M273942 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種雙鰭月熱導管散熱器，尤其係指一 種使用纟電子元件散熱使用 < 低成本雙籍片㉟導管散執 器。 μ 【先前技術】 一 -般電子元件在運作時’經常會伴隨著產生高熱，而 這-些高熱對電子元件卻存在著致命的傷害，若溫度過 南，電子元件便無法正常運作，甚至有燒毀之虞，因此在 儀益裝置之電子元件中，若有會產生高熱之電子元件，多 半會利用散熱器來將其產生之高熱散去，以確保電子元件 可正常運作。 (以二生高熱之電子元件’如電腦之中央處理單元 多係包：：與，傳統使用在供CPU散熱之散熱器 蟲执之卫” U貼合接觸t導熱鰭片以及與導熱鱗片 且口又之放4風扇，藉由導埶 後，再利闲埤办 …一θ片將cpu上之高熱導出M273942 8. Description of the new type: [Technical field to which the new type belongs] This creation relates to a dual-fin lunar heat pipe radiator, in particular to a heat-dissipating device using 纟 electronic components < μ [Previous technology] Generally, electronic components during operation 'are often accompanied by high heat generation, and these high heats have fatal damage to electronic components. If the temperature is too high, the electronic components will not operate properly, and even There is a risk of burnout. Therefore, in the electronic components of Yiyi device, if there are electronic components that generate high heat, most of them will use a heat sink to dissipate the high heat generated by them to ensure that the electronic components can operate normally. (The second generation of high-temperature electronic components, such as the computer's central processing unit, is mostly packaged with: traditionally used in the heat sink for the CPU to dissipate the heat of the insects. "U fits and contacts the thermally conductive fins and the thermally conductive scales. Then put 4 fans, and after you guide, you can do it at your leisure ... One θ film will lead the high heat on the CPU
之溫度。月…、風扇將導熱鰭片之高熱吹散以降低C P U 然而目前Ρ τ τ , 以往高出數倍，故值效率越來越高、其頻率數也較 Ρ υ上之言埶古上統之散熱器已經無法在短時間内將C 世。门…、相加以散去，故有導熱管散熱器之問 請參看筻丄固~ _ C p u li ^ ^ φ 丁傳統之導熱管散熱器係包括有與 、4中空導熱塊B0)，該中空導熱塊（5〇) M273942 一側設置有散熱鰭片（5 i )，在散熱鰭片（5 2 )與中 空導熱塊（5 0 )之間一體設置有支撐散熱縛片（5工） 用之連接片（5 2 )，由中空導熱塊（5 〇 )之一側延伸 出有貫穿至散熱鰭片（51)内部之熱導管（53)，而 在散熱鰭片（5 1 )之一側便可組裝有風扇（圖中未示 熱V官散熱為、在中空導熱塊（5 〇)及熱導管（5 3) 之間灌注有易揮發之散熱液體，其作用原理是散熱液體在 中空導熱塊（5 0 )時，會吸收中空導熱塊（5 〇 )所吸 收之熱量而蒸發成氣體，該氣體會隨熱導管移至 散熱鰭片（5 1 )處，由於散熱鰭片（5工）處因為風散 之作用而溫度較低’使得氣體散熱凝結成液體，再流回中 空導熱塊（50)，如此反復循環來達到散熱之目的。 然而雖然中空導熱塊（5〇)可經由散熱液體之相變 :㈣到散熱目的，但是由於散熱韓片（51)係單體構 k ’氣體根本未至執導誉 V s ( 5 3 )末端即凝結回液體，故 =的使用效率不高而散熱效果有限，再者散熱轉片（5 二風扇所吹出的散熱風並無法直接的對中空導熱塊 (50 W行散熱動作，故在散熱效率上 另外’以第五圖所示 丄、… 管（53)以進行散執m、、吕’品要4根的熱導 /n …、^ 4根的熱導管每一根均必須進 rr政；液體之充填及封裝 、 管之費用十分^；?成本上必須花費4根熱導 刀不付經潸效益0 【新型内容】 本創作人有惩於卜；+、# 、"專統熱導管散熱器之問題，乃積 M273942 極者手m究開# ’以期可以解決上述熱導管散熱器之 缺失’經過不斷的試驗及努力，終於開發出本創作。 本創作之主要目的在於提供一種具有高效率散敎效果 及低成本之雙鰭片熱導管散熱器。 R為了達到上述創作目的，本創作係採取以下之技術手 奴予以達成’纟中本創作係包括有中空導熱塊，該 熱塊-側設置有散熱單& ’而兩側則延伸出有貫穿至：熱Of temperature. Month, the fan blows away the high heat of the heat-conducting fins to reduce the CPU. However, the current P τ τ is several times higher in the past, so the value efficiency is getting higher and higher, and its frequency is also lower than that of P υ. The radiator has been unable to replace C in a short time. The doors…, and they are scattered together, so if you have a heat pipe heat sink, please refer to 筻 丄 solid ~ _ C pu li ^ ^ φ The traditional heat pipe heat sink includes and 4 hollow heat conducting blocks B0), the hollow The heat conduction block (50) M273942 is provided with a heat dissipation fin (5i) on one side, and a heat dissipation fin (5 workers) is integrally provided between the heat dissipation fin (5 2) and the hollow