JPWO2024005071A1 - - Google Patents

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Publication number
JPWO2024005071A1
JPWO2024005071A1 JP2024505109A JP2024505109A JPWO2024005071A1 JP WO2024005071 A1 JPWO2024005071 A1 JP WO2024005071A1 JP 2024505109 A JP2024505109 A JP 2024505109A JP 2024505109 A JP2024505109 A JP 2024505109A JP WO2024005071 A1 JPWO2024005071 A1 JP WO2024005071A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024505109A
Other languages
Japanese (ja)
Other versions
JPWO2024005071A5 (https=
JP7470885B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024005071A1 publication Critical patent/JPWO2024005071A1/ja
Application granted granted Critical
Publication of JP7470885B1 publication Critical patent/JP7470885B1/ja
Publication of JPWO2024005071A5 publication Critical patent/JPWO2024005071A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
JP2024505109A 2022-06-30 2023-06-28 エネルギー線硬化型フィルム状透明接着剤、これを含むデバイス及び該デバイスの製造方法 Active JP7470885B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022105913 2022-06-30
JP2022105913 2022-06-30
PCT/JP2023/023974 WO2024005071A1 (ja) 2022-06-30 2023-06-28 エネルギー線硬化型フィルム状透明接着剤、これを含むデバイス及び該デバイスの製造方法

Publications (3)

Publication Number Publication Date
JPWO2024005071A1 true JPWO2024005071A1 (https=) 2024-01-04
JP7470885B1 JP7470885B1 (ja) 2024-04-18
JPWO2024005071A5 JPWO2024005071A5 (https=) 2024-06-04

Family

ID=89382422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024505109A Active JP7470885B1 (ja) 2022-06-30 2023-06-28 エネルギー線硬化型フィルム状透明接着剤、これを含むデバイス及び該デバイスの製造方法

Country Status (5)

Country Link
JP (1) JP7470885B1 (https=)
KR (1) KR20250026151A (https=)
CN (1) CN119032146A (https=)
TW (1) TWI876401B (https=)
WO (1) WO2024005071A1 (https=)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4078070B2 (ja) * 2000-12-28 2008-04-23 キヤノン株式会社 インクジェットヘッドの製造方法
JP4075409B2 (ja) * 2002-02-28 2008-04-16 日立化成工業株式会社 接着フィルム及びそれを用いた電極の接続構造
KR101028603B1 (ko) * 2002-06-17 2011-04-11 세키스이가가쿠 고교가부시키가이샤 유기 전계 발광 소자 밀봉용 접착제 및 그의 응용
JP2006233203A (ja) * 2005-01-31 2006-09-07 Asahi Kasei Electronics Co Ltd 異方導電性接着剤フィルム
JP2007197617A (ja) * 2006-01-29 2007-08-09 Nitto Denko Corp 接着フィルム
KR101832522B1 (ko) * 2013-11-29 2018-04-04 주식회사 엘지화학 접착 필름 형성용 조성물, 광경화전 가공용 점착 필름, 접착 필름 및 전자종이 표시장치
JP6490999B2 (ja) * 2015-03-16 2019-03-27 デクセリアルズ株式会社 接続構造体、及び接続構造体の製造方法
MX2017015550A (es) * 2015-06-04 2018-04-11 3M Innovative Properties Co Métodos para unir aditamentos al vidrio de vehículos.
JP7138511B2 (ja) 2018-08-13 2022-09-16 リンテック株式会社 粘着剤、粘着シートおよび表示体
WO2020196240A1 (ja) 2019-03-28 2020-10-01 リンテック株式会社 シート状接着剤、封止シート、電子デバイスの封止体、及び、電子デバイスの封止体の製造方法
WO2021117396A1 (ja) * 2019-12-11 2021-06-17 株式会社スリーボンド カチオン硬化性組成物、硬化物および接合体
JP2022019609A (ja) * 2020-07-16 2022-01-27 住友ベークライト株式会社 感光性樹脂組成物、電子デバイスの製造方法、電子デバイスおよび感光性樹脂組成物の製造方法

Also Published As

Publication number Publication date
WO2024005071A1 (ja) 2024-01-04
JP7470885B1 (ja) 2024-04-18
CN119032146A (zh) 2024-11-26
KR20250026151A (ko) 2025-02-25
TWI876401B (zh) 2025-03-11
TW202403000A (zh) 2024-01-16

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