JP7770336B2 - 熱電変換材料のチップの配列方法 - Google Patents

熱電変換材料のチップの配列方法

Info

Publication number
JP7770336B2
JP7770336B2 JP2022559217A JP2022559217A JP7770336B2 JP 7770336 B2 JP7770336 B2 JP 7770336B2 JP 2022559217 A JP2022559217 A JP 2022559217A JP 2022559217 A JP2022559217 A JP 2022559217A JP 7770336 B2 JP7770336 B2 JP 7770336B2
Authority
JP
Japan
Prior art keywords
thermoelectric conversion
conversion material
chips
type thermoelectric
fixing layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022559217A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022092179A1 (https=
Inventor
佑太 関
邦久 加藤
亘 森田
克彦 堀米
睦 升本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of JPWO2022092179A1 publication Critical patent/JPWO2022092179A1/ja
Application granted granted Critical
Publication of JP7770336B2 publication Critical patent/JP7770336B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/856—Thermoelectric active materials comprising organic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/857—Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
JP2022559217A 2020-10-30 2021-10-28 熱電変換材料のチップの配列方法 Active JP7770336B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020182614 2020-10-30
JP2020182614 2020-10-30
PCT/JP2021/039752 WO2022092179A1 (ja) 2020-10-30 2021-10-28 熱電変換材料のチップの配列方法

Publications (2)

Publication Number Publication Date
JPWO2022092179A1 JPWO2022092179A1 (https=) 2022-05-05
JP7770336B2 true JP7770336B2 (ja) 2025-11-14

Family

ID=81382593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022559217A Active JP7770336B2 (ja) 2020-10-30 2021-10-28 熱電変換材料のチップの配列方法

Country Status (3)

Country Link
JP (1) JP7770336B2 (https=)
TW (1) TWI902953B (https=)
WO (1) WO2022092179A1 (https=)

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003105244A1 (ja) 2002-01-01 2003-12-18 古河電気工業株式会社 熱電素子モジュール及びその作製方法
JP2004221109A (ja) 2003-01-09 2004-08-05 Furukawa Electric Co Ltd:The 熱電素子モジュール及びその製造方法
JP2004288819A (ja) 2003-03-20 2004-10-14 Furukawa Electric Co Ltd:The 熱電素子およびその製造方法
JP2005019767A (ja) 2003-06-27 2005-01-20 Yamaha Corp 熱電変換モジュールの製造方法
US20100163090A1 (en) 2008-12-31 2010-07-01 Industrial Technology Research Institute Thermoelectric device and fabrication method thereof, chip stack structure, and chip package structure
WO2017052646A1 (en) 2015-09-25 2017-03-30 Intel Corporation Island transfer for optical, piezo and rf applications
WO2018139475A1 (ja) 2017-01-27 2018-08-02 リンテック株式会社 フレキシブル熱電変換素子及びその製造方法
WO2018181661A1 (ja) 2017-03-30 2018-10-04 リンテック株式会社 熱電変換デバイス
JP2019102808A (ja) 2017-12-06 2019-06-24 三菱マテリアル株式会社 絶縁伝熱基板、熱電変換モジュール、及び、絶縁伝熱基板の製造方法
WO2020045376A1 (ja) 2018-08-28 2020-03-05 リンテック株式会社 熱電変換材料のチップの製造方法及びその製造方法により得られたチップを用いた熱電変換モジュールの製造方法
WO2020071424A1 (ja) 2018-10-05 2020-04-09 リンテック株式会社 熱電変換材料のチップ
WO2020196709A1 (ja) 2019-03-28 2020-10-01 リンテック株式会社 熱電変換材料のチップの製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4459428A (en) * 1982-04-28 1984-07-10 Energy Conversion Devices, Inc. Thermoelectric device and method of making same
KR20160028697A (ko) * 2014-09-04 2016-03-14 한국전기연구원 벌크형 소면적 열전모듈 및 그 제조방법
KR20170019109A (ko) * 2015-08-11 2017-02-21 홍익대학교 산학협력단 열전모듈의 제조방법 및 이에 의해 제조된 열전모듈

