TWI874648B - 高導熱性矽氧組成物 - Google Patents

高導熱性矽氧組成物 Download PDF

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Publication number
TWI874648B
TWI874648B TW110115970A TW110115970A TWI874648B TW I874648 B TWI874648 B TW I874648B TW 110115970 A TW110115970 A TW 110115970A TW 110115970 A TW110115970 A TW 110115970A TW I874648 B TWI874648 B TW I874648B
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TW
Taiwan
Prior art keywords
component
thermal conductivity
composition
thermally conductive
aforementioned
Prior art date
Application number
TW110115970A
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English (en)
Chinese (zh)
Other versions
TW202146579A (zh
Inventor
細田也實
高橋瞳子
Original Assignee
日商信越化學工業股份有限公司
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Publication of TW202146579A publication Critical patent/TW202146579A/zh
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Publication of TWI874648B publication Critical patent/TWI874648B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2314/00—Polymer mixtures characterised by way of preparation
    • C08L2314/08—Polymer mixtures characterised by way of preparation prepared by late transition metal, i.e. Ni, Pd, Pt, Co, Rh, Ir, Fe, Ru or Os, single site catalyst

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW110115970A 2020-05-22 2021-05-04 高導熱性矽氧組成物 TWI874648B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020089709 2020-05-22
JP2020-089709 2020-05-22

Publications (2)

Publication Number Publication Date
TW202146579A TW202146579A (zh) 2021-12-16
TWI874648B true TWI874648B (zh) 2025-03-01

Family

ID=78708545

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110115970A TWI874648B (zh) 2020-05-22 2021-05-04 高導熱性矽氧組成物

Country Status (7)

Country Link
US (1) US12570854B2 (https=)
EP (1) EP4155347A4 (https=)
JP (1) JP7371249B2 (https=)
KR (1) KR20230015340A (https=)
CN (1) CN115667407B (https=)
TW (1) TWI874648B (https=)
WO (1) WO2021235214A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250129281A1 (en) * 2022-02-07 2025-04-24 Dow Silicones Corporation Curable thermally conductive composition
KR102545636B1 (ko) * 2023-02-17 2023-06-21 주식회사 파인테크닉스 열전도성 복합신소재용 조성물, 이를 포함하는 등기구의 방열장치 및 등기구의 방열장치로 제작된 led 등기구
JP7838191B2 (ja) * 2024-03-28 2026-03-31 積水化学工業株式会社 熱伝導性組成物
CN118931189B (zh) * 2024-08-27 2025-03-25 山东高等技术研究院 一种低成本高性能导热硅脂及其制备方法与应用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108603033A (zh) * 2016-03-18 2018-09-28 信越化学工业株式会社 热传导性硅酮组合物和半导体装置

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2938429B1 (ja) 1998-02-27 1999-08-23 信越化学工業株式会社 熱伝導性シリコーン組成物
JP2938428B1 (ja) 1998-02-27 1999-08-23 信越化学工業株式会社 熱伝導性グリース組成物
JP3543663B2 (ja) 1999-03-11 2004-07-14 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及びその製造方法
JP3803058B2 (ja) * 2001-12-11 2006-08-02 信越化学工業株式会社 熱伝導性シリコーン組成物、その硬化物及び敷設方法並びにそれを用いた半導体装置の放熱構造体
JP3952184B2 (ja) 2002-10-10 2007-08-01 信越化学工業株式会社 熱伝導性シート
JP3922367B2 (ja) * 2002-12-27 2007-05-30 信越化学工業株式会社 熱伝導性シリコーングリース組成物
US20100280164A1 (en) 2009-04-29 2010-11-04 Tundra Composites, LLC. Inorganic Composite
CN101265362A (zh) * 2008-05-07 2008-09-17 曲阜师范大学 一种功能稳定金属有机复合材料的加工方法
CN101294067B (zh) 2008-06-20 2011-09-14 清华大学 一种导热硅脂组合物
JP2010013521A (ja) * 2008-07-02 2010-01-21 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーン組成物
JP6014299B2 (ja) * 2008-09-01 2016-10-25 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物及び半導体装置
JP5843364B2 (ja) * 2012-08-13 2016-01-13 信越化学工業株式会社 熱伝導性組成物
JP5832983B2 (ja) * 2012-10-18 2015-12-16 信越化学工業株式会社 シリコーン組成物
JP5843368B2 (ja) 2013-05-07 2016-01-13 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP5898139B2 (ja) * 2013-05-24 2016-04-06 信越化学工業株式会社 熱伝導性シリコーン組成物
JP6202475B2 (ja) * 2014-06-27 2017-09-27 信越化学工業株式会社 熱伝導性複合シリコーンゴムシート
JP6149831B2 (ja) * 2014-09-04 2017-06-21 信越化学工業株式会社 シリコーン組成物
JP6260519B2 (ja) 2014-11-25 2018-01-17 信越化学工業株式会社 一液付加硬化型シリコーン組成物の保存方法及び硬化方法
US10174237B2 (en) 2015-03-02 2019-01-08 Shin-Etsu Chemical Co., Ltd. Thermal conductive silicone composition
JP6943028B2 (ja) 2017-06-15 2021-09-29 信越化学工業株式会社 熱伝導性シリコーン組成物
KR102861271B1 (ko) 2019-10-24 2025-09-18 신에쓰 가가꾸 고교 가부시끼가이샤 열전도성 실리콘 조성물 및 그 제조 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108603033A (zh) * 2016-03-18 2018-09-28 信越化学工业株式会社 热传导性硅酮组合物和半导体装置

Also Published As

Publication number Publication date
US12570854B2 (en) 2026-03-10
TW202146579A (zh) 2021-12-16
JP7371249B2 (ja) 2023-10-30
CN115667407B (zh) 2024-08-09
WO2021235214A1 (ja) 2021-11-25
US20230167301A1 (en) 2023-06-01
JPWO2021235214A1 (https=) 2021-11-25
EP4155347A1 (en) 2023-03-29
KR20230015340A (ko) 2023-01-31
EP4155347A4 (en) 2024-06-05
CN115667407A (zh) 2023-01-31

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