TWI866686B - 熱硬化性樹脂組成物、覆蓋膜以及柔性印刷配線板 - Google Patents

熱硬化性樹脂組成物、覆蓋膜以及柔性印刷配線板 Download PDF

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Publication number
TWI866686B
TWI866686B TW112148136A TW112148136A TWI866686B TW I866686 B TWI866686 B TW I866686B TW 112148136 A TW112148136 A TW 112148136A TW 112148136 A TW112148136 A TW 112148136A TW I866686 B TWI866686 B TW I866686B
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TW
Taiwan
Prior art keywords
parts
mass
resin composition
thermosetting resin
film
Prior art date
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TW112148136A
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English (en)
Chinese (zh)
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TW202430612A (zh
Inventor
権平貴志
古川勝彦
石川雄己
須藤啓佑
藤田秀一
松山浩幸
Original Assignee
日商有澤製作所股份有限公司
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Publication of TW202430612A publication Critical patent/TW202430612A/zh
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Publication of TWI866686B publication Critical patent/TWI866686B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW112148136A 2022-12-19 2023-12-11 熱硬化性樹脂組成物、覆蓋膜以及柔性印刷配線板 TWI866686B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-201801 2022-12-19
JP2022201801 2022-12-19

Publications (2)

Publication Number Publication Date
TW202430612A TW202430612A (zh) 2024-08-01
TWI866686B true TWI866686B (zh) 2024-12-11

Family

ID=91588317

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112148136A TWI866686B (zh) 2022-12-19 2023-12-11 熱硬化性樹脂組成物、覆蓋膜以及柔性印刷配線板

Country Status (5)

Country Link
JP (1) JPWO2024135268A1 (https=)
KR (1) KR20250113445A (https=)
CN (1) CN120187797A (https=)
TW (1) TWI866686B (https=)
WO (1) WO2024135268A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1121455A (ja) * 1997-07-03 1999-01-26 Toyobo Co Ltd ポリアミドイミド樹脂組成物およびそれを用いた非水電解質二次電池および回路基板
TW200808536A (en) * 2006-04-25 2008-02-16 Hitachi Chemical Co Ltd Conductor foil with adhesive layer, conductor-clad laminate, printed wiring board and multilayer wiring board
TW201022312A (en) * 2008-10-01 2010-06-16 Toyo Boseki Polyamideimine resin, said resin composition, flame retardancy adhesive agent composition and adhesive sheet, covering film, printing wiring board made from said composition
TW201316848A (zh) * 2011-07-07 2013-04-16 Hitachi Chemical Co Ltd 接著膜、使用該接著膜的多層印刷配線板及該多層印刷配線板的製造方法
CN109337066A (zh) * 2018-09-28 2019-02-15 浙江大学 一种具有反应活性、易溶解的刚性链聚合物及其制备方法和组合物
TW202000839A (zh) * 2018-06-21 2020-01-01 日商東洋紡股份有限公司 含有丙烯腈丁二烯橡膠共聚合聚醯胺醯亞胺樹脂之黏接劑組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010265376A (ja) * 2009-05-14 2010-11-25 Toyobo Co Ltd 易接着性成型用ポリエステルフィルム及び成型用ゴム／ポリエステルフィルム積層体
JP2013043925A (ja) 2011-08-23 2013-03-04 Nippon Steel & Sumikin Chemical Co Ltd 接着剤樹脂組成物、その硬化物、接着剤フィルム、カバーレイフィルム及び回路基板
JP7090824B1 (ja) * 2020-07-22 2022-06-24 株式会社有沢製作所 熱硬化性樹脂組成物、カバーレイフィルム、接着シート、及びフレキシブルプリント配線板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1121455A (ja) * 1997-07-03 1999-01-26 Toyobo Co Ltd ポリアミドイミド樹脂組成物およびそれを用いた非水電解質二次電池および回路基板
TW200808536A (en) * 2006-04-25 2008-02-16 Hitachi Chemical Co Ltd Conductor foil with adhesive layer, conductor-clad laminate, printed wiring board and multilayer wiring board
TW201022312A (en) * 2008-10-01 2010-06-16 Toyo Boseki Polyamideimine resin, said resin composition, flame retardancy adhesive agent composition and adhesive sheet, covering film, printing wiring board made from said composition
TW201316848A (zh) * 2011-07-07 2013-04-16 Hitachi Chemical Co Ltd 接著膜、使用該接著膜的多層印刷配線板及該多層印刷配線板的製造方法
TW202000839A (zh) * 2018-06-21 2020-01-01 日商東洋紡股份有限公司 含有丙烯腈丁二烯橡膠共聚合聚醯胺醯亞胺樹脂之黏接劑組成物
CN109337066A (zh) * 2018-09-28 2019-02-15 浙江大学 一种具有反应活性、易溶解的刚性链聚合物及其制备方法和组合物

Also Published As

Publication number Publication date
KR20250113445A (ko) 2025-07-25
TW202430612A (zh) 2024-08-01
WO2024135268A1 (ja) 2024-06-27
JPWO2024135268A1 (https=) 2024-06-27
CN120187797A (zh) 2025-06-20

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