JP7675831B2 - デュアル真空シール - Google Patents

デュアル真空シール Download PDF

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Publication number
JP7675831B2
JP7675831B2 JP2023545919A JP2023545919A JP7675831B2 JP 7675831 B2 JP7675831 B2 JP 7675831B2 JP 2023545919 A JP2023545919 A JP 2023545919A JP 2023545919 A JP2023545919 A JP 2023545919A JP 7675831 B2 JP7675831 B2 JP 7675831B2
Authority
JP
Japan
Prior art keywords
vacuum
seal
inner seal
flange
vacuum chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023545919A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024506143A5 (https=
JP2024506143A (ja
Inventor
フランク チレス
シャノン ヒル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
Original Assignee
KLA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Corp filed Critical KLA Corp
Publication of JP2024506143A publication Critical patent/JP2024506143A/ja
Publication of JP2024506143A5 publication Critical patent/JP2024506143A5/ja
Application granted granted Critical
Publication of JP7675831B2 publication Critical patent/JP7675831B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/16—Sealings between relatively-moving surfaces
    • F16J15/32—Sealings between relatively-moving surfaces with elastic sealings, e.g. O-rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
    • B08B9/08—Cleaning containers, e.g. tanks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/002—Sealings comprising at least two sealings in succession
    • F16J15/004—Sealings comprising at least two sealings in succession forming of recuperation chamber for the leaking fluid
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/002—Sealings comprising at least two sealings in succession
    • F16J15/006—Sealings comprising at least two sealings in succession with division of the pressure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/16—Sealings between relatively-moving surfaces
    • F16J15/26—Sealings between relatively-moving surfaces with stuffing-boxes for rigid sealing rings
    • F16J15/30—Sealings between relatively-moving surfaces with stuffing-boxes for rigid sealing rings with sealing rings made of carbon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2209/00—Details of machines or methods for cleaning hollow articles
    • B08B2209/08—Details of machines or methods for cleaning containers, e.g. tanks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Toxicology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Gasket Seals (AREA)
  • Pressure Vessels And Lids Thereof (AREA)
  • Sealing Devices (AREA)
  • Drying Of Semiconductors (AREA)
JP2023545919A 2021-02-12 2022-02-07 デュアル真空シール Active JP7675831B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202163148625P 2021-02-12 2021-02-12
US63/148,625 2021-02-12
US17/567,071 US12044313B2 (en) 2021-02-12 2021-12-31 Dual vacuum seal
US17/567,071 2021-12-31
PCT/US2022/015540 WO2022173708A1 (en) 2021-02-12 2022-02-07 Dual vacuum seal

Publications (3)

Publication Number Publication Date
JP2024506143A JP2024506143A (ja) 2024-02-09
JP2024506143A5 JP2024506143A5 (https=) 2024-09-27
JP7675831B2 true JP7675831B2 (ja) 2025-05-13

Family

ID=82800259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023545919A Active JP7675831B2 (ja) 2021-02-12 2022-02-07 デュアル真空シール

Country Status (8)

Country Link
US (1) US12044313B2 (https=)
EP (1) EP4281691A4 (https=)
JP (1) JP7675831B2 (https=)
KR (1) KR20230145085A (https=)
CN (1) CN116724185A (https=)
IL (1) IL304266B2 (https=)
TW (1) TWI884352B (https=)
WO (1) WO2022173708A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118622988A (zh) * 2023-03-10 2024-09-10 中微半导体设备(上海)股份有限公司 一种密封结构及半导体处理装置
US20240344608A1 (en) * 2023-04-11 2024-10-17 Applied Materials, Inc. Process chamber vacuum seal leakage reduction
GB2641282A (en) * 2024-05-24 2025-11-26 Edwards Ltd Differentially pumped vibration isolator

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004099924A (ja) 2002-09-05 2004-04-02 Mitsubishi Heavy Ind Ltd 真空処理装置
JP2008255386A (ja) 2007-04-02 2008-10-23 Hitachi Kokusai Electric Inc 基板処理装置
JP2012007241A (ja) 2011-07-20 2012-01-12 Ulvac Japan Ltd トンネル接合磁気抵抗効果素子の製造方法
JP2015074796A (ja) 2013-10-08 2015-04-20 国立大学法人東北大学 原子層堆積装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3007432B2 (ja) * 1991-02-19 2000-02-07 東京エレクトロン株式会社 熱処理装置
JPH05132762A (ja) * 1991-11-11 1993-05-28 Ulvac Japan Ltd 蒸着重合装置
JPH07180027A (ja) * 1993-12-24 1995-07-18 Kobe Steel Ltd 真空成膜装置用シール機構
JP3644556B2 (ja) 1996-03-29 2005-04-27 アルプス電気株式会社 成膜装置
KR100480819B1 (ko) * 2002-03-20 2005-04-06 엘지.필립스 엘시디 주식회사 합착기 챔버의 크리닝 방법
DE10302764A1 (de) * 2003-01-24 2004-07-29 Pfeiffer Vacuum Gmbh Vakuumpumpsystem
GB0424198D0 (en) * 2004-11-01 2004-12-01 Boc Group Plc Pumping arrangement
JP4943669B2 (ja) 2005-06-08 2012-05-30 東京エレクトロン株式会社 真空装置のシール構造
GB0901872D0 (en) * 2009-02-06 2009-03-11 Edwards Ltd Multiple inlet vacuum pumps
JP5353555B2 (ja) * 2009-08-21 2013-11-27 株式会社島津製作所 電子線装置
JP5166655B2 (ja) * 2011-02-02 2013-03-21 Ｃｋｄ株式会社 真空制御バルブ、真空制御装置、およびコンピュータプログラム
CN103046004B (zh) * 2011-10-12 2015-05-13 上海永超真空镀铝有限公司 真空镀铝设备中蒸发器水循环系统的防漏水结构
CN209278473U (zh) * 2018-10-10 2019-08-20 桂林实创真空数控设备有限公司 一种消除真空室变形影响的柔性密封刚性连接装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004099924A (ja) 2002-09-05 2004-04-02 Mitsubishi Heavy Ind Ltd 真空処理装置
JP2008255386A (ja) 2007-04-02 2008-10-23 Hitachi Kokusai Electric Inc 基板処理装置
JP2012007241A (ja) 2011-07-20 2012-01-12 Ulvac Japan Ltd トンネル接合磁気抵抗効果素子の製造方法
JP2015074796A (ja) 2013-10-08 2015-04-20 国立大学法人東北大学 原子層堆積装置

Also Published As

Publication number Publication date
TWI884352B (zh) 2025-05-21
IL304266A (en) 2023-09-01
CN116724185A (zh) 2023-09-08
US20220260156A1 (en) 2022-08-18
TW202237997A (zh) 2022-10-01
US12044313B2 (en) 2024-07-23
EP4281691A1 (en) 2023-11-29
WO2022173708A1 (en) 2022-08-18
IL304266B1 (en) 2025-03-01
JP2024506143A (ja) 2024-02-09
IL304266B2 (en) 2025-07-01
KR20230145085A (ko) 2023-10-17
EP4281691A4 (en) 2025-01-22

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