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• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
  • C09K5/08—Materials not undergoing a change of physical state when used
  • C09K5/14—Solid materials, e.g. powdery or granular
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
  • C08L83/04—Polysiloxanes
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
  • C08K3/013—Fillers, pigments or reinforcing additives
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/02—Elements
  • C08K3/08—Metals
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
  • C08G77/04—Polysiloxanes
  • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
  • C08G77/04—Polysiloxanes
  • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
  • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
  • C08G77/04—Polysiloxanes
  • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/02—Elements
  • C08K3/08—Metals
  • C08K2003/0812—Aluminium
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/001—Conductive additives
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/002—Physical properties
  • C08K2201/005—Additives being defined by their particle size in general
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2205/00—Polymer mixtures characterised by other features
  • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2205/00—Polymer mixtures characterised by other features
  • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2314/00—Polymer mixtures characterised by way of preparation
  • C08L2314/08—Polymer mixtures characterised by way of preparation prepared by late transition metal, i.e. Ni, Pd, Pt, Co, Rh, Ir, Fe, Ru or Os, single site catalyst

Definitions

• the present invention relates to a highly thermally conductive silicone composition capable of maintaining high heat dissipation performance.
• thermo paste exhibits high performance from the viewpoint of thermal resistance because it can be used with a thin thickness at the time of mounting.
• thermal paste that is sandwiched between members and then heat-cured before use.
• Thermal grease contains a large amount of filler to improve thermal conductivity, but as a result, the elongation after heat curing decreases. There is a concern that the material loses its flexibility due to the decrease in elongation, and it becomes impossible to follow the warp during operation. If it cannot follow, a gap is generated between the member and the heat radiating grease, and the heat radiating performance deteriorates.
• a component containing an alkenyl group at the end of the molecular chain and a component containing an alkenyl group at the side chain and / or the end of the molecular chain the elongation after curing is high and the warp during operation is high.
• a thermally conductive silicone composition capable of following the above has been proposed.
• the warp of the base material has tended to increase, and the conventional material has a thin material thickness, which may make it difficult to follow the warp.
• the conventional material has a thin material thickness, which may make it difficult to follow the warp.
• a heat conductive filler having a large particle size is used, there is a problem that the filling property is poor and the material thickness becomes thick, resulting in high thermal resistance and insufficient heat dissipation performance.
• the present invention has been made in view of the above circumstances.
• the thick material makes it possible to follow the warp of the base material, and since it has high thermal conductivity, it has a high thermal conductivity silicone composition that can maintain heat dissipation performance.
• the purpose is to provide things.
• the present invention comprises a highly thermally conductive silicone composition.
• A An organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups in one molecule and having a kinematic viscosity of 100 to 100,000 mm 2 / s at 25 ° C.
• (B) Aluminum powder having an average particle size of 50 ⁇ m or more, (C) A thermally conductive filler having an average particle size of less than 0.1 to 50 ⁇ m, (D) Organohydrogenpolysiloxane having a hydrogen atom (Si—H group) bonded to two or more silicon atoms in one molecule: ⁇ number of Si—H groups of the component (D) above ⁇ / ⁇ the above ( A) The number of alkenyl groups in the component ⁇ is 0.5 to 1.5.
• the high thermal conductive silicone composition contains an amount of 0.1% by mass to 5% by mass based on the total amount of the above.
• the high thermal conductive silicone composition is heat-cured at 150 ° C. for 60 minutes to prepare a 2 mm thick sheet, and then the shape of the No. 2 dumbbell described in JIS K6251 is prepared and the elongation measured is measured. It is preferably a highly thermally conductive silicone composition having a content of 30% or more.
• the material thickness can be increased, further high thermal conductivity can be imparted, and thermal performance can be maintained. Can be done.
• the present inventor has a high material thickness, can follow the warp of the base material, and has high thermal conductivity to maintain heat dissipation performance.
• a silicone composition was developed.
• the present invention is a highly thermally conductive silicone composition.
• A An organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups in one molecule and having a kinematic viscosity of 100 to 100,000 mm 2 / s at 25 ° C.
