TWI871434B - 電漿處理系統及邊緣環的更換方法 - Google Patents

電漿處理系統及邊緣環的更換方法 Download PDF

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Publication number
TWI871434B
TWI871434B TW110105254A TW110105254A TWI871434B TW I871434 B TWI871434 B TW I871434B TW 110105254 A TW110105254 A TW 110105254A TW 110105254 A TW110105254 A TW 110105254A TW I871434 B TWI871434 B TW I871434B
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TW
Taiwan
Prior art keywords
edge ring
ring
lifting rod
supporting
substrate
Prior art date
Application number
TW110105254A
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English (en)
Chinese (zh)
Other versions
TW202137325A (zh
Inventor
松浦伸
加藤健一
Original Assignee
日商東京威力科創股份有限公司
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Priority claimed from JP2020178354A external-priority patent/JP7550603B2/ja
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202137325A publication Critical patent/TW202137325A/zh
Application granted granted Critical
Publication of TWI871434B publication Critical patent/TWI871434B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32807—Construction (includes replacing parts of the apparatus)
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
TW110105254A 2020-03-03 2021-02-17 電漿處理系統及邊緣環的更換方法 TWI871434B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020-035948 2020-03-03
JP2020035948 2020-03-03
JP2020178354A JP7550603B2 (ja) 2020-03-03 2020-10-23 プラズマ処理システム及びエッジリングの交換方法
JP2020-178354 2020-10-23

Publications (2)

Publication Number Publication Date
TW202137325A TW202137325A (zh) 2021-10-01
TWI871434B true TWI871434B (zh) 2025-02-01

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
TW110105254A TWI871434B (zh) 2020-03-03 2021-02-17 電漿處理系統及邊緣環的更換方法
TW113150779A TW202516684A (zh) 2020-03-03 2021-02-17 電漿處理系統及基板支持台

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW113150779A TW202516684A (zh) 2020-03-03 2021-02-17 電漿處理系統及基板支持台

Country Status (4)

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US (2) US11901163B2 (https=)
JP (1) JP7727792B2 (https=)
CN (2) CN113345786B (https=)
TW (2) TWI871434B (https=)

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JP7134104B2 (ja) * 2019-01-09 2022-09-09 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理装置の載置台
TWI871434B (zh) * 2020-03-03 2025-02-01 日商東京威力科創股份有限公司 電漿處理系統及邊緣環的更換方法
TW202531381A (zh) * 2020-03-03 2025-08-01 日商東京威力科創股份有限公司 基板支持台、電漿處理系統及環狀構件之安裝方法
CN115440558A (zh) * 2021-06-03 2022-12-06 长鑫存储技术有限公司 半导体蚀刻设备
WO2023021372A1 (en) * 2021-08-16 2023-02-23 AddOn Optics Ltd. Apparatus and methods for applying vacuum-plasma treatment
US20250361614A1 (en) * 2024-05-21 2025-11-27 Applied Materials, Inc. Increased life substrate support assembly

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JP2003224169A (ja) * 2002-01-29 2003-08-08 Tokyo Electron Ltd 検査装置及びその配置構造
JP2017098540A (ja) * 2015-10-22 2017-06-01 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 正面開口式リングポッド
TW201725649A (zh) * 2015-10-22 2017-07-16 蘭姆研究公司 藉由介接腔室進行之易損零件的自動更換
US20170263478A1 (en) * 2015-01-16 2017-09-14 Lam Research Corporation Detection System for Tunable/Replaceable Edge Coupling Ring
TW201834060A (zh) * 2017-02-16 2018-09-16 日商東京威力科創股份有限公司 真空處理裝置及維護裝置

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JP4687534B2 (ja) 2005-09-30 2011-05-25 東京エレクトロン株式会社 基板の載置機構及び基板処理装置
JP5650935B2 (ja) * 2009-08-07 2015-01-07 東京エレクトロン株式会社 基板処理装置及び位置決め方法並びにフォーカスリング配置方法
JP5584517B2 (ja) * 2010-05-12 2014-09-03 東京エレクトロン株式会社 プラズマ処理装置及び半導体装置の製造方法
JP6003011B2 (ja) * 2011-03-31 2016-10-05 東京エレクトロン株式会社 基板処理装置
JP5948026B2 (ja) * 2011-08-17 2016-07-06 東京エレクトロン株式会社 半導体製造装置及び処理方法
JP6285620B2 (ja) 2011-08-26 2018-02-28 新光電気工業株式会社 静電チャック及び半導体・液晶製造装置
WO2013108750A1 (ja) * 2012-01-17 2013-07-25 東京エレクトロン株式会社 基板載置台及びプラズマ処理装置
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US10658222B2 (en) 2015-01-16 2020-05-19 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
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JP7055039B2 (ja) * 2017-03-22 2022-04-15 東京エレクトロン株式会社 基板処理装置
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JP2021040011A (ja) * 2019-09-02 2021-03-11 キオクシア株式会社 プラズマ処理装置
TWI871434B (zh) * 2020-03-03 2025-02-01 日商東京威力科創股份有限公司 電漿處理系統及邊緣環的更換方法

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Publication number Priority date Publication date Assignee Title
JP2003224169A (ja) * 2002-01-29 2003-08-08 Tokyo Electron Ltd 検査装置及びその配置構造
US20170263478A1 (en) * 2015-01-16 2017-09-14 Lam Research Corporation Detection System for Tunable/Replaceable Edge Coupling Ring
JP2017098540A (ja) * 2015-10-22 2017-06-01 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 正面開口式リングポッド
TW201725649A (zh) * 2015-10-22 2017-07-16 蘭姆研究公司 藉由介接腔室進行之易損零件的自動更換
TW201834060A (zh) * 2017-02-16 2018-09-16 日商東京威力科創股份有限公司 真空處理裝置及維護裝置

Also Published As

Publication number Publication date
CN113345786B (zh) 2025-10-03
JP2024105634A (ja) 2024-08-06
US12394605B2 (en) 2025-08-19
CN121260718A (zh) 2026-01-02
JP7727792B2 (ja) 2025-08-21
US20210280395A1 (en) 2021-09-09
TW202137325A (zh) 2021-10-01
TW202516684A (zh) 2025-04-16
US20240136158A1 (en) 2024-04-25
US11901163B2 (en) 2024-02-13
US20240234102A9 (en) 2024-07-11
CN113345786A (zh) 2021-09-03

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