CPU heat dissipation: == CPU thermal contact, fins And the heat-conducting fin "fan, through the heat-conducting fins, the temperature at which the high temperature on the CPU is derived.… A 9-plate heat blow to reduce C ρ ϋ, father and the current CPU's operating efficiency is getting higher and higher, Its frequency multiplies several times, so the traditional heat dissipation benefits of _, 、, and ′ on the car PU can no longer effectively add heat to the CU in a short period of time. There is a question about the heat pipe radiator. Please refer to the eighth figure. # CPUL The traditional heat pipe radiator includes a hollow heat conduction block (70) attached to the CPU. The heat dissipation fins (7) 4…, block (7 0) (wide 1), between the heat dissipation fins (71) and the 4 M274578 empty heat conduction block (7 Ο) is integrally provided with a supporting heat sink (7 7) 'The heat pipe (? 3) extending from the shell to the inside of the heat sink fin (7) is extended from the side of the hollow heat conducting block (70), and the side of the heat sink (7 1) is A fan assembly (not shown). In the hollow heat pipe radiator heat conducting block (70) and the heat pipe / 7 3 °

注有易揮發之散熱液體’其作用原理是散熱液體在 空導熱塊(7 0 )時,會吸收中空導熱塊(7 〇 )所吸 收之熱$而蒸發成氣體,該氣體會隨熱導管(U =韓片(川處,由於散熱續片(川處因為風散 作用而溫度較低’使得氣體散熱凝結成液體,再流回中 空導熱塊(7 0),如此反復循環來達到散熱之目的。 然而上述散熱轉片(71)乃係由-體設置在中空導 熱塊(7 0 ) 一側之連接片(7 2 )所加以固定,但該連 接片(72)多半僅具有支撑效果,但在製作上不僅十分 2煩’且所使用之原料頗多,容易產生成本高Μ問題, 故十分不符合經濟效益。 【新型内容】 本創作人有鑑於上述熱導管散熱器在支標結構上之缺 ,乃積極著手進行研發’以期可以改進上述傳统姓構之 問題,經過不斷的試驗及努力,終於開發出本創作。 本創作之主要目的在於提供一種成本低廉且組裝方便 之熱導管散熱器之支撐架。 為了達到上述創作目的,本創作係採取以下之技術手 又予以達成’其中本創作係使用在具有中空導熱塊,該中 5 M274578 V ’、、、塊上側。又置有散熱鰭片,❿旁側延伸出有貫穿至散 熱韓片内部之熱導管的熱導管散熱器上,其改良在於: 中空導熱塊上設置有朝散熱轉片延伸之支樓架,該支 撐架相對於散熱鯖片之底面處彎折有支樓段,散熱韓片上 則設置有供支撐架貫穿固定之定位孔。 藉^結構簡單之支撐架的設置,以大幅降低敎導管 月欠熱器之製作成本,且於 組裝方便之效果。鰭“心孔’可以達成 【實施方式】 加::參看第—及二圖所示,本創作熱導管散熱器之支撐 二:使”具有中空導熱塊(1〇),該中空“ 有貫穿至气ί侧叹置有散熱鑌片(1 1),而旁側延伸出 片(11)内部之熱導管(12)的執導 官散熱器上,其改良在於: 们.、、、¥ 中空導熱塊(1 0 )上設置有朝散埶妹片(2 3 伸之支撐架(χ 3 ) ㈣政熱··,、曰片(1 1 )延 構,且相對於“ μ支撐帛(")Μ兩根桿體結 再見相對於散熱鰭片(]ί、+ — ^ 4),散熱^ ( D之底面處彎折有支擇段(1 3)之端部貫穿固定之定設置有咖 之端部係彎折呈與埶導 -亥支撐力木(1 3 ) 内部之部分平行之結、::(12)插入散熱鐘 上述支標架 (1 〇 合上述具支撐段(i 亦可以為條型板狀結構或其他符 仅孔(1 5 ) 2結構4 )且可貫穿散熱韓片(1 1 )的定 6 M274578 請配合參看第三及四圖所示,本創作於組裝時,只要 將支撑4 ( 1 3 )之端部直接插至入散熱鰭片(1 1 )之 定位孔(1 5 )中即可,支撐架(1 3 )之端部會支撐散 ‘熱縛片(1 1 ),並利用支禮段(丄4 )來避免t散熱趙 片(1 1 )受擠壓而朝中空導熱塊(丄〇 )移動的情形發 生,由於本創作之支撐架(1 3 )構造簡單,製作方便, 因此可以節省熱導管散熱器之整體製作成本。 再明參看第五及六圖所示,本創作熱導管散埶器之支 •撑架的另一實施例略同於上述實施例,其不同之處在= 位孔(1 5 )係設置在散熱鰭片(1 1 )之底面位置,而 支撐架(2 0 )之端部係朝定位孔(工5 )彎折而呈垂直 於熱導管(1 2 )插入散熱鋒片(丄丄)内部之部分平行 ..之結構,而支樓架(2 〇 )相對於散熱縛片(工工)之底 面處同樣彎折有支擇段(21),其同樣可以達成上述實 施例之效果。 •、再請參看第七圖所示,本創作熱導管散熱器之支撐架 的再-實施例略同於上述實施例,其不同之處在於散熱銬 片j11)之側邊設置有具朝下方開口之定位孔(15)曰 ^ '塊(16),藉此上述貫施例之支樓架(2〇)的 端部:以由下朝上插入至定位塊(丄6 )之定位孔(、5 ) 中以定位散熱鰭片(1 1 )。 【圖式簡單說明】 第一圖係本創作實施例之立體圖。 : ., ,1 ' , . · . 第二圖係本創作實施例之立體分解圖。 7 M274578 第三圖係本創作實施例之側視圖。 第四圖係本創作實施例之另一側視圖。 第五圖係本創作另一實施例之立體分解圖。 第六圖係本創作另一實施例之側視圖。 第七圖係本創作再一實施例之側視圖。 第八圖係傳統結構之立體圖。 