TWI890761B - 熱電變換模組 - Google Patents

熱電變換模組

Info

Publication number
TWI890761B
TWI890761B TW110110348A TW110110348A TWI890761B TW I890761 B TWI890761 B TW I890761B TW 110110348 A TW110110348 A TW 110110348A TW 110110348 A TW110110348 A TW 110110348A TW I890761 B TWI890761 B TW I890761B
Authority
TW
Taiwan
Prior art keywords
thermoelectric conversion
thermoelectric
conversion material
material layer
mass
Prior art date
Application number
TW110110348A
Other languages
English (en)
Chinese (zh)
Other versions
TW202141816A (zh
Inventor
山崎俊
加藤邦久
関佑太
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW202141816A publication Critical patent/TW202141816A/zh
Application granted granted Critical
Publication of TWI890761B publication Critical patent/TWI890761B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/855—Thermoelectric active materials comprising inorganic compositions comprising compounds containing boron, carbon, oxygen or nitrogen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/857—Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW110110348A 2020-03-25 2021-03-23 熱電變換模組 TWI890761B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-054840 2020-03-25
JP2020054840 2020-03-25

Publications (2)

Publication Number Publication Date
TW202141816A TW202141816A (zh) 2021-11-01
TWI890761B true TWI890761B (zh) 2025-07-21

Family

ID=77891711

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110110348A TWI890761B (zh) 2020-03-25 2021-03-23 熱電變換模組

Country Status (5)

Country Link
US (1) US12239020B2 (https=)
JP (1) JPWO2021193357A1 (https=)
CN (1) CN115336017A (https=)
TW (1) TWI890761B (https=)
WO (1) WO2021193357A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101656292A (zh) * 2009-09-16 2010-02-24 北京科技大学 一种铋碲系纳米多孔热电材料的制备方法
WO2018143598A1 (ko) * 2017-02-01 2018-08-09 엘지이노텍 주식회사 열전 소결체 및 열전소자
CN108963064A (zh) * 2017-12-28 2018-12-07 中国科学院物理研究所 热压烧结装置、微纳多孔结构的块体热电材料及其制法
TW201917917A (zh) * 2017-07-05 2019-05-01 日商三菱綜合材料股份有限公司 熱電變換模組及熱電變換模組之製造方法
TW201941462A (zh) * 2018-03-26 2019-10-16 日商琳得科股份有限公司 熱電變換模組

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6442184A (en) * 1987-08-08 1989-02-14 Daiwa Shinku Corp Manufacture of thermocouple
JP2002033525A (ja) * 2000-07-13 2002-01-31 Nhk Spring Co Ltd 熱電素子とその製造方法
WO2008140596A2 (en) * 2006-12-01 2008-11-20 Massachusetts Institute Of Technology (Mit) Methods for high figure-of-merit in nanostructured thermoelectric materials
CN104465977B (zh) * 2011-07-20 2018-05-01 中弥浩明 热电转变元件和热电转变发电装置
JP2013219095A (ja) * 2012-04-05 2013-10-24 Toyota Industries Corp 熱電材料及びその製造方法
KR102445974B1 (ko) * 2014-12-26 2022-09-21 린텍 가부시키가이샤 펠티에 냉각 소자 및 그의 제조 방법
JP6644522B2 (ja) * 2015-11-18 2020-02-12 日東電工株式会社 半導体装置の製造方法
JP6721317B2 (ja) * 2015-11-18 2020-07-15 日東電工株式会社 半導体装置の製造方法
EP3475990B1 (en) * 2016-06-23 2020-08-05 3M Innovative Properties Company Thermoelectric tape
CN110431676A (zh) * 2017-03-16 2019-11-08 琳得科株式会社 热电转换模块用电极材料及使用其的热电转换模块
US10892396B2 (en) * 2018-06-19 2021-01-12 The Regents Of The University Of Michigan Stabilized copper selenide thermoelectric materials and methods of fabrication thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101656292A (zh) * 2009-09-16 2010-02-24 北京科技大学 一种铋碲系纳米多孔热电材料的制备方法
WO2018143598A1 (ko) * 2017-02-01 2018-08-09 엘지이노텍 주식회사 열전 소결체 및 열전소자
TW201917917A (zh) * 2017-07-05 2019-05-01 日商三菱綜合材料股份有限公司 熱電變換模組及熱電變換模組之製造方法
CN108963064A (zh) * 2017-12-28 2018-12-07 中国科学院物理研究所 热压烧结装置、微纳多孔结构的块体热电材料及其制法
TW201941462A (zh) * 2018-03-26 2019-10-16 日商琳得科股份有限公司 熱電變換模組

Also Published As

Publication number Publication date
CN115336017A (zh) 2022-11-11
TW202141816A (zh) 2021-11-01
JPWO2021193357A1 (https=) 2021-09-30
US20230133754A1 (en) 2023-05-04
WO2021193357A1 (ja) 2021-09-30
US12239020B2 (en) 2025-02-25

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