• (B) Aluminum powder having an average particle size of 50 ⁇ m or more, (C) A thermally conductive filler having an average particle size of less than 0.1 to 50 ⁇ m, (D) Organohydrogenpolysiloxane having a hydrogen atom (Si—H group) bonded to two or more silicon atoms in one molecule: ⁇ number of Si—H groups of the component (D) above ⁇ / ⁇ the above ( A) The number of alkenyl groups in the component ⁇ is 0.5 to 1.5.
• Component (A) is an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups in one molecule and having a kinematic viscosity of 100 to 100,000 mm 2 / s at 25 ° C. ..
• the organopolysiloxane of the component (A) contains two alkenyl groups directly linked to a silicon atom in one molecule, and may be linear or branched, or may be a mixture of these two or more different viscosities. ..
• alkenyl group examples include a vinyl group, an allyl group, a 1-butenyl group, a 1-hexenyl group and the like, but a vinyl group is preferable from the viewpoint of ease of synthesis and cost.
• the residual organic group bonded to the silicon atom includes an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group, a hexyl group and a dodecyl group, an aryl group such as a phenyl group, a 2-phenylethyl group and a 2-phenylpropi.
• aralkyl group such as a ru group is exemplified, and a substituted hydrocarbon group such as a chloromethyl group and a 3,3,3-trifluoropropyl group is also mentioned as an example. Of these, a methyl group is preferable from the viewpoint of ease of synthesis and cost.
• the alkenyl group bonded to the silicon atom is preferably present at the end of the molecular chain of the organopolysiloxane.
• the kinematic viscosity of the organopolysiloxane at 25 ° C. measured by the Ubbelohde type Ostwald viscometer is in the range of 100 to 100,000 mm 2 / s, preferably 500 to 100,000 mm 2 / s.
• the component (B) is an aluminum powder having an average particle size of 50 ⁇ m or more, and functions as a thermally conductive filler of the highly thermally conductive silicone composition of the present invention.
• the component (B) may be used alone or in combination of two or more.
• the shape of the component (B) is not particularly limited, and examples thereof include a spherical shape, a dendritic shape, a flaky shape, a needle shape, and an irregular shape.
• the particle shape of the component (B) has a large bulk density such as a dendritic shape, a flake shape, a needle shape, or an irregular shape. It is preferable that it is spherical rather than.
• the average particle size of the component (B) is 50 ⁇ m or more, preferably 55 to 100 ⁇ m, and more preferably 55 to 80 ⁇ m. If the average particle size is less than 50 ⁇ m, the material thickness of the high thermal conductive silicone grease becomes thin, and there is a possibility that the warp of the base material cannot be followed.
• the average particle size is a volume-based volume average diameter and can be measured by Nikkiso Co., Ltd. Microtrack MT3300EX.
• the filling amount of the component (B) is preferably in the range of 20 to 60% by mass with respect to the entire composition. If the filling amount is at least the lower limit, the thermal conductivity of the composition is high, and if it is at least the upper limit, the composition becomes uniform and there is no risk of oil separation.
• the component (C) is a thermally conductive filler having an average particle size of less than 0.1 to 50 ⁇ m, and functions to improve the thermal conductivity of the highly thermally conductive silicone composition of the present invention. By allowing the component (C) to enter the gap between the components (B), it is possible to improve the filling property of the heat conductive filler ⁇ (B) component and (C) component ⁇ as a whole in the composition.
• the heat conductive fillers include aluminum powder, copper powder, nickel powder, gold powder, metallic silicon powder, aluminum nitride powder, boron nitride powder, alumina powder, diamond powder, carbon powder, indium powder, gallium powder, and zinc oxide powder. And so on.
• the component (C) may be used alone or in combination of two or more.
• the component (C) is preferably aluminum powder, alumina powder, or zinc oxide powder, and more preferably aluminum powder and zinc oxide powder, from the viewpoint of thermal conductivity and availability.
• the average particle size of the component (C) is in the range of 0.1 to less than 50 ⁇ m, preferably 0.2 to 45 ⁇ m, and more preferably 0.2 to 40 ⁇ m. If the average particle size is less than 0.1 ⁇ m, the bulk density of the component (C) tends to increase, so that the viscosity of the composition may increase and the workability may decrease. On the other hand, when the average particle size is 50 ⁇ m or more, close-packing by the combination of the component (B) and the component (C) becomes difficult.
