TWI907598B - 活性能量線硬化性樹脂組成物、硬化物、絕緣材料及阻焊構件 - Google Patents

活性能量線硬化性樹脂組成物、硬化物、絕緣材料及阻焊構件

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Publication number
TWI907598B
TWI907598B TW110147857A TW110147857A TWI907598B TW I907598 B TWI907598 B TW I907598B TW 110147857 A TW110147857 A TW 110147857A TW 110147857 A TW110147857 A TW 110147857A TW I907598 B TWI907598 B TW I907598B
Authority
TW
Taiwan
Prior art keywords
resin
acid
groups
weight
parts
Prior art date
Application number
TW110147857A
Other languages
English (en)
Chinese (zh)
Other versions
TW202235473A (zh
Inventor
山田駿介
龜山裕史
Original Assignee
日商Ｄｉｃ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｄｉｃ股份有限公司 filed Critical 日商Ｄｉｃ股份有限公司
Publication of TW202235473A publication Critical patent/TW202235473A/zh
Application granted granted Critical
Publication of TWI907598B publication Critical patent/TWI907598B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/067—Polyurethanes; Polyureas
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/06—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyurethanes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)
  • Organic Insulating Materials (AREA)
TW110147857A 2020-12-22 2021-12-21 活性能量線硬化性樹脂組成物、硬化物、絕緣材料及阻焊構件 TWI907598B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-212261 2020-12-22
JP2020212261 2020-12-22

Publications (2)

Publication Number Publication Date
TW202235473A TW202235473A (zh) 2022-09-16
TWI907598B true TWI907598B (zh) 2025-12-11

Family

ID=82157684

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110147857A TWI907598B (zh) 2020-12-22 2021-12-21 活性能量線硬化性樹脂組成物、硬化物、絕緣材料及阻焊構件

Country Status (5)

Country Link
JP (1) JP7136386B1 (https=)
KR (1) KR20230122013A (https=)
CN (1) CN116601724A (https=)
TW (1) TWI907598B (https=)
WO (1) WO2022138184A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202433179A (zh) * 2022-12-06 2024-08-16 日商三菱化學股份有限公司 感光性著色樹脂組合物、硬化物、阻隔壁、有機電致發光元件、濾光片及圖像顯示裝置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020097704A (ja) * 2018-12-19 2020-06-25 Dic株式会社 酸基含有（メタ）アクリレート樹脂組成物、硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS565861A (en) * 1979-06-28 1981-01-21 Mitsubishi Electric Corp Varnish composition for insulating treatment
JPS61243869A (ja) 1985-04-19 1986-10-30 Taiyo Ink Seizo Kk レジストインキ組成物
JP2684948B2 (ja) * 1993-02-03 1997-12-03 株式会社日本触媒 液状感光性樹脂組成物
JP5388284B2 (ja) * 2009-05-26 2014-01-15 三菱レイヨン株式会社 硬化性組成物、及び物品
CN110563925B (zh) * 2019-09-16 2022-02-01 上海昭和高分子有限公司 一种酸酐改性环氧丙烯酸树脂、碱显像高耐热聚氨酯树脂及其阻焊油墨

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020097704A (ja) * 2018-12-19 2020-06-25 Dic株式会社 酸基含有（メタ）アクリレート樹脂組成物、硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材

Also Published As

Publication number Publication date
JP7136386B1 (ja) 2022-09-13
WO2022138184A1 (ja) 2022-06-30
TW202235473A (zh) 2022-09-16
KR20230122013A (ko) 2023-08-22
JPWO2022138184A1 (https=) 2022-06-30
CN116601724A (zh) 2023-08-15

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