TWI876401B - 能量射線硬化型膜狀透明接著劑、含有其之裝置及該裝置之製造方法 - Google Patents

能量射線硬化型膜狀透明接著劑、含有其之裝置及該裝置之製造方法 Download PDF

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Publication number
TWI876401B
TWI876401B TW112124138A TW112124138A TWI876401B TW I876401 B TWI876401 B TW I876401B TW 112124138 A TW112124138 A TW 112124138A TW 112124138 A TW112124138 A TW 112124138A TW I876401 B TWI876401 B TW I876401B
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TW
Taiwan
Prior art keywords
film
adhesive
curing
transparent adhesive
mass
Prior art date
Application number
TW112124138A
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English (en)
Chinese (zh)
Other versions
TW202403000A (zh
Inventor
坂井小雪
徳久憲司
Original Assignee
日商古河電氣工業股份有限公司
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Application filed by 日商古河電氣工業股份有限公司 filed Critical 日商古河電氣工業股份有限公司
Publication of TW202403000A publication Critical patent/TW202403000A/zh
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Publication of TWI876401B publication Critical patent/TWI876401B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
TW112124138A 2022-06-30 2023-06-28 能量射線硬化型膜狀透明接著劑、含有其之裝置及該裝置之製造方法 TWI876401B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022105913 2022-06-30
JP2022-105913 2022-06-30

Publications (2)

Publication Number Publication Date
TW202403000A TW202403000A (zh) 2024-01-16
TWI876401B true TWI876401B (zh) 2025-03-11

Family

ID=89382422

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112124138A TWI876401B (zh) 2022-06-30 2023-06-28 能量射線硬化型膜狀透明接著劑、含有其之裝置及該裝置之製造方法

Country Status (5)

Country Link
JP (1) JP7470885B1 (https=)
KR (1) KR20250026151A (https=)
CN (1) CN119032146A (https=)
TW (1) TWI876401B (https=)
WO (1) WO2024005071A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002254660A (ja) * 2000-12-28 2002-09-11 Canon Inc インクジェットヘッドの製造方法およびその製造方法によるインクジェットヘッド
TW200402456A (en) * 2002-06-17 2004-02-16 Sekisui Chemical Co Ltd Adhesive, tape and a double side adhensive tape for sealing organic electroluminescent element; an organic electroluminescent element and method thereof
TW202122444A (zh) * 2019-12-11 2021-06-16 日商三鍵有限公司 陽離子硬化性組成物、硬化物及接合體
TW202219630A (zh) * 2020-07-16 2022-05-16 日商住友電木股份有限公司 感光性樹脂組成物、電子裝置之製造方法、電子裝置及感光性樹脂組成物之製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4075409B2 (ja) * 2002-02-28 2008-04-16 日立化成工業株式会社 接着フィルム及びそれを用いた電極の接続構造
JP2006233203A (ja) * 2005-01-31 2006-09-07 Asahi Kasei Electronics Co Ltd 異方導電性接着剤フィルム
JP2007197617A (ja) * 2006-01-29 2007-08-09 Nitto Denko Corp 接着フィルム
KR101832522B1 (ko) * 2013-11-29 2018-04-04 주식회사 엘지화학 접착 필름 형성용 조성물, 광경화전 가공용 점착 필름, 접착 필름 및 전자종이 표시장치
JP6490999B2 (ja) * 2015-03-16 2019-03-27 デクセリアルズ株式会社 接続構造体、及び接続構造体の製造方法
MX2017015550A (es) * 2015-06-04 2018-04-11 3M Innovative Properties Co Métodos para unir aditamentos al vidrio de vehículos.
JP7138511B2 (ja) 2018-08-13 2022-09-16 リンテック株式会社 粘着剤、粘着シートおよび表示体
WO2020196240A1 (ja) 2019-03-28 2020-10-01 リンテック株式会社 シート状接着剤、封止シート、電子デバイスの封止体、及び、電子デバイスの封止体の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002254660A (ja) * 2000-12-28 2002-09-11 Canon Inc インクジェットヘッドの製造方法およびその製造方法によるインクジェットヘッド
TW200402456A (en) * 2002-06-17 2004-02-16 Sekisui Chemical Co Ltd Adhesive, tape and a double side adhensive tape for sealing organic electroluminescent element; an organic electroluminescent element and method thereof
TW202122444A (zh) * 2019-12-11 2021-06-16 日商三鍵有限公司 陽離子硬化性組成物、硬化物及接合體
TW202219630A (zh) * 2020-07-16 2022-05-16 日商住友電木股份有限公司 感光性樹脂組成物、電子裝置之製造方法、電子裝置及感光性樹脂組成物之製造方法

Also Published As

Publication number Publication date
WO2024005071A1 (ja) 2024-01-04
JPWO2024005071A1 (https=) 2024-01-04
JP7470885B1 (ja) 2024-04-18
CN119032146A (zh) 2024-11-26
KR20250026151A (ko) 2025-02-25
TW202403000A (zh) 2024-01-16

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