• the filling amount of the component (C) is preferably in the range of 30 to 70% by mass, more preferably in the range of 30 to 65% by mass with respect to the entire composition. If the filling amount is not less than the lower limit, the effect of adding the component (C) can be easily obtained. On the other hand, if it is not more than the upper limit, the viscosity of the obtained composition becomes low and the workability is improved.
• the total of the component (B) and the component (C) is 90 to 95% by mass, preferably 91 to 95% by mass, and more preferably 92 to 95% by mass with respect to the entire composition.
• the range of mass% is good. If the total amount is less than the lower limit, it may be difficult to achieve the thermal conductivity of 7 W / m ⁇ K in the composition. On the other hand, if the upper limit is exceeded, the composition becomes highly viscous and the workability is lowered.
• the organohydrogenpolysiloxane of component (D) needs to have two or more hydrogen atoms (Si—H groups) directly linked to silicon atoms in one molecule in order to network the composition by cross-linking. It may be linear or branched, or it may be a mixture of two or more of these different viscosities.
• the residual organic group bonded to the silicon atom includes an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group, a hexyl group and a dodecyl group, an aryl group such as a phenyl group, a 2-phenylethyl group and a 2-phenylpropi.
• aralkyl group such as a ru group is exemplified, and a substituted hydrocarbon group such as a chloromethyl group and a 3,3,3-trifluoropropyl group is also mentioned as an example.
• a methyl group is preferable from the viewpoint of ease of synthesis and cost.
• the blending amount of the component (D) is such that ⁇ the number of Si—H groups of the component (D) ⁇ / ⁇ the number of alkenyl groups of the component (A) ⁇ is 0.5 to 1.5, and 0.
• the range of 7 to 1.3 is more preferable. If the blending amount of the component (D) is less than the above lower limit, the composition cannot be sufficiently reticulated, so that the grease does not cure sufficiently, and if it exceeds the above upper limit, the crosslink density becomes too high and the elongation may decrease. ..
• Component (E) is a hydrolyzable organopolysiloxane represented by the following general formula (1), and treats the surface of the component (B) and the component (C) which are thermally conductive fillers. This is possible, and even if the component (B) or the component (C) is highly filled in the silicone component, the fluidity of the silicone composition can be maintained and good handleability can be imparted to the composition.
• R 1 represents a monovalent hydrocarbon group having 1 to 10 carbon atoms which may have a substituent, and each R 1 may be the same or different, and m is 5. Indicates an integer of ⁇ 100.
• R 1 in the above formula (1) represents a monovalent hydrocarbon group having 1 to 10 carbon atoms which may have a substituent, and each R 1 may be the same or different.
• R 1 include a methyl group.
• m is an integer of 5 to 100, preferably an integer of 10 to 60. If the value of m is less than 5, the oil bleeding derived from the silicone composition may become severe and the reliability may deteriorate. Further, if the value of m is larger than 100, the wettability of the filler may not be sufficient.
• the amount of the component (E) is in the range of 0.1 to 10% by mass, preferably 1 to 6% by mass with respect to the entire composition. If the amount of the component (E) is less than the above lower limit, sufficient wettability may not be exhibited, and if it exceeds the above upper limit, bleeding from the composition may be severe.
• Component (F) is a platinum group metal catalyst, and is a component that promotes the addition reaction between the aliphatic unsaturated hydrocarbon group in the component (A) and the Si—H group of the component (D). be.
• the platinum group metal catalyst conventionally known ones used for the addition reaction can be used. Examples thereof include platinum-based, palladium-based, and rhodium-based catalysts, and among them, platinum or a platinum compound, which is relatively easily available, is preferable. For example, elemental platinum, platinum black, platinum chloride acid, platinum-olefin complex, platinum-alcohol complex, platinum coordination compound and the like can be mentioned.
• the platinum-based catalyst may be used alone or in combination of two or more.
• the blending amount of the component (F) may be an effective amount as a catalyst, that is, an effective amount necessary for promoting the addition reaction and curing the composition of the present invention.