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003105244A1 (ja) 2002-01-01 2003-12-18 古河電気工業株式会社 熱電素子モジュール及びその作製方法
JP2004221109A (ja) 2003-01-09 2004-08-05 Furukawa Electric Co Ltd:The 熱電素子モジュール及びその製造方法
JP2004288819A (ja) 2003-03-20 2004-10-14 Furukawa Electric Co Ltd:The 熱電素子およびその製造方法
JP2005019767A (ja) 2003-06-27 2005-01-20 Yamaha Corp 熱電変換モジュールの製造方法
US20100163090A1 (en) 2008-12-31 2010-07-01 Industrial Technology Research Institute Thermoelectric device and fabrication method thereof, chip stack structure, and chip package structure
WO2017052646A1 (en) 2015-09-25 2017-03-30 Intel Corporation Island transfer for optical, piezo and rf applications
WO2018139475A1 (ja) 2017-01-27 2018-08-02 リンテック株式会社 フレキシブル熱電変換素子及びその製造方法
WO2018181661A1 (ja) 2017-03-30 2018-10-04 リンテック株式会社 熱電変換デバイス
WO2018179544A1 (ja) 2017-03-30 2018-10-04 リンテック株式会社 熱電変換モジュール及びその製造方法
WO2018181660A1 (ja) 2017-03-30 2018-10-04 リンテック株式会社 熱電変換素子層及びその製造方法
JP2019102808A (ja) 2017-12-06 2019-06-24 三菱マテリアル株式会社 絶縁伝熱基板、熱電変換モジュール、及び、絶縁伝熱基板の製造方法
WO2020045376A1 (ja) 2018-08-28 2020-03-05 リンテック株式会社 熱電変換材料のチップの製造方法及びその製造方法により得られたチップを用いた熱電変換モジュールの製造方法
WO2020071424A1 (ja) 2018-10-05 2020-04-09 リンテック株式会社 熱電変換材料のチップ
WO2020196709A1 (ja) 2019-03-28 2020-10-01 リンテック株式会社 熱電変換材料のチップの製造方法

Also Published As

Publication number Publication date
TWI902953B (zh) 2025-11-01
JPWO2022092179A1 (https=) 2022-05-05
WO2022092179A1 (ja) 2022-05-05
TW202226624A (zh) 2022-07-01

Similar Documents

Publication Publication Date Title
TWI761485B (zh) 熱電變換元件層及其製造方法
TWI816864B (zh) 熱電轉換材料的晶片的製造方法及使用由此製造方法得到的晶片的熱電轉換模組的製造方法
CN103764396B (zh) 具有包含结晶嵌段共聚物复合材料或嵌段共聚物复合材料树脂的层的多层基于聚烯烃的膜
JP2022159549A (ja) 光電池モジュール、光電池封止剤、及び光電池モジュールを製造する方法
TWI853833B (zh) 熱電轉換材料的晶片的製造方法及使用由此製造方法得到的晶片的熱電轉換模組的製造方法
JP7129110B2 (ja) 積層体及び硬化封止体の製造方法
JP7778715B2 (ja) 熱電変換モジュール
JP7770336B2 (ja) 熱電変換材料のチップの配列方法
US20260040694A1 (en) Reflective grid for photovoltaic module film and process
JP2013189493A (ja) 離型フィルム及びこれを用いた成型方法
JP2024547162A5 (https=)
JP2011176261A (ja) 太陽電池封止シート及び太陽電池モジュール
CN113707744A (zh) 一种光伏电池片用连接膜
TW202338544A (zh) 溫度控制模組
JP7770335B2 (ja) 熱電変換モジュールの製造方法
WO2023276559A1 (ja) 半導体封止体
Chen et al. HAZ-free Direct Laser Machining on Silicone-Based Flexible Hybrid Electronics
JP2012023106A (ja) 太陽電池用封止シート及びその製造方法
WO2025115422A1 (ja) 粘着性フィルムおよび電子装置の製造方法
CN117467364A (zh) 一种封装胶膜及其制备方法和应用
JP2011119357A (ja) 太陽電池樹脂封止シート
JP2011115988A (ja) 太陽電池樹脂封止シートの製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240820

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250722

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250919

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20251007

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20251104

R150 Certificate of patent or registration of utility model

Ref document number: 7770336

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150