CN115667407B - 高导热性有机硅组合物 - Google Patents

高导热性有机硅组合物 Download PDF

Info

Publication number
CN115667407B
CN115667407B CN202180036987.0A CN202180036987A CN115667407B CN 115667407 B CN115667407 B CN 115667407B CN 202180036987 A CN202180036987 A CN 202180036987A CN 115667407 B CN115667407 B CN 115667407B
Authority
CN
China
Prior art keywords
component
thermal conductivity
high thermal
silicone composition
groups
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180036987.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN115667407A (zh
Inventor
细田也实
高桥瞳子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of CN115667407A publication Critical patent/CN115667407A/zh
Application granted granted Critical
Publication of CN115667407B publication Critical patent/CN115667407B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2314/00—Polymer mixtures characterised by way of preparation
    • C08L2314/08—Polymer mixtures characterised by way of preparation prepared by late transition metal, i.e. Ni, Pd, Pt, Co, Rh, Ir, Fe, Ru or Os, single site catalyst

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202180036987.0A 2020-05-22 2021-04-29 高导热性有机硅组合物 Active CN115667407B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020089709 2020-05-22
JP2020-089709 2020-05-22
PCT/JP2021/017129 WO2021235214A1 (ja) 2020-05-22 2021-04-29 高熱伝導性シリコーン組成物

Publications (2)

Publication Number Publication Date
CN115667407A CN115667407A (zh) 2023-01-31
CN115667407B true CN115667407B (zh) 2024-08-09

Family

ID=78708545

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180036987.0A Active CN115667407B (zh) 2020-05-22 2021-04-29 高导热性有机硅组合物

Country Status (7)

Country Link
US (1) US12570854B2 (https=)
EP (1) EP4155347A4 (https=)
JP (1) JP7371249B2 (https=)
KR (1) KR20230015340A (https=)
CN (1) CN115667407B (https=)
TW (1) TWI874648B (https=)
WO (1) WO2021235214A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250129281A1 (en) * 2022-02-07 2025-04-24 Dow Silicones Corporation Curable thermally conductive composition
KR102545636B1 (ko) * 2023-02-17 2023-06-21 주식회사 파인테크닉스 열전도성 복합신소재용 조성물, 이를 포함하는 등기구의 방열장치 및 등기구의 방열장치로 제작된 led 등기구
JP7838191B2 (ja) * 2024-03-28 2026-03-31 積水化学工業株式会社 熱伝導性組成物
CN118931189B (zh) * 2024-08-27 2025-03-25 山东高等技术研究院 一种低成本高性能导热硅脂及其制备方法与应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016011322A (ja) * 2014-06-27 2016-01-21 信越化学工業株式会社 熱伝導性複合シリコーンゴムシート
CN108603033A (zh) * 2016-03-18 2018-09-28 信越化学工业株式会社 热传导性硅酮组合物和半导体装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2938429B1 (ja) 1998-02-27 1999-08-23 信越化学工業株式会社 熱伝導性シリコーン組成物
JP2938428B1 (ja) 1998-02-27 1999-08-23 信越化学工業株式会社 熱伝導性グリース組成物
JP3543663B2 (ja) 1999-03-11 2004-07-14 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及びその製造方法
JP3803058B2 (ja) * 2001-12-11 2006-08-02 信越化学工業株式会社 熱伝導性シリコーン組成物、その硬化物及び敷設方法並びにそれを用いた半導体装置の放熱構造体
JP3952184B2 (ja) 2002-10-10 2007-08-01 信越化学工業株式会社 熱伝導性シート
JP3922367B2 (ja) * 2002-12-27 2007-05-30 信越化学工業株式会社 熱伝導性シリコーングリース組成物
US20100280164A1 (en) 2009-04-29 2010-11-04 Tundra Composites, LLC. Inorganic Composite
CN101265362A (zh) * 2008-05-07 2008-09-17 曲阜师范大学 一种功能稳定金属有机复合材料的加工方法
CN101294067B (zh) 2008-06-20 2011-09-14 清华大学 一种导热硅脂组合物
JP2010013521A (ja) * 2008-07-02 2010-01-21 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーン組成物
JP6014299B2 (ja) * 2008-09-01 2016-10-25 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物及び半導体装置
JP5843364B2 (ja) * 2012-08-13 2016-01-13 信越化学工業株式会社 熱伝導性組成物
JP5832983B2 (ja) * 2012-10-18 2015-12-16 信越化学工業株式会社 シリコーン組成物
JP5843368B2 (ja) 2013-05-07 2016-01-13 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP5898139B2 (ja) * 2013-05-24 2016-04-06 信越化学工業株式会社 熱伝導性シリコーン組成物
JP6149831B2 (ja) * 2014-09-04 2017-06-21 信越化学工業株式会社 シリコーン組成物
JP6260519B2 (ja) 2014-11-25 2018-01-17 信越化学工業株式会社 一液付加硬化型シリコーン組成物の保存方法及び硬化方法
US10174237B2 (en) 2015-03-02 2019-01-08 Shin-Etsu Chemical Co., Ltd. Thermal conductive silicone composition
JP6943028B2 (ja) 2017-06-15 2021-09-29 信越化学工業株式会社 熱伝導性シリコーン組成物
KR102861271B1 (ko) 2019-10-24 2025-09-18 신에쓰 가가꾸 고교 가부시끼가이샤 열전도성 실리콘 조성물 및 그 제조 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016011322A (ja) * 2014-06-27 2016-01-21 信越化学工業株式会社 熱伝導性複合シリコーンゴムシート
CN108603033A (zh) * 2016-03-18 2018-09-28 信越化学工业株式会社 热传导性硅酮组合物和半导体装置