• the mass of the component (A) is preferably 0.1 to 500 ppm, more preferably 1 to 200 ppm, based on the mass converted to the platinum group metal atom. When the amount of the catalyst is within the above range, the effect as a catalyst can be obtained and it is economical, which is preferable.
• the highly thermally conductive silicone composition of the present invention suppresses the progress of the hydrosilylation reaction at room temperature (that is, suppresses the catalytic activity of the component (F)), and extends the shelf life and pot life.
• the component (G) can be contained as a control agent for the above.
• the control agent conventionally known ones can be used, and acetylene compounds, nitrogen compounds, organic phosphorus compounds, oxime compounds, and organic chloro compounds are preferable.
• the blending amount of the component (G) is 0.1% by mass or more with respect to the component (A), sufficient shelf life and pot life can be obtained, and if it is 5% by mass or less, the curing rate can be maintained.
• the range of 1 to 5% by mass is preferable, the range of 0.1 to 1% by mass is more preferable, and the range of 0.1 to 0.5% by mass is further preferable. These may be diluted with toluene or the like and used in order to improve the dispersibility in the highly thermally conductive silicone composition.
• the highly thermally conductive silicone composition of the present invention contains 2,6-di-t-butyl-4 in order to prevent deterioration of the addition-curable silicone composition.
• -A conventionally known antioxidant such as methylphenol may be contained, if necessary.
• a heat resistance improver, an adhesive aid, a mold release agent, a dye, a pigment, a flame retardant, a sedimentation inhibitor, a thixo property improver and the like can be blended as needed.
• the components (A) to (G) and other components are, for example, Trimix, Twinmix, Planetary Mixer (all registered trademarks of Inoue Seisakusho Co., Ltd. mixer), Ultra Mixer. Mix with a mixer such as (registered trademark of Mizuho Kogyo Co., Ltd. mixer), Hibis Dispermix (registered trademark of Tokushu Kagaku Kogyo Co., Ltd. mixer).
• the highly thermally conductive silicone composition of the present invention may be mixed while heating, and the heating conditions are not particularly limited, but the temperature is usually 25 to 220 ° C, preferably 40 to 200 ° C, and more. The temperature is preferably 50 to 200 ° C., and the time is usually 3 minutes to 24 hours, preferably 5 minutes to 12 hours, and more preferably 10 minutes to 6 hours. Further, deaeration may be performed at the time of heating.
• the highly thermally conductive silicone composition of the present invention has an absolute viscosity measured at 25 ° C. using a Malcolm viscometer (type PC-1TL) in the range of 50 to 1,000 Pa ⁇ s, preferably 100 to 100. It is 800 Pa ⁇ s, more preferably 150 to 600 Pa ⁇ s. If the absolute viscosity is less than the lower limit of the above range, the heat conductive filler may settle over time during storage, resulting in poor workability. Further, if the upper limit of the above range is exceeded, the extensibility becomes poor and the workability may deteriorate.
• a Malcolm viscometer type PC-1TL
• the high thermal conductivity silicone composition of the present invention has a thermal conductivity of 7 W / m ⁇ K or more in the ISO 22007-2 compliant hot disk method.
• the thermal conductivity can be measured with Model QTM-500 manufactured by Kyoto Denshi Kogyo Co., Ltd.
• the highly thermally conductive silicone composition of the present invention is heat-cured at 150 ° C. for 60 minutes to prepare a 2 mm thick sheet, and then the shape of the No. 2 dumbbell described in JIS K6251 is prepared and the elongation measured is 30% or more. It is preferably 35% or more, more preferably 40% or more. The higher the elongation, the more preferable it is, so the upper limit cannot be determined, but it can be, for example, 200% or less. If the elongation (elongation at the time of cutting) is 30% or more, peeling is unlikely to occur during high-temperature storage, and there is no risk of deterioration of thermal resistance.
• Each high thermal conductivity silicone composition is poured into a mold having a thickness of 3 cm, covered with a kitchen wrap, and the thermal conductivity at 25 ° C. is measured by the ISO 22007-2 compliant hot disk method. Measured at 500.