【主要元件符號說明】 (1〇)中空導熱塊 (1 1 )散熱鰭片 (12) 熱導管 (13) 支撐架 (14) 支撐段 (15) 定位孔 (16) 定位塊 (2 0 )支撐架 (21)支撐段 (7 0 )中空導熱塊 (7 1 )散熱鰭片 (7 2 )連接片 (7 3 )熱導管The volatile heat-dissipating liquid is noted. Its working principle is that the heat-dissipating liquid will absorb the heat $ absorbed by the hollow heat-conducting block (70) and evaporate into a gas when the heat-conducting block (70) is empty, and the gas will follow the heat pipe ( U = Korean film (Sichuan, due to the heat dissipation continuum (Sichuan, the temperature is lower due to wind dispersion), so that the gas is radiated and condensed into a liquid, and then flows back to the hollow heat conduction block (70), so the cycle is repeated to achieve the purpose of heat dissipation However, the above-mentioned heat-dissipating rotating piece (71) is fixed by a connecting piece (72) provided on the side of the hollow heat-conducting block (70), but most of the connecting piece (72) only has a supporting effect, but It is not only very troublesome in production, but also uses a lot of raw materials, which is prone to high-cost problems. Therefore, it is not economically efficient. [New content] The author considers that the above heat pipe radiators are on the support structure. The shortcoming is to actively carry out research and development 'in order to improve the problem of the traditional surname structure mentioned above. After continuous experiments and efforts, we finally developed this creation. The main purpose of this creation is to provide a low cost and easy assembly Support frame of heat pipe radiator. In order to achieve the above-mentioned creation purpose, this creation system has adopted the following technical hand to achieve 'where this creation system is used with a hollow heat-conducting block, which is on the upper side of the 5 M274578 V'. Heat dissipation fins are also arranged, and a heat pipe radiator extending from a heat pipe penetrating to the inside of the heat sink is extended on the side of the ridge. The improvement is that a hollow heat conducting block is provided with a supporting frame extending toward the heat dissipation fin. The support frame is bent with branch sections at the bottom surface relative to the heat-dissipating mackerel, and the heat-dissipating Korean plate is provided with positioning holes for the support frame to pass through and fix. By using the simple structure of the support frame, the monthly underheating of the concrete tube is greatly reduced The production cost of the device and the effect of convenient assembly. The fin "heart hole" can achieve [implementation] Plus :: See the first and second picture, the support of this creative heat pipe radiator II: make "has hollow heat conduction Block (10), which has a hollow heat sink (1 1) penetrating to the side of the air, and the side of the heat pipe (12) is extended from the instructor's radiator on the side. Improvement lies in .... ,,, ¥ The hollow heat conducting block (1 0) is provided with a support frame (2 3 extending support frame (χ 3) ㈣ 政 热 ··, 曰, (1 1)) of the hollow thermal conductive block, and "Μ support 帛 (") M two rods bye-bye Relative to the heat sink fin (] ί, + — ^ 4), the heat sink ^ (D is bent at the end of the support section (1 3) at the bottom The fixed end through which the coffee is fixed is bent to form a knot parallel to the inner part of the guide-hai support