KR20230121722A - 유전체층의 제조 방법, 수지 조성물, 및 유전체층을 포함하는 적층체 - Google Patents

유전체층의 제조 방법, 수지 조성물, 및 유전체층을 포함하는 적층체 Download PDF

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KR20230121722A
KR20230121722A KR1020237014972A KR20237014972A KR20230121722A KR 20230121722 A KR20230121722 A KR 20230121722A KR 1020237014972 A KR1020237014972 A KR 1020237014972A KR 20237014972 A KR20237014972 A KR 20237014972A KR 20230121722 A KR20230121722 A KR 20230121722A
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South Korea
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dielectric layer
resin composition
ghz
dielectric
layer
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KR1020237014972A
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English (en)
Korean (ko)
Inventor
히로요시 니시야마
료 쇼다
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도판 인사츠 가부시키가이샤
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Publication of KR20230121722A publication Critical patent/KR20230121722A/ko
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002Inhomogeneous material in general
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/33Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • B32B7/025Electric or magnetic properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/14Organic dielectrics
    • H01G4/18Organic dielectrics of synthetic material, e.g. derivatives of cellulose
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/20Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
    • H01G4/206Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 inorganic and synthetic material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/14Organic dielectrics
    • H01G4/145Organic dielectrics vapour deposited
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/20Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Aerials With Secondary Devices (AREA)
  • Inorganic Insulating Materials (AREA)
KR1020237014972A 2020-12-17 2021-12-15 유전체층의 제조 방법, 수지 조성물, 및 유전체층을 포함하는 적층체 Pending KR20230121722A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020209095 2020-12-17
JPJP-P-2020-209095 2020-12-17
PCT/JP2021/046304 WO2022131298A1 (ja) 2020-12-17 2021-12-15 誘電体層の製造方法、樹脂組成物、及び誘電体層を含む積層体

Publications (1)

Publication Number Publication Date
KR20230121722A true KR20230121722A (ko) 2023-08-21

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KR1020237014972A Pending KR20230121722A (ko) 2020-12-17 2021-12-15 유전체층의 제조 방법, 수지 조성물, 및 유전체층을 포함하는 적층체

Country Status (7)

Country Link
US (1) US20230420156A1 (https=)
EP (1) EP4266850A4 (https=)
JP (2) JP7323708B2 (https=)
KR (1) KR20230121722A (https=)
CN (1) CN116600990A (https=)
TW (1) TWI904301B (https=)
WO (1) WO2022131298A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025128885A (ja) * 2024-02-22 2025-09-03 リンテック株式会社 電磁波吸収部材
JP2025128955A (ja) * 2024-02-22 2025-09-03 リンテック株式会社 電磁波吸収部材

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311330A (ja) 2004-03-22 2005-11-04 Takiron Co Ltd 電波吸収体
WO2018230026A1 (ja) 2017-06-13 2018-12-20 日東電工株式会社 電磁波吸収体及び電磁波吸収体付成形品

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005187551A (ja) * 2003-12-25 2005-07-14 Ntn Corp 高誘電性樹脂組成物
JP2013236064A (ja) * 2012-04-10 2013-11-21 Idemitsu Kosan Co Ltd ノイズ吸収積層体
GB2519133B (en) * 2013-10-11 2018-06-27 Qinetiq Ltd Electromagnetic field absorbing composition
JP6163622B2 (ja) * 2015-05-29 2017-07-12 リンテック株式会社 粘着シート
JP6184579B2 (ja) * 2015-12-14 2017-08-23 日東電工株式会社 電磁波吸収体およびそれを備えた電磁波吸収体付成形体
JP6795300B2 (ja) * 2015-12-17 2020-12-02 東洋インキScホールディングス株式会社 電磁波抑制シートおよびこれを用いた電磁波抑制粘着シート、電磁波抑制用樹脂組成物、電磁波抑制層
US20190373778A1 (en) * 2016-11-10 2019-12-05 Maxell Holdings, Ltd. Electromagnetic wave absorbing sheet
WO2019077808A1 (ja) * 2017-10-19 2019-04-25 関西ペイント株式会社 ミリ波帯域用電波吸収シート及びミリ波電波吸収方法
JP2019155603A (ja) * 2018-03-07 2019-09-19 凸版印刷株式会社 蓄光フィルム及びその製造方法
JP7256036B2 (ja) * 2019-03-05 2023-04-11 出光興産株式会社 電磁波吸収シート及びその製造方法
JP2020161584A (ja) * 2019-03-26 2020-10-01 積水化学工業株式会社 λ/4型電波吸収体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311330A (ja) 2004-03-22 2005-11-04 Takiron Co Ltd 電波吸収体
WO2018230026A1 (ja) 2017-06-13 2018-12-20 日東電工株式会社 電磁波吸収体及び電磁波吸収体付成形品

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Publication number Publication date
US20230420156A1 (en) 2023-12-28
WO2022131298A1 (ja) 2022-06-23
CN116600990A (zh) 2023-08-15
JP2023016814A (ja) 2023-02-02
TW202228997A (zh) 2022-08-01
EP4266850A1 (en) 2023-10-25
JPWO2022131298A1 (https=) 2022-06-23
TWI904301B (zh) 2025-11-11
EP4266850A4 (en) 2024-06-05
JP7323708B2 (ja) 2023-08-08

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