JPWO2022138184A1 - - Google Patents
Info
- Publication number
- JPWO2022138184A1 JPWO2022138184A1 JP2022518293A JP2022518293A JPWO2022138184A1 JP WO2022138184 A1 JPWO2022138184 A1 JP WO2022138184A1 JP 2022518293 A JP2022518293 A JP 2022518293A JP 2022518293 A JP2022518293 A JP 2022518293A JP WO2022138184 A1 JPWO2022138184 A1 JP WO2022138184A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/067—Polyurethanes; Polyureas
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
- C08F299/06—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyurethanes
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Materials For Photolithography (AREA)
- Organic Insulating Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020212261 | 2020-12-22 | ||
| JP2020212261 | 2020-12-22 | ||
| PCT/JP2021/045258 WO2022138184A1 (ja) | 2020-12-22 | 2021-12-09 | 活性エネルギー線硬化性樹脂組成物、硬化物、絶縁材料及びレジスト部材 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022138184A1 true JPWO2022138184A1 (https=) | 2022-06-30 |
| JP7136386B1 JP7136386B1 (ja) | 2022-09-13 |
| JPWO2022138184A5 JPWO2022138184A5 (https=) | 2022-12-05 |
Family
ID=82157684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022518293A Active JP7136386B1 (ja) | 2020-12-22 | 2021-12-09 | 活性エネルギー線硬化性樹脂組成物、硬化物、絶縁材料及びレジスト部材 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7136386B1 (https=) |
| KR (1) | KR20230122013A (https=) |
| CN (1) | CN116601724A (https=) |
| TW (1) | TWI907598B (https=) |
| WO (1) | WO2022138184A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202433179A (zh) * | 2022-12-06 | 2024-08-16 | 日商三菱化學股份有限公司 | 感光性著色樹脂組合物、硬化物、阻隔壁、有機電致發光元件、濾光片及圖像顯示裝置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS565861A (en) * | 1979-06-28 | 1981-01-21 | Mitsubishi Electric Corp | Varnish composition for insulating treatment |
| JPS61243869A (ja) | 1985-04-19 | 1986-10-30 | Taiyo Ink Seizo Kk | レジストインキ組成物 |
| JP2684948B2 (ja) * | 1993-02-03 | 1997-12-03 | 株式会社日本触媒 | 液状感光性樹脂組成物 |
| JP5388284B2 (ja) * | 2009-05-26 | 2014-01-15 | 三菱レイヨン株式会社 | 硬化性組成物、及び物品 |
| JP7172555B2 (ja) * | 2018-12-19 | 2022-11-16 | Dic株式会社 | 酸基含有（メタ）アクリレート樹脂組成物、硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材 |
| CN110563925B (zh) * | 2019-09-16 | 2022-02-01 | 上海昭和高分子有限公司 | 一种酸酐改性环氧丙烯酸树脂、碱显像高耐热聚氨酯树脂及其阻焊油墨 |
-
2021
- 2021-12-09 WO PCT/JP2021/045258 patent/WO2022138184A1/ja not_active Ceased
- 2021-12-09 JP JP2022518293A patent/JP7136386B1/ja active Active
- 2021-12-09 CN CN202180086345.1A patent/CN116601724A/zh active Pending
- 2021-12-09 KR KR1020237020029A patent/KR20230122013A/ko active Pending
- 2021-12-21 TW TW110147857A patent/TWI907598B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| JP7136386B1 (ja) | 2022-09-13 |
| WO2022138184A1 (ja) | 2022-06-30 |
| TW202235473A (zh) | 2022-09-16 |
| TWI907598B (zh) | 2025-12-11 |
| KR20230122013A (ko) | 2023-08-22 |
| CN116601724A (zh) | 2023-08-15 |
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