force wood (1 3): (12) Insert the above-mentioned support frame of the cooling clock (1 0 above) 6 M274578 with support section (i can also be a strip plate structure or other symbols only holes (1 5) 2 structure 4) and can penetrate the heat sink (1 1) Please refer to the third and fourth figures for cooperation During the assembly of this work, as long as the end of the support 4 (1 3) is directly inserted into the positioning hole (1 5) of the heat sink fin (1 1), the end of the support frame (1 3) will Support San 'heat binding piece (1 1), and use the ceremonial segment (丄 4) to avoid the situation that t heat dissipation Zhao piece (1 1) is squeezed and moved towards the hollow heat conducting block (丄 〇). Support frame (1 3) The structure is simple and the manufacturing is convenient, so the overall manufacturing cost of the heat pipe radiator can be saved. Again referring to the fifth and sixth figures, another embodiment of the supporting and supporting frame of the heat pipe diffuser of the present invention is slightly the same as the above embodiment, and the difference is that the position hole (1 5) is set at The bottom surface of the heat dissipation fin (1 1), and the end of the support frame (20) is bent toward the positioning hole (work 5) and inserted perpendicular to the heat pipe (1 2) into the heat dissipation fin (丄 丄). The part is parallel to the structure, and the support frame (20) is also bent with a support section (21) at the bottom surface with respect to the heat sink (worker), which can also achieve the effect of the above embodiment. • Please refer to the seventh figure again. The re-embodiment of the support frame of the heat pipe radiator of this creation is slightly the same as the above embodiment, except that the side of the heat-dissipating cuff j11) is provided with a downward direction. The positioning hole (15) of the opening is referred to as the block (16), so that the end of the supporting frame (20) of the above embodiment is inserted into the positioning hole (孔 6) of the positioning block (丄 6) from bottom to top ( , 5) to position the heat sink fins (1 1). [Schematic description] The first figure is a perspective view of the creative embodiment. :.,,, 1 ',. ·. The second picture is a three-dimensional exploded view of this creative embodiment. 7 M274578 The third picture is a side view of this creative embodiment. The fourth figure is another side view of this creative embodiment. The fifth figure is an exploded perspective view of another embodiment of the present invention. The sixth figure is a side view of another embodiment of the present invention. The seventh figure is a side view of still another embodiment of the present invention. The eighth figure is a perspective view of a conventional structure. [Description of main component symbols] (1〇) Hollow heat conducting block (1 1) Heat dissipation fin (12) Heat pipe (13) Support frame (14) Support section (15) Positioning hole (16) Positioning block (2 0) support Support section (7 0) of the frame (7), hollow heat conducting block (7 1), radiating fins (7 2), connecting piece (7 3), heat pipe

