TWI884352B - 真空系統及操作該真空系統之方法 - Google Patents

真空系統及操作該真空系統之方法 Download PDF

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Publication number
TWI884352B
TWI884352B TW111101930A TW111101930A TWI884352B TW I884352 B TWI884352 B TW I884352B TW 111101930 A TW111101930 A TW 111101930A TW 111101930 A TW111101930 A TW 111101930A TW I884352 B TWI884352 B TW I884352B
Authority
TW
Taiwan
Prior art keywords
vacuum
seal
flange
inner seal
vacuum chamber
Prior art date
Application number
TW111101930A
Other languages
English (en)
Chinese (zh)
Other versions
TW202237997A (zh
Inventor
法藍西絲 區利塞
夏儂 希爾
Original Assignee
美商科磊股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商科磊股份有限公司 filed Critical 美商科磊股份有限公司
Publication of TW202237997A publication Critical patent/TW202237997A/zh
Application granted granted Critical
Publication of TWI884352B publication Critical patent/TWI884352B/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/16—Sealings between relatively-moving surfaces
    • F16J15/32—Sealings between relatively-moving surfaces with elastic sealings, e.g. O-rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
    • B08B9/08—Cleaning containers, e.g. tanks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/002—Sealings comprising at least two sealings in succession
    • F16J15/004—Sealings comprising at least two sealings in succession forming of recuperation chamber for the leaking fluid
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/002—Sealings comprising at least two sealings in succession
    • F16J15/006—Sealings comprising at least two sealings in succession with division of the pressure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/16—Sealings between relatively-moving surfaces
    • F16J15/26—Sealings between relatively-moving surfaces with stuffing-boxes for rigid sealing rings
    • F16J15/30—Sealings between relatively-moving surfaces with stuffing-boxes for rigid sealing rings with sealing rings made of carbon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2209/00—Details of machines or methods for cleaning hollow articles
    • B08B2209/08—Details of machines or methods for cleaning containers, e.g. tanks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Toxicology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Gasket Seals (AREA)
  • Pressure Vessels And Lids Thereof (AREA)
  • Sealing Devices (AREA)
  • Drying Of Semiconductors (AREA)
TW111101930A 2021-02-12 2022-01-18 真空系統及操作該真空系統之方法 TWI884352B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US202163148625P 2021-02-12 2021-02-12
US63/148,625 2021-02-12
US17/567,071 US12044313B2 (en) 2021-02-12 2021-12-31 Dual vacuum seal
US17/567,071 2021-12-31

Publications (2)

Publication Number Publication Date
TW202237997A TW202237997A (zh) 2022-10-01
TWI884352B true TWI884352B (zh) 2025-05-21

Family

ID=82800259

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111101930A TWI884352B (zh) 2021-02-12 2022-01-18 真空系統及操作該真空系統之方法

Country Status (8)

Country Link
US (1) US12044313B2 (https=)
EP (1) EP4281691A4 (https=)
JP (1) JP7675831B2 (https=)
KR (1) KR20230145085A (https=)
CN (1) CN116724185A (https=)
IL (1) IL304266B2 (https=)
TW (1) TWI884352B (https=)
WO (1) WO2022173708A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118622988A (zh) * 2023-03-10 2024-09-10 中微半导体设备(上海)股份有限公司 一种密封结构及半导体处理装置
US20240344608A1 (en) * 2023-04-11 2024-10-17 Applied Materials, Inc. Process chamber vacuum seal leakage reduction
GB2641282A (en) * 2024-05-24 2025-11-26 Edwards Ltd Differentially pumped vibration isolator

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09263944A (ja) * 1996-03-29 1997-10-07 Furontetsuku:Kk 成膜装置
JP2004099924A (ja) * 2002-09-05 2004-04-02 Mitsubishi Heavy Ind Ltd 真空処理装置
CN103046004B (zh) * 2011-10-12 2015-05-13 上海永超真空镀铝有限公司 真空镀铝设备中蒸发器水循环系统的防漏水结构
US9234595B2 (en) * 2011-02-02 2016-01-12 Ckd Corporation Vacuum control valve and vacuum control apparatus
CN209278473U (zh) * 2018-10-10 2019-08-20 桂林实创真空数控设备有限公司 一种消除真空室变形影响的柔性密封刚性连接装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3007432B2 (ja) * 1991-02-19 2000-02-07 東京エレクトロン株式会社 熱処理装置
JPH05132762A (ja) * 1991-11-11 1993-05-28 Ulvac Japan Ltd 蒸着重合装置
JPH07180027A (ja) * 1993-12-24 1995-07-18 Kobe Steel Ltd 真空成膜装置用シール機構
KR100480819B1 (ko) * 2002-03-20 2005-04-06 엘지.필립스 엘시디 주식회사 합착기 챔버의 크리닝 방법
DE10302764A1 (de) * 2003-01-24 2004-07-29 Pfeiffer Vacuum Gmbh Vakuumpumpsystem
GB0424198D0 (en) * 2004-11-01 2004-12-01 Boc Group Plc Pumping arrangement
JP4943669B2 (ja) 2005-06-08 2012-05-30 東京エレクトロン株式会社 真空装置のシール構造
JP2008255386A (ja) * 2007-04-02 2008-10-23 Hitachi Kokusai Electric Inc 基板処理装置
GB0901872D0 (en) * 2009-02-06 2009-03-11 Edwards Ltd Multiple inlet vacuum pumps
JP5353555B2 (ja) * 2009-08-21 2013-11-27 株式会社島津製作所 電子線装置
JP5456730B2 (ja) 2011-07-20 2014-04-02 株式会社アルバック トンネル接合磁気抵抗効果素子の製造方法
JP2015074796A (ja) 2013-10-08 2015-04-20 国立大学法人東北大学 原子層堆積装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09263944A (ja) * 1996-03-29 1997-10-07 Furontetsuku:Kk 成膜装置
JP2004099924A (ja) * 2002-09-05 2004-04-02 Mitsubishi Heavy Ind Ltd 真空処理装置
US9234595B2 (en) * 2011-02-02 2016-01-12 Ckd Corporation Vacuum control valve and vacuum control apparatus
CN103046004B (zh) * 2011-10-12 2015-05-13 上海永超真空镀铝有限公司 真空镀铝设备中蒸发器水循环系统的防漏水结构
CN209278473U (zh) * 2018-10-10 2019-08-20 桂林实创真空数控设备有限公司 一种消除真空室变形影响的柔性密封刚性连接装置

Also Published As

Publication number Publication date
JP7675831B2 (ja) 2025-05-13
IL304266A (en) 2023-09-01
CN116724185A (zh) 2023-09-08
US20220260156A1 (en) 2022-08-18
TW202237997A (zh) 2022-10-01
US12044313B2 (en) 2024-07-23
EP4281691A1 (en) 2023-11-29
WO2022173708A1 (en) 2022-08-18
IL304266B1 (en) 2025-03-01
JP2024506143A (ja) 2024-02-09
IL304266B2 (en) 2025-07-01
KR20230145085A (ko) 2023-10-17
EP4281691A4 (en) 2025-01-22

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