heat conduction block (50). The connecting piece (5 2) extends from one side of the hollow heat conducting block (50) with a heat pipe (53) penetrating into the inside of the heat dissipation fin (51), and on one side of the heat dissipation fin (5 1) Can be assembled with a fan (The heat is not shown in the figure. The heat dissipation is between the hollow heat conducting block (50) and the heat pipe (53)). A volatile heat dissipating liquid is filled in. The function principle is that the heat dissipating liquid is in the hollow heat conducting block. (50), it will absorb the heat absorbed by the hollow thermal block (50) and evaporate into a gas. The gas will move to the heat dissipation fin (51) with the heat pipe. The temperature is lower because of the effect of wind dispersion, so that the gas is radiated and condensed into a liquid, and then flows back to the hollow heat-conducting block (50), and so on. To achieve the purpose of heat dissipation. However, although the hollow thermally conductive block (50) can pass through the phase transition of the heat-dissipating liquid: to the heat-dissipation purpose, because the heat-dissipating Korean film (51) is a single structure k 'gas, it has not reached the direction of V The end of s (5 3) is condensed back to the liquid, so the use efficiency is not high and the heat dissipation effect is limited. Moreover, the heat dissipation fan (5 The cooling wind blown by the second fan cannot directly radiate the hollow heat conduction block (50 W line heat dissipation). In order to dissipate heat, in addition to the heat dissipation efficiency shown in the fifth figure, the tube (53) is used to disperse m, and Lv 'product requires 4 thermal conductances / n, each of the 4 heat pipes. All the roots must enter the rr policy; the cost of filling, packaging, and tube of the liquid is very expensive; 4 costs must be spent on the thermal guide knife without paying economic benefits 0 [new content] The author has punished him; +, # "The problem of specializing in heat pipe radiators is the product of M273942 极 者 手 msearching on # 'in order to solve the above-mentioned shortage of heat pipe radiators.' After continuous experimentation and hard work, this work was finally developed. The main purpose is to provide a highly efficient dispersion effect and Low-cost dual-fin heat pipe radiator. In order to achieve the above-mentioned creative purpose, this creative system adopts the following technical hands to achieve it. 'Nakamoto's creative system includes a hollow thermal block, and a heat sink is provided on the side of the thermal block. & 'And the sides extend through to: heat
單元内部之熱導管’中空導熱塊及熱導管之間灌注二 發之散熱液體，其改良在於： 主有易揮 錢熱單元係由兩組散熱鰭片所構成，散熱鰭片間具 固疋之間距，該熱導管係中段位置設置在導熱塊中，而 兩端：朝散熱鰭片延伸’且散熱韓片之鰭片係垂直於導熱 塊之設置面。The heat pipe inside the unit's hollow heat-conducting block and the second heat radiation liquid are filled between the heat pipes. The improvement is as follows: The main unit with easy-to-spend money is composed of two sets of heat dissipation fins. Pitch, the middle position of the heat pipe system is set in the heat conduction block, and the two ends: extend toward the heat dissipation fins, and the fins of the heat dissipation Korean fins are perpendicular to the installation surface of the heat conduction block.