Claims (1)

M274578 九、申請專利範圍: 1、 一種熱導管散熱器之支撐架,其係使用在具有中 空導熱塊’該中空導熱塊上側設置有散熱鰭片,而旁側延 伸出有貝牙至散熱·鰭片内部之熱導管的熱導管散熱器上, 其改良在於: 中空導熱塊上设置有朝散熱趙片延伸之支撐架,該支 擇架相對於散熱鰭片之底面處彎折有支撐段,散熱雜片上 則設置有供支撐架貫穿固定之定位孔。 P 2、 如申請專利範圍第1項所述之熱導管散熱器之支 撐架’其中定位孔係設置在散熱鰭片之側邊。 3、 如申請專利範圍第1項所述之熱導管散熱器之支 撐架,其中定位孔係設置在散熱鰭片之底面。 4、 如申請專利範圍第1項所述之熱導管散熱.器之支 撐架,其中散熱鰭片之側邊設置有具朝下方開口之定位孔 的定位塊。 _ 5、如申請專利範圍第1或2或3或4項所述之熱導 管散熱器之支撐架,其中支撐架係桿體結構。 6、如申請專利範圍第1或2或3或4項所述之熱導 I散熱裔之支樓架’其中支撐架係條型板狀結構。 十、圖式: 如次頁 9M274578 9. Scope of patent application: 1. A support frame for a heat pipe radiator, which is provided with a hollow heat conducting block. The upper side of the hollow heat conducting block is provided with heat dissipation fins, and the side is extended with shell teeth to heat dissipation and fins. The improvement of the heat pipe radiator of the heat pipe inside the sheet is that a support frame extending toward the heat dissipation fin is provided on the hollow heat conducting block, and the support frame is bent with a support section at the bottom surface of the heat dissipation fin to dissipate heat. The miscellaneous piece is provided with a positioning hole for the support frame to penetrate and fix. P 2. The support frame of the heat pipe radiator according to item 1 of the scope of the patent application, wherein the positioning hole is provided on the side of the heat dissipation fin. 3. The support frame of the heat pipe radiator according to item 1 of the scope of the patent application, wherein the positioning hole is provided on the bottom surface of the heat dissipation fin. 4. The support frame of the heat pipe heat sink as described in item 1 of the scope of patent application, wherein the side of the heat sink fin is provided with a positioning block having a positioning hole opening downward. _ 5. The support frame of the heat pipe radiator as described in item 1 or 2 or 3 or 4 of the patent application scope, wherein the support frame is a rod structure. 6. The thermal conductivity I as described in item 1 or 2 or 3 or 4 of the scope of the patent application, wherein the supporting frame is a strip-shaped structure. X. Schematic: as next page 9
TW94205019U 2005-03-31 2005-03-31 Supporting rack of heat pipe cooling device TWM274578U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94205019U TWM274578U (en) 2005-03-31 2005-03-31 Supporting rack of heat pipe cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94205019U TWM274578U (en) 2005-03-31 2005-03-31 Supporting rack of heat pipe cooling device

Publications (1)

Publication Number Publication Date
TWM274578U true TWM274578U (en) 2005-09-01

Family

ID=37007191

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94205019U TWM274578U (en) 2005-03-31 2005-03-31 Supporting rack of heat pipe cooling device

Country Status (1)

Country Link
TW (1) TWM274578U (en)

Similar Documents

Publication Publication Date Title
TWM246694U (en) Heat dissipation device
TW201024982A (en) Heat dissipation device
TWM278206U (en) Cooling and fixing device
TWI305132B (en)
TWM274578U (en) Supporting rack of heat pipe cooling device
TWI325754B (en) Heat dissipation module
TWM337966U (en) Flat plate heat sink
TWI308682B (en) Heat dissipation device
CN2926974Y (en) Hot-pipe radiator
TWI309149B (en) Heat dissipation device
TWM275461U (en) Heat sink having heat pipe
TWM272365U (en) Heat dissipation device
TWI295554B (en) Heat dissipation device
TWI243639B (en) Improved heat dissipation device for computer case
JP3083057U (en) Heat dissipation device
TWM247923U (en) Improved heat sink body structure with uniform temperature in heat conduction
TWM396991U (en) Multiple heat-source heat-dissipating module structure
TWI321443B (en) Heat dissipation device
TWM277981U (en) Heat dissipating assembly with heat pipes
TWM270412U (en) Heat dissipating device with heat pipe
TWM273942U (en) Dual fin type heat pipe heat sink
TWM278220U (en) Heat pipe radiator and cooling fins thereof
TWM278219U (en) Heat pipe radiator and cooling fins thereof
TWM249427U (en) Heat sink module
TWM272363U (en) Multi-directional heat-spreading heat sink