Also Published As

Publication number Publication date
US12570854B2 (en) 2026-03-10
TWI874648B (zh) 2025-03-01
TW202146579A (zh) 2021-12-16
JP7371249B2 (ja) 2023-10-30
WO2021235214A1 (ja) 2021-11-25
US20230167301A1 (en) 2023-06-01
JPWO2021235214A1 (https=) 2021-11-25
EP4155347A1 (en) 2023-03-29
KR20230015340A (ko) 2023-01-31
EP4155347A4 (en) 2024-06-05
CN115667407A (zh) 2023-01-31

Similar Documents

Publication Publication Date Title
CN115667407B (zh) 高导热性有机硅组合物
JP6388072B2 (ja) 熱伝導性シリコーン組成物
JP5832983B2 (ja) シリコーン組成物
JP6614362B2 (ja) 熱伝導性シリコーン組成物
CN105246977A (zh) 热传导性硅酮组合物
JP2013082816A (ja) 硬化性オルガノポリシロキサン組成物及び半導体装置
JP5843364B2 (ja) 熱伝導性組成物
JP7467017B2 (ja) 熱伝導性シリコーン組成物及びその硬化物
JP7070320B2 (ja) 熱伝導性シリコーン組成物
JP2015212318A (ja) 熱伝導性シリコーン組成物
JP2012107152A (ja) 熱伝導性シリコーングリース組成物
JP6943028B2 (ja) 熱伝導性シリコーン組成物
JP6314710B2 (ja) 熱伝導性シリコーン組成物
WO2023132192A1 (ja) 高熱伝導性シリコーン組成物
TW202334374A (zh) 導熱性矽氧組成物
JP7219728B2 (ja) 熱伝導性シリコーン組成物
TW202340377A (zh) 導熱性矽氧組成物
JP7689935B2 (ja) 熱伝導性シリコーン組成物及びその硬化物
WO2025187619A1 (ja) 熱伝導性シリコーン組成物
JP2025110656A (ja) 熱伝導性付加硬化型シリコーン組成物
JP2025092146A (ja) 熱伝導性付加硬化型シリコーン組成物、及び熱伝導性付加硬化型シリコーン組成物の製造方法
WO2025053195A1 (ja) 熱伝導性シリコーン組成物

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant