KR20230121722A - 유전체층의 제조 방법, 수지 조성물, 및 유전체층을 포함하는 적층체 - Google Patents
유전체층의 제조 방법, 수지 조성물, 및 유전체층을 포함하는 적층체 Download PDFInfo
- Publication number
- KR20230121722A KR20230121722A KR1020237014972A KR20237014972A KR20230121722A KR 20230121722 A KR20230121722 A KR 20230121722A KR 1020237014972 A KR1020237014972 A KR 1020237014972A KR 20237014972 A KR20237014972 A KR 20237014972A KR 20230121722 A KR20230121722 A KR 20230121722A
- Authority
- KR
- South Korea
- Prior art keywords
- dielectric layer
- resin composition
- ghz
- dielectric
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/002—Inhomogeneous material in general
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/025—Electric or magnetic properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
- H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
- H01G4/206—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 inorganic and synthetic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
- H01G4/145—Organic dielectrics vapour deposited
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Aerials With Secondary Devices (AREA)
- Inorganic Insulating Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020209095 | 2020-12-17 | ||
| JPJP-P-2020-209095 | 2020-12-17 | ||
| PCT/JP2021/046304 WO2022131298A1 (ja) | 2020-12-17 | 2021-12-15 | 誘電体層の製造方法、樹脂組成物、及び誘電体層を含む積層体 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20230121722A true KR20230121722A (ko) | 2023-08-21 |
Family
ID=82057665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237014972A Pending KR20230121722A (ko) | 2020-12-17 | 2021-12-15 | 유전체층의 제조 방법, 수지 조성물, 및 유전체층을 포함하는 적층체 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20230420156A1 (https=) |
| EP (1) | EP4266850A4 (https=) |
| JP (2) | JP7323708B2 (https=) |
| KR (1) | KR20230121722A (https=) |
| CN (1) | CN116600990A (https=) |
| TW (1) | TWI904301B (https=) |
| WO (1) | WO2022131298A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2025128885A (ja) * | 2024-02-22 | 2025-09-03 | リンテック株式会社 | 電磁波吸収部材 |
| JP2025128955A (ja) * | 2024-02-22 | 2025-09-03 | リンテック株式会社 | 電磁波吸収部材 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005311330A (ja) | 2004-03-22 | 2005-11-04 | Takiron Co Ltd | 電波吸収体 |
| WO2018230026A1 (ja) | 2017-06-13 | 2018-12-20 | 日東電工株式会社 | 電磁波吸収体及び電磁波吸収体付成形品 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005187551A (ja) * | 2003-12-25 | 2005-07-14 | Ntn Corp | 高誘電性樹脂組成物 |
| JP2013236064A (ja) * | 2012-04-10 | 2013-11-21 | Idemitsu Kosan Co Ltd | ノイズ吸収積層体 |
| GB2519133B (en) * | 2013-10-11 | 2018-06-27 | Qinetiq Ltd | Electromagnetic field absorbing composition |
| JP6163622B2 (ja) * | 2015-05-29 | 2017-07-12 | リンテック株式会社 | 粘着シート |
| JP6184579B2 (ja) * | 2015-12-14 | 2017-08-23 | 日東電工株式会社 | 電磁波吸収体およびそれを備えた電磁波吸収体付成形体 |
| JP6795300B2 (ja) * | 2015-12-17 | 2020-12-02 | 東洋インキScホールディングス株式会社 | 電磁波抑制シートおよびこれを用いた電磁波抑制粘着シート、電磁波抑制用樹脂組成物、電磁波抑制層 |
| US20190373778A1 (en) * | 2016-11-10 | 2019-12-05 | Maxell Holdings, Ltd. | Electromagnetic wave absorbing sheet |
| WO2019077808A1 (ja) * | 2017-10-19 | 2019-04-25 | 関西ペイント株式会社 | ミリ波帯域用電波吸収シート及びミリ波電波吸収方法 |
| JP2019155603A (ja) * | 2018-03-07 | 2019-09-19 | 凸版印刷株式会社 | 蓄光フィルム及びその製造方法 |
| JP7256036B2 (ja) * | 2019-03-05 | 2023-04-11 | 出光興産株式会社 | 電磁波吸収シート及びその製造方法 |
| JP2020161584A (ja) * | 2019-03-26 | 2020-10-01 | 積水化学工業株式会社 | λ/4型電波吸収体 |
-
2021
- 2021-12-15 JP JP2022514217A patent/JP7323708B2/ja active Active
- 2021-12-15 WO PCT/JP2021/046304 patent/WO2022131298A1/ja not_active Ceased
- 2021-12-15 KR KR1020237014972A patent/KR20230121722A/ko active Pending
- 2021-12-15 EP EP21906659.4A patent/EP4266850A4/en active Pending
- 2021-12-15 CN CN202180084206.5A patent/CN116600990A/zh active Pending
- 2021-12-16 TW TW110147131A patent/TWI904301B/zh active
-
2022
- 2022-11-08 JP JP2022179132A patent/JP2023016814A/ja active Pending
-
2023
- 2023-06-09 US US18/208,068 patent/US20230420156A1/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005311330A (ja) | 2004-03-22 | 2005-11-04 | Takiron Co Ltd | 電波吸収体 |
| WO2018230026A1 (ja) | 2017-06-13 | 2018-12-20 | 日東電工株式会社 | 電磁波吸収体及び電磁波吸収体付成形品 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20230420156A1 (en) | 2023-12-28 |
| WO2022131298A1 (ja) | 2022-06-23 |
| CN116600990A (zh) | 2023-08-15 |
| JP2023016814A (ja) | 2023-02-02 |
| TW202228997A (zh) | 2022-08-01 |
| EP4266850A1 (en) | 2023-10-25 |
| JPWO2022131298A1 (https=) | 2022-06-23 |
| TWI904301B (zh) | 2025-11-11 |
| EP4266850A4 (en) | 2024-06-05 |
| JP7323708B2 (ja) | 2023-08-08 |
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St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
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St.27 status event code: A-2-2-P10-P11-nap-X000 |
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