TWI902953B - 熱電變換材料之晶片之排列方法 - Google Patents

熱電變換材料之晶片之排列方法

Info

Publication number
TWI902953B
TWI902953B TW110140097A TW110140097A TWI902953B TW I902953 B TWI902953 B TW I902953B TW 110140097 A TW110140097 A TW 110140097A TW 110140097 A TW110140097 A TW 110140097A TW I902953 B TWI902953 B TW I902953B
Authority
TW
Taiwan
Prior art keywords
thermoelectric conversion
conversion material
type thermoelectric
fixing layer
wafers
Prior art date
Application number
TW110140097A
Other languages
English (en)
Chinese (zh)
Other versions
TW202226624A (zh
Inventor
関佑太
加藤邦久
森田亘
堀米克彦
升本睦
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW202226624A publication Critical patent/TW202226624A/zh
Application granted granted Critical
Publication of TWI902953B publication Critical patent/TWI902953B/zh

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/856—Thermoelectric active materials comprising organic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/857—Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
TW110140097A 2020-10-30 2021-10-28 熱電變換材料之晶片之排列方法 TWI902953B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020182614 2020-10-30
JP2020-182614 2020-10-30

Publications (2)

Publication Number Publication Date
TW202226624A TW202226624A (zh) 2022-07-01
TWI902953B true TWI902953B (zh) 2025-11-01

Family

ID=81382593

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110140097A TWI902953B (zh) 2020-10-30 2021-10-28 熱電變換材料之晶片之排列方法

Country Status (3)

Country Link
JP (1) JP7770336B2 (https=)
TW (1) TWI902953B (https=)
WO (1) WO2022092179A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201721834A (zh) * 2015-09-25 2017-06-16 英特爾股份有限公司 用於光學、壓電及射頻應用的島部轉移
TW201927552A (zh) * 2017-12-06 2019-07-16 日商三菱綜合材料股份有限公司 絕緣傳熱基板、熱電變換模組及絕緣傳熱基板之製造方法
TW202029537A (zh) * 2018-10-05 2020-08-01 日商琳得科股份有限公司 熱電變換材料之晶片
TW202036940A (zh) * 2018-08-28 2020-10-01 日商琳得科股份有限公司 熱電轉換材料的晶片的製造方法及使用由此製造方法得到的晶片的熱電轉換模組的製造方法
WO2020196709A1 (ja) * 2019-03-28 2020-10-01 リンテック株式会社 熱電変換材料のチップの製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4459428A (en) * 1982-04-28 1984-07-10 Energy Conversion Devices, Inc. Thermoelectric device and method of making same
JP3989486B2 (ja) * 2002-06-06 2007-10-10 古河電気工業株式会社 熱電素子モジュール及びその作製方法
JP4383056B2 (ja) * 2003-01-09 2009-12-16 古河電気工業株式会社 熱電素子モジュールの製造方法
JP4346332B2 (ja) 2003-03-20 2009-10-21 古河電気工業株式会社 熱電素子およびその製造方法
JP2005019767A (ja) * 2003-06-27 2005-01-20 Yamaha Corp 熱電変換モジュールの製造方法
TWI405361B (zh) 2008-12-31 2013-08-11 財團法人工業技術研究院 熱電元件及其製程、晶片堆疊結構及晶片封裝結構
KR20160028697A (ko) * 2014-09-04 2016-03-14 한국전기연구원 벌크형 소면적 열전모듈 및 그 제조방법
KR20170019109A (ko) * 2015-08-11 2017-02-21 홍익대학교 산학협력단 열전모듈의 제조방법 및 이에 의해 제조된 열전모듈
WO2018139475A1 (ja) * 2017-01-27 2018-08-02 リンテック株式会社 フレキシブル熱電変換素子及びその製造方法
CN110494997A (zh) 2017-03-30 2019-11-22 琳得科株式会社 热电转换模块及其制造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201721834A (zh) * 2015-09-25 2017-06-16 英特爾股份有限公司 用於光學、壓電及射頻應用的島部轉移
TW201927552A (zh) * 2017-12-06 2019-07-16 日商三菱綜合材料股份有限公司 絕緣傳熱基板、熱電變換模組及絕緣傳熱基板之製造方法
TW202036940A (zh) * 2018-08-28 2020-10-01 日商琳得科股份有限公司 熱電轉換材料的晶片的製造方法及使用由此製造方法得到的晶片的熱電轉換模組的製造方法
TW202029537A (zh) * 2018-10-05 2020-08-01 日商琳得科股份有限公司 熱電變換材料之晶片
WO2020196709A1 (ja) * 2019-03-28 2020-10-01 リンテック株式会社 熱電変換材料のチップの製造方法

Also Published As

Publication number Publication date
JP7770336B2 (ja) 2025-11-14
JPWO2022092179A1 (https=) 2022-05-05
WO2022092179A1 (ja) 2022-05-05
TW202226624A (zh) 2022-07-01

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