…错由散熱鰭片間之間距，風扇之散熱風可以透過散熱 早：直接吹送至中空導熱塊周圍區域以進行周圍電子元： =放熱’且各散熱鰭片體積適當，讓熱導管末端亦可以充 2進行散熱液體的相變化來達到優異的散熱效果，而熱 導&中奴设置導熱塊，且兩端朝散熱鰭片延伸之設計可以 省下半之熱導管封叙費用以達到低成本之要求。 【實施方式】 %麥看第-至四圖所示，本創作雙鰭片熱導管散熱哭 係包括有中空導熱塊（1〇)，該中空導熱塊厂 L置有散熱單元（2G)，而兩側則延伸出有貫穿至散 熱單元（2 0 )内部之熱導管（丄丄），中空導熱塊（； ⑧ 6 M273942 〇)及熱導答1、 、 )之間灌注有易揮發之散熱液體，其 改良在於： σ亥放熱早元f 9 、乂么丄 2 0 )係由兩組散熱鰭片（2 2 )所構 成’散熱鰭片（Ρ Ί彳 導其Γ 7 ]、 ）間具有固定之間距（2 2 )，該熱 二…係中段位置設置在導熱塊（1 0 )中，而兩 之門距…）延伸，並由散熱鰭片（2 1 )間 “二）分別彎折近90度後貫穿至散熱錯片（2. 0)之設置面。 之J係垂直於導熱塊。 :本創作於散熱單元（2 0)上側設置風扇（圖中未 二二散熱|#片（21)間之間 |J二進二直接朝中空導熱塊（1〇)之周圍區域吹送， w η 電70件的直接氣冷 效果’併輔以熱導管⑴）内部之散熱液體在熱導管（1 1」及中空導熱塊（i 〇 )之間的相變化循環，進一步的 :南散熱效率’讓電子元件的熱量傳導至中空導埶塊（1 丄時，能以最快速之方式來加以散去以確保電子元件之 運作效率及使用壽命。 由於熱導管（1 1 )係中段設置有導熱塊（i 〇 )， 而兩端朝散熱(21)延伸之結構，因此只要利 :之熱導管（1 1 ) ’便可達成如兩根熱導管（i丄）之 導熱散熱效果，在成本上可以大幅節省熱導管（1 1 ) 填散熱液體及進行封裝之費用。 請參看第五圖所示，本創作之另—實施例與上述實施 M273942 例略同，其不同之處係熱導f 元C 2 0 )之散熱I奮片（2 1 二中，一樣可以達到與上述實施例之 f圖式簡單說明】… By the distance between the cooling fins, the cooling wind of the fan can pass through the heat early: directly blow to the area around the hollow heat conduction block to perform the surrounding electronic elements: = heat radiation 'and each cooling fin has a proper volume, so that the end of the heat pipe can also Charge 2 performs the phase change of the heat-dissipating liquid to achieve excellent heat-dissipating effect, and the design of the thermal conduction & mid-slave with heat-conducting block and both ends extending towards the heat-dissipating fin can save half of the heat pipe sealing cost to achieve low cost Requirements. [Embodiment] As shown in Figures 4 to 4 of% Maikan, the cooling fins of the double fin heat pipe of this creation include a hollow heat conducting block (10), and the hollow heat conducting block factory L has a heat dissipating unit (2G), and On both sides, there is a heat pipe (丄 丄) penetrating into the interior of the heat dissipation unit (20), and a hollow heat conducting block (; ⑧ 6 M273942 〇) and the thermal answer 1,,) are filled with a volatile heat dissipation liquid. The improvement is that: σHai exothermic early element f 9 and 乂 2 丄) are composed of two sets of heat radiating fins (2 2). The distance (2 2), the middle position of the thermal two ... is set in the heat conduction block (1 0), and the two door distances ...) extend, and are respectively bent close by the "two" between the heat dissipation fins (2 1). After 90 degrees, it penetrates to the setting surface of the heat sink (2.0). J is perpendicular to the heat conduction block .: This creation sets a fan on the heat sink (20). ) Between | J two into two blow directly to the surrounding area of the hollow heat conduction block (1〇), w η direct air cooling effect of 70 pieces of electricity 'with supplementary heat pipe ⑴) The phase change cycle of the heat-dissipating liquid between the heat pipe (1 1 ″ and the hollow heat-conducting block (i 〇) further circulates the heat dissipation efficiency of the electronic components to the hollow heat-conducting block (1 丄). It is dissipated in the fastest way to ensure the operating efficiency and service life of the electronic components. Because the heat pipe (1 1) is provided with a heat conducting block (i 〇) in the middle section, and the two ends extend toward the heat dissipation (21), Therefore, as long as the heat pipe (1 1) 'is used, the heat conduction and heat dissipation effect of the two heat pipes (i 丄) can be achieved, and the cost of filling the heat dissipation liquid and packaging the heat pipe (1 1) can be greatly saved in cost. Please refer to the fifth figure. The other embodiment of this creation is slightly the same as the implementation of the M273942 example above. The difference is the heat dissipation f (C 2 0) of the thermal conductivity f 2 (2 1 2). Simple explanation with f scheme of the above embodiment]
第一圖係本創作之立體圖。 第二圖係本創作之立體分解圖。 第二圖係本創作之側視圖。 第四圖係本創作之另一側視圖。 第五圖係本創作另一實施例之立體圖 第六圖係傳統結構立體圖。 【主要元件符號說明】 (1 〇)中空導熱塊 (11)熱導管 (2 0 )散熱單元 (2 1 )散熱鰭片 (2 2 )間距 (5 0 )中空導熱塊 (5 1 )散熱鰭片 (5 2 )連接片 (5 3 )熱導管The first picture is a three-dimensional view of this creation. The second picture is a three-dimensional exploded view of this creation. The second picture is a side view of this creation. The fourth picture is another side view of this creation. The fifth figure is a perspective view of another embodiment of the present invention. The sixth figure is a perspective view of a conventional structure. [Description of main component symbols] (1 〇) Hollow heat conducting block (11) Heat pipe (2 0) Heat dissipation unit (2 1) Heat dissipation fin (2 2) Pitch (50) Hollow heat conduction block (5 1) Heat dissipation fin (5 2) connecting piece (5 3) heat pipe