TWI904301B - 介電體層之製造方法、樹脂組成物、及包含介電體層之積層體 - Google Patents

介電體層之製造方法、樹脂組成物、及包含介電體層之積層體

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Publication number
TWI904301B
TWI904301B TW110147131A TW110147131A TWI904301B TW I904301 B TWI904301 B TW I904301B TW 110147131 A TW110147131 A TW 110147131A TW 110147131 A TW110147131 A TW 110147131A TW I904301 B TWI904301 B TW I904301B
Authority
TW
Taiwan
Prior art keywords
dielectric layer
resin composition
dielectric
electromagnetic wave
ghz
Prior art date
Application number
TW110147131A
Other languages
English (en)
Chinese (zh)
Other versions
TW202228997A (zh
Inventor
西山碩芳
正田亮
Original Assignee
日商凸版印刷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商凸版印刷股份有限公司 filed Critical 日商凸版印刷股份有限公司
Publication of TW202228997A publication Critical patent/TW202228997A/zh
Application granted granted Critical
Publication of TWI904301B publication Critical patent/TWI904301B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002—Inhomogeneous material in general
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
    • H01G4/206—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 inorganic and synthetic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H01G4/145—Organic dielectrics vapour deposited
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Aerials With Secondary Devices (AREA)
  • Inorganic Insulating Materials (AREA)
TW110147131A 2020-12-17 2021-12-16 介電體層之製造方法、樹脂組成物、及包含介電體層之積層體 TWI904301B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-209095 2020-12-17
JP2020209095 2020-12-17

Publications (2)

Publication Number Publication Date
TW202228997A TW202228997A (zh) 2022-08-01
TWI904301B true TWI904301B (zh) 2025-11-11

Family

ID=82057665

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110147131A TWI904301B (zh) 2020-12-17 2021-12-16 介電體層之製造方法、樹脂組成物、及包含介電體層之積層體

Country Status (7)

Country Link
US (1) US20230420156A1 (https=)
EP (1) EP4266850A4 (https=)
JP (2) JP7323708B2 (https=)
KR (1) KR20230121722A (https=)
CN (1) CN116600990A (https=)
TW (1) TWI904301B (https=)
WO (1) WO2022131298A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025128885A (ja) * 2024-02-22 2025-09-03 リンテック株式会社 電磁波吸収部材
JP2025128955A (ja) * 2024-02-22 2025-09-03 リンテック株式会社 電磁波吸収部材

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020161584A (ja) * 2019-03-26 2020-10-01 積水化学工業株式会社 λ／４型電波吸収体

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005187551A (ja) * 2003-12-25 2005-07-14 Ntn Corp 高誘電性樹脂組成物
JP2005311330A (ja) 2004-03-22 2005-11-04 Takiron Co Ltd 電波吸収体
JP2013236064A (ja) * 2012-04-10 2013-11-21 Idemitsu Kosan Co Ltd ノイズ吸収積層体
GB2519133B (en) * 2013-10-11 2018-06-27 Qinetiq Ltd Electromagnetic field absorbing composition
JP6163622B2 (ja) * 2015-05-29 2017-07-12 リンテック株式会社 粘着シート
JP6184579B2 (ja) * 2015-12-14 2017-08-23 日東電工株式会社 電磁波吸収体およびそれを備えた電磁波吸収体付成形体
JP6795300B2 (ja) * 2015-12-17 2020-12-02 東洋インキＳｃホールディングス株式会社 電磁波抑制シートおよびこれを用いた電磁波抑制粘着シート、電磁波抑制用樹脂組成物、電磁波抑制層
US20190373778A1 (en) * 2016-11-10 2019-12-05 Maxell Holdings, Ltd. Electromagnetic wave absorbing sheet
JP7162414B2 (ja) * 2017-06-13 2022-10-28 日東電工株式会社 電磁波吸収体及び電磁波吸収体付成形品
WO2019077808A1 (ja) * 2017-10-19 2019-04-25 関西ペイント株式会社 ミリ波帯域用電波吸収シート及びミリ波電波吸収方法
JP2019155603A (ja) * 2018-03-07 2019-09-19 凸版印刷株式会社 蓄光フィルム及びその製造方法
JP7256036B2 (ja) * 2019-03-05 2023-04-11 出光興産株式会社 電磁波吸収シート及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020161584A (ja) * 2019-03-26 2020-10-01 積水化学工業株式会社 λ／４型電波吸収体

Also Published As

Publication number Publication date
US20230420156A1 (en) 2023-12-28
WO2022131298A1 (ja) 2022-06-23
CN116600990A (zh) 2023-08-15
KR20230121722A (ko) 2023-08-21
JP2023016814A (ja) 2023-02-02
TW202228997A (zh) 2022-08-01
EP4266850A1 (en) 2023-10-25
JPWO2022131298A1 (https=) 2022-06-23
EP4266850A4 (en) 2024-06-05
JP7323708B2 (ja) 2023-08-08

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