TWI870560B - 環氧樹脂用硬化劑、硬化性樹脂組成物、硬化物、預浸體、電路基板、增層膜、半導體密封材及半導體裝置 - Google Patents

環氧樹脂用硬化劑、硬化性樹脂組成物、硬化物、預浸體、電路基板、增層膜、半導體密封材及半導體裝置 Download PDF

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TWI870560B
TWI870560B TW110107498A TW110107498A TWI870560B TW I870560 B TWI870560 B TW I870560B TW 110107498 A TW110107498 A TW 110107498A TW 110107498 A TW110107498 A TW 110107498A TW I870560 B TWI870560 B TW I870560B
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Taiwan
Prior art keywords
active ester
compound
polyol
resin composition
epoxy resin
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TW110107498A
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English (en)
Chinese (zh)
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TW202136362A (zh
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金榮璨
迫雅樹
林弘司
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日商Ｄｉｃ股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/76—Esters of carboxylic acids having a carboxyl group bound to a carbon atom of a six-membered aromatic ring
    • C07C69/80—Phthalic acid esters
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/76—Esters of carboxylic acids having a carboxyl group bound to a carbon atom of a six-membered aromatic ring
    • C07C69/80—Phthalic acid esters
    • C07C69/82—Terephthalic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW110107498A 2020-03-03 2021-03-03 環氧樹脂用硬化劑、硬化性樹脂組成物、硬化物、預浸體、電路基板、增層膜、半導體密封材及半導體裝置 TWI870560B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020036001 2020-03-03
JP2020036008 2020-03-03
JP2020-036008 2020-03-03
JP2020-036001 2020-03-03

Publications (2)

Publication Number Publication Date
TW202136362A TW202136362A (zh) 2021-10-01
TWI870560B true TWI870560B (zh) 2025-01-21

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TW110107498A TWI870560B (zh) 2020-03-03 2021-03-03 環氧樹脂用硬化劑、硬化性樹脂組成物、硬化物、預浸體、電路基板、增層膜、半導體密封材及半導體裝置

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JP (1) JP7323048B2 (https=)
KR (1) KR102828902B1 (https=)
CN (1) CN115210213B (https=)
TW (1) TWI870560B (https=)
WO (1) WO2021177233A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7389967B2 (ja) * 2020-06-19 2023-12-01 Dic株式会社 リン含有活性エステル、硬化性樹脂組成物、硬化物、プリプレグ、回路基板、ビルドアップフィルム、半導体封止材、及び、半導体装置
JP7739869B2 (ja) * 2021-09-03 2025-09-17 Dic株式会社 重合性不飽和基を有する樹脂組成物、硬化性樹脂組成物、硬化物、及び物品
JP7739870B2 (ja) * 2021-09-03 2025-09-17 Dic株式会社 重合性不飽和基を有する樹脂組成物、硬化性樹脂組成物、硬化物、及び物品
JP7810196B2 (ja) * 2024-02-09 2026-02-03 味の素株式会社 樹脂組成物
JP2025123062A (ja) * 2024-02-09 2025-08-22 味の素株式会社 樹脂組成物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4915063B1 (https=) * 1970-12-25 1974-04-12
JPS4915062B1 (https=) * 1970-12-25 1974-04-12

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0782348A (ja) 1993-07-22 1995-03-28 Hitachi Chem Co Ltd エポキシ樹脂組成物及びその硬化物
JP3826322B2 (ja) 2002-10-31 2006-09-27 大日本インキ化学工業株式会社 エポキシ樹脂組成物およびその硬化物
JP2005068063A (ja) * 2003-08-22 2005-03-17 Kyoto Institute Of Technology ニトロフェニルテレフタレート誘導体及びその製造方法
US8669333B2 (en) * 2010-07-02 2014-03-11 Dic Corporation Thermosetting resin composition, cured product thereof, active ester resin, semiconductor encapsulating material, prepreg, circuit board, and build-up film
JP6255624B2 (ja) * 2014-01-16 2018-01-10 Dic株式会社 活性エステル樹脂、エポキシ樹脂組成物、その硬化物、プリプレグ、回路基板、及びビルドアップフィルム
JP6376392B2 (ja) * 2014-11-21 2018-08-22 Dic株式会社 エポキシ樹脂組成物、硬化性樹脂組成物、活性エステル、硬化物、半導体封止材料、半導体装置、プレプリグ、フレキシルブル配線基板、回路基板、ビルドアップフィルム、ビルドアップ基板、繊維強化複合材料、成形品
TWI685540B (zh) 2014-12-15 2020-02-21 日商迪愛生股份有限公司 熱硬化性樹脂組成物、其硬化物、及用於其之活性酯樹脂
KR102453731B1 (ko) * 2018-03-29 2022-10-14 디아이씨 가부시끼가이샤 경화성 조성물 및 그 경화물

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4915063B1 (https=) * 1970-12-25 1974-04-12
JPS4915062B1 (https=) * 1970-12-25 1974-04-12

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
期刊 Chang, H.S. et al, "Synthesis and Properties of TLCPs with 2,6-Naphthalene-Based Mesogen, Polymethylene Spacer, and Nonlinear 4,4’-Thiodiphenyl Links", Journal of Applied Polymer Science, Vol 83, Issue 7, 14 February 2002, Pages 1536-1546. *

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Publication number Publication date
WO2021177233A1 (ja) 2021-09-10
JP7323048B2 (ja) 2023-08-08
KR102828902B1 (ko) 2025-07-04
CN115210213A (zh) 2022-10-18
TW202136362A (zh) 2021-10-01
CN115210213B (zh) 2024-12-10
JPWO2021177233A1 (https=) 2021-09-10
KR20220134605A (ko) 2022-10-05

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