JP7136386B1 - 活性エネルギー線硬化性樹脂組成物、硬化物、絶縁材料及びレジスト部材 - Google Patents

活性エネルギー線硬化性樹脂組成物、硬化物、絶縁材料及びレジスト部材 Download PDF

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JP7136386B1
JP7136386B1 JP2022518293A JP2022518293A JP7136386B1 JP 7136386 B1 JP7136386 B1 JP 7136386B1 JP 2022518293 A JP2022518293 A JP 2022518293A JP 2022518293 A JP2022518293 A JP 2022518293A JP 7136386 B1 JP7136386 B1 JP 7136386B1
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JPWO2022138184A5 (https=
JPWO2022138184A1 (https=
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駿介 山田
裕史 亀山
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DIC Corp
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DIC Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/067—Polyurethanes; Polyureas
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/06—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyurethanes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)
  • Organic Insulating Materials (AREA)
JP2022518293A 2020-12-22 2021-12-09 活性エネルギー線硬化性樹脂組成物、硬化物、絶縁材料及びレジスト部材 Active JP7136386B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020212261 2020-12-22
JP2020212261 2020-12-22
PCT/JP2021/045258 WO2022138184A1 (ja) 2020-12-22 2021-12-09 活性エネルギー線硬化性樹脂組成物、硬化物、絶縁材料及びレジスト部材

Publications (3)

Publication Number Publication Date
JPWO2022138184A1 JPWO2022138184A1 (https=) 2022-06-30
JP7136386B1 true JP7136386B1 (ja) 2022-09-13
JPWO2022138184A5 JPWO2022138184A5 (https=) 2022-12-05

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JP2022518293A Active JP7136386B1 (ja) 2020-12-22 2021-12-09 活性エネルギー線硬化性樹脂組成物、硬化物、絶縁材料及びレジスト部材

Country Status (5)

Country Link
JP (1) JP7136386B1 (https=)
KR (1) KR20230122013A (https=)
CN (1) CN116601724A (https=)
TW (1) TWI907598B (https=)
WO (1) WO2022138184A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202433179A (zh) * 2022-12-06 2024-08-16 日商三菱化學股份有限公司 感光性著色樹脂組合物、硬化物、阻隔壁、有機電致發光元件、濾光片及圖像顯示裝置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020097704A (ja) * 2018-12-19 2020-06-25 Dic株式会社 酸基含有（メタ）アクリレート樹脂組成物、硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS565861A (en) * 1979-06-28 1981-01-21 Mitsubishi Electric Corp Varnish composition for insulating treatment
JPS61243869A (ja) 1985-04-19 1986-10-30 Taiyo Ink Seizo Kk レジストインキ組成物
JP2684948B2 (ja) * 1993-02-03 1997-12-03 株式会社日本触媒 液状感光性樹脂組成物
JP5388284B2 (ja) * 2009-05-26 2014-01-15 三菱レイヨン株式会社 硬化性組成物、及び物品
CN110563925B (zh) * 2019-09-16 2022-02-01 上海昭和高分子有限公司 一种酸酐改性环氧丙烯酸树脂、碱显像高耐热聚氨酯树脂及其阻焊油墨

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020097704A (ja) * 2018-12-19 2020-06-25 Dic株式会社 酸基含有（メタ）アクリレート樹脂組成物、硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材

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Publication number Publication date
WO2022138184A1 (ja) 2022-06-30
TW202235473A (zh) 2022-09-16
TWI907598B (zh) 2025-12-11
KR20230122013A (ko) 2023-08-22
JPWO2022138184A1 (https=) 2022-06-30
CN116601724A (zh) 2023-08-15

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