CN116600990A - 介电体层的制造方法、树脂组合物、以及包含介电体层的层叠体 - Google Patents

介电体层的制造方法、树脂组合物、以及包含介电体层的层叠体 Download PDF

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Publication number
CN116600990A
CN116600990A CN202180084206.5A CN202180084206A CN116600990A CN 116600990 A CN116600990 A CN 116600990A CN 202180084206 A CN202180084206 A CN 202180084206A CN 116600990 A CN116600990 A CN 116600990A
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CN
China
Prior art keywords
dielectric layer
resin composition
dielectric
electromagnetic wave
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180084206.5A
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English (en)
Chinese (zh)
Inventor
西山硕芳
正田亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Publication of CN116600990A publication Critical patent/CN116600990A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002—Inhomogeneous material in general
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
    • H01G4/206—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 inorganic and synthetic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H01G4/145—Organic dielectrics vapour deposited
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Aerials With Secondary Devices (AREA)
  • Inorganic Insulating Materials (AREA)
CN202180084206.5A 2020-12-17 2021-12-15 介电体层的制造方法、树脂组合物、以及包含介电体层的层叠体 Pending CN116600990A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-209095 2020-12-17
JP2020209095 2020-12-17
PCT/JP2021/046304 WO2022131298A1 (ja) 2020-12-17 2021-12-15 誘電体層の製造方法、樹脂組成物、及び誘電体層を含む積層体

Publications (1)

Publication Number Publication Date
CN116600990A true CN116600990A (zh) 2023-08-15

Family

ID=82057665

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180084206.5A Pending CN116600990A (zh) 2020-12-17 2021-12-15 介电体层的制造方法、树脂组合物、以及包含介电体层的层叠体

Country Status (7)

Country Link
US (1) US20230420156A1 (https=)
EP (1) EP4266850A4 (https=)
JP (2) JP7323708B2 (https=)
KR (1) KR20230121722A (https=)
CN (1) CN116600990A (https=)
TW (1) TWI904301B (https=)
WO (1) WO2022131298A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025128885A (ja) * 2024-02-22 2025-09-03 リンテック株式会社 電磁波吸収部材
JP2025128955A (ja) * 2024-02-22 2025-09-03 リンテック株式会社 電磁波吸収部材

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005187551A (ja) * 2003-12-25 2005-07-14 Ntn Corp 高誘電性樹脂組成物
JP2017112253A (ja) * 2015-12-17 2017-06-22 日本合成化学工業株式会社 電磁波抑制シートおよびこれを用いた電磁波抑制粘着シート、電磁波抑制用樹脂組成物、電磁波抑制層
US20180148611A1 (en) * 2015-05-29 2018-05-31 Lintec Corporation Pressure sensitive adhesive sheet
CN108353521A (zh) * 2015-12-14 2018-07-31 日东电工株式会社 电磁波吸收体以及具备该电磁波吸收体的带有电磁波吸收体的成形体
JP2020161584A (ja) * 2019-03-26 2020-10-01 積水化学工業株式会社 λ／４型電波吸収体

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311330A (ja) 2004-03-22 2005-11-04 Takiron Co Ltd 電波吸収体
JP2013236064A (ja) * 2012-04-10 2013-11-21 Idemitsu Kosan Co Ltd ノイズ吸収積層体
GB2519133B (en) * 2013-10-11 2018-06-27 Qinetiq Ltd Electromagnetic field absorbing composition
US20190373778A1 (en) * 2016-11-10 2019-12-05 Maxell Holdings, Ltd. Electromagnetic wave absorbing sheet
JP7162414B2 (ja) * 2017-06-13 2022-10-28 日東電工株式会社 電磁波吸収体及び電磁波吸収体付成形品
WO2019077808A1 (ja) * 2017-10-19 2019-04-25 関西ペイント株式会社 ミリ波帯域用電波吸収シート及びミリ波電波吸収方法
JP2019155603A (ja) * 2018-03-07 2019-09-19 凸版印刷株式会社 蓄光フィルム及びその製造方法
JP7256036B2 (ja) * 2019-03-05 2023-04-11 出光興産株式会社 電磁波吸収シート及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005187551A (ja) * 2003-12-25 2005-07-14 Ntn Corp 高誘電性樹脂組成物
US20180148611A1 (en) * 2015-05-29 2018-05-31 Lintec Corporation Pressure sensitive adhesive sheet
CN108353521A (zh) * 2015-12-14 2018-07-31 日东电工株式会社 电磁波吸收体以及具备该电磁波吸收体的带有电磁波吸收体的成形体
JP2017112253A (ja) * 2015-12-17 2017-06-22 日本合成化学工業株式会社 電磁波抑制シートおよびこれを用いた電磁波抑制粘着シート、電磁波抑制用樹脂組成物、電磁波抑制層
JP2020161584A (ja) * 2019-03-26 2020-10-01 積水化学工業株式会社 λ／４型電波吸収体

Also Published As

Publication number Publication date
US20230420156A1 (en) 2023-12-28
WO2022131298A1 (ja) 2022-06-23
KR20230121722A (ko) 2023-08-21
JP2023016814A (ja) 2023-02-02
TW202228997A (zh) 2022-08-01
EP4266850A1 (en) 2023-10-25
JPWO2022131298A1 (https=) 2022-06-23
TWI904301B (zh) 2025-11-11
EP4266850A4 (en) 2024-06-05
JP7323708B2 (ja) 2023-08-08

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