• a high thermal conductive silicone composition is sandwiched between a 15 mm ⁇ 15 mm ⁇ 1 mmt Si chip and a 15 mm ⁇ 15 mm ⁇ 1 mmt Ni plate, and the high thermal conductive silicone composition is heat-cured in an oven at 150 ° C. for 60 minutes to achieve thermal resistance.
• a test piece for measurement was prepared. After that, the test piece was left at 150 ° C. for 1000 hours, and the change in thermal resistance was observed. This thermal resistance measurement was performed by nanoflash (manufactured by Nitsche, LFA447).
• the high thermal conductivity silicone composition was heat-cured in an oven at 150 ° C. for 60 minutes to prepare a test piece for measuring the hardness of the cured product.
• the hardness of the cured product was measured by Asker C specified in JIS S 6050: 2008.
• composition The following components for forming the highly thermally conductive silicone composition of the present invention were prepared.
• the kinematic viscosity shows the value at 25 ° C. by the Ubbelohde type Ostwald viscometer.
• the average particle size is a volume-based volume average diameter, and was measured by Nikkiso Co., Ltd. Microtrack MT3300EX.
• Component B-1 Aluminum powder having an average particle size of 60 ⁇ m
• B-2 Aluminum powder having an average particle size of 45 ⁇ m (comparative example)
• Component C-1 Aluminum powder with an average particle size of 10 ⁇ m
• C-2 Aluminum powder with an average particle size of 1.5 ⁇ m
• C-3 Zinc oxide powder with an average particle size of 1.0 ⁇ m
• Component F-1 Platinum atom, a solution of a platinum-divinyltetramethyldisiloxane complex in which both ends are sealed with a dimethylvinylsilyl group and dissolved in dimethylpolysiloxane having a kinematic viscosity of 600 mm 2 / s at 25 ° C. Contains 1% by mass
• Heat resistance improver A compound represented by the following formula
• the components (A) to (G) and the heat resistance improver were blended as follows to obtain silicone compositions of Examples 1 to 6 and Comparative Examples 1 to 6. That is, the components (A), (B), (C) and (E) were added to a 5 liter planetary mixer (manufactured by Inoue Seisakusho Co., Ltd.) and mixed at 170 ° C. for 1 hour. After cooling to room temperature, the components (F), (G) and (D) and a heat resistance improver were added and mixed so as to be uniform to prepare a silicone composition.
• the high thermal conductivity silicone compositions of Examples 1 to 6 satisfying the requirements of the present invention have a thermal conductivity of 7 W / m ⁇ K or more, and the thermal resistance after high-temperature storage is almost changed. do not.
• Comparative Example 1 in which the total amount of the components (B) and (C), which are the heat conductive fillers, is small, the thermal conductivity is not sufficient, and in Comparative Example 2, the content of the heat conductive filler is too large. Does not become grease-like.
• Comparative Example 3 since the component (B) contains aluminum powder having an average particle size of less than 50 ⁇ m and the material thickness is thin, the thermal resistance at the time of high temperature storage deteriorates.
• Comparative Examples 4 and 5 if the ratio of ⁇ number of Si—H groups of component (D) ⁇ / ⁇ number of Si—Vi groups of component (A) ⁇ is too low, the composition is not sufficiently cured. On the other hand, if it is too high, it becomes too hard and the elongation becomes low, so that the thermal resistance after high temperature storage deteriorates. In Comparative Example 6, when only the component (B) was used as the heat conductive filler, the filler was deteriorated, the silicone oil was separated, and the material became non-uniform. Therefore, the highly thermally conductive silicone composition of the present invention has a high thermal conductivity, and it is possible to maintain the heat dissipation performance without deteriorating the thermal resistance after high temperature storage.
• the high thermal conductivity silicone composition of the present invention has a thick material, it can follow the warp of a large base material, and further, since it has high thermal conductivity, it has high thermal performance even when the material thickness is thick. Can be guaranteed. Further, since the elongation is high, the thermal resistance after high temperature storage does not deteriorate, and it can be particularly preferably used as a highly reliable thermal paste used for removing heat from electronic components that generate heat during use.
• the present invention is not limited to the above embodiment.
• the above-described embodiment is an example, and any of the above-described embodiments having substantially the same configuration as the technical idea described in the claims of the present invention and having the same effect and effect is the present invention. Is included in the technical scope of.

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