JPWO2022092179A1 - - Google Patents

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Publication number
JPWO2022092179A1
JPWO2022092179A1 JP2022559217A JP2022559217A JPWO2022092179A1 JP WO2022092179 A1 JPWO2022092179 A1 JP WO2022092179A1 JP 2022559217 A JP2022559217 A JP 2022559217A JP 2022559217 A JP2022559217 A JP 2022559217A JP WO2022092179 A1 JPWO2022092179 A1 JP WO2022092179A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2022559217A
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Japanese (ja)
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JP7770336B2 (ja
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Publication of JPWO2022092179A1 publication Critical patent/JPWO2022092179A1/ja
Application granted granted Critical
Publication of JP7770336B2 publication Critical patent/JP7770336B2/ja
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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/856—Thermoelectric active materials comprising organic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/857—Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
JP2022559217A 2020-10-30 2021-10-28 熱電変換材料のチップの配列方法 Active JP7770336B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020182614 2020-10-30
JP2020182614 2020-10-30
PCT/JP2021/039752 WO2022092179A1 (ja) 2020-10-30 2021-10-28 熱電変換材料のチップの配列方法

Publications (2)

Publication Number Publication Date
JPWO2022092179A1 true JPWO2022092179A1 (https=) 2022-05-05
JP7770336B2 JP7770336B2 (ja) 2025-11-14

Family

ID=81382593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022559217A Active JP7770336B2 (ja) 2020-10-30 2021-10-28 熱電変換材料のチップの配列方法

Country Status (3)

Country Link
JP (1) JP7770336B2 (https=)
TW (1) TWI902953B (https=)
WO (1) WO2022092179A1 (https=)

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58212377A (ja) * 1982-04-28 1983-12-10 エナ−ジ−・コンバ−シヨン・デバイセス・インコ−ポレ−テツド 改良された熱電気デバイスとその製法
WO2003105244A1 (ja) * 2002-01-01 2003-12-18 古河電気工業株式会社 熱電素子モジュール及びその作製方法
JP2004221109A (ja) * 2003-01-09 2004-08-05 Furukawa Electric Co Ltd:The 熱電素子モジュール及びその製造方法
JP2004288819A (ja) * 2003-03-20 2004-10-14 Furukawa Electric Co Ltd:The 熱電素子およびその製造方法
JP2005019767A (ja) * 2003-06-27 2005-01-20 Yamaha Corp 熱電変換モジュールの製造方法
US20100163090A1 (en) * 2008-12-31 2010-07-01 Industrial Technology Research Institute Thermoelectric device and fabrication method thereof, chip stack structure, and chip package structure
KR20160028697A (ko) * 2014-09-04 2016-03-14 한국전기연구원 벌크형 소면적 열전모듈 및 그 제조방법
KR20170019109A (ko) * 2015-08-11 2017-02-21 홍익대학교 산학협력단 열전모듈의 제조방법 및 이에 의해 제조된 열전모듈
WO2017052646A1 (en) * 2015-09-25 2017-03-30 Intel Corporation Island transfer for optical, piezo and rf applications
WO2018139475A1 (ja) * 2017-01-27 2018-08-02 リンテック株式会社 フレキシブル熱電変換素子及びその製造方法
WO2018179544A1 (ja) * 2017-03-30 2018-10-04 リンテック株式会社 熱電変換モジュール及びその製造方法
JP2019102808A (ja) * 2017-12-06 2019-06-24 三菱マテリアル株式会社 絶縁伝熱基板、熱電変換モジュール、及び、絶縁伝熱基板の製造方法
WO2020045376A1 (ja) * 2018-08-28 2020-03-05 リンテック株式会社 熱電変換材料のチップの製造方法及びその製造方法により得られたチップを用いた熱電変換モジュールの製造方法
WO2020071424A1 (ja) * 2018-10-05 2020-04-09 リンテック株式会社 熱電変換材料のチップ
WO2020196709A1 (ja) * 2019-03-28 2020-10-01 リンテック株式会社 熱電変換材料のチップの製造方法

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58212377A (ja) * 1982-04-28 1983-12-10 エナ−ジ−・コンバ−シヨン・デバイセス・インコ−ポレ−テツド 改良された熱電気デバイスとその製法
WO2003105244A1 (ja) * 2002-01-01 2003-12-18 古河電気工業株式会社 熱電素子モジュール及びその作製方法
JP2004221109A (ja) * 2003-01-09 2004-08-05 Furukawa Electric Co Ltd:The 熱電素子モジュール及びその製造方法
JP2004288819A (ja) * 2003-03-20 2004-10-14 Furukawa Electric Co Ltd:The 熱電素子およびその製造方法
JP2005019767A (ja) * 2003-06-27 2005-01-20 Yamaha Corp 熱電変換モジュールの製造方法
US20100163090A1 (en) * 2008-12-31 2010-07-01 Industrial Technology Research Institute Thermoelectric device and fabrication method thereof, chip stack structure, and chip package structure
KR20160028697A (ko) * 2014-09-04 2016-03-14 한국전기연구원 벌크형 소면적 열전모듈 및 그 제조방법
KR20170019109A (ko) * 2015-08-11 2017-02-21 홍익대학교 산학협력단 열전모듈의 제조방법 및 이에 의해 제조된 열전모듈
WO2017052646A1 (en) * 2015-09-25 2017-03-30 Intel Corporation Island transfer for optical, piezo and rf applications
WO2018139475A1 (ja) * 2017-01-27 2018-08-02 リンテック株式会社 フレキシブル熱電変換素子及びその製造方法
WO2018179544A1 (ja) * 2017-03-30 2018-10-04 リンテック株式会社 熱電変換モジュール及びその製造方法
WO2018181661A1 (ja) * 2017-03-30 2018-10-04 リンテック株式会社 熱電変換デバイス
WO2018181660A1 (ja) * 2017-03-30 2018-10-04 リンテック株式会社 熱電変換素子層及びその製造方法
JP2019102808A (ja) * 2017-12-06 2019-06-24 三菱マテリアル株式会社 絶縁伝熱基板、熱電変換モジュール、及び、絶縁伝熱基板の製造方法
WO2020045376A1 (ja) * 2018-08-28 2020-03-05 リンテック株式会社 熱電変換材料のチップの製造方法及びその製造方法により得られたチップを用いた熱電変換モジュールの製造方法
WO2020071424A1 (ja) * 2018-10-05 2020-04-09 リンテック株式会社 熱電変換材料のチップ
WO2020196709A1 (ja) * 2019-03-28 2020-10-01 リンテック株式会社 熱電変換材料のチップの製造方法

Also Published As

Publication number Publication date
TWI902953B (zh) 2025-11-01
JP7770336B2 (ja) 2025-11-14
WO2022092179A1 (ja) 2022-05-05
TW202226624A (zh) 2022-07-01

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