KR20250026151A - 에너지선 경화성 필름형 투명 접착제, 이를 포함하는 디바이스 및 그 디바이스의 제조 방법 - Google Patents

에너지선 경화성 필름형 투명 접착제, 이를 포함하는 디바이스 및 그 디바이스의 제조 방법 Download PDF

Info

Publication number
KR20250026151A
KR20250026151A KR1020247033162A KR20247033162A KR20250026151A KR 20250026151 A KR20250026151 A KR 20250026151A KR 1020247033162 A KR1020247033162 A KR 1020247033162A KR 20247033162 A KR20247033162 A KR 20247033162A KR 20250026151 A KR20250026151 A KR 20250026151A
Authority
KR
South Korea
Prior art keywords
film
adhesive
type
energy
transparent adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247033162A
Other languages
English (en)
Korean (ko)
Inventor
코유키 사카이
켄지 토쿠히사
Original Assignee
후루카와 덴키 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후루카와 덴키 고교 가부시키가이샤 filed Critical 후루카와 덴키 고교 가부시키가이샤
Publication of KR20250026151A publication Critical patent/KR20250026151A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
KR1020247033162A 2022-06-30 2023-06-28 에너지선 경화성 필름형 투명 접착제, 이를 포함하는 디바이스 및 그 디바이스의 제조 방법 Pending KR20250026151A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022105913 2022-06-30
JPJP-P-2022-105913 2022-06-30
PCT/JP2023/023974 WO2024005071A1 (ja) 2022-06-30 2023-06-28 エネルギー線硬化型フィルム状透明接着剤、これを含むデバイス及び該デバイスの製造方法

Publications (1)

Publication Number Publication Date
KR20250026151A true KR20250026151A (ko) 2025-02-25

Family

ID=89382422

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247033162A Pending KR20250026151A (ko) 2022-06-30 2023-06-28 에너지선 경화성 필름형 투명 접착제, 이를 포함하는 디바이스 및 그 디바이스의 제조 방법

Country Status (5)

Country Link
JP (1) JP7470885B1 (https=)
KR (1) KR20250026151A (https=)
CN (1) CN119032146A (https=)
TW (1) TWI876401B (https=)
WO (1) WO2024005071A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020026491A (ja) 2018-08-13 2020-02-20 リンテック株式会社 接着剤、粘着シートおよび表示体
WO2020196240A1 (ja) 2019-03-28 2020-10-01 リンテック株式会社 シート状接着剤、封止シート、電子デバイスの封止体、及び、電子デバイスの封止体の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4078070B2 (ja) * 2000-12-28 2008-04-23 キヤノン株式会社 インクジェットヘッドの製造方法
JP4075409B2 (ja) * 2002-02-28 2008-04-16 日立化成工業株式会社 接着フィルム及びそれを用いた電極の接続構造
KR101028603B1 (ko) * 2002-06-17 2011-04-11 세키스이가가쿠 고교가부시키가이샤 유기 전계 발광 소자 밀봉용 접착제 및 그의 응용
JP2006233203A (ja) * 2005-01-31 2006-09-07 Asahi Kasei Electronics Co Ltd 異方導電性接着剤フィルム
JP2007197617A (ja) * 2006-01-29 2007-08-09 Nitto Denko Corp 接着フィルム
KR101832522B1 (ko) * 2013-11-29 2018-04-04 주식회사 엘지화학 접착 필름 형성용 조성물, 광경화전 가공용 점착 필름, 접착 필름 및 전자종이 표시장치
JP6490999B2 (ja) * 2015-03-16 2019-03-27 デクセリアルズ株式会社 接続構造体、及び接続構造体の製造方法
MX2017015550A (es) * 2015-06-04 2018-04-11 3M Innovative Properties Co Métodos para unir aditamentos al vidrio de vehículos.
WO2021117396A1 (ja) * 2019-12-11 2021-06-17 株式会社スリーボンド カチオン硬化性組成物、硬化物および接合体
JP2022019609A (ja) * 2020-07-16 2022-01-27 住友ベークライト株式会社 感光性樹脂組成物、電子デバイスの製造方法、電子デバイスおよび感光性樹脂組成物の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020026491A (ja) 2018-08-13 2020-02-20 リンテック株式会社 接着剤、粘着シートおよび表示体
WO2020196240A1 (ja) 2019-03-28 2020-10-01 リンテック株式会社 シート状接着剤、封止シート、電子デバイスの封止体、及び、電子デバイスの封止体の製造方法

Also Published As

Publication number Publication date
WO2024005071A1 (ja) 2024-01-04
JPWO2024005071A1 (https=) 2024-01-04
JP7470885B1 (ja) 2024-04-18
CN119032146A (zh) 2024-11-26
TWI876401B (zh) 2025-03-11
TW202403000A (zh) 2024-01-16

Similar Documents

Publication Publication Date Title
KR20110128863A (ko) 다이싱 시트 첨부 반도체 보호막 형성용 필름, 이것을 이용한 반도체 장치의 제조 방법 및 반도체 장치
KR20160083863A (ko) 보호막 형성용 조성물, 보호막 형성용 시트, 및 보호막 부착 칩
CN114555697A (zh) 树脂膜、复合片及带第一保护膜的半导体芯片的制造方法
KR20200081336A (ko) 수지 시트
KR102602545B1 (ko) 수지 시트 및 반도체 장치
JP7155245B2 (ja) ダイボンディングフィルム、ダイシングダイボンディングシート、及び半導体チップの製造方法
JP2019067852A (ja) 樹脂シート、およびその製造方法
JP7471880B2 (ja) フィルム状接着剤及びダイシングダイボンディングシート
KR102759594B1 (ko) 필름형 접착제 및 반도체 가공용 시트
KR20250026151A (ko) 에너지선 경화성 필름형 투명 접착제, 이를 포함하는 디바이스 및 그 디바이스의 제조 방법
JP7497299B2 (ja) フィルム状接着剤、積層シート、複合シート、及び積層体の製造方法
CN113165347B (zh) 膜状粘合剂、层叠片、复合片及层叠体的制造方法
KR102846920B1 (ko) 플렉시블 디바이스용 필름형 접착제, 플렉시블 디바이스용 접착 시트 및 플렉시블 디바이스의 제조 방법
JP7450116B2 (ja) フレキシブルデバイス用樹脂組成物、フレキシブルデバイス用フィルム状接着剤、フレキシブルデバイス用接着シート、及びフレキシブルデバイスの製造方法
TW202100604A (zh) 膜狀接著劑以及半導體加工用片
KR102943975B1 (ko) 플렉시블 디바이스용 기초재·접착제층 일체형 시트 및 플렉시블 디바이스의 제조 방법
JP7471879B2 (ja) フィルム状接着剤及びダイシングダイボンディングシート
JP7814996B2 (ja) ダイシングダイボンディングシート及び半導体装置の製造方法
JP2025086713A (ja) 樹脂膜形成フィルムおよび樹脂膜付きワーク個片化物の製造方法
CN119744052A (zh) 保护膜形成膜及带保护膜的工件加工物的制造方法
CN113165350A (zh) 膜状粘合剂、层叠片、复合片及层叠体的制造方法

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20241004

Patent event code: PA01051R01D

Comment text: International Patent Application

A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20250210

Comment text: Request for Examination of Application

PG1501 Laying open of application