JPWO2021193357A1 - - Google Patents
Info
- Publication number
- JPWO2021193357A1 JPWO2021193357A1 JP2022510042A JP2022510042A JPWO2021193357A1 JP WO2021193357 A1 JPWO2021193357 A1 JP WO2021193357A1 JP 2022510042 A JP2022510042 A JP 2022510042A JP 2022510042 A JP2022510042 A JP 2022510042A JP WO2021193357 A1 JPWO2021193357 A1 JP WO2021193357A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/857—Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/855—Thermoelectric active materials comprising inorganic compositions comprising compounds containing boron, carbon, oxygen or nitrogen
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020054840 | 2020-03-25 | ||
| PCT/JP2021/011109 WO2021193357A1 (ja) | 2020-03-25 | 2021-03-18 | 熱電変換モジュール |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021193357A1 true JPWO2021193357A1 (https=) | 2021-09-30 |
Family
ID=77891711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022510042A Pending JPWO2021193357A1 (https=) | 2020-03-25 | 2021-03-18 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12239020B2 (https=) |
| JP (1) | JPWO2021193357A1 (https=) |
| CN (1) | CN115336017A (https=) |
| TW (1) | TWI890761B (https=) |
| WO (1) | WO2021193357A1 (https=) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6442184A (en) * | 1987-08-08 | 1989-02-14 | Daiwa Shinku Corp | Manufacture of thermocouple |
| JP2002033525A (ja) * | 2000-07-13 | 2002-01-31 | Nhk Spring Co Ltd | 熱電素子とその製造方法 |
| JP2010512011A (ja) * | 2006-12-01 | 2010-04-15 | マサチユセツツ・インスチチユート・オブ・テクノロジイ | ナノ構造をもつ熱電材料における高い示性数のための方法 |
| JP2013219095A (ja) * | 2012-04-05 | 2013-10-24 | Toyota Industries Corp | 熱電材料及びその製造方法 |
| WO2016104615A1 (ja) * | 2014-12-26 | 2016-06-30 | リンテック株式会社 | ペルチェ冷却素子及びその製造方法 |
| JP2017098284A (ja) * | 2015-11-18 | 2017-06-01 | 日東電工株式会社 | 半導体装置の製造方法 |
| JP2017098282A (ja) * | 2015-11-18 | 2017-06-01 | 日東電工株式会社 | 半導体装置の製造方法 |
| WO2018168837A1 (ja) * | 2017-03-16 | 2018-09-20 | リンテック株式会社 | 熱電変換モジュール用電極材料及びそれを用いた熱電変換モジュール |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101656292B (zh) | 2009-09-16 | 2011-04-20 | 北京科技大学 | 一种铋碲系纳米多孔热电材料的制备方法 |
| CN104465977B (zh) * | 2011-07-20 | 2018-05-01 | 中弥浩明 | 热电转变元件和热电转变发电装置 |
| EP3475990B1 (en) * | 2016-06-23 | 2020-08-05 | 3M Innovative Properties Company | Thermoelectric tape |
| WO2018143598A1 (ko) | 2017-02-01 | 2018-08-09 | 엘지이노텍 주식회사 | 열전 소결체 및 열전소자 |
| WO2019009202A1 (ja) | 2017-07-05 | 2019-01-10 | 三菱マテリアル株式会社 | 熱電変換モジュール、及び、熱電変換モジュールの製造方法 |
| CN108963064B (zh) | 2017-12-28 | 2019-11-29 | 中国科学院物理研究所 | 热压烧结装置、微纳多孔结构的块体热电材料及其制法 |
| US20210098672A1 (en) | 2018-03-26 | 2021-04-01 | Lintec Corporation | Thermoelectric conversion module |
| US10892396B2 (en) * | 2018-06-19 | 2021-01-12 | The Regents Of The University Of Michigan | Stabilized copper selenide thermoelectric materials and methods of fabrication thereof |
-
2021
- 2021-03-18 WO PCT/JP2021/011109 patent/WO2021193357A1/ja not_active Ceased
- 2021-03-18 US US17/913,487 patent/US12239020B2/en active Active
- 2021-03-18 CN CN202180024577.4A patent/CN115336017A/zh active Pending
- 2021-03-18 JP JP2022510042A patent/JPWO2021193357A1/ja active Pending
- 2021-03-23 TW TW110110348A patent/TWI890761B/zh active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6442184A (en) * | 1987-08-08 | 1989-02-14 | Daiwa Shinku Corp | Manufacture of thermocouple |
| JP2002033525A (ja) * | 2000-07-13 | 2002-01-31 | Nhk Spring Co Ltd | 熱電素子とその製造方法 |
| JP2010512011A (ja) * | 2006-12-01 | 2010-04-15 | マサチユセツツ・インスチチユート・オブ・テクノロジイ | ナノ構造をもつ熱電材料における高い示性数のための方法 |
| JP2013219095A (ja) * | 2012-04-05 | 2013-10-24 | Toyota Industries Corp | 熱電材料及びその製造方法 |
| WO2016104615A1 (ja) * | 2014-12-26 | 2016-06-30 | リンテック株式会社 | ペルチェ冷却素子及びその製造方法 |
| JP2017098284A (ja) * | 2015-11-18 | 2017-06-01 | 日東電工株式会社 | 半導体装置の製造方法 |
| JP2017098282A (ja) * | 2015-11-18 | 2017-06-01 | 日東電工株式会社 | 半導体装置の製造方法 |
| WO2018168837A1 (ja) * | 2017-03-16 | 2018-09-20 | リンテック株式会社 | 熱電変換モジュール用電極材料及びそれを用いた熱電変換モジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115336017A (zh) | 2022-11-11 |
| TW202141816A (zh) | 2021-11-01 |
| TWI890761B (zh) | 2025-07-21 |
| US20230133754A1 (en) | 2023-05-04 |
| WO2021193357A1 (ja) | 2021-09-30 |
| US12239020B2 (en) | 2025-02-25 |
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